JP2003103694A - Laminated body, its manufacturing method, and method for manufacturing wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which can cope with densification more cheaply by forming the wiring board by using a laminated foil having a barrier layer to utilize a both surfaces-exposing technique and a selective etching technique. SOLUTION: On both side surfaces of the laminated foil comprising the barrier layer composed of a metal or an alloy which is different in etching characteristics from Cu or Cu alloy and a first conductor layer and a second conductor layer which comprise the Cu or Cu alloy formed on both sides of the barrier layer, a first masking layer and a second masking layer which comprise a metal or an alloy different in etching characteristics from the Cu or the Cu alloy are formed by being registered with each other to provide a laminated body.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a laminate, a method for producing the same, and a method for producing a wiring board using the laminate.

[0002]

2. Description of the Related Art In recent years, with the rapid spread of portable information devices such as mobile phones and notebook computers, the weight, size and performance of the devices have been rapidly increasing. On the other hand, high density is required. In response to this, in printed wiring boards and semiconductor package wiring boards, fine wiring patterns and narrower pitches are being promoted, while multilayer wiring boards are becoming the mainstream.

Regarding inter-layer connection of a conventional multilayer wiring board,
For example, as shown schematically in Figure 7, (a) Double-sided Cu-clad resin
Using (10), (b) after forming a hole that penetrates Cu (11) and resin (12), (c) performs Cu plating (13) inside the hole to obtain interlayer conduction, (d) The method of forming a desired wiring pattern is used. In this technique, a so-called through hole (14) is formed using a drill or a laser, and through hole plating is performed. Further, for example, as schematically shown in FIG. 8, (e) resin-coated Cu foil (16) is arranged on both sides of the patterned core substrate (15), (f) build-up, and (g) inner layer After making holes using a laser so that the holes stop in the wiring layer, (h) Cu surface is plated with Cu, and (i) a wiring pattern is formed, so-called IVH (17) (Interstitial Via
What forms a hole) is the mainstream.

[0004]

In the wiring board having the through holes, laser drilling is necessary to cope with high density, and in the wiring board having the IVH, laser drilling is indispensable. However, laser drilling has poor positioning accuracy of ± several tens of μm and requires a large pad, which reduces the flexibility of wiring design and increases the cost of laser drilling as the number of holes increases. However, there are many factors that hinder high density. In addition, since the wiring and lands (including the leading wiring) are formed by etching after laser drilling and plating, the wiring thickness increases,
There is also a problem that it is difficult to miniaturize the wiring. An object of the present invention is to provide a wiring board that can cope with high density at a lower cost by forming a wiring board using a double-sided exposure technique and a selective etching technique using a laminated foil having a barrier layer. is there.

[0005]

The present inventor eliminates the need for a laser step and a plating step by forming a wiring board using a double-sided exposure technique and a selective etching technique using a laminated foil including a barrier layer. The present inventors have found that the wiring density of the wiring board can be increased and the cost can be reduced, and the present invention has been achieved.

That is, according to the present invention, a barrier layer made of a metal or an alloy having a different etching characteristic from Cu or a Cu alloy, a first conductor layer made of the Cu or Cu alloy formed on both sides of the barrier layer, and a first conductor layer On both surfaces of the laminated foil consisting of the two conductor layers, the first mask layer and the second mask layer on which a pattern made of a metal or an alloy having a different etching characteristic from the Cu or Cu alloy is formed, are positioned with respect to each other. It is a laminated body formed by combining. Preferably, the mask layer is made of Ni or Ni alloy, or the mask layer is Sn or
It is a laminated body made of Sn alloy. More preferably, the barrier layer is a laminated body made of a metal or alloy of Ti, Ni or Sn.

The present invention also provides a barrier layer made of a metal or an alloy having different etching characteristics from Cu or a Cu alloy, a first conductor layer made of Cu or a Cu alloy formed on both sides of the barrier layer, and Using a laminated foil consisting of two conductor layers,
At least, (1) a step of forming a resist on both surfaces of the laminated foil, (2) exposing both surfaces of the laminated foil,
Step of developing to form a concave pattern in the resist, (3)
On the concave pattern portion, on the concave pattern formed on the first conductor layer a first mask layer made of a metal or alloy having different etching characteristics from Cu or Cu alloy, and on the second conductor layer. On the concave pattern formed on
A step of forming a second mask layer made of a metal or an alloy having a different etching property from the Cu alloy by a plating method, and (4)
And a step of removing the resist remaining on both side surfaces of the laminated foil.

Further, the present invention provides a barrier layer made of a metal or an alloy having different etching characteristics from Cu or a Cu alloy, a first conductor layer made of Cu or a Cu alloy formed on both sides of the barrier layer, and Using a laminated foil consisting of two conductor layers,
At least (1) Cu or C on both surfaces of the laminated foil
A first mask layer made of a metal or alloy having a different etching property from the u alloy is formed on the first conductor layer, and Cu or Cu.
A step of forming a second mask layer made of a metal or an alloy having different etching characteristics from the alloy on the second conductor layer,
(2) a step of forming a resist on the first mask layer and the second mask layer, and (3) exposing both resists formed on the first mask layer and the second mask layer, , A step of developing to form a concave pattern in the resist,
(4) etching the concave pattern portion to form a pattern on the first mask layer and the second mask layer, and (5) remaining on the first mask layer and the second mask layer. And a step of removing the resist.

The present invention is also a method for manufacturing a wiring board using the above-mentioned laminated body, wherein at least (1) a protective layer is formed so as not to contact the second conductor layer of the laminated body with an etching solution. And (2) using an etching solution capable of selectively etching the first conductor layer exposed on the side of the first mask layer, using the first mask layer as an etching mask, A step of etching the exposed portion,
(3) etching the exposed portion of the barrier layer with an etchant capable of selectively etching the barrier layer with respect to the first conductor layer, (4) protecting the exposed portion of the second conductor layer A step of removing a layer, (5) a step of embedding the first mask layer, the first conductor layer and the barrier layer in an insulating layer, (6) for the second mask layer and the barrier layer A method for manufacturing a wiring board, which includes a step of etching an exposed portion of the second conductor layer by using an etching solution capable of selectively etching the second conductor layer and using the second mask layer as an etching mask. .

The present invention is also a method for manufacturing a wiring board using the above-mentioned laminated body, wherein at least (1) a protective layer is formed so as not to contact the second conductor layer of the laminated body with an etching solution. Step, and (2) using an etching solution capable of selectively etching the first conductor layer exposed on the first mask layer side, using the first mask layer as an etching mask, exposing the first conductor layer A step of etching the portion,
(3) removing the protective layer on the exposed portion of the second conductor layer, (4) embedding the first mask layer and the first conductor layer in an insulating layer, (5) second Using an etchant capable of selectively etching the second conductor layer exposed on the mask layer side, using the second mask layer as an etching mask, and etching the exposed portion of the second conductor layer, And (6) a step of etching the exposed portion of the barrier layer with an etchant capable of selectively etching the barrier layer with respect to the second conductor layer.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below. The present invention is characterized in that metal mask layers having etching selectivity are formed in alignment with each other on both surfaces of a laminated foil including a barrier layer. In particular,
As shown in FIG. 1, an important feature of the present invention is that a barrier layer (2) having etching characteristics different from those of Cu or Cu alloy and a first conductor made of Cu or Cu alloy formed on both sides of the barrier layer. On both side surfaces of the laminated foil (4) consisting of the layer (1) and the second conductor layer (3), a pattern made of a metal or alloy having different etching characteristics from the Cu or Cu alloy is formed. The mask layer (5) and the second mask layer (6) are formed in alignment with each other. The greatest advantage of using the laminated body of the present invention is that by performing double-sided exposure, it is possible to eliminate the positional deviation of the patterns formed in the first conductor layer and the second conductor layer, and to achieve high-density wiring design. There is a great deal of freedom.

First, a method for obtaining the laminate of the present invention will be described. The first method of obtaining the laminate of the present invention will be described below with reference to FIG. (a) A laminated foil (4) in which a barrier layer (2) is sandwiched between a first conductor layer (1) made of Cu or a Cu alloy and a second conductor layer (3) made of Cu or a Cu alloy. To prepare. The barrier layer is Cu
Alternatively, the Cu alloy is a metal or alloy having different etching characteristics. The method for manufacturing this laminated foil will be described later. (b) A resist (7) is attached to both sides of the laminated foil, and exposed and developed using a double-sided exposure technique to form concave patterns in the resist. The concave pattern formation at this time is formed at the position of the mask layer for forming a pattern such as a wiring at a desired position. For example, when the pattern of the mask layer is formed by, for example, a plating method, the position of the front and back patterns is Make sure that the front and back surfaces are aligned so that they do not shift excessively.

Next, (c) By the above process, the first and second conductor layers are exposed in the resist recess. The first mask layer is formed on the exposed portions of the first and second conductor layers, respectively.
(5) and the second mask layer (6) are formed by, for example, a plating method. At this time, the material of the plating layer has a different etching characteristic from that of Cu or Cu alloy, which is the material of the first and second conductor layers. Then, (d) the resist (7) remaining on both sides (front and back sides) of the laminated foil is removed to obtain a laminate as shown in FIG. 1 of the present invention.

By the way, since the first conductor layer and the second conductor layer form a pattern by selective etching, a thinner thickness is preferable because finer wiring can be formed at a narrow pitch. When forming bumps and wirings, the corresponding conductor layers are preferably 150 μm or less and 50 μm or less. More preferably, they are 115 μm or less and 35 μm or less, respectively. On the other hand, the barrier layer needs to have a thickness that functions as an etching barrier, and is preferably as thin as possible so that it can be quickly removed by selective etching. The thickness of the barrier layer varies depending on the material, but is preferably 0.05 μm to 5 μm, more preferably 0.1 μm to 1 μm.
Further, the thickness of the first and second mask layers needs to be a thickness that can function as an etching mask, but if it is too thick, the etching of the first and second conductor layers may not be fine. Therefore, 0.5 μm to 10 μm is preferable,
More preferably, it is 1 μm to 8 μm.

Next, the material for the first conductor layer and the second conductor layer is preferably a metal or alloy having a low electric resistance, and is defined as Cu or Cu alloy widely used as a wiring material. Cu alloys are used for lead frames, etc. Cu-Fe alloys, Cu-Fe-Co alloys, Cu-Ni-Si alloys, Cu-Cr-Ti alloys, Cu-Cr-Zr alloys, Cu-Zr It is good to select from a system alloy etc. For example, the first conductor layer and the second conductor layer may be the same material or different materials. Further, as the barrier layer, it is possible to selectively etch the first conductor layer and the second conductor layer, and it is necessary to obtain conduction between the first conductor layer and the second conductor layer. Therefore, metal is preferable,
Metals or alloys of Ti, Ni, Sn that function as a barrier against the selective etching solution for the conductor layer described above are preferable.

Further, in the present invention, the barrier layer and the first and second mask layers may be the same or different. In particular, the first and second mask layers may be removed by etching when etching the exposed portion of the barrier layer, but generally Ni / Au plating on the surface of Cu, Sn plating,
Or, since it is often used after surface treatment such as pre-flux, use the mask layer for the above purposes or leave it as a part of the wiring board and use it as the bonding promotion layer of the multilayer laminate. Is also possible. As mentioned above Ni
Is commonly used as a diffusion barrier, on which
It is recommended to use after plating with Au. Therefore, the first and second mask layers are preferably Ni or Ni alloy. Further, Sn can be used for protection of wiring and is also effective for bonding. Therefore, the first and second mask layers may be Sn or Sn alloy.

The preferred combinations of the first mask layer / first conductor layer / barrier layer / second conductor layer / second mask layer of the laminate of the present invention are listed below. / Ti
/ Cu / Ni, Sn / Cu / Ti / Cu / Sn, Ni / Cu / Sn / Cu / Ni, Sn / Cu / Sn / C
u / Sn, Sn / Cu / Ni / Cu / Sn, Ni / Cu / Ni / Cu / Ni and the like are preferable.

The second method of obtaining the laminate of the present invention will be described below with reference to FIG. (a) First, the first conductor layer shown in the above-mentioned first manufacturing method
(1) / barrier layer (2) / prepare a laminated foil having a structure of the second conductor layer (3), the first mask layer (5) and the second mask respectively on the front and back of the laminated foil. Forming layer (6), first mask layer
A material for a laminate having a structure of / first conductor layer / barrier layer / second conductor layer / second mask layer is prepared. The mask layer and the barrier layer are made of a metal or an alloy having different etching characteristics from Cu or a Cu alloy.

(B) A resist (7) is attached to both surfaces, and a double-sided exposure technique is used to perform exposure and development to form concave patterns on the resist. Since the concave pattern formation at this time forms a pattern such as wiring at a desired position, it is formed at a position where the mask layer that first appears in the concave portion is removed by etching, and the pattern positions on the front and back surfaces are not excessively displaced. First, align the front and back sides. (c) Next, using the resist pattern formed in (b) as an etching mask, the first and second mask layers exposed in the recesses of the resist are selectively etched to obtain a mask layer pattern. (d) Then, the resist remaining on the first and second mask layers is removed to obtain the laminate of the present invention as shown in FIG.

Although not particularly limited in the present invention, the method for producing the laminated foil used in the present invention described above includes a method of sequentially laminating by plating, a plating method or a dry film forming method and a surface activated bonding method. A combination and the like are preferable. The dry film forming method refers to all dry film forming methods using vapor phase or plasma, such as physical vapor deposition method and chemical vapor deposition method. A method of forming a film by ionizing and accelerating a material that has been heated in a vacuum and evaporating, a method of striking a desired atom by bombarding a gas ion like sputtering, or a special crucible is used. It also includes a molecular beam vapor deposition method in which a material is drawn out in a molecular beam shape and evaporated (above, physical vapor deposition method), and a film forming method in which a certain gas is heated and reacted like a chemical vapor deposition method.

Among them, physical vapor deposition methods such as vacuum vapor deposition method, sputtering method and ion plating method, which are remarkably speeding up the film forming technique in recent years, are suitable. The vacuum deposition method has high deposition rate and good productivity. The sputtering method can be applied even when the metal to be the conductor layer is a high melting point metal,
The metal used as the conductor layer has a wide selection range, and a dry film-forming layer formed by any method enables uniform and uniform film formation.

Specifically, for example, a desired first barrier layer and a desired second barrier layer are formed on at least one surface of the second conductor layer by a plating method or a dry film forming method, and the first barrier layer is formed. It is preferable that the surface of the layer and the surface of the first conductor layer are ion bombarded in an inert atmosphere, and the activated surfaces are joined so as to face each other. In the case of the plating method, the material for the barrier layer is limited to the one that can be plated. On the other hand, in the dry film forming method, a material that cannot be obtained by the plating method can be used as the barrier layer, but the film can be formed only on each side.

As another method, materials for the first conductor layer and the second conductor layer are prepared, and a material for the barrier layer is formed on one surface of each by a dry film formation method in a vacuum chamber. Then, the film-forming surfaces are butted against each other and bonded to each other to produce a three-layer laminated foil. When a five-layer laminated foil is required, the first and second barrier layers may be further formed on both surfaces of the laminated foil by a plating method or a dry film forming method. The laminated foil of the present invention is not limited to the one produced by the above manufacturing method.

Next, a method for manufacturing a wiring board using the laminate of the present invention obtained in the above steps will be shown and specifically described. For example, as shown in FIG. 4, first, (e) first mask layer (5) / first conductor layer (1) / barrier layer (2)
A laminate of the present invention having a structure of / second conductor layer (3) / second bamask layer (6) is prepared. (f) The protective layer (8) is formed so that the second conductor layer (3) does not come into contact with the etching solution. A resist or a peelable film may be used for the protective layer. The resist may be a dry film type laminate, or a liquid type may be applied by a method such as dipping or spin coating. (g) First conductor layer (1) exposed on the side of the first mask layer (5)
The exposed portion of the first conductor layer is etched using the first mask layer (5) as an etching mask using an etching solution that selectively etches.

Next, as shown in FIG. 5, (h) the exposed portion of the barrier layer (2) is etched using an etchant capable of selectively etching the barrier layer with respect to the first conductor layer. At this time, if the first mask layer is of the same kind as the barrier layer, it is removed. If the first mask layer has a barrier function for the etching solution of the barrier layer, the first mask layer is removed. It can remain. As will be described later, the first mask layer may be used as a base layer for external connection. Further, the protective layer (8) formed in (i) and (f) is removed. In the case of resist, it can be removed with an alkali such as caustic soda or caustic potash. Moreover, a peelable film can be easily peeled off.

Next, (j) part of the etched first mask layer, first conductor layer and barrier layer is embedded in the insulating layer (9). here,
In order to expose the tip of the first mask layer or the first conductor layer, surface grinding or the like is performed in some cases. If the first mask layer is unnecessary, it may be removed by grinding. And (k) Cu or C for the second mask and barrier layers.
The exposed portion of the second conductor layer (3) is etched using an etching solution capable of selectively etching the u alloy to obtain a wiring board. As described above, by using the laminated body of the present invention, it is possible to eliminate the positional deviation between the patterns formed on the first conductor layer and the second conductor layer.

Further, as a method of forming a wiring board of the present invention,
In addition to the above, for example, as shown in FIG. 4, first, (e) the first mask layer (5) / first conductor layer (1) / barrier layer (2)
A laminate of the present invention having a structure of / second conductor layer (3) / second bamask layer (6) is prepared. (f) The protective layer (8) is formed so that the second conductor layer (3) does not come into contact with the etching solution. A resist or a peelable film may be used for the protective layer. The resist may be a dry film type laminate, or a liquid type may be applied by a method such as dipping or spin coating. (g) First conductor layer (1) exposed on the side of the first mask layer (5)
The exposed portion of the first conductor layer is etched using the first mask layer (5) as an etching mask using an etching solution that selectively etches.

Next, as shown in FIG. 6, (h) the protective layer is removed. In the case of resist, it can be removed with an alkali such as caustic soda or caustic potash. Moreover, a peelable film can be easily peeled off. (i) After the first mask layer and the first conductor layer are embedded in the insulating layer (9), (j) the second conductor layer exposed on the second mask layer (6) side
Using an etchant capable of selectively etching (3), the second mask layer (6) as an etching mask,
The exposed portion of the second conductor layer (3) is etched. Further, (k) the barrier layer (2) is removed by etching. Even in the above steps, by using the laminated body of the present invention, it is possible to eliminate the positional deviation of the patterns formed in the first conductor layer and the second conductor layer.

As the selective etching solution for the conductor layer, a ferric chloride solution, a cupric chloride solution, an alkaline etchant and the like, which are generally used as an etching solution for copper, are preferable. In particular, the alkaline etchant is suitable because it can selectively etch Cu or Cu alloy with respect to many metals.

By the way, the obtained wiring board may be used as a wiring board with bumps. After applying Au plating for external connection, or joining with paste or solder balls as it is. It is also possible to stack similar wiring boards with bumps to form a multilayer wiring board. In addition, the laminated foil of the present invention is not limited to the use for manufacturing the wiring with bumps shown here, and different patterns are formed in the first conductor layer and the second conductor layer by using the selective etching technique. It goes without saying that it can be used for technology.

If this technique is used, bumps can be collectively formed by selective etching instead of laser drilling, which increases cost due to an increase in the number of holes, which is advantageous in terms of cost and can be applied to high density. . Further, since there is no plating step and the wiring thickness can be reduced, it is possible to cope with the miniaturization of wiring.

Specifically, the wiring with bumps is wire-bonded to the wiring using, for example, an Au wire, mounted with a semiconductor element, filled with a molding resin, and a solder ball is placed on the tip of the bump on the wiring board. It may be a semiconductor element mounting package. The connection between the semiconductor element and the wiring may be solder bump bonding instead of wire bonding. Also, solder paste may be used instead of the solder balls. Alternatively, the wiring with bumps may be used to penetrate the insulating layer and be laminated to form a multilayer wiring board. In this case, a via-on-via structure can be formed, electrical characteristics are excellent, and useless lead wiring is unnecessary. Further, it may be built up in combination with a technique such as a laser via forming technique.

By using the laminated foil of the present invention, it is possible to use the double-sided simultaneous exposure technique, and it is possible to provide a wiring board that can cope with higher density at a lower cost.

[0034]

According to the present invention, by forming a wiring board using a double-sided exposure technique and a selective etching technique by using a laminated foil having a barrier layer, a wiring board which can cope with high density can be made cheaper. Can be provided to.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an example of a laminated foil of the present invention.

FIG. 2 is a schematic view showing an example of a method for manufacturing a laminate of the present invention.

FIG. 3 is a schematic view showing an example of a method for producing a laminate of the present invention.

FIG. 4 is a schematic view showing an example of a method for manufacturing a wiring board using the laminate of the present invention.

FIG. 5 is a schematic view showing an example of a method for manufacturing a wiring board using the laminate of the present invention.

FIG. 6 is a schematic view showing an example of a method for manufacturing a wiring board using the laminate of the present invention.

FIG. 7 is a schematic view showing an example of a conventional method for manufacturing a wiring board.

FIG. 8 is a schematic view showing an example of a conventional method for manufacturing a wiring board.

[Explanation of symbols] 1. First conductor layer, 2. Barrier layer, 3. Second conductor layer,
4. Laminated foil, 5. First mask layer, 6. Second mask layer, 7. Resist, 8. Protective layer, 9. Insulating layer, 10. Double-sided Cu tension resin, 11. Cu, 12. Resin, 13. Cu plating,
14. Through hole, 15. Core substrate, 16. With resin
Cu foil, 17. IVH

Continued front page    F-term (reference) 4F100 AB01A AB01D AB01E AB10A                       AB16A AB16D AB16E AB17B                       AB17C AB21A AB21D AB21E                       AB31A AB31B AB31C AB31D                       AB31E BA05 BA06 BA10D                       BA10E GB43 JD01A JG01B                       JG01C                 5E317 AA24 AA27 BB12 CC25 CD25                       CD27 GG14                 5E339 AB02 AD03 BC02 BD06 BE11                       BE13 BE17 CD05 CE17 CF07                       EE01

Claims (8)

[Claims] 1. A barrier layer made of a metal or an alloy having a different etching characteristic from Cu or a Cu alloy, and a first conductor layer and a second conductor made of the Cu or Cu alloy formed on both sides of the barrier layer. On both sides of the laminated foil consisting of layers, the Cu
Alternatively, the first mask layer and the second mask layer having a pattern formed of a metal or an alloy having a different etching characteristic from that of a Cu alloy are formed. 2. The laminated body according to claim 1, wherein the mask layer is made of Ni or a Ni alloy. 3. The laminate according to claim 1, wherein the mask layer is made of Sn or Sn alloy. 4. The laminate according to claim 1, wherein the barrier layer is made of a metal or an alloy of Ti, Ni or Sn. 5. A barrier layer made of a metal or an alloy having a different etching property from Cu or a Cu alloy, and a first conductor layer and a second conductor made of the Cu or Cu alloy formed on both sides of the barrier layer. Using a laminated foil consisting of layers, at least,
(1) a step of forming a resist on both side surfaces of the laminated foil, (2) a step of exposing and developing both side surfaces of the laminated foil to form a concave pattern in the resist, (3) in the concave pattern portion , A concave pattern formed on the first conductor layer, and a concave pattern formed on the first conductor layer, a first mask layer made of a metal or alloy having different etching characteristics from Cu or Cu alloy Cu or Cu alloy on the second mask layer made of a metal or alloy having different etching characteristics, a step of forming by plating, (4) a step of removing the resist remaining on both side surfaces of the laminated foil, A method for producing a laminate, comprising: 6. A barrier layer made of a metal or an alloy having a different etching characteristic from Cu or a Cu alloy, and a first conductor layer and a second conductor made of the Cu or Cu alloy formed on both sides of the barrier layer. Using a laminated foil consisting of layers, at least,
(1) On both side surfaces of the laminated foil, a first mask layer made of a metal or an alloy having different etching characteristics from Cu or Cu alloy is formed on the first conductor layer, and Cu or Cu alloy has etching characteristics. A step of forming a second mask layer made of a different metal or alloy on the second conductor layer, (2) a step of forming a resist on the first mask layer and the second mask layer, (3 ) A step of forming a concave pattern in the resist by exposing and developing both resists formed on the first mask layer and the second mask layer, and (4) etching the concave pattern portion, A step of forming a pattern on the first mask layer and the second mask layer, and (5) a step of removing the resist remaining on the first mask layer and the second mask layer, And a method for manufacturing a laminate. 7. A method of manufacturing a wiring board using the laminate according to claim 1, comprising at least (1)
A step of forming a protective layer so as not to contact the second conductor layer of the laminate with an etching solution, and (2) an etching solution capable of selectively etching the first conductor layer exposed on the first mask layer side. Using the first mask layer as an etching mask, a step of etching the exposed portion of the first conductor layer, (3) etching capable of selectively etching the barrier layer with respect to the first conductor layer Etching the exposed portion of the barrier layer with a liquid, (4) removing the protective layer of the exposed portion of the second conductor layer, (5) the first mask layer and the first A step of embedding the conductor layer and the barrier layer in an insulating layer, and (6) using the etching liquid capable of selectively etching the second conductor layer with respect to the second mask layer and the barrier layer, Using the mask layer as an etching mask, the second conductor Method for manufacturing a wiring board, which comprises a step of etching the exposed portion. 8. A method of manufacturing a wiring board using the laminate according to claim 1, comprising at least (1)
A step of forming a protective layer so as not to contact the second conductor layer of the laminate with an etching solution, and (2) an etching solution capable of selectively etching the first conductor layer exposed on the first mask layer side. Using the first mask layer as an etching mask, the step of etching the exposed portion of the first conductor layer, (3) the step of removing the protective layer of the exposed portion of the second conductor layer, (4) a step of embedding the first mask layer and the first conductor layer in an insulating layer, and (5) an etching solution capable of selectively etching the second conductor layer exposed on the second mask layer side. Using the second mask layer as an etching mask, the step of etching the exposed portion of the second conductor layer, (6) selectively etching the barrier layer with respect to the second conductor layer. The exposed portion of the barrier layer is etched with a possible etching solution. Method for manufacturing a wiring board, which comprises the step of quenching, the.