JP2003174251A - 電子部品の実装方法 - Google Patents

電子部品の実装方法

Info

Publication number
JP2003174251A
JP2003174251A JP2001374745A JP2001374745A JP2003174251A JP 2003174251 A JP2003174251 A JP 2003174251A JP 2001374745 A JP2001374745 A JP 2001374745A JP 2001374745 A JP2001374745 A JP 2001374745A JP 2003174251 A JP2003174251 A JP 2003174251A
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
resin sheet
mounting
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001374745A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003174251A5 (enExample
Inventor
Masato Hirano
正人 平野
Takashi Igari
貴史 猪狩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001374745A priority Critical patent/JP2003174251A/ja
Publication of JP2003174251A publication Critical patent/JP2003174251A/ja
Publication of JP2003174251A5 publication Critical patent/JP2003174251A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001374745A 2001-12-07 2001-12-07 電子部品の実装方法 Pending JP2003174251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001374745A JP2003174251A (ja) 2001-12-07 2001-12-07 電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001374745A JP2003174251A (ja) 2001-12-07 2001-12-07 電子部品の実装方法

Publications (2)

Publication Number Publication Date
JP2003174251A true JP2003174251A (ja) 2003-06-20
JP2003174251A5 JP2003174251A5 (enExample) 2005-07-21

Family

ID=19183261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001374745A Pending JP2003174251A (ja) 2001-12-07 2001-12-07 電子部品の実装方法

Country Status (1)

Country Link
JP (1) JP2003174251A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126869A (ja) * 2019-02-01 2020-08-20 パナソニックＩｐマネジメント株式会社 マスク設計装置およびマスク開口寸法決定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126869A (ja) * 2019-02-01 2020-08-20 パナソニックＩｐマネジメント株式会社 マスク設計装置およびマスク開口寸法決定方法

Similar Documents

Publication Publication Date Title
KR100530965B1 (ko) 인쇄용 마스크, 이를 이용한 솔더 페이스트 인쇄 방법, 표면실장 구조체, 및 그의 제조 방법
US7314378B2 (en) Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus
KR20080037551A (ko) 솔더 볼 탑재 방법 및 솔더 볼 탑재 기판의 제조 방법
EP1081990A2 (en) A method for forming a solder ball
US20120152606A1 (en) Printed wiring board
US20020112348A1 (en) Component mounting method
JPH11233910A (ja) 部品実装方法
US20090217520A1 (en) Method for forming solder lumps on printed circuit board substrate
KR20140026127A (ko) 인쇄회로기판 제조 방법
JPH07288375A (ja) 回路基板
US7057293B2 (en) Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same
JP2001156488A (ja) シールドケース付き電子部品及びその製造方法
JP2003174251A (ja) 電子部品の実装方法
JP2004079666A (ja) プリント基板、プリント基板の製造方法および電子部品の実装方法
US6429389B1 (en) Via-in-pad apparatus and methods
JPH05129753A (ja) デイスクリート部品およびデイスクリート部品のプリント基板実装方法
JP2006066811A (ja) はんだ印刷用マスク、部品実装方法
JP2001358448A (ja) 半田ペースト塗布用マスクおよびこれを用いた電子部品の実装方法
JP2008066344A (ja) 多層基板と金属接合材料の印刷方法
JPH02222195A (ja) フットプリント内バイアホールを穴埋めした多層配線板の製造方法
JP2004200278A (ja) 回路基板アセンブリ
JP2003142812A (ja) チップ部品の実装方法
JPH11340361A (ja) Ｂｇａ型半導体装置、及び同半導体装置のバンプ形成方法
JPH11214830A (ja) サブストレ−トの製造方法
JPH06283834A (ja) 配線回路板、その製造方法及びリード接続方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041129

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070129

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070306