JP2003077775A - Method for manufacturing chip electronic component and chip electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of a chip electronic component where an end face electrode is formed on each end face of a component body to have an extension extending to a part of the side face, and a side face electrode is formed to surround the side face so that the extension of end face electrode becomes thinner than the side face electrode, and have one extension of end face electrode floats on the mounting surface to cause defective mounting. SOLUTION: Conductive paste 42 for the side face electrode and conductive pastes 44 and 45 for the extension of the end face electrode are applied simultaneously toward the side faces 5-8 of the component body 2. Subsequently, conductive paste for the end face electrode is applied toward respective end faces 3 and 4, thus preventing the extension of the end face electrode from becoming thinner than the side face electrode.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-shaped electronic component and a chip-shaped electronic component obtained by this manufacturing method, and more particularly to an improvement in a method for forming an external terminal electrode in the chip-shaped electronic component. It is a thing.

[0002]

2. Description of the Related Art For example, various electronic parts having respective functions such as a capacitor, a feedthrough capacitor, an inductor, a capacitor array, an LC composite part, a high frequency module, a capacitor network, and the like may have three or more external terminal electrodes. Also, some of these electronic components have a chip-like form. The chip-shaped electronic component of interest to the present invention is thus the chip-shaped electronic component having three or more external terminal electrodes.

FIG. 5 is a perspective view showing the external appearance of a chip-shaped electronic component 1 which is of interest to the present invention.

The chip-shaped electronic component 1 comprises a chip-shaped component body 2. The component body 2 includes first and second end surfaces 3 and 4 which face each other, and the first and second end surfaces 3 and 4.
Has first, second, third and fourth side faces 5, 6, 7 and 8 respectively connecting the end faces 3 and 4 thereof.
The first side surface 5 and the third side surface 7 face each other, and the second side surface 6 and the fourth side surface 8 face each other.

Further, three external terminal electrodes 9 to 11 are formed on the outer surface of the component body 2. These external terminal electrodes 9 to 11 are formed by applying a conductive paste onto the outer surface of the component body 2 and baking it.

The external terminal electrodes 9 to 11 are first and second end face electrodes 9 and 10 formed on the first and second end faces 3 and 4 of the component body 2, respectively, and the component body 2.
And a side surface electrode 11 formed between the first and second end surface electrodes 9 and 10 in a state of orbiting the first to fourth side surfaces 5 to 8.

Further, the first and second end face electrodes 9 and 10 respectively extend to part of each of the first to fourth side faces 5 to 8, and the first and second end face electrode extensions 12 and 13 are provided. have.

When the first and second end faces 3 and 4 of the component body 2 have a substantially square shape as in the chip-shaped electronic component 1 shown in FIG. 5, the first and third components are formed.
Since the side surfaces 5 and 7 and the second and fourth side surfaces 6 and 8 are indistinguishable from each other in appearance, that is, there is no directivity, the side surface electrode 11 has the first to fourth side surfaces 5 to 8. It is often formed in a state of orbiting.

On the other hand, when the end surface of the component body has a rectangular shape, it is possible to distinguish the appearance between the first and second side surfaces and the second and fourth side surfaces. For this reason, that is, since it has directionality, the formation mode of the external terminal electrodes as shown in FIG. 6 may be adopted.

FIG. 6 is a perspective view showing the appearance of another chip-shaped electronic component 21 which is of interest to the present invention.

The chip-shaped electronic component 21 includes a chip-shaped component body 22. The component body 22 includes first and second end faces 23 and 24 facing each other and the first and second end faces 23 and 24.
And the second, third, and fourth side surfaces 25, 26, 27, and 28 connecting the second end surfaces 23 and 24, respectively.

Further, first and second end face electrodes 29 and 30 are formed on the first and second end faces 23 and 24 of the component body 22, respectively, and the second and fourth side faces 26 and 28 are formed. The first and second end face electrodes 29 and 30 are provided between the first and second end faces, respectively.
Side electrodes 31 and 32 are formed.

First and second end face electrodes 29 and 30
Have first and second end face electrode extensions 33 and 34, respectively, extending to respective parts of the first to fourth side faces 25 to 28. On the other hand, the first and second side surface electrodes 31 and 32 have first and second side surface electrode extensions 35 and 36 extending to respective parts of the first and third side surfaces 25 and 27, respectively. ing.

In the chip-shaped electronic component 1 or 21, for example, the following method is used to apply the conductive paste to be the end face electrodes 9 and 10 or 29 and 30 and the side face electrodes 11 or 31 and 32. Has been done. The method for forming the end surface electrodes 9 and 10 and the side surface electrode 11 in the chip-shaped electronic component 1 and the method for forming the end surface electrodes 29 and 30 and the side surface electrodes 31 and 32 in the chip-shaped electronic component 21 are substantially the same. Hereinafter, the end face electrodes 9 and 10 and the side face electrode 11 in the chip-shaped electronic component 1 will be described.
A method of forming the will be described.

First, in order to apply a conductive paste to serve as the side surface electrodes 11, a slit plate provided with slits for passing the conductive paste is prepared.
Then, the component main body 2 is arranged with the first side surface 5 facing the one main surface side of the slit plate, and then the conductive paste is supplied so as to rise to the one main surface side of the slit plate through the slit. The conductive paste is applied onto the first side surface 5 by.

The same operation is performed on each of the second to fourth side surfaces 6 to 8 of the component body 2.

On the other hand, in order to apply the conductive paste to be the first end face electrode 9, a paste layer made of the conductive paste and having a predetermined thickness is formed, and the first end face 3 faces the paste layer. Dipped and then pulled up. Thereby, the conductive paste is applied on the first end face 3 and, at the same time, applied so as to extend to a part of each of the first to fourth side faces 5 to 8.

The same operation is performed by the second end surface 4 of the component body 2.
Will also be implemented.

The conductive paste thus applied becomes the first and second end face electrodes 9 and 10 and the side face electrode 11 by baking.

In addition, intaglio printing or letterpress printing may be applied in order to apply the conductive paste to be the side electrodes 11.

[0021]

FIG. 7 is for explaining the problem to be solved by the present invention, and shows a state in which the chip-shaped electronic component 1 shown in FIG. 1 is placed on the mounting surface 38. Shows.

As described above, the conductive paste to be the end face electrodes 9 and 10 and the conductive paste to be the side face electrode 11 are applied in separate steps, and the end face electrode extensions 12 and 13 are provided. Since the end face electrodes 9 and 10 are formed by a part of the conductive paste applied toward each of the end faces 3 and 4 of the component body 2, the thickness of the side face electrode 11 is equal to that of the end face electrode extensions 12 and 13. It tends to be thicker than each thickness.

When such a difference in thickness is caused between the side surface electrode 11 and the end surface electrode extensions 12 and 13,
As shown in FIG. 7, when the chip-shaped electronic component 1 is placed on the mounting surface 38, one end surface electrode extension, for example, the second end
There is a case where the end surface electrode extension 13 of the above is lifted or tilted from the mounting surface 38. The floating of the end surface electrode extension 13 causes a mounting failure of the chip-shaped electronic component 1.

In order to solve the above-mentioned problems, it is conceivable to intentionally apply a thick conductive paste to serve as the end face electrode extensions 12 and 13, for example, to the end face electrodes 9 and 10, respectively. It is effective to repeat the step of applying the conductive paste to be performed a plurality of times, but in this case, the number of steps of applying the conductive paste increases, which is not very advantageous in terms of manufacturing cost.

Further, as described above, since the application of the conductive paste to be the end surface electrodes 9 and 10 and the application of the conductive paste to be the side surface electrodes 11 are performed in different steps, It may be difficult to secure a predetermined gap between each of the end face electrode extensions 12 and 13 of the end face electrodes 9 and 10 and the side face electrode 11. In particular,
The longitudinal dimension of each of the side surfaces 5 to 8 of the component body 2 is 1.6.
In a chip-shaped electronic component 1 as small as less than mm,
This problem becomes more prominent.

Although not specifically described,
Also in the chip-shaped electronic component 21 shown in FIG. 6, a problem substantially similar to the problem described above may be encountered.

Therefore, an object of the present invention is to provide a method of manufacturing a chip-shaped electronic component and a chip-shaped electronic component obtained by this manufacturing method, which can solve the above-mentioned problems.

[0028]

According to the present invention, there are provided first and second end faces facing each other and first, second, third and fourth side faces for connecting the first and second end faces, respectively. A chip-shaped component body having a first side surface and a third side surface facing each other, and a second side surface and a fourth side surface facing each other, and on the outer surface of the component body An external terminal electrode formed by applying and baking a conductive paste to the first and second external terminal electrodes.
First and second end surface electrodes formed on the end surfaces of the first and second side surfaces, and side surface electrodes formed between the first and second end surface electrodes in a state of orbiting the first to fourth side surfaces. 1st and 2nd end surface electrodes are 1st thru | or 4th, respectively.
Firstly, a method of manufacturing a chip-shaped electronic component having first and second end face electrode extensions extending to respective portions of the side surfaces of the electronic component is first described.

In the method of manufacturing a chip-shaped electronic component as described above, in order to solve the above-mentioned technical problem, the present invention provides a step of preparing a component main body, and steps toward each of the first to fourth side surfaces. A side surface applying step of simultaneously applying a conductive paste for the side surface electrodes and a conductive paste for the first and second end surface electrode extensions, and a first side surface for each of the first and second end surfaces. And an end face providing step of applying a conductive paste for the second end face electrode, respectively.

It is preferable that the above-mentioned side face imparting step is carried out before the end face imparting step.

In the above case, in the end face providing step, the first
And the conductive paste for the second end surface electrode is applied so as not to exceed the application area of the conductive paste for each of the first and second end surface electrode extensions applied by the side surface applying step. It is preferable.

In the side surface applying step, in a preferred embodiment, a slit provided with slits for passing the conductive paste for the side surface electrodes and the conductive paste for the first and second end surface electrode extensions, respectively. A step of preparing the plate, a step of arranging the component main body with the first to fourth side faces facing the one main surface side of the slit plate, and then, applying the conductive paste through the slit to the one main surface of the slit plate. The step of applying the conductive paste to each of the first to fourth side surfaces by supplying the conductive paste so as to swell to the surface side is performed.

On the other hand, in the end face providing step, in a preferred embodiment, a step of forming a paste layer having a predetermined thickness made of a conductive paste for each of the first and second end face electrodes, and a step of moving toward the paste layer. And dipping each of the first and second end faces.

The present invention is also directed to a chip-shaped electronic component obtained by the manufacturing method as described above.

In the chip-shaped electronic component according to the present invention, it is preferable that the first and second end face electrode extensions have a thickness equal to or larger than the thickness of the side face electrode.

As described above, the present invention is not limited to a chip-shaped electronic component in which the side surface electrode is formed around the first to fourth side surfaces of the component body. It is also directed to a chip-shaped electronic component formed on the second and fourth side surfaces in a state of being separated from each other.

That is, in the second aspect of the present invention, the first, second, and third end faces that face each other and the first, second, and third end faces that connect the first and second end faces, respectively, are connected.
And a chip-shaped component body having a fourth side surface, a first side surface and a third side surface facing each other, and a second side surface and a fourth side surface facing each other. An external terminal electrode formed by applying and baking a conductive paste on the outer surface of the component body, wherein the external terminal electrode is formed on each of the first and second end faces.
And a second end face electrode and first and second side face electrodes formed on the second and fourth side faces and between the first and second end face electrodes, respectively. Two
End face electrodes each have first and second end face electrode extensions extending to respective portions of the first to fourth side faces, and the first and second side face electrodes respectively have first and second end face electrode extensions. The present invention is directed to a method of manufacturing a chip-shaped electronic component having first and second side surface electrode extensions extending to respective parts of the third side surface.

In order to solve the above-mentioned technical problems, the method of manufacturing a chip-shaped electronic component according to the second aspect of the present invention includes a step of preparing a component main body and a second step toward the second and fourth side surfaces. A first side surface applying step of simultaneously applying a conductive paste for the first and second side surface electrodes and a conductive paste for the first and second end surface electrode extensions, and first and third side surfaces And a second side surface applying step of simultaneously applying a conductive paste for the first and second end face electrode extensions to each of the first and second sides.
And an end face providing step of applying a conductive paste for the first and second end face electrodes to each of the end faces.

The above-mentioned first and second side surface giving steps are preferably carried out before the end surface giving step.

In the above case, in the end face providing step, the first
And the conductive paste for the second end face electrode is
It is preferable that the conductive paste is applied so as not to exceed the conductive paste application region for each of the first and second end face electrode extension parts provided by the second side surface applying step.

In the first side surface applying step, in a preferred embodiment, a conductive paste for each of the first and second side surface electrodes and a conductive paste for the first and second end surface electrode extensions are provided. A step of preparing a slit plate provided with slits for passing respectively, a step of arranging the component main body with each of the second and fourth side surfaces facing one main surface side of the slit plate, and then, The step of applying the conductive paste onto each of the second and fourth side surfaces by supplying the conductive paste through the slit so as to rise to the one main surface side of the slit plate is performed.

In the second side surface giving step, in a preferred embodiment, a step of preparing a slit plate provided with slits for respectively passing the conductive pastes for the first and second end face electrode extensions, , A step of arranging the component main body with the first and third side faces facing the one main surface side of the slit plate, and then the conductive paste is swelled to the one main surface side of the slit plate through the slit. Supplying the conductive paste onto each of the first and third side surfaces.

In the end face providing step, in a preferred embodiment, a step of forming a paste layer having a predetermined thickness made of a conductive paste for each of the first and second end face electrodes, and a step toward the paste layer. First and second
And a step of dipping each of the end faces of the.

The present invention is also directed to a chip-shaped electronic component obtained by the manufacturing method according to the second aspect of the present invention described above.

In the chip-shaped electronic component according to the second aspect, the first and second end face electrode extension portions have a thickness equal to or greater than the thickness of the first and second side face electrodes and the first and second side face electrode extension portions. It is preferable to have a thickness equal to or more than the thickness of.

[0046]

BEST MODE FOR CARRYING OUT THE INVENTION To explain an embodiment of the present invention, reference is made again to FIGS. 5 and 6 described above. Further, the description of the basic configuration relating to the chip-shaped electronic components 1 and 21 performed with reference to FIGS. 5 and 6 is also incorporated in the description of the embodiment of the present invention.

FIG. 1 is a front view showing the chip-shaped electronic component 1 described with reference to FIG. 5, and shows a characteristic configuration in one embodiment of the present invention.

In FIG. 1, the chip-shaped electronic component 1 is illustrated as being placed on the mounting surface 38. As can be seen from the positional relationship with the mounting surface 38, the first and second end surface electrodes 9 provided in the chip-shaped electronic component 1 shown in FIG.
The first and second end face electrode extensions 12 and 13 of 10 and 10 have a thickness larger than that of the side face electrode 11. The thickness of the end face electrode extensions 12 and 13 may be equal to the thickness of the side face electrode 11, and therefore,
The end face electrode extensions 12 and 13 are characterized by having a thickness equal to or greater than the thickness of the side face electrode 11.

By setting the relationship between the thickness of the end face electrode extensions 12 and 13 and the thickness of the side face electrode 11 as described above, when placed on the mounting surface 38, as shown in FIG.
It is possible to prevent the one end face electrode extension 13 from rising and causing a mounting defect or the like.

In order to manufacture such a chip-shaped electronic component 1, for example, the following method is carried out.

First, as shown in FIG. 2, the slit plate 41
Is prepared. The slit plate 41 is for passing the conductive paste 42 for the side surface electrode 11 and has a width corresponding to the width of the side surface electrode 11.
3 and the conductive pastes 44 and 45 for the first and second end face electrode extensions 12 and 13, respectively, which pass through the first and second end face electrode extensions 12 and 13. Slits 46 and 47 each having a width corresponding to each width are provided.

On the one main surface side of the slit plate 41,
For example, the component body 2 is arranged with the first side surface 5 facing. At this time, the first side surface 5 of the component body 2 may be in contact with the one main surface of the slit plate 41 as shown in the figure, or may be arranged at a slight interval.

Then, the conductive pastes 42, 44 and 4 filled in the slits 43, 46 and 47, respectively.
5, a pressure as indicated by an arrow 48 is exerted, whereby the conductive pastes 42, 44 and 45 are supplied through the slits 43, 46 and 47 so as to rise to the one main surface side of the slit plate 41. . As a result, the conductive pastes 42, 44 and 45 are applied on the first side surface 5 of the component body 2.

The same operation is performed on each of the second to fourth side surfaces 6 to 8 of the component body 2.

Instead of the method using the slit plate 41 as described above, the conductive pastes 42, 44 and 4 are used.
To provide 5, methods such as by intaglio printing or letterpress printing may be applied.

In FIG. 3, conductive pastes 42, 44 and 45 to be the side electrode 11 and the first and second end face electrode extensions 12 and 13 respectively obtained by finishing the above-mentioned side surface applying step. Component body 2 provided in a state of rotating around the first to fourth side surfaces 5 to 8
It is shown.

As described above, the conductive paste 42 to be the side surface electrode 11 and the first and second end surface electrode extension portions 1 are formed.
2 and 13 and the conductive pastes 44 and 45 to be respectively applied at the same time in the same process, so that FIG.
As shown in, it is easy to make the applied thickness of the conductive paste 42 substantially equal to the applied thickness of the conductive pastes 44 and 45.

The first and second end face electrode extensions 1
Conductive pastes 44 and 45 to be 2 and 13
As shown in FIG. 2, instead of being provided so as to reach both ends of the side surfaces 5-8 of the component body 2, it may be provided so as to leave a predetermined gap at both ends of the side surfaces 5-8.
By doing so, each part of the conductive pastes 44 and 45 will be separated from the first and second end faces 3 and 4 of the component body 2.
Since it can be reliably prevented from protruding to the respective peripheral edge portions, it becomes easier to control the applied thickness of the conductive paste to be the end surface electrodes 9 and 10 in the end surface application step described later.

However, if the above-mentioned advantages are not desired, the conductive pastes 44 and 45 to be the first and second end face electrode extension portions 12 and 13 are partially contained in the first and second conductive pastes 44 and 45 of the component body 2. It may be provided so as to protrude to the peripheral edge of each of the first and second end faces 3 and 4.

Next, as shown in FIG. 3, an end face imparting step is performed. That is, the conductive paste 50 is spread on the dip plate 49 in a state of giving a predetermined thickness, whereby the conductive paste layer 51 is formed. Then, the first end surface 3 is formed on the conductive paste layer 51.
The component main body 2 is dipped toward the conductive paste layer 51, and then pulled up, as indicated by an arrow 52.

As a result, as shown in the enlarged cross-sectional view of FIG. 4, the conductive paste 50 to serve as the first end surface electrode 9 is applied onto the first end surface 3 of the component body 2. At this time, a part of the conductive paste 50 is applied so as to also cover a part of the conductive paste 44 to be the first end face electrode extension portion 12. The conductive paste 50 applied so as to cover a part of the conductive paste 44 to be the end face electrode extension 12 works to make the thickness of the end face electrode extension 12 thicker than the thickness of the side face electrode 11, and the conductive paste By controlling the applied thickness of the conductive paste 50, the difference between the thickness of the end face electrode extension 12 and the thickness of the side face electrode 11 can be controlled.

In the step shown in FIG. 3, the depth of dipping of the component body 2 into the conductive paste layer 51 is controlled so that the conductive paste 50 becomes the first end surface as shown in FIG. It is preferable that the conductive paste 44 is applied so as not to exceed the application region of the electrode extension portion 12. This ensures that a gap is provided between the first end surface electrode extension 12 and the side surface electrode 11.

An operation similar to the above-described operation is performed on the second end surface 4 of the component body 2 so that the second end surface electrode 10 is electrically conductive on the second end surface 4 of the component body. Paste 50 is applied.

The conductive pastes 42, 44, 45 and 50 applied as described above are dried, and then,
By being baked, the first and second end face electrodes 9 and 1 in the chip-shaped electronic component 1 shown in FIG.
0 and side electrode 11 are formed.

In the above embodiment, the side surface electrode 1
1 and the side surface applying step for applying the conductive pastes 42, 44 and 45 to be the first and second end surface electrode extensions 12 and 13 should be the first and second end surface electrodes 9 and 10. It was performed before the end face application step of applying the conductive paste 50. As described above, if the side surface imparting step is performed before the end surface imparting step, there is an advantage that the accuracy in applying the conductive pastes 42, 44, and 45 in the side surface imparting step can be increased. . If such an advantage is not particularly desired, the side surface imparting step may be performed after the end surface imparting step.

The method for forming the end face electrodes 9 and 10 and the side surface electrode 11 in the chip-shaped electronic component 1 shown in FIG. 5 has been described above. The end face electrodes 29 and 30 in the chip-shaped electronic component 21 shown in FIG. 6 have been described above. Also, in forming the side electrodes 31 and 32, a method substantially similar to the above-mentioned method can be applied.

That is, the second side surface 26 of the component body 22.
Toward the first side surface applying step of simultaneously applying a conductive paste for the first side surface electrode 31 and a conductive paste for the first and second end surface electrode extensions 33 and 34. It At this time, the conductive paste for the first side surface electrode 31 is also applied on each part of the first and third side surfaces 25 and 27 so as to also provide the first side surface electrode extension 35. It

The above-described first side face applying step is also performed on the fourth side face 28 of the component body 22, whereby the second side face electrode 32 and the second side face electrode extension 3 are formed.
A conductive paste to be 6 is applied.

In the above-mentioned first side surface imparting step, for example, a step substantially similar to the step shown in FIG. 2 is performed. That is, a slit plate provided with slits for passing the conductive paste for the first side surface electrode 31 and the conductive paste for the first and second end surface electrode extensions 33 and 34, respectively, is prepared. The component main body 22 is arranged with the second side surface 26 facing the one main surface side of the slit plate, and then the conductive paste is supplied through the slit so as to rise to the one main surface side of the slit plate. Applying a conductive paste on the second side surface 26 is performed.

Similarly, the component main body 22 is arranged with the fourth side surface 28 facing the one main surface side of the slit plate, and then the conductive paste is raised to the one main surface side of the slit plate through the slit. The conductive paste is applied onto the fourth side surface 28 by supplying the conductive paste.

Further, toward the first side surface 25 of the component body 22, the first and second end face electrode extension portions 33 and 3 are formed.
The second side surface applying step of applying the conductive paste for No. 4 at the same time is performed.

The above-mentioned second side face giving step is performed by the component main body 2
The second side surface 27 is also implemented.

In the second side surface giving step, as an example, the step substantially similar to the step shown in FIG. 2 is performed.

That is, a slit plate provided with slits for passing the conductive pastes for the first and second end face electrode extensions 33 and 34, respectively, is prepared, and one main surface side of the slit plate is prepared. The component main body 22 is arranged with the first side surface 25 facing, and then the conductive paste is supplied through the slit so as to rise to the one main surface side of the slit plate, so that the conductive paste is provided on the first side surface 25. Is given to.

Similarly, the component main body 22 is arranged with the third side surface 27 facing the one main surface side of the slit plate, and then the conductive paste is raised to the one main surface side of the slit plate through the slit. The conductive paste is applied on the third side surface 27 by supplying the electric power.

Next, end face application for applying the conductive paste for the first and second end face electrodes 29 and 30 to the first and second end faces 23 and 24 of the component body 22 respectively. The process is carried out.

In the above-mentioned end face imparting step, for example, a step substantially similar to the step shown in FIG. 3 is performed.

That is, a paste layer made of a conductive paste for the first end face electrode 29 and having a predetermined thickness is formed, and the first end face 23 is dipped toward the paste layer.

Similarly, a paste layer having a predetermined thickness made of a conductive paste for the second end face electrode 30 is formed, and the second end face 24 is formed toward this paste layer.
Dipping is done.

Also in the formation of the end face electrodes 29 and 30 and the side face electrodes 31 and 32 in this chip-shaped electronic component 21, it is preferable that the first and second side face imparting steps are performed before the end face imparting step.

In the end face application step, the conductive paste for the first and second end surface electrodes 29 and 30 is the first and second end face electrodes applied in the first and second side surface application steps. It is preferable to apply the conductive paste so as not to exceed the application area of the conductive paste for each of the extensions 33 and 34.

Thereafter, these conductive pastes are dried and baked to form the end face electrodes 29 and 30 and the side face electrodes 31 and 32 shown in FIG.

In this chip-shaped electronic component 21, the first
The second end face electrode extensions 33 and 34 not only have a thickness equal to or greater than the thickness of the first and second side face electrodes 31 and 32, but also the thickness of the first and second side face electrode extensions 35 and 36. It is preferable to have the above thickness.

Although the present invention has been described above with reference to specific embodiments, the present invention is not limited to these, and various other modifications are possible within the scope of the present invention. is there.

For example, the side surface electrodes 11 or 31 and 32 are the end surface electrodes 9 or 29 and the end surface electrodes 10 or 3.
If it is located between 0 and 0, its position, number, width, etc. can be arbitrarily changed.

The chip-shaped electronic component to which the present invention is applied is not particularly limited as long as it has electrodes formed on the end faces and side faces of the component body, and the internal structure of the component body is not particularly limited. So, for example, a capacitor,
Feedthrough capacitor, inductor, capacitor array, LC
It can be applied to various chip-shaped electronic components having respective functions such as composite components, high frequency modules, and capacitor networks.

[0087]

As described above, according to the present invention, when forming the side surface electrode having the side surface electrode and the end surface electrode extension on the component body,
Simultaneously applying the conductive paste for the side surface electrode and the conductive paste for the end surface electrode extension, the side surface applying step, and applying the conductive paste for the end surface electrode toward the end surface of the component body, the end surface The applying step is performed.

Therefore, in the side surface applying step, the conductive paste for the end face electrode extension can be applied in a state where it is not at least thinner than the thickness of the conductive paste for the side surface electrode. Further, in the end face application step, when a part of the conductive paste for the end face electrode is applied so as to ride on the above-mentioned conductive paste for the end face electrode, the thickness of the end face electrode may be increased. it can.

From the above, in the obtained chip-shaped electronic component, the thickness of the end face electrode extension can be made equal to or more than the thickness of the side face electrode, and the side face electrode is the second and fourth parts of the component body. The side electrode extension is formed on each of the side faces of the first and third side faces and extends to part of each of the first and third side faces, the thickness is not less than the thickness of the side electrode and not less than the thickness of the side electrode extension. be able to.

Therefore, when the chip-shaped electronic component according to the present invention is placed on the mounting surface, it is possible to prevent the phenomenon in which one end face electrode extension is lifted from the mounting surface. It is possible to prevent inconvenience such as mounting failure due to the above.

In the side surface applying step, since the conductive paste for the side surface electrode is applied at the same time as the conductive paste for the end surface electrode extension portion is applied, the end surface electrode extension of the end surface electrode is performed. It is easy to secure a predetermined gap between the portion and the side surface electrode.

In order to more reliably bring out the above-mentioned effect, in the end face applying step, the conductive paste for the end face electrode is applied to the end face electrode extension portion applied in the side face applying process. It is preferably applied so as not to exceed the area.

In the method for manufacturing a chip-shaped electronic component according to the present invention, when the side surface applying step is performed before the end surface applying step, the conductive paste for the side surface electrode and the end surface electrode extension portion are formed in the side surface applying step. The conductive paste can be applied with high accuracy, and therefore, both the side surface electrode and the end surface electrode can be formed with high accuracy in terms of position, pattern, and the like.

[Brief description of drawings]

FIG. 1 is a front view showing a chip-shaped electronic component 1 according to an embodiment of the present invention.

FIG. 2 is a plan view for obtaining the chip-shaped electronic component 1 shown in FIG.
It is a front view which shows the state which is performing the side surface provision process which applies the conductive pastes 42, 44, and 45 toward each of the side surfaces 5-8 of the component main body 2.

FIG. 3 is a view showing the conductive paste 50 directed toward each of the end surfaces 3 and 4 of the component body 2 after the side surface applying step shown in FIG.
It is a front view which shows the state which is performing the end face provision process which imparts.

FIG. 4 is an enlarged cross-sectional view showing a part of the component body 2 after the end face imparting step shown in FIG. 3 is completed.

FIG. 5 is a perspective view showing the external appearance of the chip-shaped electronic component 1 shown in FIG. 1 or the chip-shaped electronic component 1 that is of interest to the present invention.

FIG. 6 is a perspective view showing the external appearance of a chip-shaped electronic component 21 according to another embodiment of the present invention or another chip-shaped electronic component 21 of interest to the present invention.

FIG. 7 is a front view showing the chip-shaped electronic component 1 for explaining the problem to be solved by the present invention.

[Explanation of symbols]

1,21 Chip-shaped electronic components 2,22 parts body 3, 4, 23, 24 End face 5-8, 25-28 Side 9, 10, 29, 30 Edge electrode 11, 31, 32 Side electrode 12, 13, 33, 34 End electrode extension 35,36 Side electrode extension 41 slit plate 42,44,45,50 Conductive paste 43,46,47 slits 51 Conductive paste layer

Claims (15)

[Claims] 1. The first and second end surfaces facing each other and the first, second, third and fourth side surfaces connecting the first and second end surfaces, respectively, A chip-shaped component body in which a side face and the third side face face each other, and the second side face and the fourth side face face each other, and conductivity is provided on an outer surface of the component body. An external terminal electrode formed by applying and baking a paste, wherein the external terminal electrode has first and second end surface electrodes formed on the first and second end surfaces, respectively, and the first and second end surface electrodes. A side surface electrode formed between the first and second end surface electrodes in a state of orbiting through a fourth side surface, wherein the first and second end surface electrodes are respectively the first and second side surface electrodes.
To first and second portions extending to respective parts of the fourth side surface
A method of manufacturing a chip-shaped electronic component having an end face electrode extension, comprising: a step of preparing the component body; and a step of preparing the side face electrode toward each of the first to fourth side faces. Side surface applying step of simultaneously applying a conductive paste for forming the conductive paste and a conductive paste for the first and second end surface electrode extensions, and the first and second end surfaces facing each other.
And a step of applying an electroconductive paste for the second end surface electrodes, respectively, and a method of manufacturing a chip-shaped electronic component. 2. The method for manufacturing a chip-shaped electronic component according to claim 1, wherein the side surface imparting step is performed before the end surface imparting step. 3. In the end face applying step, the conductive paste for the first and second end face electrodes is provided in each of the first and second end face electrode extension parts applied in the side face applying process. The method for producing a chip-shaped electronic component according to claim 2, wherein the conductive paste is applied so as not to exceed a region where the conductive paste is applied. 4. The slit provided with slits for passing the conductive paste for the side surface electrodes and the conductive paste for the first and second end surface electrode extension portions, respectively, in the side surface applying step. A step of preparing a plate, a step of arranging the component main body with each of the first to fourth side surfaces facing one main surface side of the slit plate, and then a conductive paste is passed through the slit to form the slit. The chip shape according to any one of claims 1 to 3, further comprising a step of applying a conductive paste onto each of the first to fourth side surfaces by supplying the conductive paste so that the conductive paste rises to one main surface side of the plate. Electronic component manufacturing method. 5. The step of applying an end face comprises the step of forming a paste layer having a predetermined thickness and made of a conductive paste for each of the first and second end face electrodes, and the step of forming a paste layer toward the paste layer. The method of manufacturing a chip-shaped electronic component according to claim 1, further comprising a step of dipping each of the first and second end faces. 6. A chip-shaped electronic component obtained by the manufacturing method according to claim 1. 7. The first and second end face electrode extensions have a thickness equal to or greater than the thickness of the side face electrode.
The chip-shaped electronic component described in. 8. The first and second end faces facing each other and the first, second, third and fourth side faces connecting the first and second end faces, respectively, are provided. A chip-shaped component body in which a side face and the third side face face each other, and the second side face and the fourth side face face each other, and conductivity is provided on an outer surface of the component body. An external terminal electrode formed by applying and baking a paste, wherein the external terminal electrode has first and second end surface electrodes respectively formed on the first and second end surfaces, and the second terminal electrode. And a first and second side surface electrode formed on the fourth side surface between the first and second end surface electrodes, respectively, wherein the first and second end surface electrodes are respectively, The first
To first and second portions extending to respective parts of the fourth side surface
The end surface electrode extension portion of the first and second side surface electrodes, respectively.
And first and second extending to respective portions of the third side surface
A method of manufacturing a chip-shaped electronic component having a side surface electrode extension, the method comprising: preparing the component body;
And a first side surface applying step of simultaneously applying a conductive paste for the second side surface electrode and a conductive paste for the first and second end surface electrode extensions, and the first and third side surface applying steps. Towards each of the sides, said first
And a second side surface applying step of simultaneously applying a conductive paste for the second end surface electrode extension, and the first and second end surfaces facing toward each of the first and second end surfaces.
And a step of applying an electroconductive paste for the second end surface electrodes, respectively, and a method of manufacturing a chip-shaped electronic component. 9. The first and second side surface applying steps,
The method for manufacturing a chip-shaped electronic component according to claim 8, which is performed before the end face imparting step. 10. The step of applying the end face in the first step
And a conductive paste for the second end face electrode is a conductive paste application region for each of the first and second end face electrode extensions applied by the first and second side face applying steps. The method for manufacturing a chip-shaped electronic component according to claim 9, wherein the method is applied so as not to exceed the value. 11. The first side surface imparting step is performed by the first step.
And a slit plate provided with slits for passing the conductive paste for each of the second side surface electrodes and the conductive paste for the first and second end surface electrode extensions, respectively. A step of arranging the component body with the second and fourth side surfaces facing the one main surface side of the slit plate, and then applying a conductive paste through the slit to the one main surface of the slit plate. The method for producing a chip-shaped electronic component according to claim 8, further comprising: applying a conductive paste to each of the second and fourth side surfaces by supplying the conductive paste so that the conductive paste rises to the side. . 12. The second side surface imparting step comprises the first step.
And a step of preparing a slit plate provided with slits for passing a conductive paste for the second end face electrode extension, respectively, and the first and third side faces on one main surface side of the slit plate. The step of disposing the component body in a state where each of them is directed, and then supplying the conductive paste through the slit so as to swell to the one main surface side of the slit plate, thereby supplying the conductive paste to the first and the first. The method of manufacturing a chip-shaped electronic component according to any one of claims 8 to 11, further comprising: a step of applying the chip-shaped electronic component to each of the three side surfaces. 13. The step of applying an end surface comprises the step of forming a paste layer having a predetermined thickness and made of a conductive paste for each of the first and second end surface electrodes, and the step of forming a paste layer toward the paste layer. The method of manufacturing a chip-shaped electronic component according to claim 8, further comprising a step of dipping each of the first and second end faces. 14. A chip-shaped electronic component obtained by the manufacturing method according to claim 8. 15. The first and second end surface electrode extensions have a thickness greater than or equal to the thickness of the first and second side surface electrodes and greater than or equal to the thickness of the first and second side surface electrode extensions. The chip-shaped electronic component according to claim 14.