JP2003133136A5 - - Google Patents
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- Publication number
- JP2003133136A5 JP2003133136A5 JP2001330746A JP2001330746A JP2003133136A5 JP 2003133136 A5 JP2003133136 A5 JP 2003133136A5 JP 2001330746 A JP2001330746 A JP 2001330746A JP 2001330746 A JP2001330746 A JP 2001330746A JP 2003133136 A5 JP2003133136 A5 JP 2003133136A5
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- layer
- conductor
- magnetic body
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 8
- 239000000696 magnetic material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 6
- 239000010409 thin film Substances 0.000 claims 2
- 239000010408 film Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 description 21
- 230000004907 flux Effects 0.000 description 11
- 239000000843 powder Substances 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000001659 ion-beam spectroscopy Methods 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910019586 CoZrTa Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001330746A JP2003133136A (ja) | 2001-10-29 | 2001-10-29 | 磁性部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001330746A JP2003133136A (ja) | 2001-10-29 | 2001-10-29 | 磁性部品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003133136A JP2003133136A (ja) | 2003-05-09 |
| JP2003133136A5 true JP2003133136A5 (enExample) | 2005-03-17 |
Family
ID=19146426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001330746A Pending JP2003133136A (ja) | 2001-10-29 | 2001-10-29 | 磁性部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003133136A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1536433A1 (en) * | 2003-11-28 | 2005-06-01 | Freescale Semiconductor, Inc. | High frequency thin film electrical circuit element |
| JP2006228983A (ja) * | 2005-02-17 | 2006-08-31 | Tdk Corp | コイル部品 |
| US7821371B2 (en) * | 2005-11-01 | 2010-10-26 | Kabushiki Kaisha Toshiba | Flat magnetic element and power IC package using the same |
| JP2008041833A (ja) * | 2006-08-03 | 2008-02-21 | Sony Corp | プレーナインダクタの製造方法及び検査方法 |
| WO2009063975A1 (ja) * | 2007-11-15 | 2009-05-22 | Meleagros Corporation | 電力伝送装置の空芯コイル、電力伝送装置のコイル、電力伝送装置、電力伝送装置の送電装置および電力伝送装置に使用される半導体集積回路 |
| KR101373540B1 (ko) * | 2010-05-17 | 2014-03-12 | 다이요 유덴 가부시키가이샤 | 기판 내장용 전자 부품 및 부품 내장형 기판 |
-
2001
- 2001-10-29 JP JP2001330746A patent/JP2003133136A/ja active Pending
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