JP2003163435A5 - - Google Patents

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Publication number
JP2003163435A5
JP2003163435A5 JP2002333419A JP2002333419A JP2003163435A5 JP 2003163435 A5 JP2003163435 A5 JP 2003163435A5 JP 2002333419 A JP2002333419 A JP 2002333419A JP 2002333419 A JP2002333419 A JP 2002333419A JP 2003163435 A5 JP2003163435 A5 JP 2003163435A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002333419A
Other languages
Japanese (ja)
Other versions
JP2003163435A (ja
Filing date
Publication date
Priority claimed from US09/990,819 external-priority patent/US6809937B2/en
Application filed filed Critical
Publication of JP2003163435A publication Critical patent/JP2003163435A/ja
Publication of JP2003163435A5 publication Critical patent/JP2003163435A5/ja
Withdrawn legal-status Critical Current

Links

JP2002333419A 2001-11-16 2002-11-18 回路構成要素の衝撃及び振動絶縁装置 Withdrawn JP2003163435A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/990819 2001-11-16
US09/990,819 US6809937B2 (en) 2001-11-16 2001-11-16 Method and apparatus for shock and vibration isolation of a circuit component

Publications (2)

Publication Number Publication Date
JP2003163435A JP2003163435A (ja) 2003-06-06
JP2003163435A5 true JP2003163435A5 (enExample) 2006-01-12

Family

ID=25536548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002333419A Withdrawn JP2003163435A (ja) 2001-11-16 2002-11-18 回路構成要素の衝撃及び振動絶縁装置

Country Status (2)

Country Link
US (2) US6809937B2 (enExample)
JP (1) JP2003163435A (enExample)

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US20080028326A1 (en) * 2006-07-26 2008-01-31 Research In Motion Limited System and method for adaptive theming of a mobile device
ATE442766T1 (de) * 2006-10-17 2009-09-15 Delphi Tech Inc Vorrichtung zur befestigung eines elektrischen bauteils auf einer leiterplatte
US20090014166A1 (en) * 2007-07-09 2009-01-15 Baker Hughes Incorporated Shock absorption for a logging instrument
US7863732B2 (en) * 2008-03-18 2011-01-04 Stats Chippac Ltd. Ball grid array package system
US7871862B2 (en) * 2008-09-08 2011-01-18 Stats Chippac Ltd. Ball grid array package stacking system
JP5185048B2 (ja) * 2008-09-29 2013-04-17 株式会社東芝 電子機器、および半導体パッケージ
US8390112B2 (en) * 2008-09-30 2013-03-05 Intel Corporation Underfill process and materials for singulated heat spreader stiffener for thin core panel processing
JP5408260B2 (ja) * 2010-01-22 2014-02-05 千住金属工業株式会社 はんだカラムの製造方法、はんだカラムの製造装置及びはんだカラム
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
US8900927B2 (en) 2010-08-16 2014-12-02 International Business Machines Corporation Multichip electronic packages and methods of manufacture
US20130277818A1 (en) * 2011-01-20 2013-10-24 Chi Hock Goh Chip carrier support systems
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure
US10787303B2 (en) 2016-05-29 2020-09-29 Cellulose Material Solutions, LLC Packaging insulation products and methods of making and using same
US11078007B2 (en) 2016-06-27 2021-08-03 Cellulose Material Solutions, LLC Thermoplastic packaging insulation products and methods of making and using same
US10912224B2 (en) 2018-05-30 2021-02-02 Amazon Technologies, Inc. Thermally conductive vibration isolating connector
US11054193B2 (en) * 2018-05-30 2021-07-06 Amazon Technologies, Inc. Vehicle with vibration isolated electronics
JP7576376B2 (ja) * 2021-03-12 2024-10-31 パナソニックオートモーティブシステムズ株式会社 基板間接続構造および電力変換装置
US20220117079A1 (en) * 2021-12-17 2022-04-14 Intel Corporation Cooling assembly with dampened oscillation response

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