JPH11126730A - Manufacture of multiple electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure a favorable electrical connection between electrodes constituting function elements and external electrodes as well as prevent short circuits in solder bridges between assembled external electrodes when a plurality of function elements are installed in one element assembly. SOLUTION: A trench 7, which is narrower than an electrode 3 constituting function element installed in a sintered body and deep enough to reach the electrode 3, is machined on both sides of the sintered body of a multiple electronic component. Part of the edges of the electrode 3 must be exposed inside the trench 7. Then, an external electrode 9 is formed only inside the trench 7 so that the electrode is on the same plane as the upper and lower surface of the sintered body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multiple-type electronic component in which a plurality of functional elements are formed in a single element body.

[0002]

2. Description of the Related Art A conventional method for manufacturing a multiple-type electronic component will be described with reference to the drawings, taking a multiple-type multilayer ceramic capacitor (hereinafter referred to as a capacitor array) as an example.

FIG. 7 is a view showing a conventional green laminate of a capacitor array, FIG. 8 is a development view thereof, FIG. 9 is a view showing a sintered body, and FIG. 10 is a view showing a completed product.

Using a known method for manufacturing a multilayer capacitor,
As shown in FIG. 8, a plurality of layers obtained by printing the internal electrodes 23 on the dielectric layer 22 are laminated, and the laminated body provided with the invalid layer 24 above and below is cut into the shape of the green laminated body 21 shown in FIG. Thereafter, firing is performed at a predetermined temperature. Next, the obtained sintered body 25 is subjected to barrel polishing to expose the group of internal electrodes 23 formed inside the sintered body 25 to the side surface of the sintered body 25 as shown in FIG. A method of manufacturing a capacitor array as shown in FIG. 10 by forming external electrodes 26 so as to cover the group of electrodes 23 is generally known.

[0005]

However, in the conventional capacitor array, barrel polishing of the sintered body 25 is performed to expose the end of the internal electrode 23 formed inside the sintered body 25 to the side surface. In order to completely expose the 23 end portions, barrel polishing for a long time is required. If the polishing is not sufficient, when the external electrode 26 paste is applied to the exposed surface of the internal electrode 23 of the sintered body 25 and baked, The connection between the end of the internal electrode 23 and the external electrode 26 is insufficient, so-called poor capacity loss occurs, and the external electrode 2 is formed on the uneven surface formed on the side surface of the sintered body 25 by barrel polishing.
When the paste 6 is applied, air bubbles remain in the concave portions on the side surfaces, and the air bubbles become hollow by the subsequent baking.
3 and the external electrode 26 are hindered, and a so-called capacity loss failure occurs. Further, when the finished product is mounted on a substrate, there is a problem that a solder bridge is formed between adjacent external electrodes 26 and a short circuit occurs between the external electrodes 26.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and to provide a highly reliable method for manufacturing a multiple electronic component.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is to prevent the end portions of the internal electrodes of each multilayer capacitor formed inside the capacitor array green laminate from being exposed on both side surfaces of the sintered body. After firing, a cut groove narrower than the width of the internal electrode is made to intersect all internal electrode ends from the side of the sintered body to the end of the internal electrode. After reliably exposing the end of the internal electrode, which cannot be sufficiently exposed only by polishing, to only the inner surface of the cut groove, apply the external electrode paste only to the inner surface of the cut groove, and bake it. Make connections between external electrodes. This method completes the connection between the internal electrode and the external electrode, secures a sufficiently large insulation interval between adjacent external electrodes, and eliminates short-circuit failure due to solder bridges between adjacent external electrodes when mounting on a board. Occurrence can also be prevented.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a multi-unit type comprising a plurality of functional elements having electrodes formed at predetermined intervals in a parallel direction inside a single element body. In the electronic component, an end of an electrode constituting each of the functional elements is provided so as not to be in contact with both side surfaces of the element body, and both side surfaces of the element body are connected to an end of an electrode of the functional element formed therein. And forming an external electrode on the inner surface of the groove so as to connect to the electrode. By forming a cut groove so as to be in contact with the electrode constituting the functional element, applying and baking an independent external electrode paste for each functional element unit on the inner surface of the cut groove to form the external electrode, Connection between external electrodes and external electrodes can be secured. It is expected to have an effect.

According to a second aspect of the present invention, an electrode lead portion is provided at an end of an electrode constituting each functional element so as to be in contact with a side surface of the element body, and a cut is made only in a side surface portion where the electrode lead portion is in contact. The method for manufacturing a multiple-part electronic component according to claim 1, wherein the groove is machined, wherein the electrode lead-out portion of the functional element is formed so as to be in contact with a side surface of the element body, thereby forming the cut groove. In addition to easy positioning, the notch groove can be reliably crossed with the electrode lead-out portion, and the subsequent formation of the external electrode has the effect that the connection between the internal electrode and the external electrode can be made more reliable. .

[0010] According to a third aspect of the present invention, the width of the cut groove is set as follows.
3. The method of manufacturing a multiple electronic component according to claim 1, wherein the width of the electrode constituting the functional element is smaller than that of the electrode. The width of the external electrodes is narrower than the electrode width of the functional element, and the distance between adjacent external electrodes can be secured sufficiently large. It has the effect that a short circuit can be prevented.

[0011] According to a fourth aspect of the present invention, the width of the cut groove is set as follows.
4. The method for manufacturing a multiple electronic component according to claim 1, wherein the processing is performed to be narrower than an interval between adjacent cut grooves. In the case where external electrodes are formed, the distance between adjacent external electrodes can be sufficiently widened, and when multiple electronic components are mounted on a board, short-circuiting due to solder bridges between adjacent external electrodes can be prevented. Have.

The invention according to claim 5 is characterized in that the corner portion at the bottom of the cut groove is machined into a curved surface. This is a method for manufacturing a component, whereby the external electrode paste can be reliably applied to the corner portion at the bottom of the cut groove, and air bubbles that are likely to be generated when the external electrode paste is applied to the corner portion are removed. It has the effect of being able to.

The invention according to claim 6 is characterized in that the bottom surface of the cut groove is machined inwardly into a curved surface. This is a method for manufacturing a molded electronic component, which has an effect that the external electrode paste can be surely applied to the bottom surface of the cut groove.

The invention according to claim 7 is characterized in that the external electrodes are formed so as to be flush with the upper and lower planes of the element body. This is a method of manufacturing a multiple-type electronic component, whereby the bending strength of the element body, which is reduced due to the provision of the cut groove, can be reinforced by forming an external electrode on the inner surface of the cut groove, and the external electrode is formed. Since it is provided so as to be flush with the lower and upper surfaces of the element body, it has an effect that the design of the soldering lands of the mounting board becomes easy.

According to an eighth aspect of the present invention, the functional element comprises:
A multilayer capacitor element having internal electrodes formed in a plurality of layers at predetermined intervals via a dielectric layer in an upward and downward direction,
8. The multilayer capacitor element according to claim 1, wherein the internal electrodes of the multilayer capacitor element are connected to external electrodes formed on the inner surfaces of the cut grooves on different side surfaces facing each other alternately. This is a method of manufacturing a multiple-type electronic component, and has an effect that an internal electrode of each multilayer ceramic capacitor formed in a body and an external electrode formed on an inner surface of a cut groove can be reliably connected.

According to a ninth aspect of the present invention, the functional element is a resistive element having a resistive film formed on an upper surface of the element body, and the electrode portion of the resistive element is formed in a cut groove on a side surface of the element body. 8. The device according to claim 1, wherein the device is connected to an external electrode.
The method of manufacturing a multiple-type electronic component according to any one of the above, whereby the electrodes of the individual resistor elements formed in the element body and the external electrodes formed on the inner surfaces of the cut grooves can be reliably connected. It has the action of:

Hereinafter, a method for manufacturing a multiple electronic component according to an embodiment of the present invention will be described using a capacitor array.

(Embodiment) FIGS. 1 to 6 show a capacitor array according to the present invention. 1 is a perspective view of a green laminate, FIG. 2 is an exploded perspective view of the green laminate, FIG. 3 is a perspective view of a sintered body, FIG. 4 is a perspective view of a sintered body having cut grooves, and FIG. FIG. 6 is a perspective view of the finished product, and FIG. 6 is a sectional view of the finished product. In the figure, 1 is a green laminate, 2 is a dielectric layer, 3 is an internal electrode, 4 is a lead portion of the internal electrode 3, 5 is an ineffective layer, 6 is a sintered body, 7 is a cut groove, and 8 is a cut. A corner portion 9 at the bottom of the groove is an external electrode.

A green sheet for the dielectric layer 2 is manufactured by using a known multilayer capacitor manufacturing method.

Next, after printing the internal electrode 3 provided with the lead portion 4 shown in FIG. 2 on the surface of the prepared green sheet, a plurality of the green sheets are laminated. To form a laminate block.

Next, the laminate block is cut into the shape of the green laminate 1 shown in FIG. 1 and fired at a predetermined temperature to produce a sintered body 6 shown in FIG.

Thereafter, as shown in FIG. 4, the cut grooves 7 are formed at the positions of the lead-out portions 4 exposed on both side surfaces of the sintered body 6 for each multilayer capacitor unit constituting the capacitor array. The position of the cut groove 7 can be easily determined because the extraction portion 4 is exposed on the side surface of the sintered body 6, and the width of the cut groove 7 is smaller than the width of the internal electrode 3 as shown in FIG. The distance between adjacent multilayer capacitors, that is, the width is smaller than the width of the portion where the internal electrode 3 is not formed, and the depth intersects all the end portions of the internal electrode 3 and is alternately exposed on different side surfaces facing each other. The bottom surface of the cut groove 7 and the corner portion 8 are further processed into a curved surface so as not to contact the end of the internal electrode 3 on the side. Thereby, all the internal electrodes 3 can be reliably exposed only on the inner surface of the cut groove 7 and a part thereof, and when applying the external electrode 9 paste in the next step, the bottom surface of the cut groove 7 and By processing the corner portion 8 to have a curved surface, the electrode paste can be uniformly applied to the inner surface of the cut groove 7, and when the rising portion of the bottom surface of the cut groove 7 is square,
The generation of air bubbles that are easily left behind at the corners can be prevented, and a good connection between the internal electrode 3 and the external electrode 9 can be ensured.

Thereafter, an external electrode 9 is further provided on the inner surface of the cut groove 7 as shown in FIGS. 5 and 6 so that the external electrode 9 is flush with the upper and lower surfaces of the sintered body 6. Formed. Since the surface of the external electrode 9 is flat, it is easy to design the size of the soldering land on the substrate on which the capacitor array is mounted. Further, the width of the formed external electrode 9 is smaller than the width of the internal electrode 3 and the width of the adjacent external electrode 9 And is provided only inside the cut groove 7, so that the adjacent external electrodes 9
In addition to this, there is an effect that an insulation distance between the external electrodes 9 can be sufficiently widened and a short circuit due to a solder bridge between the adjacent external electrodes 9 can be prevented when the capacitor array is mounted on the substrate.

In the present embodiment, the extraction portion 4 is provided at the end of the internal electrode 3. However, the position of the internal electrode 3 formed inside the sintered body 6 is displayed by displaying an externally-determinable display. Although it is possible to omit step 4 and the description has been made using the capacitor array, a similar method can be used for a multiple-type electronic component such as a multiple-type resistor.

[0025]

As described above, according to the present invention, both sides of a multiple-piece electronic component sintered body having a plurality of functional elements formed therein are provided at a depth reaching the electrodes constituting each functional element, and The cut groove is machined so as to be narrower than the width of the groove and smaller than the interval between adjacent functional elements, and the bottom surface and the corner portion of the cut groove are formed so as to be curved. Next, an external electrode paste is applied to the inner surface of the cut groove so as to connect to the electrode of the functional element,
At the time of formation, air bubbles that are easily left behind in the cut groove corners are removed, and electrical connection between the electrode of the functional element and the external electrode can be ensured. In addition, since the external electrodes are formed so as to be flush with the upper and lower surfaces of the sintered body, a sufficiently large insulation distance can be secured between adjacent external electrodes, and when mounting multiple electronic components on a substrate, A short circuit due to a solder bridge between adjacent external electrodes can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view of a green laminate of a multiple-layer ceramic capacitor of one embodiment of the present invention.

FIG. 2 is an exploded perspective view of the same green laminate.

FIG. 3 is a perspective view of the same sintered body.

FIG. 4 is a perspective view of a sintered body in which a cut groove is processed.

FIG. 5 is a perspective view of the same finished product.

FIG. 6 is a plan sectional view of the same finished product.

FIG. 7 is a perspective view of a green laminate of a conventional multi-layered multilayer ceramic capacitor.

FIG. 8 is an exploded perspective view of the green laminate.

FIG. 9 is a perspective view of the same sintered body.

FIG. 10 is a perspective view of the same finished product.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Green laminated body 2 Dielectric layer 3 Internal electrode 4 Lead-out part 5 Invalid layer 6 Sintered body 7 Cut groove 8 Corner part 9 External electrode 21 Green laminated body 22 Dielectric layer 23 Internal electrode 24 Invalid layer 25 Sintered body 26 External electrode

Claims (9)

[Claims] 1. A multiple electronic component comprising a plurality of functional elements each having an electrode and formed at predetermined intervals in a parallel direction inside a single element body, wherein an end of an electrode constituting each of the functional elements is provided. Parts are provided so as not to be in contact with both side surfaces of the element body, and then cut grooves are formed so that both side surfaces of the element body intersect with the ends of the electrodes of the functional elements formed therein, An external electrode is formed on the inner surface of the cut groove so as to be connected to the electrode. 2. An electrode lead portion is provided at an end portion of an electrode constituting each functional element so as to be in contact with a side surface of a body, and a cut groove is formed only in a side surface portion contacted by the electrode lead portion. 2. The method of manufacturing a multiple electronic component according to claim 1, wherein: 3. The method for manufacturing a multiple electronic component according to claim 1, wherein the width of the cut groove is processed to be smaller than the width of the electrode constituting the functional element. 4. The process according to claim 1, wherein the width of the cut groove is smaller than the interval between adjacent cut grooves.
The method for manufacturing a multiple-type electronic component according to any one of the above. 5. The method for manufacturing a multiple electronic component according to claim 1, wherein a corner portion at a bottom of the cut groove is processed into a curved surface. 6. The method for manufacturing a multiple electronic component according to claim 1, wherein the bottom surface of the cut groove is formed into a curved surface inward. 7. The multiple electronic component according to claim 1, wherein the external electrodes are formed so as to be flush with the upper and lower surfaces of the element body. Production method. 8. A multi-layer capacitor element having a plurality of internal electrodes formed at predetermined intervals with a dielectric layer interposed therebetween in an upward and downward direction, wherein the internal electrodes of the multi-layer capacitor element are alternately layered. The method for manufacturing a multiple electronic component according to any one of claims 1 to 7, wherein the multiple electronic components are connected to an external electrode formed on an inner surface of the cut groove on a different side surface facing the side surface. 9. The functional element is a resistive element having a resistive film formed on an upper surface of the element body, and an electrode portion of the resistive element is connected to an external electrode formed in a cut groove on a side surface of the element body. The method for manufacturing a multiple electronic component according to any one of claims 1 to 7, wherein: