JP2003172745A - 半導体加速度センサ - Google Patents

半導体加速度センサ

Info

Publication number
JP2003172745A
JP2003172745A JP2001363371A JP2001363371A JP2003172745A JP 2003172745 A JP2003172745 A JP 2003172745A JP 2001363371 A JP2001363371 A JP 2001363371A JP 2001363371 A JP2001363371 A JP 2001363371A JP 2003172745 A JP2003172745 A JP 2003172745A
Authority
JP
Japan
Prior art keywords
mass
pairs
acceleration sensor
elastic
semiconductor acceleration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001363371A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003172745A5 (enExample
Inventor
Masakatsu Saito
正勝 斎藤
Shigenori Tanaka
茂徳 田中
Yoshio Ikeda
由夫 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2001363371A priority Critical patent/JP2003172745A/ja
Priority to US10/243,650 priority patent/US20030057447A1/en
Priority to EP02021223A priority patent/EP1298442A1/en
Priority to KR1020020057700A priority patent/KR20030026872A/ko
Priority to CN02143502A priority patent/CN1409118A/zh
Publication of JP2003172745A publication Critical patent/JP2003172745A/ja
Publication of JP2003172745A5 publication Critical patent/JP2003172745A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/053—Translation according to an axis perpendicular to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/058—Rotation out of a plane parallel to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
JP2001363371A 2001-09-26 2001-11-28 半導体加速度センサ Pending JP2003172745A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001363371A JP2003172745A (ja) 2001-09-26 2001-11-28 半導体加速度センサ
US10/243,650 US20030057447A1 (en) 2001-09-26 2002-09-16 Acceleration sensor
EP02021223A EP1298442A1 (en) 2001-09-26 2002-09-18 Acceleration sensor
KR1020020057700A KR20030026872A (ko) 2001-09-26 2002-09-24 가속도 센서
CN02143502A CN1409118A (zh) 2001-09-26 2002-09-26 加速度传感器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001293526 2001-09-26
JP2001-293526 2001-09-26
JP2001363371A JP2003172745A (ja) 2001-09-26 2001-11-28 半導体加速度センサ

Publications (2)

Publication Number Publication Date
JP2003172745A true JP2003172745A (ja) 2003-06-20
JP2003172745A5 JP2003172745A5 (enExample) 2005-04-07

Family

ID=26622909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001363371A Pending JP2003172745A (ja) 2001-09-26 2001-11-28 半導体加速度センサ

Country Status (5)

Country Link
US (1) US20030057447A1 (enExample)
EP (1) EP1298442A1 (enExample)
JP (1) JP2003172745A (enExample)
KR (1) KR20030026872A (enExample)
CN (1) CN1409118A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006329885A (ja) * 2005-05-27 2006-12-07 Dainippon Printing Co Ltd 角速度センサおよびその製造方法
US8418558B2 (en) 2009-05-29 2013-04-16 Torex Semiconductor Ltd. Acceleration sensor element and acceleration sensor having same
US8474318B2 (en) 2007-07-27 2013-07-02 Hitachi Metals, Ltd. Acceleration sensor
CN105021846A (zh) * 2015-07-06 2015-11-04 西安交通大学 一种六轴一体式微加速度传感器及其制作方法
US10444015B2 (en) 2014-03-20 2019-10-15 Kyocera Corporation Sensor for detecting angular velocity

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491901A1 (en) 2003-06-25 2004-12-29 Matsushita Electric Works, Ltd. Semiconductor acceleration sensor and method of manufacturing the same
JP4416460B2 (ja) * 2003-09-16 2010-02-17 トレックス・セミコンダクター株式会社 加速度センサー
JP2006214743A (ja) * 2005-02-01 2006-08-17 Matsushita Electric Works Ltd 半導体加速度センサ
JP2006275896A (ja) * 2005-03-30 2006-10-12 Yokohama Rubber Co Ltd:The 半導体加速度センサ
JP4832802B2 (ja) * 2005-05-30 2011-12-07 Ｏｋｉセミコンダクタ株式会社 半導体加速度センサ装置及びその製造方法
ITTO20070033A1 (it) * 2007-01-19 2008-07-20 St Microelectronics Srl Dispositivo microelettromeccanico ad asse z con struttura di arresto perfezionata
CN102967729A (zh) * 2012-09-18 2013-03-13 华东光电集成器件研究所 一种压阻式mems加速度计
TWI506278B (zh) * 2012-12-06 2015-11-01 村田製作所股份有限公司 High Voltage Resistive MEMS Sensors
CN107211223B (zh) 2015-01-26 2020-04-03 思睿逻辑国际半导体有限公司 Mems换能器
CN107963095B (zh) * 2017-11-23 2020-06-02 交控科技股份有限公司 车轮速度传感器、检测装置及车轴状态检测方法
CN113366321A (zh) * 2019-09-05 2021-09-07 深圳市柔宇科技股份有限公司 加速度传感器
CN116499460B (zh) * 2023-04-27 2026-03-27 南京邮电大学 一种基于氮化镓的八梁结构惯导系统及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2940293B2 (ja) * 1992-03-31 1999-08-25 日産自動車株式会社 半導体加速度センサの製造方法
EP1119032B8 (en) * 1992-04-22 2008-03-19 Denso Corporation A method for producing a semiconductor device
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
JPH06148229A (ja) * 1992-11-04 1994-05-27 Fujikura Ltd 半導体加速度センサ
JP2639308B2 (ja) * 1992-11-19 1997-08-13 富士電機株式会社 力センサ，温度センサおよび温度・力センサ装置
JPH08107219A (ja) * 1994-10-04 1996-04-23 Seiko Instr Inc 半導体加速度センサ及び半導体加速度センサの製造方法
JP3305516B2 (ja) * 1994-10-31 2002-07-22 株式会社東海理化電機製作所 静電容量式加速度センサ及びその製造方法
FR2742230B1 (fr) * 1995-12-12 1998-01-09 Sextant Avionique Accelerometre et procede de fabrication
US5894090A (en) * 1996-05-31 1999-04-13 California Institute Of Technology Silicon bulk micromachined, symmetric, degenerate vibratorygyroscope, accelerometer and sensor and method for using the same
EP0899574B1 (en) * 1997-02-21 2004-07-21 Matsushita Electric Works, Ltd. Acceleration sensor element and method of its manufacture
US6196067B1 (en) * 1998-05-05 2001-03-06 California Institute Of Technology Silicon micromachined accelerometer/seismometer and method of making the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006329885A (ja) * 2005-05-27 2006-12-07 Dainippon Printing Co Ltd 角速度センサおよびその製造方法
US8474318B2 (en) 2007-07-27 2013-07-02 Hitachi Metals, Ltd. Acceleration sensor
US8418558B2 (en) 2009-05-29 2013-04-16 Torex Semiconductor Ltd. Acceleration sensor element and acceleration sensor having same
US10444015B2 (en) 2014-03-20 2019-10-15 Kyocera Corporation Sensor for detecting angular velocity
CN105021846A (zh) * 2015-07-06 2015-11-04 西安交通大学 一种六轴一体式微加速度传感器及其制作方法
CN105021846B (zh) * 2015-07-06 2018-04-17 西安交通大学 一种六轴一体式微加速度传感器及其制作方法

Also Published As

Publication number Publication date
CN1409118A (zh) 2003-04-09
KR20030026872A (ko) 2003-04-03
EP1298442A1 (en) 2003-04-02
US20030057447A1 (en) 2003-03-27

Similar Documents

Publication Publication Date Title
KR100715644B1 (ko) 가속도 센서
JP2003232803A (ja) 半導体型加速度センサ
KR100301097B1 (ko) 가속도센서용소자및그제조방법
US20040025591A1 (en) Accleration sensor
JPH0479420B2 (enExample)
US20030057447A1 (en) Acceleration sensor
JP4335545B2 (ja) 圧力と加速度との双方を検出するセンサおよびその製造方法
US6763719B2 (en) Acceleration sensor
EP1517151A1 (en) Acceleration sensor
JP3985214B2 (ja) 半導体加速度センサー
JP4589605B2 (ja) 半導体多軸加速度センサ
JP2004177357A (ja) 半導体加速度センサ
JP2006098321A (ja) 半導体型３軸加速度センサ
JP3191770B2 (ja) 半導体加速度センサ及びその製造方法
JP3985215B2 (ja) 半導体加速度センサー
CN100422697C (zh) 加速度传感器
JP3405219B2 (ja) 半導体加速度センサ素子及びその製造方法
JP2010032389A (ja) 物理量センサ及びその製造方法
JPH1144705A (ja) 半導体加速度センサおよびその製造方法
JP5401820B2 (ja) センサ
JP5067295B2 (ja) センサ及びその製造方法
JP2005069946A (ja) 半導体加速度センサ
JPH07273351A (ja) 半導体センサ
JP3405222B2 (ja) 半導体加速度センサ素子及びその製造方法
JPH04192370A (ja) 半導体加速度センサ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040511

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040511

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060214

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060414