JP3402752B2 - Electronic component mounting equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recognizes an electronic component held by a take-out nozzle by a component recognition device and mounts it on a printed circuit board, and recognizes the position of a component by an image of light reflected upon the component. When recognizing a component in the reflected illumination system, the background of the component is radiated, and the position of the component is recognized by the transmitted image of the light that has passed through the component. When recognizing the component in the transillumination system, the component is illuminated with light. The present invention relates to an electronic component automatic mounting device having a diffusion plate.

[0002]

2. Description of the Related Art An electronic component automatic mounting apparatus of this type is disclosed in Japanese Patent Laid-Open No.
Japanese Unexamined Patent Publication No. 320906/1990 discloses that a component recognizing device recognizes a positional deviation of an electronic component held by a take-out nozzle, corrects the positional deviation based on the recognition result, and mounts a component at a predetermined position on a printed circuit board. Done. Depending on the type of electronic component, when this recognition is performed, light is emitted from above the component and the transmitted image is captured by the recognition camera below, and when the recognition process is performed, from below with the camera to the lead of the component. There is disclosed a technique in which the recognition process may be performed by shining light on the reflected light and capturing an image of the reflected light.
Then, in the case of the former illumination at the time of recognition of the transillumination method, light is applied from the light source to the diffuser plate provided above the extraction nozzle, and the diffuser plate irradiates the light. In the case of illumination during system recognition, the diffuser needs to be dark as it is the background of the image of the brightly glowing component.

[0003]

However, in the above-mentioned prior art, the same diffuser plate is the background of the image of the component in both the reflection illumination type illumination and the transmissive illumination type illumination. Since the color of the material is compatible with both methods, it is necessary to have an intermediate color between a bright color and a dark color, and both methods have a drawback that the recognition performance is halfway.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to obtain a good background brightness of an image in both of the case of recognizing the parts of the reflection illumination system and the transmission illumination system.

[0005]

Therefore, according to the present invention, an electronic component held by a take-out nozzle is recognized by a component recognizing device and mounted on a printed circuit board, and at the same time, an image of the component is reflected by an image of light reflected upon the component. When recognizing a component of the reflected illumination method that performs position recognition, it becomes the background of the component, and when recognizing the position of the component by the transillumination method that recognizes the position of the component by the transmitted image of the emitted light transmitted through the component. In an electronic component automatic mounting apparatus having a diffusion plate that reflects light from a light source and irradiates the component with light, the diffusion plate includes a reflection layer that reflects light from the light source, and a reflection layer of the reflection layer. Transmitted illumination system provided on the light source side
From the light source to the reflective layer when recognizing a component by
When the components of the reflective lighting system are recognized,
Is in a state of blocking the light from the light source to the reflective layer.
And a brightness changing layer for changing the brightness of the diffusion plate.

[0006]

Further, the present invention is a reflection illumination system in which an electronic component held by an ejection nozzle is recognized by a component recognition device and mounted on a printed circuit board, and the position of the component is recognized by an image of light reflected by the component. When recognizing a part, the background of the part is recognized, and the position of the part is recognized by the transmitted image of the light that has been radiated. The diffuser plate that illuminates the part when recognizing the part by the transillumination method is used. In the electronic component automatic mounting device having, the diffuser plate has a reflection for reflecting light.
Layer and the state of transmitting or blocking light to this reflective layer.
And a liquid crystal layer to be turned into a liquid crystal layer .

[0008]

According to the structure of the present invention, the lightness changing layer is provided on the light source side of the reflecting layer, and when the component is recognized by the transmissive illumination system , the light is transmitted from the light source to the reflecting layer and is reflected. When recognizing the parts of the lighting system, from the light source to the reflective layer
The light is blocked, and the brightness of the diffusion plate is changed.

According to the second aspect of the invention, the liquid crystal layer provided on the diffusion plate provided with the reflection layer for reflecting light changes to the transmission state or the light shielding state of the light to the reflection layer to change the brightness of the diffusion plate. It is possible.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, 1 is a Y table that moves in the Y direction by the rotation of the Y-axis motor 2, and 3 is a result that results from moving in the X direction on the Y table 1 by the rotation of the X-axis motor 4. An XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).

Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, which rotates the ball screw 10 so that the supply screw 7 is fitted to the linear guide 1 via a nut (not shown) fixed to the supply base 7.
It is guided by 2 and moves in the X direction. Reference numeral 13 denotes a rotary table which rotates intermittently, and mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at the outer edge of the table 13 at equal intervals in accordance with the intermittent pitch. Has been done.

The mounting position of the mounting head 15 for picking up the component 5 by the suction nozzle 14 from the supply device 8 (the position marked with a black dot in the upper part of FIG. 2) is the suction station I, and the suction station I is mounted. When the head 15 descends, the suction nozzle 14 sucks the component 5. Reference numeral II denotes a recognition station in which the mounting head 15 that has picked up the component 5 stops due to intermittent rotation of the rotary table 13, and the component recognition device 16 recognizes the displacement of the component 5 with respect to the suction nozzle 14.

Reference numeral III denotes a mounting station (a position marked with a black circle in the lower part of FIG. 2) where the mounting head 15 stops in order to mount the component 5 held by the suction nozzle 14 on the printed circuit board 6. When the head 15 descends, X
The component 5 is mounted on the printed circuit board 6 stopped at a predetermined position by the movement of the Y table 3. The mounting head 15 is shown in FIG.
Further, as shown in FIG. 3, a rotary body 20 is attached to the rotary plate 13 so that the suction nozzles 14 can be moved in and out of a mounting plate 19 which is vertically movable with respect to the rotary table 13 at the suction station I and the mounting station III. A motor 21 that is rotatably mounted in a direction around an axis parallel to the rotation axis (hereinafter referred to as θ direction) and that rotates the rotating body 20 is formed above the motor 21. The suction nozzle 14 penetrates the rotating body 20 and is vertically movable.

The rotating body 20 has a diffuser plate 2 as a background of a screen imaged by a camera when the component recognition device 16 recognizes a displacement of the component 5 with respect to the suction nozzle 14.
2 is formed. For component recognition, recognition of a transillumination system in which the component 5 is illuminated from the opposite side of the camera, that is, above the component 5 and recognized by the projected image of the component 5, and light reflected from the component 5 by irradiating the component 5 with light from the camera side There is a recognition of the reflected illumination method. In FIGS. 1 and 4, reference numeral 23 denotes a light source. In the case of the transmissive illumination system shown in FIG. 1, the light emitted from the light source 23 is applied to the diffuser plate 22 and the light reflected and diffused by the diffuser plate 22 causes the component 5 to pass through. The light is transmitted and received by the component recognition device 16, and in the case of the reflection illumination system shown in FIG.
2 is designed as a background.

The diffusion plate 22 is a white coating layer 24 applied to the inside of the rotating body 20, and the diffusion plate 22 is attached on the white coating layer 24.
Is formed by a liquid crystal layer 25 as a layer for changing the brightness and a nearly transparent milky white resin plate 26 attached thereon. The material of the resin plate 26 is, for example, polyacetal. The liquid crystal layer 25 has a panel-like structure in which liquid crystal is sandwiched between glass plates and becomes transparent in a direction perpendicular to the glass plates when a voltage is applied between electrodes provided over the entire surfaces of the glass plates on the upper and lower sides. When the electric potential difference disappears, the light cannot pass through.

The liquid crystal layer 25 and the resin plate 26 may be attached to the rotating body 20 by screwing instead of pasting. Each of the electrodes of the liquid crystal layer 25 is provided with a lead wire 27 for applying a voltage to make the liquid crystal layer 25 transparent and shielded. White paint layer 24
Is a layer that diffuses and reflects light, and as shown in FIG.
Is transparent, the light from the light source 23 is reflected and the liquid crystal layer 2
The diffused light is applied to the component 5 through the resin 5 and the resin plate 26 to recognize the transillumination method, and the liquid crystal layer 2
When 5 is in the light-shielded state, the light from the light source 23 is shielded by the liquid crystal layer 25 and hardly reflected, and the diffusion plate 22 is in a dark state. The white coating layer 24, the liquid crystal layer 25 and the resin plate 26 have a suction nozzle 1
There is a hole through which 4 passes.

The lead wire 27 is an electrode 30 provided on the surface of the rotating shaft 29 of the motor 21 to which the rotating body 22 is attached.
A lead ring 32 connected to a slip ring 31 which is provided in a ring shape on the inner surface of the mounting plate 19 and which allows the electrode 30 to come into contact with the rotary body 20 at any rotational position. The inside of the rotary table is connected to the interface 34 shown in FIG. 5 via a slip ring having a similar structure to a rotary shaft (not shown) of the rotary table.

The control block of the automatic electronic component mounting apparatus will be described in detail with reference to FIG. Reference numeral 36 denotes a CPU as a brightness changing means, which controls various operations relating to component mounting based on the data stored in the RAM 38 in accordance with the program stored in the ROM 37. The recognition device 16 and the drive circuit 3 are connected to the CPU 36 via the interface 34.
9 etc. are connected. The drive circuit 39 is connected to the supply table drive motor 9 and the motor 21 of each head 15.

NC data as shown in FIG. 6 is stored in the RAM 38. NC data is printed circuit board 6
Although it is stored in the RAM 38 for each type, the reel number (column labeled “R-NO”) and the X data (column labeled “X”) for each step indicating the mounting order. ), Y data (column labeled “Y”) and θ data (column labeled “θ”). The reel number is a number indicating the arrangement position of the component supply device 8 on the supply base 7, the X data and the Y data represent the XY position coordinates where the chip component 5 on the printed circuit board 6 should be mounted, and the θ data is the chip component. 5 shows the θ direction in which the chip component 5 should be mounted, that is, the angle amount by which the sucked chip component 5 should rotate. "E" in the "C" column indicates that component mounting for each printed circuit board 6 is completed in this step.

The RAM 38 also stores the arrangement data shown in FIG. 7 and the component library data shown in FIG.
The arrangement data of FIG. 7 indicates the arrangement position of the component supply device 8 on the supply base 7 for each reel number and the component supply device 8 at that position.
The component ID indicating the type of the chip component 5 supplied by is stored. The component library data shown in FIG. 8 is a component ID.
Various data are stored for each of them, and for example, data indicating whether the component should be recognized by the reflective illumination method or the transmitted illumination method. The CPU 36 reads out data relating to what should be done with respect to the component 5 from the component library data via the arrangement data based on the reel number read out by the NC data.

The light source 23 is also controlled by the CPU 36 via the interface 34 so that the lower surface of the component 5 is directly irradiated with light in the case of the component recognition of the reflection illumination system, and the component 5 is illuminated in the case of the transillumination system. The diffuser plate 26 is irradiated with light without direct contact as much as possible. The operation will be described below with the above configuration.

First, when an unillustrated automatic operation start key is pressed, automatic operation is started, and the printed circuit board 6 is moved to XY.
When placed on the table 3 and positioned and fixed, the mounting operation of the component 5 is started according to the step of the NC data (FIG. 6) of the substrate 6. That is, reel number 1 in step 1
Is read, and the motor 9 is rotated so that the component supply device 8 of the reel number stops at the suction position of the suction nozzle 14, and the supply base 7 is moved. When the mounting head 15 in the selected state by the rotation of the motor 21 reaches the suction station I by the rotation of the rotary table 13, the nozzle 14 matching the component type of the component supply device 8 reaches the suction station I, and the mounting head 15 is not shown. As the cam is driven, it descends and the chip component 5 supplied by the component supply device 8 is adsorbed by the adsorption nozzle 14 as shown in FIG.

Next, when the head 15 moves and reaches the recognition station II due to the intermittent rotation of the rotary table 13, the component recognition device 16 recognizes the component 5 sucked by the suction nozzle 14. That is, the CPU 36 reads the arrangement data of FIG. 7 from the reel number of step 1 of the NC data of FIG. 6 read from the RAM 38, knows that the component ID is AAA, reads the component library data of the component ID AAA, and reads this component 5 It is determined that the transillumination type component recognition is applied to.

Next, the CPU 36 switches the light source 23 to the transmissive illumination system according to this judgment, and further, the lead wire 32,
The liquid crystal of the liquid crystal layer 25 is made transparent through the diffusion plate 22.
Control to brighten. Next, the component recognition device 16 images the component 5, and the light emitted from the light source 23 strikes the diffusion plate 22, but the resin plate 26 and the liquid crystal layer 2 in a transparent state.
After passing through 5, the white coating layer 24 is reflected, diffused, again transmitted through the liquid crystal layer 25 and the resin plate 26, and irradiated on the component 5, and this image is picked up by the camera of the component recognition device 16. As shown in FIG. 9, the picked-up image is such that the part 5 is black and the background diffuser plate 22 is sufficiently bright so that the image of the part 5 is clearly projected.

Based on the image, the positional deviation of the component 5 (including the angular positional deviation) is recognized. Next, the head 15 is recognized by the rotation of the rotary table 13.
Although moving from the section II, the CPU 36 uses the recognition device 16
If it is recognized from the recognition result that there is an angle deviation of Δθ, the drive circuit 39 is caused to rotate the rotary shaft 29 by an angle “90−Δθ” in which the positional deviation is added to 90 degrees of the θ data of the NC data. The component 5 is issued a command and the angular displacement is corrected, and the component 5 is swung to the angular position of the θ data to be mounted.

Next, when the mounting head 15 reaches the mounting station III, the mounting head 15 descends in the same manner as in the suction station I, and is mounted at the coordinate position (X1, Y1) of the printed circuit board 6 by 90 degrees. It is installed at an angle. Since the XY table 3 is mounted in the position, the XY table 3 is displaced by the rotation of the X-axis motor 4 and the Y-axis motor 2 due to the recognition result of the recognition device 16, and the suction nozzle 14 is rotated by "90-Δθ". The movement amount is corrected by correcting the positional deviation due to the movement.

In this way, the suction operation or the mounting operation of the component 5 is performed for each mounting head 15 in the order of the steps of the NC data. At a certain step, the component ID of the component 5 sucked by the suction nozzle 14 If it is stored in the component library data that the reflection lighting system is stored, C
When the mounting head 15 holding the component 5 reaches the recognition station II, the PU 36 adjusts the light source 23 to the reflective illumination system so that the lower surface of the component 5 is directly illuminated with the liquid crystal layer 25 shown in FIG. As shown in FIG. Most of the light from the light source 23 is applied to the lower surface of the component 5, but there is also light that hits the diffuser plate 22.
The light that hits 2 passes through the resin plate 26 but cannot pass through the liquid crystal layer 25, and even if a small amount is reflected on the surface of the liquid crystal layer 25, it is overwhelmingly larger than the amount of light reflected by the white coating layer 24. The amount of light reflected by the diffuser 22 and entering the component recognition device 16 is suppressed to a small amount and is made dark. As shown in FIG. 10, the image of the component 5 picked up by the component recognition device 16 is sufficiently dark so that the image of the component 5 is bright and the portion of the diffuser plate 22 serving as the background has a contrast of the image of the component 5. ing. Accurate position shift recognition processing is performed based on this image. In the image of FIG. 10, the entire component 5 is shown in white for the sake of convenience.
The most protruding metal lead is reflected most strongly, and the mold part is not as bright as the lead part,
The contrast of the image of the lead portion appears due to the difference from the brightness of the diffusion plate 22, and it is important that the brightness of the diffusion plate 22 is dark.

In the present embodiment, the structure of the diffusion plate 22 is such that the resin plate 26 is laminated on the liquid crystal layer 25, but the resin plate 26 is directly laminated on the white coating layer 24, that is, the diffusion plate. It is conceivable to have a structure in which liquid crystal is superposed on the surface of 22, or a structure in which liquid crystal is simply superposed on the white coating layer 24. When the liquid crystal layer is to be formed on the surface of the diffusion plate as described above, a coating may be applied thereon.

[0029]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, the antireflection light is reflected.
The brightness of the diffuser plate can be changed by changing the light from the light source to the reflective layer to the transmissive state or the light-shielding state by the brightness changing layer such as a liquid crystal layer provided on the diffuser plate having the reflective layer. Therefore, at the time of recognizing both the transillumination type and the reflection illuminating type components, it is possible to easily obtain an image with the optimal brightness as a background suitable for the respective types, and it is possible to perform the component recognition processing based on the image. Therefore, the accuracy of component recognition can be improved.

[Brief description of drawings]

FIG. 1 is a side view of a mounting head.

FIG. 2 is a plan view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 3 is a perspective view of the mounting head as seen from below.

FIG. 4 is a side view of the mounting head.

FIG. 5 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 6 is a diagram showing NC data.

FIG. 7 is a diagram showing arrangement data.

FIG. 8 is a diagram showing component library data.

FIG. 9 is an image of a transillumination type component.

FIG. 10 is an image of a component of a reflection illumination type.

[Explanation of symbols]

5 Chip-shaped electronic components (electronic components) 6 printed circuit boards 14 Adsorption nozzle (take-out nozzle) 16 parts recognition device 22 Diffuser 25 Liquid crystal layer (brightness changing means) 36 CPU (brightness changing means)

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Claims (2)

(57) [Claims] 1. A reflective illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing the position of the component based on an image of light reflected by the component. When recognizing, it becomes the background of the parts ,
A light source is used when recognizing a component by the transillumination method, in which the position of the component is recognized by the transmitted image of the emitted light that has passed through the component.
In an electronic component automatic mounting apparatus having a diffuser plate that reflects light from a device and irradiates the component with light, the diffuser plate includes a light source.
The reflective layer that reflects the light from and the light source side of this reflective layer.
The above-mentioned reflection is used when recognizing a component by the eclipse transmission illumination method.
The light from the light source is transmitted to the layer, and the reflective illumination method is used.
From the light source to the reflective layer during the recognition of the components of the formula
The brightness that changes the brightness of the diffuser plate by blocking the light
An electronic component automatic mounting device, characterized in that a change layer is provided. 2. A reflection illumination type component for recognizing an electronic component held by a take-out nozzle by a component recognizing device, mounting the electronic component on a printed circuit board, and recognizing a position of the component based on an image of light reflected by the component. When recognizing, it becomes the background of the parts ,
In the electronic component automatic mounting device having a diffuser plate that irradiates the component with light when recognizing the component by the transillumination method in which the position of the component is recognized by the transmitted image of the emitted light transmitted through the component , This is a reflective layer that reflects light and this
Liquid crystal that changes to the state of transmitting light to the reflective layer or blocking light
A device for automatically mounting electronic parts, characterized in that a layer is provided.