JP2003172745A - 半導体加速度センサ - Google Patents
半導体加速度センサInfo
- Publication number
- JP2003172745A JP2003172745A JP2001363371A JP2001363371A JP2003172745A JP 2003172745 A JP2003172745 A JP 2003172745A JP 2001363371 A JP2001363371 A JP 2001363371A JP 2001363371 A JP2001363371 A JP 2001363371A JP 2003172745 A JP2003172745 A JP 2003172745A
- Authority
- JP
- Japan
- Prior art keywords
- mass
- pairs
- acceleration sensor
- elastic
- semiconductor acceleration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001133 acceleration Effects 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000002093 peripheral effect Effects 0.000 claims abstract description 3
- 230000035945 sensitivity Effects 0.000 description 20
- 239000013078 crystal Substances 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 238000005530 etching Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 102100033007 Carbonic anhydrase 14 Human genes 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000867862 Homo sapiens Carbonic anhydrase 14 Proteins 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0109—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001363371A JP2003172745A (ja) | 2001-09-26 | 2001-11-28 | 半導体加速度センサ |
| US10/243,650 US20030057447A1 (en) | 2001-09-26 | 2002-09-16 | Acceleration sensor |
| EP02021223A EP1298442A1 (en) | 2001-09-26 | 2002-09-18 | Acceleration sensor |
| KR1020020057700A KR20030026872A (ko) | 2001-09-26 | 2002-09-24 | 가속도 센서 |
| CN02143502A CN1409118A (zh) | 2001-09-26 | 2002-09-26 | 加速度传感器 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-293526 | 2001-09-26 | ||
| JP2001293526 | 2001-09-26 | ||
| JP2001363371A JP2003172745A (ja) | 2001-09-26 | 2001-11-28 | 半導体加速度センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003172745A true JP2003172745A (ja) | 2003-06-20 |
| JP2003172745A5 JP2003172745A5 (enExample) | 2005-04-07 |
Family
ID=26622909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001363371A Pending JP2003172745A (ja) | 2001-09-26 | 2001-11-28 | 半導体加速度センサ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20030057447A1 (enExample) |
| EP (1) | EP1298442A1 (enExample) |
| JP (1) | JP2003172745A (enExample) |
| KR (1) | KR20030026872A (enExample) |
| CN (1) | CN1409118A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006329885A (ja) * | 2005-05-27 | 2006-12-07 | Dainippon Printing Co Ltd | 角速度センサおよびその製造方法 |
| US8418558B2 (en) | 2009-05-29 | 2013-04-16 | Torex Semiconductor Ltd. | Acceleration sensor element and acceleration sensor having same |
| US8474318B2 (en) | 2007-07-27 | 2013-07-02 | Hitachi Metals, Ltd. | Acceleration sensor |
| CN105021846A (zh) * | 2015-07-06 | 2015-11-04 | 西安交通大学 | 一种六轴一体式微加速度传感器及其制作方法 |
| US10444015B2 (en) | 2014-03-20 | 2019-10-15 | Kyocera Corporation | Sensor for detecting angular velocity |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1491901A1 (en) | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
| JP4416460B2 (ja) * | 2003-09-16 | 2010-02-17 | トレックス・セミコンダクター株式会社 | 加速度センサー |
| JP2006214743A (ja) * | 2005-02-01 | 2006-08-17 | Matsushita Electric Works Ltd | 半導体加速度センサ |
| JP2006275896A (ja) * | 2005-03-30 | 2006-10-12 | Yokohama Rubber Co Ltd:The | 半導体加速度センサ |
| JP4832802B2 (ja) * | 2005-05-30 | 2011-12-07 | Okiセミコンダクタ株式会社 | 半導体加速度センサ装置及びその製造方法 |
| ITTO20070033A1 (it) * | 2007-01-19 | 2008-07-20 | St Microelectronics Srl | Dispositivo microelettromeccanico ad asse z con struttura di arresto perfezionata |
| CN102967729A (zh) * | 2012-09-18 | 2013-03-13 | 华东光电集成器件研究所 | 一种压阻式mems加速度计 |
| TWI506278B (zh) * | 2012-12-06 | 2015-11-01 | Murata Manufacturing Co | High Voltage Resistive MEMS Sensors |
| WO2016120213A1 (en) | 2015-01-26 | 2016-08-04 | Cirrus Logic International Semiconductor Limited | Mems devices and processes |
| CN107963095B (zh) * | 2017-11-23 | 2020-06-02 | 交控科技股份有限公司 | 车轮速度传感器、检测装置及车轴状态检测方法 |
| WO2021042316A1 (zh) * | 2019-09-05 | 2021-03-11 | 深圳市柔宇科技有限公司 | 加速度传感器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2940293B2 (ja) * | 1992-03-31 | 1999-08-25 | 日産自動車株式会社 | 半導体加速度センサの製造方法 |
| EP0567075B1 (en) * | 1992-04-22 | 2001-10-24 | Denso Corporation | A method for producing semiconductor device |
| JP2776142B2 (ja) * | 1992-05-15 | 1998-07-16 | 株式会社日立製作所 | 加速度センサ |
| JPH06148229A (ja) * | 1992-11-04 | 1994-05-27 | Fujikura Ltd | 半導体加速度センサ |
| JP2639308B2 (ja) * | 1992-11-19 | 1997-08-13 | 富士電機株式会社 | 力センサ,温度センサおよび温度・力センサ装置 |
| JPH08107219A (ja) * | 1994-10-04 | 1996-04-23 | Seiko Instr Inc | 半導体加速度センサ及び半導体加速度センサの製造方法 |
| JP3305516B2 (ja) * | 1994-10-31 | 2002-07-22 | 株式会社東海理化電機製作所 | 静電容量式加速度センサ及びその製造方法 |
| FR2742230B1 (fr) * | 1995-12-12 | 1998-01-09 | Sextant Avionique | Accelerometre et procede de fabrication |
| US5894090A (en) * | 1996-05-31 | 1999-04-13 | California Institute Of Technology | Silicon bulk micromachined, symmetric, degenerate vibratorygyroscope, accelerometer and sensor and method for using the same |
| AU4722097A (en) * | 1997-02-21 | 1998-09-09 | Matsushita Electric Works Ltd. | Acceleration sensor element and method of its manufacture |
| US6196067B1 (en) * | 1998-05-05 | 2001-03-06 | California Institute Of Technology | Silicon micromachined accelerometer/seismometer and method of making the same |
-
2001
- 2001-11-28 JP JP2001363371A patent/JP2003172745A/ja active Pending
-
2002
- 2002-09-16 US US10/243,650 patent/US20030057447A1/en not_active Abandoned
- 2002-09-18 EP EP02021223A patent/EP1298442A1/en not_active Withdrawn
- 2002-09-24 KR KR1020020057700A patent/KR20030026872A/ko not_active Withdrawn
- 2002-09-26 CN CN02143502A patent/CN1409118A/zh active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006329885A (ja) * | 2005-05-27 | 2006-12-07 | Dainippon Printing Co Ltd | 角速度センサおよびその製造方法 |
| US8474318B2 (en) | 2007-07-27 | 2013-07-02 | Hitachi Metals, Ltd. | Acceleration sensor |
| US8418558B2 (en) | 2009-05-29 | 2013-04-16 | Torex Semiconductor Ltd. | Acceleration sensor element and acceleration sensor having same |
| US10444015B2 (en) | 2014-03-20 | 2019-10-15 | Kyocera Corporation | Sensor for detecting angular velocity |
| CN105021846A (zh) * | 2015-07-06 | 2015-11-04 | 西安交通大学 | 一种六轴一体式微加速度传感器及其制作方法 |
| CN105021846B (zh) * | 2015-07-06 | 2018-04-17 | 西安交通大学 | 一种六轴一体式微加速度传感器及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030057447A1 (en) | 2003-03-27 |
| EP1298442A1 (en) | 2003-04-02 |
| KR20030026872A (ko) | 2003-04-03 |
| CN1409118A (zh) | 2003-04-09 |
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