JP2003163435A - 回路構成要素の衝撃及び振動絶縁装置 - Google Patents

回路構成要素の衝撃及び振動絶縁装置

Info

Publication number
JP2003163435A
JP2003163435A JP2002333419A JP2002333419A JP2003163435A JP 2003163435 A JP2003163435 A JP 2003163435A JP 2002333419 A JP2002333419 A JP 2002333419A JP 2002333419 A JP2002333419 A JP 2002333419A JP 2003163435 A JP2003163435 A JP 2003163435A
Authority
JP
Japan
Prior art keywords
insulating material
support frame
component
integrated circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002333419A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003163435A5 (enExample
Inventor
Thomas J Augustin
トーマス・ジェイ・オーグスティン
Christopher G Malone
クリストファー・ジー・マローン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003163435A publication Critical patent/JP2003163435A/ja
Publication of JP2003163435A5 publication Critical patent/JP2003163435A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/233—Foamed or expanded material encased
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/237—Noninterengaged fibered material encased [e.g., mat, batt, etc.]
    • Y10T428/238—Metal cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Wire Bonding (AREA)
JP2002333419A 2001-11-16 2002-11-18 回路構成要素の衝撃及び振動絶縁装置 Withdrawn JP2003163435A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/990819 2001-11-16
US09/990,819 US6809937B2 (en) 2001-11-16 2001-11-16 Method and apparatus for shock and vibration isolation of a circuit component

Publications (2)

Publication Number Publication Date
JP2003163435A true JP2003163435A (ja) 2003-06-06
JP2003163435A5 JP2003163435A5 (enExample) 2006-01-12

Family

ID=25536548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002333419A Withdrawn JP2003163435A (ja) 2001-11-16 2002-11-18 回路構成要素の衝撃及び振動絶縁装置

Country Status (2)

Country Link
US (2) US6809937B2 (enExample)
JP (1) JP2003163435A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086976A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器、および半導体パッケージ
US11824301B2 (en) 2021-03-12 2023-11-21 Panasonic Intellectual Property Management Co., Ltd. Inter-board connection structure and power conversion apparatus

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US6914785B1 (en) * 2002-10-11 2005-07-05 Massachusetts Institute Of Technology Variable electronic circuit component
DE10337442A1 (de) * 2003-08-14 2005-03-10 Siemens Ag Vorrichtung zur Halterung
US20080028326A1 (en) * 2006-07-26 2008-01-31 Research In Motion Limited System and method for adaptive theming of a mobile device
ATE442766T1 (de) * 2006-10-17 2009-09-15 Delphi Tech Inc Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte
US20090014166A1 (en) * 2007-07-09 2009-01-15 Baker Hughes Incorporated Shock absorption for a logging instrument
US7863732B2 (en) * 2008-03-18 2011-01-04 Stats Chippac Ltd. Ball grid array package system
US7871862B2 (en) * 2008-09-08 2011-01-18 Stats Chippac Ltd. Ball grid array package stacking system
US8390112B2 (en) * 2008-09-30 2013-03-05 Intel Corporation Underfill process and materials for singulated heat spreader stiffener for thin core panel processing
JP5408260B2 (ja) * 2010-01-22 2014-02-05 千住金属工業株式会社 はんだカラムの製造方法、はんだカラムの製造装置及びはんだカラム
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
US8900927B2 (en) 2010-08-16 2014-12-02 International Business Machines Corporation Multichip electronic packages and methods of manufacture
US20130277818A1 (en) * 2011-01-20 2013-10-24 Chi Hock Goh Chip carrier support systems
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure
US10787303B2 (en) 2016-05-29 2020-09-29 Cellulose Material Solutions, LLC Packaging insulation products and methods of making and using same
US11078007B2 (en) 2016-06-27 2021-08-03 Cellulose Material Solutions, LLC Thermoplastic packaging insulation products and methods of making and using same
US10912224B2 (en) 2018-05-30 2021-02-02 Amazon Technologies, Inc. Thermally conductive vibration isolating connector
US11054193B2 (en) * 2018-05-30 2021-07-06 Amazon Technologies, Inc. Vehicle with vibration isolated electronics
US20220117079A1 (en) * 2021-12-17 2022-04-14 Intel Corporation Cooling assembly with dampened oscillation response

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US5200362A (en) 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5103292A (en) * 1989-11-29 1992-04-07 Olin Corporation Metal pin grid array package
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US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086976A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器、および半導体パッケージ
US11824301B2 (en) 2021-03-12 2023-11-21 Panasonic Intellectual Property Management Co., Ltd. Inter-board connection structure and power conversion apparatus

Also Published As

Publication number Publication date
US7185423B2 (en) 2007-03-06
US20030093897A1 (en) 2003-05-22
US6809937B2 (en) 2004-10-26
US20050022375A1 (en) 2005-02-03

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