JP2001023864A - Multiple electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple electronic part having high deflective strength by preventing defective soldering during mounting to a circuit board, in constructing the multiple electronic part by combining functional elements having either different or identical electrical characteristics. SOLUTION: In a multiple electronic part 19 wherein a plurality of functional elements 12 to 15 are arranged on a single board 17, an external electrode 11 folded onto upper and lower main surfaces 8 of each of the elements 12 to 15 is arranged such that the electrode 11 is electrically connected to a corresponding inner electrode 3 of the element in a manner covering the whole part of an end 4 of the electrode 3, while located in a central portion of each of both end faces 9 of the element, the end 4 being exposed to each face 9. The elements 12 to 15 are bonded together to the board 17 at one of the surfaces 8 using a thermosetting adhesive 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple-type electronic component in which a plurality of functional elements of the same type having different electrical characteristics such as capacitance are connected, or a plurality of heterogeneous functional elements such as a capacitor element, a resistor element and a thermistor. The present invention relates to a multiple-type electronic component connected by means of a connector.

[0002]

2. Description of the Related Art In order to reduce the size and weight of electronic components constituting an electronic circuit of an electronic device and to facilitate the work of mounting these functional elements on a circuit board, it is difficult to form them into a rectangular or cubic chip type. Well known. Japanese Patent Application Laid-Open No. 6-251993 shown in FIG. 9 discloses a method for facilitating the mounting operation and increasing the mounting density. This is because the notch 4
2 and an adhesive such as an acrylic resin-based organic adhesive or a glass frit-based inorganic adhesive that is insoluble or infusible at the soldering temperature at the side where the external electrode 43 is not formed, and disappears at the time of soldering. This is a multiple electronic component 45 connected and joined via the reference numeral 44.

[0003]

According to this prior art, a thermally decomposable adhesive 44 which disappears at the time of solder bonding between the sides on which the external electrodes 43 are not formed is used.
When the multiple electronic component 45 connected and joined by the above is soldered on the circuit board, the adhesive 44 sublimates and disappears at the soldering temperature,
Since a gap is formed between the adjacent multilayer capacitor elements 41, generation of stray capacitance between the multilayer capacitor elements 41 can be suppressed. The external electrodes 43 insoluble or infusible glass frit-based inorganic adhesive 44 formed non side by solder bonding temperature, such as water glass or glass solder _{(PbO-B 2 O 3 -ZnO} 2 -SiO 2, PbO It is stated that the multiple electronic component 45 melt-bonded with -B ₂ O ₃ -ZnO ₂ -Al ₂ O ₃ ) has improved connection strength and can eliminate the problem that the multilayer capacitor element 41 is separated during transportation or handling.

[0004] However, the above-mentioned technique uses an organic adhesive 44.
Is used, the external electrode 4 of the multilayer capacitor element 41 is used.
Since the thin side surfaces where no 3 is formed are connected and connected to each other, there is a problem that the bending strength of the multiple electronic component 45 is reduced and the multilayer capacitor elements 41 are separated from each other during handling. On the other hand, when the inorganic adhesive 44 is used, the multilayer capacitor element 4 is heated at a heating temperature at which the glass frit is melted.
1 has a problem that the surface of the external electrode 43 is deteriorated, and soldering failure is likely to occur at the time of mounting on the substrate.

An object of the present invention is to provide a multiple electronic component which solves the above-mentioned conventional problems.

[0006]

In order to achieve the above object, the present invention provides a multiple-type electronic component having a plurality of functional elements arranged on a single substrate, wherein the functional elements are opposed to each other on opposite end faces. An external electrode electrically connected to the end of the internal electrode exposed to the outside, and an external electrode folded on the upper and lower main planes is provided at the center of the both end faces, and the functional elements are connected to one of the upper and lower main planes. Is a multiple-type electronic component in which the surface is connected and bonded on a substrate with a thermosetting adhesive. With this configuration, the multiple-type electronic component has a greater bending strength than a method of bonding the functional elements to each other on the thin side surfaces, and the functional element and the substrate are firmly connected by heating the substrate side. Can be connected and bonded. In addition, since the board is bonded to one of the upper and lower surfaces of each functional element, the external electrode folded part on the side where multiple electronic components are solder-mounted on the circuit board is less affected by heating, and there is no deterioration of the surface. The solderability is not reduced.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a multiple-type electronic component in which a plurality of functional elements are arranged on a single substrate, wherein the functional elements are provided on opposite end faces. An external electrode electrically connected to the exposed end of the internal electrode and folded back to the upper and lower main planes is provided at the center of the both end faces, and the functional elements are connected to one of the upper and lower main planes. This is a multiple-type electronic component whose surface is connected and bonded to the substrate with a thermosetting adhesive, which increases the bending strength compared to the case where the thin side surfaces of each functional element are bonded to each other with an adhesive. At the same time, by heating the board side, the adhesive can be cured and the functional elements can be bonded to the board, so when mounting the completed multiple-type electronic component on the circuit board, each function that comes into contact with the circuit board The external electrode folded on the opposite side of the device substrate Thermal effects during fat hardening is reduced and has an effect of not lowering the solderability of the external electrode and the circuit board.

According to a second aspect of the present invention, there is provided the multiple electronic component according to the first aspect, wherein the substrate and the functional element are bonded by using an adhesive which is cured at a temperature lower than 150 ° C. This is to reduce the effect of heat on the external electrodes of the functional element when bonding each functional element to the board, and not to reduce the solderability between the external electrodes and the circuit board when mounting on the circuit board. it can.

According to a third aspect of the present invention, the substrate and the functional element are bonded by using an adhesive having a dielectric constant lower than the dielectric constant of the constituent material of the functional element.
2. A multiple electronic component according to (1). This has the effect of reducing stray capacitance generated between adjacent functional elements and between substrates.

According to a fourth aspect of the present invention, the substrate and the functional element are bonded using an adhesive having an insulation resistance higher than the insulation resistance of the constituent material of the functional element. A multiple electronic component according to any one of the above,
This can prevent the surface insulation resistance between the opposing external electrodes folded on the main plane in contact with the substrate side of each functional element and between the external electrodes of the adjacent functional elements from decreasing.

According to a fifth aspect of the present invention, there is provided the multiple electronic component according to any one of the first to fourth aspects, wherein the characteristics of each of the functional elements are displayed on the surface of the substrate. This can be easily identified visually without checking various characteristics of each functional element with a measuring instrument.

According to a sixth aspect of the present invention, there is provided the multiple electronic component according to any one of the first to fifth aspects, wherein the substrate is an insulator. It is possible to prevent the surface insulation resistance between the external electrodes facing each other folded on the main plane in contact with the substrate side and between the external electrodes of the adjacent functional elements from decreasing.

According to a seventh aspect of the present invention, the substrate is bonded with an adhesive so that the substrate does not come into contact with the ends of the external electrodes of the functional element folded on the upper and lower main planes. The multiple electronic component according to one of the aspects described above reduces the influence of heat on the external electrodes when the substrate side is heated to cure the adhesive.

According to the invention described in claim 8 of the present invention, the functional element whose substrate is folded on the upper and lower main planes is thicker than the thickness of the end of the external electrode of the functional element.
The multiple-type electronic component described in (1) reduces the influence of heat on the external electrodes when the substrate side is heated to cure the adhesive.

According to a ninth aspect of the present invention, there is provided the multiple electronic component according to any one of the first to eighth aspects, wherein a direction indicator is provided on the substrate. The element can be reliably arranged at a predetermined position on the board, and the direction of mounting the completed multiple electronic component on the circuit board can be visually confirmed.

According to a tenth aspect of the present invention, the thickness of the functional element in the upper and lower main plane directions and the thickness in the width direction are different from each other. This is a multiple-type electronic component. Since the thickness direction and the width direction of each functional element can be reliably distinguished from each other, the functional elements can be correctly aligned on the substrate.

According to an eleventh aspect of the present invention, in the multiple unit according to any one of the first to tenth aspects, the thickness of the functional element in the upper and lower main plane directions is greater than the thickness in the width direction. This is a type electronic component, which is bonded so that one main surface of each functional element is in contact with the substrate, so that the soldered part of the external electrode folded back on the other main surface is less affected by heat during bonding. In addition to preventing the solderability from deteriorating, when mounting the completed multiple electronic component on the circuit board, the distance between the soldering location of the external electrodes and the board becomes longer, and the bonding surface with the board becomes less hot. To prevent peeling.

According to a twelfth aspect of the present invention, the width of the end of the internal electrode constituting the functional element is smaller than the width of the internal electrode formed inside the functional element. The multiple electronic component according to any one of the above, which increases the effective area of the internal electrode of the functional element and narrows only the end exposed on the end face, without deteriorating the performance of the functional element. Even if the width of the external electrode electrically connected to the end is reduced, the reliability of the connection with the internal electrode is ensured, and the interval between adjacent external electrodes is widened to prevent a short circuit.

According to a thirteenth aspect of the present invention, the width of the end of the internal electrode constituting the functional element is smaller than the width of the external electrode. It is a multiple-type electronic component, which completely covers the entire end of the internal electrode exposed on the end face of the functional element with an external electrode, improves the reliability of electrical connection with the end, and externally connects the functional element. When a plating process is performed on the surface after the electrode is formed, it is possible to prevent the plating solution from entering the body from the end of the internal electrode.

According to a fourteenth aspect of the present invention, an external electrode connected to an end of an internal electrode constituting a functional element is provided.
14. The device according to claim 1, which is formed perpendicular to an end surface.
The multiple-type electronic component according to any one of the above, improves reliability of electrical connection between all of the internal electrode ends exposed on the end surface of the functional element and the external electrodes.

According to a fifteenth aspect of the present invention, there is provided the multiple electronic component according to any one of the first to fourteenth aspects, wherein each edge of the functional element is chamfered. When each functional element is bonded onto the substrate, the gap between the chamfered ridges of adjacent functional elements becomes a groove. When mounted on a circuit board by soldering, the spatial distance between adjacent external electrodes is increased, and problems such as short circuits are prevented.

According to a sixteenth aspect of the present invention, the width of the external electrode of the functional element is smaller than the distance between the external electrodes of the adjacent functional elements. In this way, the distance between external electrodes of adjacent functional elements is increased, and when the completed multiple electronic component is mounted on a circuit board, soldering between adjacent external electrodes is performed. A short circuit due to a bridge can be prevented.

According to a seventeenth aspect of the present invention, there is provided the multiple electronic component according to any one of the first to sixteenth aspects, wherein each functional element is a multilayer capacitor element.
As a result, it is possible to provide a multi-layer type multilayer capacitor in which a plurality of multilayer capacitor elements having the same or different characteristics are connected.

According to the invention described in claim 18 of the present invention, each of the functional elements is a resistor element.
The multiple electronic component according to any one of the above, whereby it is possible to provide a multiple resistor in which a plurality of resistance elements having the same or different characteristics are connected.

According to a nineteenth aspect of the present invention, there is provided a multiple electronic component according to any one of the first to sixteenth aspects, wherein each functional element is a thermistor element. It is possible to provide a multiple thermistor in which a plurality of thermistor elements having different or different characteristics are connected.

According to a twentieth aspect of the present invention, there is provided any one of the first to nineteenth aspects, wherein a functional element such as a multilayer capacitor element, a resistor element or a thermistor element is combined and adhered on a substrate. Of multiple electronic components,
This makes it possible to provide a multiple-type electronic component in which a plurality of electronic components having different electrical characteristics are combined and connected.

Hereinafter, a multiple electronic component according to an embodiment of the present invention will be described using a multiple multilayer ceramic capacitor (hereinafter, referred to as a multilayer capacitor).

FIG. 1 is a perspective view of a green chip of a multilayer capacitor element, FIG. 2 is a development view thereof, FIG. 3 is a multilayer capacitor sintered body after chamfering, FIG. 4 is a perspective view of the multilayer capacitor element, and FIG. FIG. 6 is a perspective view of the multiple laminated capacitor, FIG. 7 is a plan view of the multiple laminated capacitor, and FIG. 8 is a side view of the multiple laminated capacitor.

In the figure, 1 is a green chip, 2 is a ceramic dielectric layer, 3 is an internal electrode, 4 is an end portion of the internal electrode 3, 5 is an upper ineffective layer, 6 is a lower ineffective layer, and 7 is a firing after chamfering. 8 is a plane, 9 is an end face, 10 is a side face, 11 is an external electrode, 12, 13, 14, and 15 are multilayer capacitor elements,
Reference numeral 16 denotes an adhesive, reference numeral 17 denotes a substrate, reference numeral 18 denotes a seal, reference numeral 19 denotes a multi-layered multilayer capacitor, and reference numeral 20 denotes a cutout.

First, a green sheet of the ceramic dielectric layer 2 is manufactured by using a known method of manufacturing a multilayer ceramic capacitor.

Next, a plurality of green sheets of the ceramic dielectric layer 2 produced are laminated to form an upper ineffective layer 5 and a lower ineffective layer 6.
Is prepared.

Next, a green sheet of the ceramic dielectric layer 2 is laminated on the surface of the lower ineffective layer 6, and the first three internal electrodes are printed thereon. A green sheet of the ceramic dielectric layer 2 is laminated thereon,
On the surface, a second layer of internal electrodes, which is paired with the first layer of internal electrodes, is printed. Further, after laminating a green sheet of the ceramic dielectric layer 2 thereon, the third inner electrode layer, which is the same as the first layer, is printed on the surface. Subsequently, after laminating a green sheet of the ceramic dielectric layer 2 thereon, the third internal electrode layer of the fourth layer same as the second layer is printed.

In this manner, a predetermined number of green sheets of the ceramic dielectric layer 2 and a printing of three internal electrodes are alternately laminated, and then the upper ineffective layer 5 is finally laminated under pressure. A laminated green block (not shown) is prepared. At this time, one end 4 of the odd-numbered internal electrodes 3 and the even-numbered internal electrodes 3 is formed to be narrower than the internal electrodes 3 as shown in FIG.

Thereafter, the laminated green block is cut into the shape of the green chip 1 shown in FIG. In the cut green chip 1, the end portions 4 of the odd-numbered internal electrode 3 layers are alternately provided with one end surface 9 at every other side of the ceramic dielectric layer 2.
In addition, the end portions 4 of the even-numbered three internal electrodes are alternately exposed on the other end surfaces 9 opposed to each other with the ceramic dielectric layer 2 interposed therebetween.

Next, the green chip is fired at a predetermined temperature to produce a sintered body (not shown).

Next, the obtained sintered body is chamfered by barrel polishing to expose the end portions 4 of the internal electrodes 3 formed inside the sintered body to the end surfaces 9 of the sintered body 7, respectively. As shown in FIG. 2, an external electrode 11 which is electrically connected so as to cover the entire end 4 of the exposed internal electrode 3 and which is folded back on the upper and lower planes 8 is formed at the center of both end faces 9 facing each other. 0.
A multilayer capacitor element 12 having a thickness of 8 mm, a thickness of 1.0 mm, and a length of 1.6 mm was completed. At this time, the external electrodes 11 are formed so as to intersect perpendicularly with the laminating direction of the internal electrodes 3 and to cover all the end portions 4 exposed on the end face 9 of the sintered body 7. In addition to ensuring reliability, when plating the surface of the external electrode 11, the plating solution is prevented from entering the inside of the sintered body 7 along the end 4.

According to the above-described manufacturing method, multilayer capacitor elements 13, 14, and 15 having different electrical characteristics by changing the effective overlapping area of the internal electrode 3 and the thickness of the ceramic dielectric layer 2 using ceramic materials having different dielectric constants are manufactured. did.

Subsequently, a notch 20 indicating the directionality is provided, and the end portion between the opposing external electrodes 11 which is thicker than the end portions of the external electrodes 11 of the multilayer capacitor elements 12 to 15 and which is folded back on the plane 8 is provided. On a glass-epoxy substrate 17 narrower than the spacing of 5.1, the dielectric constant is 5.1 and the volume resistivity is 4 × 1.
0 ¹⁴ acrylic resin by applying a thermosetting adhesive 16 mainly composed of [Omega] cm, the multilayer capacitor element thereon 1:12
5 are arranged in parallel so that one of the planes 8 is in contact with each other, irradiated with ultraviolet rays (80 w / cm) for about 10 seconds, temporarily cured, and then inverted to heat the surface of the substrate 17 at a temperature of 150 ° C. for about 10 seconds. Cured. The values of the dielectric constant and the volume resistivity of the adhesive 16 are not particularly limited. The curing temperature is preferably in the range of 100 to 150 ° C.

Thereafter, the characteristics of each of the multilayer capacitor elements 12 to 15 adhered to the surface of the substrate 17 are marked 18 to display FIG.
As a result, a multiple-layered multilayer capacitor 19 as shown in FIG.

Since the multilayer capacitor elements 12 to 15 have a width of 0.8 mm, a thickness of 1.0 mm and a length of 1.6 mm, the thickness in the width direction and the thickness in the plane 8 direction are used. Can be easily identified, and the planes 8 can be arranged in parallel so that the planes 8 are in close contact with each other. Element 12-1
5 can be reliably arranged in a predetermined position.

Furthermore, since the substrate 17 thicker than the end of the external electrode 11 is adhered so as not to contact the end between the opposing external electrodes 11 turned back to the plane 8, the multiple type multilayer capacitor 19 is mounted. When soldering to a circuit board, the surface of the external electrode 11 to be soldered on the surface opposite to the board 17 of the multilayer capacitor elements 12 to 15 is deteriorated in surface by heat at the time of curing of the adhesive 16 and solderability is deteriorated. Can be prevented. Furthermore, the multilayer capacitor elements 12 to
Since 15 is securely bonded to the substrate 17, it can be transported,
When handling, the multilayer capacitor elements 12 to 15
No more separation from

Further, since the adhesive 16 uses an acrylic resin whose dielectric constant is smaller than the dielectric constant of the ceramic material, the stray capacitance between the multilayer capacitor elements 12 to 15 and between the substrates 17 is reduced. Can be suppressed small. In addition, since 4 × 10 ¹⁴ Ωcm, which is larger than the insulation resistance of the ceramic material, is used for the substrate 17 and glass epoxy is used for the substrate 17, the surface insulation resistance between the external electrodes 11 opposed to each other with the substrate 17 interposed therebetween is reduced. Without lowering, it is possible to prevent migration or short circuit between the external electrodes 11.

In the multiple capacitor 19, since the ridges of the multilayer capacitor elements 12 to 15 are chamfered, a groove-like gap is generated between the adjacent multilayer capacitor elements 12 to 15,
The adhesive 16 wraps around this and is firmly adhered to the substrate 17, and the distance between the external electrodes 11 formed narrower than the distance between the adjacent external electrodes 11 becomes wider,
When mounted on a circuit board, a short circuit due to a solder bridge between adjacent external electrodes 11 can be prevented.

In the seal 18 of the characteristic display, C is a capacitor element, H is a rated voltage of 50 V, K is a tolerance ± 10%, B is a B characteristic, 102 is 1 nF, 152 is 1.5 nF, and 222
Represents 2.2 nF and 103 represents 10 nF.

In the present embodiment, the multiple electronic components are formed by combining only the multilayer capacitor elements 12 to 15 with the functional elements. However, the multiple electronic parts are formed by combining functional elements such as resistor elements and thermistor elements. Can also.

The multi-layered multilayer capacitor 19 of the present invention manufactured in this way and the conventional multi-layered multilayer capacitor (using an inorganic adhesive) were compared with each other in terms of solderability and bending strength. The results are shown in (Table 1) and (Table 2).

[0047]

[Table 1]

The soldering is performed by immersing ten multiple capacitors 19 and 45 on a predetermined circuit board in a 260 ° C. reflow solder bath, respectively.
The case where all the external electrodes 11 and 43 surfaces of 9, 45 were covered with the solder by one third or more in terms of area ratio (○), and the case where at least one of the external electrodes 11 and 43 was less than one third (×) ).

As shown in Table 1, the product of the present invention was 10
While the solderability of all the pieces was (o), the conventional example had four (x). This is the conventional inorganic adhesive 4
4, water glass or glass solder _{((PbO-B 2 O 3} -ZnO 2 -SiO 2, P
Since bO—B ₂ O ₃ —ZnO ₂ —Al ₂ O ₃ ) is used, it takes 20 to dissolve it and bond the multilayer capacitor elements 41 together.
It is considered that a heat treatment of 0 ° C. or more was required, and at that temperature, the surface of the external electrode 43 was thermally degraded, and four poor solderability (×) were generated.

The product of the present invention emits ultraviolet rays (80 w / cm) for about 1
Since the substrate 17 is heated and cured at 150 ° C. for about 10 seconds for a short time after irradiating for 0 second and temporarily curing, the surface of the external electrode 11 is not thermally degraded and no soldering failure occurs. Further, an external electrode 1 for soldering the multilayer capacitor elements 12 to 15
Since the distance between the edge of the substrate 1 and the substrate 17 is wide, it was confirmed that the adhesive surface with the substrate 17 was not peeled off by heat during soldering even when an acrylic adhesive having high thermal decomposability was used. Have been.

[0051]

[Table 2]

As shown in Table 2, the average value of the transverse rupture strength of the product of the present invention was 5.57 kg, whereas the conventional example showed a small value of 2.48 kg. This is a conventional example,
The laminated capacitor element 41 is smaller than the product of the present invention because it is bonded to each other on the thin side surfaces where the external electrodes 43 are not formed. In the present invention, since the multilayer capacitor elements 12 to 15 are adhered to the glass epoxy substrate 17 with the adhesive 16, it is clear that the transverse rupture strength is much larger than that of the conventional example.

[0053]

As described above, according to the present invention, in a multiple-type electronic component in which a plurality of functional elements are arranged on a single substrate, the functional elements are entirely exposed at the end portions of the internal electrodes exposed at opposite end faces. External electrodes electrically connected so as to cover the upper and lower main planes are provided at the center of both end faces,
By connecting one of the upper and lower principal planes to the board with a thermosetting adhesive, the bending strength of the multiple electronic components is increased, and the finished product is soldered to the circuit board. When mounting, it is possible to provide a highly reliable multiple electronic component that does not reduce solderability.

[Brief description of the drawings]

FIG. 1 is a perspective view of a green chip of a multilayer ceramic capacitor element according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the green chip.

FIG. 3 is a perspective view of the sintered body after the chamfering.

FIG. 4 is a perspective view of the multilayer ceramic capacitor element.

FIG. 5 is an exploded perspective view of the multiple-layer ceramic capacitor.

FIG. 6 is a perspective view of a completed product of the multiple-layer ceramic capacitor.

FIG. 7 is a plan view of a completed product of the multi-layer ceramic capacitor.

FIG. 8 is a side view of a completed product of the multi-layer monolithic ceramic capacitor.

FIG. 9 is a perspective view of a completed product of a conventional multiple electronic component.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Green chip 2 Ceramic dielectric layer 3 Internal electrode 4 End part 5 Upper ineffective layer 6 Lower ineffective layer 7 Sintered body after chamfering 8 Plane 9 End face 10 Side face 11 External electrode 12, 13, 14, 15 Multilayer ceramic capacitor element 16 Adhesive 17 Substrate 18 Marking 19 Multiple-layered multilayer ceramic capacitor 20 Notch

Continued on front page F-term (reference) 5E001 AB03 AD03 AH04 AH06 AJ02 AZ01 5E082 AA01 BC31 CC05 DD03 EE04 EE35 FG06 FG26 FG54 GG10 GG26 JJ03 JJ15 KK07 KK08 MM06 MM24 MM26 MM28 PP01 PP02 PP05 PP06

Claims (20)

[Claims] 1. A multiple electronic component having a plurality of functional elements arranged on a single substrate, wherein the functional elements are electrically connected to end portions of internal electrodes exposed at opposite end faces,
External electrodes folded on the upper and lower main planes are provided at the center portions of the both end faces, and the functional elements are connected to each other by connecting one of the upper and lower main planes to the substrate with a thermosetting adhesive. Multiple electronic components. 2. The multiple electronic component according to claim 1, wherein the substrate and the functional element are bonded together using an adhesive that cures at a temperature lower than 150 ° C. 3. The multiple electronic component according to claim 1, wherein the substrate and the functional element are bonded together using an adhesive having a dielectric constant lower than the dielectric constant of the constituent material of the functional element. 4. The multiple unit according to claim 1, wherein the substrate and the functional element are bonded together using an adhesive having an insulation resistance higher than the insulation resistance of the constituent material of the functional element. Electronic components. 5. The multiple electronic component according to claim 1, wherein characteristics of each of the functional elements are displayed on a surface of the substrate. 6. The multiple electronic component according to claim 1, wherein the substrate is an insulator. 7. The multiple electronic component according to claim 1, wherein the substrate is bonded with an adhesive so as not to be in contact with an end of the external electrode of the functional element folded on the upper and lower main planes. . 8. The multiple electronic component according to claim 1, wherein the substrate has a thickness that is larger than the thickness of the end of the external electrode of the functional element folded back on the upper and lower main planes. 9. The multiple electronic component according to claim 1, wherein a direction indicator is provided on the substrate. 10. A thickness of the functional element in the upper and lower main plane directions,
The multiple electronic component according to any one of claims 1 to 9, wherein the thickness in the width direction is different. 11. The multiple electronic component according to claim 1, wherein the thickness of the functional element in the upper and lower main plane directions is greater than the thickness in the width direction. 12. The multiple type according to claim 1, wherein the width of the end of the internal electrode constituting the functional element is smaller than the width of the internal electrode formed inside the functional element. Electronic components. 13. The device according to claim 1, wherein the width of the end of the internal electrode constituting the functional element is smaller than the width of the external electrode.
The multiple electronic component according to any one of the above. 14. The multiple type according to claim 1, wherein an external electrode connected to an end of the internal electrode constituting the functional element is formed perpendicular to a surface of the end. Electronic components. 15. The multiple electronic component according to claim 1, wherein each edge of the functional element is chamfered. 16. The multiple electronic component according to claim 1, wherein a width of the external electrode of the functional element is smaller than a distance between the external electrodes of the adjacent functional elements. 17. The multiple electronic component according to claim 1, wherein each of the functional elements is a multilayer capacitor element. 18. The multiple electronic component according to claim 1, wherein each functional element is a resistor element. 19. The multiple electronic component according to claim 1, wherein each functional element is a thermistor element. 20. The multiple electronic component according to claim 1, wherein a functional element such as a multilayer capacitor element, a resistor element or a thermistor element is combined and adhered on a substrate.