JP2003076291A - Method and device for cutting wiring pattern of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to accurately cut a wiring pattern formed on a surface of a substrate by a laser beam while the substrate is being made to run at a high speed, and also to control to surely prevent the laser beam from being emitted on the part where the wiring pattern is not formed. SOLUTION: The positions of each electrode group 5G arranged on a lower substrate 2 of a liquid crystal panel 1 placed on a running table 22 of which the position is adjustable in the directions of X, Y, and θ, and the position of a blank part 7 where the electrodes 5 are not arranged, are recorded beforehand in a coordinate setting part 31 as coordinate positions with respect to the laser beam emitting position as the point of origin, and the laser beam is intermittently emitted to short-circuit wiring arranged at forming intervals of each electrode group G so that a mark 9 provided on the lower substrate 2 on the running table 22 is made to run from the state where it is located at the reference position, and when the electrode group 5G reaches the position of the origin point, the laser beam is emitted from a laser beam emitting means 25, and a switch 30 is made to operate at the position where the mark moves from the electrode group 5G to the blank part 7, to stop emitting the laser beam.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern cutting method and apparatus for cutting an unnecessary wiring pattern formed on a substrate such as a liquid crystal substrate by irradiating a laser beam.

[0002]

2. Description of the Related Art For example, a TFT drive type liquid crystal panel is constructed by enclosing a liquid crystal between two upper and lower transparent substrates, one substrate being a TFT substrate and the other substrate being a color filter substrate. . A driver circuit is connected to at least two sides of the four sides of the TFT substrate. The driver circuit includes an LSI (Integrated Circuit Element), and the mounting method of the driver circuit is TAB (Tape Automat).
The ed bonding method, COG (Chip on Glass) method and the like are widely used. In the TAB mounting method, the LSI is mounted on a tape-shaped film carrier and TCP (Tape C
This TCP is mounted on a board. Further, in the COG method, the LSI forming the driver circuit is directly mounted on the substrate.

A large number of transistors are arranged in a matrix on the TFT substrate, and a wiring pattern is formed so as to connect to each of these transistors. In this manner, a part of the wiring pattern forming portion on the substrate is projected from the substrate to be superposed on the wiring pattern, and a large number of electrodes are formed on the protruding portion, and each of these electrodes is electrically connected to the transistor. . The driver circuit is mounted so as to be connected to each electrode. For example, TCP is used in the TAB mounting method. The TCP is formed by mounting an LSI on a film carrier, and a predetermined number of leads are extended in the film carrier, and each of these leads is connected to an electrode.

Whether the TAB mounting method or another mounting method such as COG is used, the electrodes provided on the substrate constituting the liquid crystal panel are exposed to the outside before the driver circuit is mounted. Therefore, from the viewpoint of protecting the circuit from static electricity, all electrodes formed on the substrate are short-circuited. As a constitution of the short-circuit portion of the electrode, a pattern of the short-circuit wiring is formed on the surface of the substrate, and the short-circuit wiring is connected to each electrode. Therefore, before the driver circuit is mounted on the substrate, the short-circuit wiring and each electrode must be electrically disconnected.

For this reason, a laser beam irradiation means is provided to irradiate the short-circuit wiring of the substrate with the laser beam, and the short-circuit wiring is cut by separating a part of the short-circuit wiring from the surface of the substrate. It is common. Therefore, the laser beam irradiation means is provided so as to face the wiring cutting line on the substrate, but the laser beam irradiation means must scan the substrate with the laser beam. In order to scan with this laser beam, either the liquid crystal panel or the laser beam irradiation means is moved. Since the laser beam irradiation means is heavy and has a large size, it is not preferable to drive the laser beam irradiation means side. There is a so-called galvano method as a laser beam scanning method. In this galvano method, since only the mirror needs to be moved, the driving mechanism is relatively simple. However, the galvano method has a disadvantage that the scanning position of the laser beam changes due to the influence of temperature.

From the above, the laser beam irradiation means is fixedly arranged, the liquid crystal panel is installed on the traveling means, and the irradiation position of the laser beam on the liquid crystal panel is irradiated by the laser beam irradiation means. Generally, the liquid crystal panel is moved straight by operating the traveling means in the state where it coincides with the optical path, and the laser beam is emitted from the laser beam emitting means during this period.

[0007]

By the way, as described above, the large number of electrodes formed on the substrate of the liquid crystal panel are not all formed at the same pitch interval because of the connection to the driver circuit, but the drivers are not formed at the same pitch interval. An electrode group is formed for each connection portion of the circuit, and a space between adjacent electrode groups is a blank portion in which no electrode is formed over a predetermined interval. It is designed to be used for other purposes such as forming another wiring pattern in this blank portion. For this reason, it is controlled so that the blank portion between the electrode groups is not irradiated with a laser beam. There is a need to. Thus, in scanning the substrate with the laser beam, the irradiation of the laser beam is intermittent. Therefore, depending on how to set the timing of intermittent irradiation when the substrate is traveling, it becomes a big restriction on the traveling speed of the substrate, and when trying to perform highly accurate processing, the processing / processing speed decreases. There is a problem.

The present invention has been made in view of the above points, and an object of the present invention is to accurately cut a wiring pattern formed on the surface of a substrate while the substrate is traveling at a high speed. To be able to do it.

[0009]

In order to achieve the above-mentioned object, a plurality of electrode groups are formed with a predetermined number of electrodes as a group, and a substrate provided with a wiring pattern connected to each of these electrode groups is provided. As a method of irradiating the connection portion of the wiring pattern to each of the electrode groups with a laser beam to partially cut the wiring pattern, the substrate is placed on a traveling table and the traveling table is It is configured to continuously run in a straight direction at a constant speed, the reference position of the substrate placed on the traveling table is detected, and a laser beam is irradiated at the formation interval of the electrode groups, and adjacent electrode groups are arranged. In order not to irradiate the laser beam in the interval,
From the reference position, the coordinates of the irradiation position and the non-irradiation position of the laser beam are set during traveling of the traveling table, and the wiring pattern of each electrode group formation interval is intermittently irradiated with the laser beam by this coordinate position signal. It is characterized by doing so.

In addition, a plurality of electrode groups are formed with a predetermined number of electrodes as a group, and a connection portion of the wiring patterns to each of the electrode groups is formed on a substrate provided with a wiring pattern connected to each of the electrode groups. A device for irradiating a laser beam on the substrate to partially cut the wiring pattern includes a traveling table on which a substrate is placed and continuously travels in a straight direction at a constant speed, and a traveling table mounted on the traveling table. Reference position detecting means for detecting a reference position of the placed substrate, traveling distance measuring means for measuring a traveling distance of the traveling table, and laser beam irradiation for irradiating the wiring pattern of the substrate with a laser beam. Means, coordinate setting means for setting the coordinates of the position of the electrode group from the reference position, and a laser beam irradiation for the formation interval of the electrode group, and the interval between adjacent electrode groups Is provided with a control means for controlling the laser beam irradiation means so that the laser beam irradiation means is intermittently irradiated so as not to irradiate the laser beam. In this control means, the detection signal from the reference position detection means and the travel distance measurement means are used. From the traveling distance of the traveling table to the irradiation position of the laser beam, the irradiation of the laser beam by the laser beam irradiation means is started at the coordinate position of the start end of the electrode group, and the laser beam irradiation is started at the coordinate position of the end part of the electrode group. The feature is that the irradiation is controlled to be stopped.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. In the embodiments described below, it is assumed that a part of the wiring pattern group formed on the surface of the substrate of the liquid crystal panel is peeled off with a laser beam so as to disconnect from the ground line. The method and apparatus for cutting the wiring pattern of the substrate of the present invention are not limited to this.

First, FIG. 1 shows the structure of a liquid crystal panel before mounting the driver circuit. In the figure,
The liquid crystal panel 1 includes a lower substrate 2 and an upper substrate 3, and liquid crystal is sealed between the two substrates 2 and 3. Where T
When configured as an FT drive type liquid crystal panel, the lower substrate 2 is a TFT substrate and the upper substrate 3 is a color filter substrate. The size of the lower substrate 2 is larger than that of the upper substrate 3. Therefore, at least two sides (three sides in the illustrated example) of the lower substrate 2 project from the upper substrate 3 by a predetermined length.

The protruding portion of the lower substrate 2 is a driver circuit connecting portion 2a, and a predetermined wiring pattern is formed on each driver circuit connecting portion 2a. Elements, such as TFTs (thin film transistors), are provided in a matrix in a region where the lower substrate 2 and the upper substrate 3 overlap each other, and wirings are connected to these respective elements. Each of these wiring is
On the lower substrate 2, it is connected to a large number of electrodes formed on each driver circuit connecting portion 2a. Terminals and leads of the driver circuit are electrically connected to these electrodes.

FIG. 2 shows an enlarged view of one driver circuit connecting portion 2a on the lower substrate 2. Although there may be differences in the number of electrodes, intervals, etc., the other driver circuit connecting portions are not substantially different in structure from the driver circuit connecting portion 2a. Although not shown in the drawing, a large number of circuit elements such as TFTs are formed in a matrix in the overlapping portion of the lower substrate 2 and the upper substrate 3, and the wiring 4 from each of these elements is provided on the upper substrate 3.
Is extended to the driver circuit connecting portion 2a of the lower substrate 2 protruding from the overlapping portion. Further, electrodes 5 are arranged in the driver circuit connecting portion 2 a, and each wiring 4 is connected to each of these electrodes 5. Each electrode 5 is further short-circuited by the short-circuit wiring 6 on the end side of the lower substrate 2. Each of the wiring 4, the electrode 5, and the short-circuiting wiring 6 is formed by etching a metal thin film formed on the surface of the lower substrate 2 by a film forming means, and can also be formed by a printing means.

The driver circuit shown by reference numeral 10 in FIG. 2 is TAB mounted in the driver circuit connecting portion 2a. The driver circuit 10 has an LS on the carrier film 11.
The I12 is mounted, and terminals (not shown) of the LSI 12 are connected to a predetermined number of leads 13 and 14 provided on the carrier film 11. Carrier film 11
The lead 13 on one side is connected to the electrode 5 provided on the driver circuit connecting portion 2 a of the lower substrate 2. This driver circuit 1
A plurality of 0s are connected on one side of the lower substrate 2. For this reason, the electrode 5 constitutes the electrode group portion 5G for every number connected to the driver circuit 10 for one electrode, and therefore the plurality of electrode group portions 5G are formed in the driver circuit connecting portion 2a. . Here, the electrode group portion 5G includes a predetermined number of electrodes 5, and wirings 4 and short-circuiting wirings 6 connected to these electrodes 5. A blank portion 7 is formed between the electrode group portions 5G adjacent to each other, and the blank portion 7 is a region where other wirings, circuit patterns and the like are formed.

The short-circuit wiring 6 formed on the lower substrate 2 and constituting the electrode group portion 5G is for short-circuiting all the electrodes 5 constituting the electrode group portion 5G, and further at the edge portion of the lower substrate 2 and the like. All the short circuit wirings 6 are electrically connected to each other.
Therefore, if any part of the conductive portion of the short-circuit wiring 6 is grounded, the entire circuit is grounded, and circuit elements such as TFTs can be protected against static electricity. Therefore, before mounting the driver circuit 10 on the lower substrate 2, a process of disconnecting the connection between the electrode 5 and the short-circuit wiring 6 is performed. In this process, in the electrode group portion 5G, a laser beam is irradiated to a position in the short-circuiting wiring 6 in the vicinity of the connection portion to the electrode 5 and, for example, as shown in a cutting area 8 in FIG. Short circuit wiring 6 formed in
The connection of the short-circuit wiring 6 to the electrode 5 is cut off by peeling off a part of the.

In order to perform the above processing, the wiring pattern cutting device 20 shown in FIG. 3 is used. First, the liquid crystal panel 1 is fixedly mounted by a means such as vacuum suction on a traveling table 22 that can reciprocate in the direction of the arrow along the straight guide 21 in the figure. The traveling table 22 causes the liquid crystal panel 1 to reciprocate between the positioning stage S1 and the processing stage S2.
The traveling table 22 has a position fine adjustment mechanism 23 in the X, Y, and θ directions, and the position fine adjustment mechanism 23 adjusts the position of the liquid crystal panel 1.

A TV camera 2 is mounted on the positioning stage S1.
The image recognition means 24 using 4a is installed, the mark 9 provided on the corner portion of the lower substrate 2 is detected by the television camera 24a, and the mark 9 is compared with the reference position set in the image recognition means 24. I am trying to do it. As a result, the liquid crystal panel 1 mounted on the traveling table 22.
Of the lower substrate 2 of the liquid crystal panel 1 by detecting the deviation from the position serving as the reference and operating the position fine adjustment mechanism 23 to appropriately adjust the position of the traveling table 22 in the X, Y, and θ directions. The position is adjusted so that the position is appropriate. That is, the mark 9 is a mark for detecting the position of the liquid crystal panel 1.

In the processing stage S2, the laser beam irradiation means 2 is placed at a position above the traveling path of the traveling table 22.
5 are provided. This laser beam irradiation means 25
Is a laser oscillator 26 and an expander lens 27 for collimating a laser beam from the laser oscillator 26.
A reflecting mirror 28 for bending the optical path of the laser beam by 90 °, and a condenser lens 29. Therefore,
The laser beam irradiating means 25 irradiates the surface of the lower substrate 2 with a laser beam so as to have a predetermined spot diameter, and the metal thin film formed on the lower substrate 2 is peeled and removed. As a result, the short-circuit wiring 6 is partially cut off, and the conduction with the electrode 5 is cut off.

The laser beam is applied to the connecting portion between the electrode 5 and the short-circuiting wiring 6, but the blank area 7 is controlled not to be irradiated with the laser beam. That is, while the liquid crystal panel 1 travels on the travel table 22, the laser beam irradiation means 25 intermittently irradiates the laser beam. For this purpose, the laser oscillator 26 has a switch 3
0 is provided. The switch 30 can be configured by, for example, a Q switch, and the switch 30 is an O switch.
By controlling the N and OFF, the lower substrate 2 is irradiated with the laser beam only on the connecting portion between the electrode 5 and the short-circuiting wiring 6, and the blank region 7 is controlled to be stopped. To be done.

The operation control of the laser oscillator 26 is performed based on the coordinate information. For this purpose, the coordinate setting unit 31 is provided. As shown in FIG. 4, the coordinate setting unit 31 sets the laser beam irradiation position S as the origin position when the liquid crystal panel 1 is arranged at the reference position in the traveling direction of the traveling table 22, for example, the X-axis direction. The distance from the origin position to the position of the electrode group portion 5G on the lower substrate 2 is recorded as coordinate data. That is, in the driver circuit connection portion 2a of the lower substrate 2, the coordinate position information of the starting point of each electrode group portion 5G is P1H, P2H, P3H, ... PnH,
Also, the coordinate position information of the end point is P1L, P2L, P3L, ...
..Recorded as PnL. Since the interval between the electrode group parts 5G in each driver circuit connection part 2a of the lower substrate 2 is constant, the coordinate position to be recorded may be only the starting point coordinate position of the electrode group part 5G.

The reference position of the lower substrate 2 is set based on the mark 9 provided on the lower substrate 2. That is, the television camera 24a captures an image of the mark 9 on the lower substrate 2, the image is recognized by the image recognition means 24, and the position fine adjustment mechanism 23 provided with the traveling table 22 is operated so that the mark 9 becomes a predetermined reference position. Then, the position adjustment is performed. The position adjusted in this way becomes the reference position.
Therefore, the image recognition means 24 also functions as a reference position detection means for the lower substrate 2.

A means for measuring the traveling distance of the lower substrate 2 is provided in order to irradiate the laser beam from the laser oscillator 26 and stop the irradiation each time each electrode group 5G on the lower substrate 2 moves to the origin position. This mileage measuring means,
Encoder 32 and counter 3 provided on the traveling table 22
3 and 3. The encoder 32 outputs a pulse signal every time the traveling table 22 travels a predetermined distance, and the pulse signal from the encoder 32 is measured by the counter 33. Then, the counter 33 is reset when the lower substrate 2 is placed at the reference position, and in this state, the pulse signal from the encoder 32 is transferred to the counter 3
3, the moving distance of the lower substrate 2 is measured by measuring the number of pulses from the reset state.

The measured value of the counter 33, that is, the moving distance of the lower substrate 2 is compared with the coordinate information recorded in the coordinate setting section 31 by the comparator 34. The coordinate setting unit 31 includes start point coordinate positions P1H, P2H, P3H, ...
..PnH and end point coordinate positions P1L, P2L, P3L,
... PnL is set. Then, the coordinate position information P from the coordinate information output unit 31a in the coordinate setting unit 31.
1H, P1L, P2H, P2L, P3H, P3L, ...
-PnH and PnL are sequentially read out and sequentially compared with the measured value of the counter 33, and the laser beam is irradiated to the lower substrate 2 by turning on and off the switch 30 of the laser oscillator 26 each time they match. By controlling so as to stop the irradiation, the connecting portion of the short-circuiting wiring 6 to the electrode 5 forming the electrode group portion 5G is cut off so as to be peeled off, and the laser beam irradiation is performed at the position of the blank portion 7. Stop.

Here, the operation of the entire apparatus including the setting of each coordinate position in the coordinate setting section 31, the operation of the counter 33, the traveling of the traveling table 22 and the like is performed based on the signal from the control circuit 35. The control circuit 35 is composed of a CPU and the like.

With the above structure, each driver circuit connecting portion 2a of the lower substrate 2 of the liquid crystal panel 1 is provided while the traveling table 22 is traveling straight at a high speed.
In each of the electrode group portions 5G formed in the above, the short-circuit wiring 6 connected to the electrodes 5 is surely cut, and
It is possible not to give any damage to the blank portion 7 between G and 5G. Therefore, a method of cutting the short circuit wiring 6 will be described below.

First, the coordinate setting section 31 acquires the coordinate position information of the start point and the coordinate position information of the end point of each electrode group portion 5G. For this purpose, above the irradiation position of the laser beam,
That is, the second television camera 36 is installed at a position above the position where the reflection mirror 28 is arranged, and the second television camera 36 can photograph the electrode group portion 5G. Then, the reflection mirror 28 is removed from the optical path to bring the irradiation position of the laser beam into the visual field of the second television camera 38. On the other hand, the traveling table 22 is arranged on the positioning stage S1, and the liquid crystal panel 1 is mounted on the traveling table 22.
The mark 9 on the lower substrate 2 is photographed by the television camera 24a which is placed on the top and constitutes the image recognition means 24. And
When the mark 9 is deviated from the reference position by the image recognition means 24, the position fine adjustment mechanism 23 is operated to adjust the position. When this position adjustment is completed, the liquid crystal panel 1 is caused to travel by the travel table 22, and the travel distance of the travel table 22 is measured by the signal from the encoder 32.

When the traveling table 22 travels for a predetermined distance, the first electrode group portion 5G on the lower substrate 2 comes into a predetermined position in the visual field of the second television camera 36. Therefore, the traveling distance of the traveling table 22 up to this time is recorded in the coordinate setting unit 31 as the coordinate position P1H on the X axis with the irradiation position of the laser beam as the origin. Further, since the position where the first electrode group portion 5G of the lower substrate 2 passes is within the visual field of the second television camera 36, the distance to this position is recorded in the coordinate setting unit 31 as the coordinate position P1L. Hereinafter, each time the position of the start point and the end point of the electrode group portion 5G is detected, it is recorded in the coordinate setting unit 31. In this way, the coordinate position of each electrode group portion 5G is acquired. As a result, if the mark 9 on the lower substrate 2 is located at the reference position at the position of the television camera 24a, the short-circuit wiring on the lower substrate 2 is obtained. The cutting position 6 always passes through the irradiation position of the laser beam. When the coordinate setting unit 31 sets and records the coordinate position of each electrode group 5G as described above, the reflecting mirror 28 is returned to the normal position.

Therefore, the traveling table 22 is arranged on the positioning stage S1, and the liquid crystal panel 1 is mounted on the traveling table 22. The liquid crystal panel 1 can be placed by a handling means such as a robot, and the lower substrate 2
Are brought into contact with the traveling table 22, and the lower substrate 2 is fixed by vacuum adsorption or the like by the traveling table 22.

In this state, the image recognition means 24 equipped with the television camera 24a detects the position of the lower substrate 2 based on the mark 9, and when the mark 9 deviates from the reference position, the fine position adjustment mechanism 23 is activated. Operate and run table 2
Adjust position 2. When this position adjustment is completed, the traveling table 22 is moved from the positioning stage S1 toward the processing stage S2. This moving distance is encoder 3
2 and a counter 33 for measuring the travel distance. At this time, the first starting point coordinate position P1H is read from the coordinate information output unit 31a in the coordinate setting unit 31 and compared with the detection signal from the counter 33 in the comparator 34. Then, when the traveling table 22 moves by the distance from the origin position to the first starting point coordinate position P1H of the lower substrate 2, the switch 30 is turned on, and the laser oscillator 26 starts irradiation of the laser beam. As a result, the short-circuit wiring 6 in the electrode group portion 5G
The connection of the electrode to the electrode 5 is cut by the energy of the laser beam.

When the laser beam irradiation start signal of the laser oscillator 26 is output from the comparator 34 to the switch 30, the coordinate information output section 31a outputs the next coordinate position information, that is, the first end point coordinate position P1L to the comparator 34. And is compared with the output from the counter 33. And counter 3
Irradiation of the laser beam from the laser oscillator 26 continues until the movement of the lower substrate 2 by 3 reaches the coordinate position P1L, that is, while the electrode group portion 5G is arranged at the irradiation position of the laser beam. Then, when the comparator 34 detects that the substrate 2 has advanced to the end point coordinate position P1L, a signal is input to the switch 30 and the switch 30 is turned off. As a result, the relevant electrode group portion 5
All the electrodes 5 in G are disconnected from the short-circuit wiring 6.

When the switch 30 is turned off, the lower substrate 2
The irradiation of the laser beam to the laser beam is stopped, but during this period, the blank portion 7 in the lower substrate 2 passes through the laser beam irradiation position. Therefore, the blank portion 7 is not irradiated with the laser beam. As a result, when the blank portion 7 is provided with another pattern or the like, the pattern or the like is not damaged by the laser beam.

Then, the comparator 34 detects that the lower substrate 2 has reached the end point coordinate position P1L, and the switch 3
When 0 is turned off, the next coordinate information, that is, the second starting point coordinate position P2H is read from the coordinate information output unit 31a and compared with the output value of the counter 33. Then, when the second starting point coordinate position P2H of the lower substrate 2 reaches the laser beam irradiation position, the switch 30 is turned on again, and the laser beam irradiation is started. Hereinafter, the coordinate position information recorded in the coordinate setting unit 31 is read from the coordinate information output unit 31a, and the comparator 3
In 4, the output value of the counter 33 is sequentially compared and ON / OFF control of the switch 30 is performed.

As a result, in all of the electrode group parts 5G provided in the driver circuit connecting part 2a of the lower substrate 2, the connecting parts of the short-circuit wiring 6 to the electrodes 5 are cut off, and moreover, the electrode group part 5G. Irradiation of the laser beam by the laser oscillator 26 is intermittently performed so that the irradiation of the laser beam is stopped in the blank portion 7 where no mark is formed.

[0035]

Since the present invention is constructed as described above, the wiring pattern formed on the surface of the substrate can be accurately cut by the laser beam while the substrate is traveling at a high speed, and the wiring pattern is formed. There is an effect that it is possible to control so as not to irradiate the laser beam to the unexposed portion.

[Brief description of drawings]

FIG. 1 is a plan view of a liquid crystal panel as an example of a substrate to be processed / processed.

FIG. 2 is an enlarged view of a main part of FIG. 1 together with an example of a driver circuit mounted on a liquid crystal panel.

FIG. 3 is a configuration explanatory diagram of a wiring pattern cutting device for a substrate, showing an embodiment of the present invention.

FIG. 4 is an explanatory diagram of coordinate positions of each electrode group portion on the lower substrate.

[Explanation of symbols]

1 LCD panel 2 Lower substrate 3 Upper substrate 5G electrode group 5 electrodes 6 short circuit wiring 7 Blank area 8 Cutting area 9 mark 20 Wiring pattern cutting device 21 Straight ahead guide 22 Travel table 23 Position fine adjustment mechanism 24 image recognition means 24a TV camera 25 Laser beam irradiation means 26 Laser oscillator 30 Switch 31 Coordinate setting section 31a Coordinate information output unit 32 encoder 33 counter 34 comparator 35 control circuit

Claims (2)

[Claims] 1. A substrate, on which a plurality of electrode groups are formed with a predetermined number of electrodes as a group, and a wiring pattern connected to each of these electrode groups is provided on a substrate, the connection portion of the wiring pattern to each of the electrode groups. Is a method of partially cutting the space between the wiring pattern and the electrodes by irradiating the substrate with a laser beam on the traveling table, and the traveling table is moved straight at a constant speed. It is made to run continuously, the reference position of the substrate placed on the running table is detected, a laser beam is irradiated at the formation interval of the electrode groups, and a laser beam is irradiated at the interval between adjacent electrode groups. In order not to do so, the coordinates of the irradiation position and the non-irradiation position of the laser beam are set from the reference position during traveling of the traveling table, and the wiring pattern of each electrode group forming interval is set by this coordinate position signal. A method for cutting a wiring pattern on a substrate, which comprises intermittently irradiating a laser beam. 2. A plurality of electrode groups are formed with a predetermined number of electrodes as a group, and a connection portion of the wiring pattern to each of the electrode groups is formed on a substrate provided with a wiring pattern connected to each of the electrode groups. An apparatus for irradiating a laser beam on a part of the wiring pattern to partially cut the wiring pattern, wherein a substrate is placed, and the traveling table continuously travels in a straight direction at a constant speed; Position detecting means for detecting the reference position of the printed board, running distance measuring means for measuring the running distance of the running table, and laser beam irradiating means for irradiating the wiring pattern of the board with a laser beam. A coordinate setting means for setting the coordinates of the position of the electrode group from the reference position, and irradiating a laser beam to the formation interval of the electrode group,
In order not to irradiate the laser beam at the interval between adjacent electrode groups, a control means for controlling the laser beam irradiation means to intermittently irradiate is provided, and in this control means, a detection signal from the reference position detection means, From the traveling distance of the traveling table from the traveling distance measuring means to the irradiation position of the laser beam, irradiation of the laser beam by the laser beam irradiation means is started at the coordinate position of the starting end portion of the electrode group, and the end portion of the electrode group is A wiring pattern cutting device for a substrate, characterized in that the laser beam irradiation is controlled to stop at a coordinate position.