JP3222982B2 - Component recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognizing device for recognizing a position of an electronic component picked up by a suction nozzle by illuminating the electronic component with an image pick-up device and recognizing a position of the component relative to the nozzle.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus of this type, as disclosed in Japanese Patent Application Laid-Open No. 3-94500, light emitted from a light source is diffused into a diffusion plate by an electronic component taken out by a suction nozzle. The illuminated and transmitted image is captured by the imaging camera, and the displacement of the electronic component with respect to the suction nozzle is recognized. Then, the positional deviation is caused by angle correction and
The direction is corrected, and the component is mounted at a position to be mounted on the printed circuit board at an angle to be mounted.

[0003]

However, in the prior art, if light in the same state is always emitted from a light source, an image captured by an imaging camera may not be accurate depending on the type of electronic component. For example, in the case of a rectangular parallelepiped electronic component, as shown in FIG. 10, unnecessary light is not reflected downward to form a sharply contoured image. As shown in the figure, when light is applied from the lateral direction, the light hits a portion inside the outermost shape of the lower half of the component as viewed from above, and there is a drawback that the outline is not clear and the accurate position cannot be recognized. In addition, when the light adapted to the cylindrical electronic component is applied to the rectangular parallelepiped electronic component, the amount of light is too small to obtain a clear image.

[0004] Therefore, an object of the present invention is to make it possible for a good image to be picked up by an image pickup device regardless of the type of electronic component.

[0005]

For this purpose, a component recognizing device for recognizing a position of the component with respect to the nozzle by capturing an image obtained by illuminating the electronic component sucked by the suction nozzle by an illumination unit with an image pickup device. For each part type
An adjusting means is provided for adjusting the light amount of the illuminating section according to the type of component based on the illumination data stored in the apparatus .

Also, in a component recognition device that picks up an image obtained by illuminating the electronic component sucked by the suction nozzle with an imaging device and recognizes the position of the component with respect to the nozzle, the light source illuminates the electronic component. Multiple lighting blocks and lighting data stored in the storage device for each component type
An adjusting means for adjusting the amount of light for each of the lighting blocks according to the type of component based on the type of component is provided.

[0007]

According to the structure of the first aspect, the adjusting means is provided for each component type.
The light amount of the illumination unit is adjusted according to the type of component based on the illumination data stored in the storage device . According to the configuration of the second aspect, the adjusting means is stored in the storage device for each component type.
The light amount of each lighting block is adjusted according to the component type based on the lighting data .

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. In FIG. 2, (1) is an XY table which is moved in the X and Y directions by driving an X-axis servo motor (2) and a Y-axis servo motor (3). A printed circuit board (5) on which (4) is mounted is placed.

Reference numeral (6) denotes a component supply table on which a number of component supply devices (7) are arranged in parallel. A guide (10) is formed by rotating a ball screw (9) by driving a component supply servomotor (8).
And is moved in the left-right direction in FIG. (11) The above-mentioned chip component (4) is provided on the lower surface with the above-mentioned component supply device (7).
A rotary table in which a plurality of suction nozzles (13) provided with a plurality of suction nozzles (12) for taking out and transporting the ink is intermittently rotated via an index unit (not shown) by the rotation of a motor (not shown). Be moved. The suction head section (13) is provided corresponding to the intermittent rotation pitch.

(I) is a suction station for taking out the chip component (4) from the component supply device (7). (II)
Is a recognition station for recognizing the state of the chip component (4) sucked by the suction nozzle (12) by the component recognition device (16). (III) is a chip component (4)
A nozzle rotation correction station that performs rotation correction for the nozzle rotation device (1) based on the recognition result of the recognition device (16) so that the angle of the component (4) becomes the mounting angle.
7) is corrected and the nozzle (12) is rotated.

(IV) a mounting station for mounting the chip component (4) after completion of the operation in the nozzle rotation correction station (III) on a printed circuit board (5);
From these, an electronic component automatic mounting apparatus is configured. Next, the component recognition device (16) will be described with reference to FIGS. Reference numeral (20) denotes an acrylic diffusion plate provided at a peripheral portion of each of the suction nozzles (12). Reference numeral (21) denotes a nozzle (12) above each nozzle (12) for each head (13). ) An acrylic diffusion plate provided over the entire surface.

The diffusion plates (20) and (21) are coated on the upper surface to form a reflection surface, the inside is formed as a light guide layer, and the lower surface is formed as a rough surface. The light is diffusely reflected on the reflecting surface and further diffused on the lower surface, and is irradiated on the chip component (4). (22) The diffusion plate (20)
(21) is a lighting unit for irradiating light, and the lighting unit (2)
2) is divided into ten lighting blocks (23). Each lighting block (23) has a light emitting LED (2
4) are arranged, and an illumination circuit (3) described later is provided.
According to 1), the brightness of the LED (24) can be adjusted for each block (23), and lighting and extinguishing can be controlled for each block (23).

The lower one of the illumination blocks (23) outside the rotary table (11) is the illumination block (2).
3A), (23B), and (23C) (the side of the nozzle (12) sucking the component (4) in FIG. 1), and above these are the illumination blocks (23D), (23E), and (23F). Among the lighting blocks (23), the lower ones inside the rotary table (11) are lighting blocks (23G) and (23H).
J) is attached.

An imaging camera (26) captures a transmitted image of light from the diffusion plates (20) and (21) by the illumination of the illumination part (22) of the chip part (4) sucked by the suction nozzle (12). It is. A control block of the electronic component automatic mounting device will be described with reference to FIG. (27) is the CPU (2
The imaging camera (26) is connected to the interface connected to 8) via a recognition processing circuit (32). The recognition processing circuit (32) performs recognition processing based on the image captured by the imaging camera (26). Reference numeral (29) denotes a RAM serving as a storage device, which stores center position data, NC data, parts library data, and the like of each suction nozzle (12). A ROM (30) stores a program related to a mounting operation of the chip component (4). A lighting circuit (31) is connected to the interface (27), and a CPU (28) controls the circuit (31) to change the brightness of each lighting block (23) so that it can be turned on and off. .

The data stored in the RAM (82) will be described. As shown in FIG. 5, the NC data includes a mounting position (X coordinate data, Y coordinate data) on the printed circuit board (5) and mounting angle data indicating the mounting direction for each step indicating the mounting order of the component (4). (Θ angle) and part type (hereinafter referred to as “type”) are stored. The control command "E" indicates the end of the step.

As shown in FIGS. 6 to 8, the part library data includes, for each part type, part thickness data indicating the thickness of the part (4), external dimensions (part X size, part Y size), and a lighting unit. “Lighting” data indicating the type of brightness (including turning on and off) of each lighting block (23) of (22) is stored. The type “R1” is a cylindrical chip component having a circular cross section as shown in FIG. 9 (4).
(The two-dot chain line in FIG. 9 is a horizontal line passing through the center of the circle), and “A” is stored as the illumination data. In the case of a cylindrical part, the part thickness data is omitted.

The product type "R2" is a chip component (4) having a rectangular parallelepiped shape as shown in FIG. The operation of the above configuration will be described below. First, when the printed circuit board (5) is placed on the XY table (1), the component supply unit (6) is moved by driving the component supply unit servo motor (8), and the type of the step "1" of the NC data is obtained. "R1"
Is supplied to the suction station (I). By the rotation of the rotary table (11), the suction head (13) moves to the suction station (I), and the suction nozzle (12) for picking up the type "R1" stops at the component pick-up position of the station. The suction nozzle (12) is moved by the lowering of the suction head (13).
Takes out the part (4).

Next, the suction nozzle (12) sucking the component (4) moves to the recognition station (II) by rotating the rotary table (11). In the recognition station (II), the part (4) sucked by the nozzle (12) is the part library data of FIG.
Is read by the CPU (28), and in the state indicated by the data (stored in another area of the RAM (29)), the matching illumination blocks (23G) (23)
H) and the blocks (23I) and (23J) thereunder are turned off, and the other illumination blocks (23) (upper side in FIG. 1) outside the rotary table (11) are turned on. Thereby, the diffusion plates (20) and (21) are illuminated and the diffusion plates (2) and (21) are illuminated.
0) Light is irradiated from the lower surface of (21) and the transmitted light of the chip component (4) reaching the recognition station (II) is captured by the imaging camera (26). At this time, since the illumination block (23) inside the rotary table (11) is turned off, the light of the LED (24) comes from a distance and spreads, hits below the component (4), and enters as shown in FIG. And the amount of light hitting below the component and reflected is reduced, and the component (4)
The amount of light that strikes the suction nozzle (12) that is not sucking the light and also falls below the component (4) after being reflected is also reduced,
A good transmission image of the cylindrical part (4) is captured by the imaging camera (2).
6), the recognition processing circuit (32) recognizes a position shift or the like of the chip component (4) with respect to the suction nozzle (12) based on the image.

Next, the chip part (4) of the kind "R1" reaches the nozzle rotation correction station, corrects the recognition result, and positions the angle according to the NC data by the nozzle rotation device (17). Next, the component (4) is moved to the position indicated by the NC data by the movement of the XY table (1) of the printed board (5) at the mounting station, and the suction head (13) is moved to the position indicated by the NC data.
It is mounted by the descent of.

Next, the part (4) of the above step "1"
When the nozzle (12) sucking the nozzle stops at the recognition station (II), the next nozzle (12) stops at the suction station (I), and the type “R2” indicated in step “2” of the NC data. Is picked up in the same manner as in step "1". When the part (4) of “R2” reaches the recognition station, the illumination data “B” is read from the parts library data. "R
The component (4) of "2" is a rectangular parallelepiped shape, but is a relatively small component, and the diffuser plate (21) does not need to be bright, so that the illumination blocks (23D) (23E) (23F) (23)
I) (23J) is lit darkly, and the other lighting blocks (23) are lit brightly.

At this time, the illumination blocks (23G) (23
H) (23I) (23J) are lit and the part (4)
The light reflected by the suction nozzle (12) that does not suck the light and the light that spreads because it is far from the component (4) that is sucked by the suction nozzle (12) and enters as shown in FIG. Does not affect the transmitted image because it does not reflect downward.

In this state, the transmitted image of the chip component (4) is recognized in the same manner as described above. Thereafter, the component (4) is mounted on the printed circuit board (5) in the same manner. Next, the part (4) of step "3" of the NC data is similarly sucked at the suction station and moved to the recognition station.

The part (4) is of type “R3”,
It is read out that the lighting data is “C” from the parts library data of “1”. The part (4) is a large-sized part (4) and includes not only the diffusion plate (20) but also the diffusion plate (2).
Since 1) also becomes the background of the transmission image, the brightness of the LED (24) of each lighting block (23) is adjusted so that the brightness of the diffusion plate (20) and the brightness of the diffusion plate (21) become substantially the same. The CPU (28) controls the lighting circuit (31) so as to emit light.

The recognition of the chip component (4) in the state of being illuminated in this way is performed in the same manner as described above, and thereafter, the component (4) is mounted on the printed circuit board (5) in the same manner. In the present embodiment, the chip component (4) is irradiated with light from above and the transmitted image is taken to perform component recognition. However, light is applied to the lower surface of the component (4) from below. Even in the case of irradiating and imaging the reflected image with an imaging camera, by adjusting the brightness of the illumination block in accordance with the type of the component (4), optimal illumination conditions can be set for each component type.

In the case of a cylindrical part (4), for example, in the case of a small part as shown in FIG. 1, the upper illumination block (23) in FIG. For example, the brightness of each lighting block (23) may be adjusted. Further, the illumination data stored in the part library data in this embodiment may be stored in, for example, a control command column for each step of the NC data as shown in this embodiment.

Furthermore, the illumination data of the parts library data itself does not know what the brightness of each illumination block (23) is and does not correspond to the data in another area of the RAM (29). Although how to adjust the block (23) is stored, data indicating the state of each block (23) may be stored directly in the part library data.

In this embodiment, the brightness state of each illumination block (23) of the illumination unit (22) is only one at the recognition station, and the image is captured only once by the imaging camera (26). However, in the case where the image is divided into several parts by the chip part (4) (for example, a large part), each block ( The brightness of 23) may be adjusted so that the state of the brightness of each block is changed each time an image is taken while the camera is stopped.

Also, the CPU (28) adjusts the brightness of each block (23) so as to obtain the best illumination state in accordance with the captured image, and performs imaging again to confirm the best condition. You may make it control. Further, although the illumination block (23) is divided into ten in this embodiment, it may be divided into fewer or more divisions so that the brightness can be controlled, for example, for each LED. The brightness may be controlled. Even if the light source is not an LED but an optical fiber or a surface light source, the brightness can be controlled by dividing into blocks.

[0029]

As described above, according to the present invention, for each type of electronic component,
The brightness of the lighting unit or each lighting block can be adjusted according to the type of the electronic component based on the lighting data stored in the storage device, and as a result, when the image is captured for component recognition in a short time, The image can be in the best condition.

[Brief description of the drawings]

FIG. 1 is a view of a lighting unit and a suction head of the present invention as viewed from below.

FIG. 2 is a plan view of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 3 is a side view of a component recognition device to which the present invention is applied.

FIG. 4 is a control block diagram of the present invention.

FIG. 5 is a diagram showing NC data.

FIG. 6 is a diagram showing part library data.

FIG. 7 is a diagram showing part library data.

FIG. 8 is a diagram showing part library data.

FIG. 9 is a view showing a state in which light is applied to a cylindrical part.

FIG. 10 is a view showing a state in which light is irradiated to a rectangular parallelepiped component.

[Explanation of symbols]

 (4) Chip-shaped electronic component (12) Suction nozzle (14) Recognition device (16) Component recognition device (22) Illumination unit (23) Illumination block (26) Imaging camera (28) CPU (adjustment means) (31) Illumination Circuit (adjustment means)

Continuation of the front page (56) References JP-A-4-10792 (JP, A) JP-A-62-150107 (JP, A) JP-A-63-124938 (JP, A) JP-A-63-18209 (JP) JP-A-4-196985 (JP, A) JP-A-3-94500 (JP, A) JP-A-63-73533 (JP, A) JP-A-61-287195 (JP, A) JP-A-4-174347 (JP, A) JP-A-6-135949 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A component recognizing device that captures an image obtained by illuminating an electronic component sucked by a suction nozzle by an illumination unit with an imaging device and recognizes a position of the component with respect to the nozzle, and stores the image for each component type. Lighting stored in the device
An apparatus for recognizing parts, comprising an adjusting means for adjusting the amount of light of the illumination unit based on data according to the type of part. 2. A component recognizing device for recognizing an image obtained by illuminating an electronic component sucked by a suction nozzle with an imaging device and recognizing a position of the component with respect to the nozzle.
A plurality of lighting blocks serving as light sources for illuminating electronic components;
Based on the illumination data stored in the storage device for each part type
And an adjusting means for adjusting the light amount of each of the illumination blocks according to the type of the component.