JP2811938B2 - Observation device for electronic components - Google Patents
Observation device for electronic componentsInfo
- Publication number
- JP2811938B2 JP2811938B2 JP2227029A JP22702990A JP2811938B2 JP 2811938 B2 JP2811938 B2 JP 2811938B2 JP 2227029 A JP2227029 A JP 2227029A JP 22702990 A JP22702990 A JP 22702990A JP 2811938 B2 JP2811938 B2 JP 2811938B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light source
- electronic component
- shutter
- diffuser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
- Automatic Assembly (AREA)
- Image Processing (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は電子部品の観察装置に関し、詳しくは、移載
ヘッドに吸着された寸法が異る大小様々な電子部品のシ
ルエットを観察して、その位置ずれを検出するための装
置に関する。Description: BACKGROUND OF THE INVENTION The present invention relates to an electronic component observation device. More specifically, the present invention relates to a device for observing silhouettes of various sizes of electronic components having different dimensions adsorbed on a transfer head. The present invention relates to a device for detecting the displacement.
（従来の技術） IC,LSI,抵抗チップ，コンデンサチップなどの電子部
品を、移載ヘッドのノズルに吸着して基板に移送搭載す
る途中において、電子部品を観察し、その位置ずれを検
出する装置として、特開昭60−28298号公報に記載され
たものが知られている。(Prior art) A device that observes electronic components, such as ICs, LSIs, resistor chips, and capacitor chips, while adsorbing them to the nozzles of the transfer head and transfers them to the substrate, and detects the displacement. Japanese Patent Application Laid-Open No. 60-28298 discloses a known method.
このものは、第２図に示すように、移載ヘッド100の
ノズル101の基端部側に設けられた光拡散体102へ向っ
て、光源103から光を照射し、その反射光をカメラ104に
入射させることにより、電子部品P1,P2のシルエットを
観察するようになっており、電子部品P1,P2を基板へ移
送しながら、その位置ずれを検出できる長所を有してい
る。As shown in FIG. 2, the light is emitted from a light source 103 toward a light diffuser 102 provided on the base end side of a nozzle 101 of a transfer head 100, and the reflected light is transmitted to a camera 104. In this case, the silhouette of the electronic components P1 and P2 can be observed by transmitting the electronic components P1 and P2 to the substrate.
（発明が解決しようとする課題） 上記手段にあっては、光源103から照射された光が、
電子部品の下面に当って、その反射光がカメラ104に入
射すると、電子部品が明るく輝き、そのシルエットを明
瞭に観察することはできない。したがって光源103から
照射された光が、電子部品の下面に照射されないように
しなければならない。(Problems to be Solved by the Invention) In the above means, the light emitted from the light source 103 is
When the reflected light impinges on the lower surface of the electronic component and enters the camera 104, the electronic component shines brightly, and its silhouette cannot be clearly observed. Therefore, it is necessary to prevent light emitted from the light source 103 from being emitted to the lower surface of the electronic component.
ところが電子部品の寸法は大小様々であり、１辺が1m
m以下の小形のものから、数cm以上の大形のものまで基
板に搭載されることから、光の照射位置を小形の電子部
品P1に合わせると、その光ａは大形の電子部品P2の下面
に反射されてしまい、大形の電子部品P2を明瞭に観察で
きず、また光の照射位置を大形の電子部品P2に合わせる
と、その光ｂは小形の電子部品P1からなり離れた部分で
反射されることから、電子部品P1は暗く観察されて、そ
のシルエットを明瞭に観察できない問題があった。However, the dimensions of electronic components vary in size, with each side measuring 1m.
Since the light irradiating position is adjusted to the small electronic component P1, the light a is larger than that of the large electronic component P2. Reflected on the lower surface, the large electronic component P2 cannot be clearly observed, and when the irradiation position of the light is adjusted to the large electronic component P2, the light b is separated from the small electronic component P1 and is separated from the small electronic component P1. Therefore, there is a problem that the electronic component P1 is observed dark and its silhouette cannot be clearly observed.
そこで本発明は、寸法が異る大小様々な電子部品のシ
ルエットを、明瞭に観察できる手段を提供することを目
的とする。Therefore, an object of the present invention is to provide means for clearly observing the silhouettes of various sizes of electronic components having different dimensions.
（課題を解決するための手段） 本発明は、移載ヘッドのノズルに吸着された電子部品
の観察装置であって、上記ノズルの基端部側に設けられ
た光拡散体へ向って光を照射するリング状の光源とこ
の、このリング状の光源の下方にあってこの光拡散体に
反射された光を受光するカメラと、この光源から光拡散
体に対する光の照射位置を変更する照射位置変更手段と
を備え、この照射位置変更手段が、リング状の光源の内
方に設けられて上記光源から上記光拡散体へ向って照射
された光を部分的に遮光する円筒状のシャッターと、こ
のシャッターを昇降させる昇降手段から成ることを特徴
とする電子部品の観察装置である。(Means for Solving the Problems) The present invention relates to a device for observing an electronic component adsorbed to a nozzle of a transfer head, wherein light is directed toward a light diffuser provided on a base end side of the nozzle. A ring-shaped light source for irradiation, a camera below the ring-shaped light source for receiving light reflected by the light diffuser, and an irradiation position for changing a light irradiation position of the light from the light source to the light diffuser And a cylindrical shutter that is provided inside the ring-shaped light source and partially shields light emitted from the light source toward the light diffuser. An electronic component observing device comprising an elevating means for elevating and lowering the shutter.
（作用） 上記構成によれば、電子部品の寸法に応じてシャッタ
ーを昇降させ、シャッターで光源から光拡散体へ照射さ
れる光を部分的に遮光することにより、寸法が異る大小
様々な電子部品を下方のカメラで明瞭に観察することが
できる。(Operation) According to the above configuration, the shutter is moved up and down in accordance with the size of the electronic component, and the shutter partially blocks light emitted from the light source to the light diffuser, so that various sizes of electronic devices having different sizes are changed. The part can be clearly observed with the camera below.
次に、図面を参照しながら本発明の実施例を説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ），（ｂ）は、小形の電子部品P1と大形の
電子部品P2を観察している様子を示すものである。１は
移載ヘッドＡの本体であり、下方に突出するホルダー２
に、ノズル部３が装着されている。ノズル部３は、ホル
ダー２に着脱自在に装着される装着体４と、ノズル５
と、ノズル５の基端部側につば状に外方に突出する円板
状の光拡散体６から構成されており、ノズル５の下端部
に、電子部品P1,P2を真空吸着する。FIGS. 1A and 1B show a state in which a small electronic component P1 and a large electronic component P2 are observed. 1 is a main body of the transfer head A, and a holder 2 projecting downward.
, A nozzle portion 3 is mounted. The nozzle unit 3 includes a mounting body 4 detachably mounted on the holder 2 and a nozzle 5.
And a disc-shaped light diffuser 6 protruding outward in a brim-like shape on the base end side of the nozzle 5, and the electronic components P 1 and P 2 are vacuum-sucked to the lower end of the nozzle 5.
Ｂは観察装置であって、リング状の光源11と、この光
源11の下方に設けられたカメラ12と、この光源11の内方
に設けられた円筒状のシャッター13から構成されてい
る。シャッター13の側部にはナット14が装着されてい
る。15はこのナット14に螺合する垂直な送りねじ、16は
モータである。したがってモータ16が駆動すると、シャ
ッター13は上下動し、光源11から光拡散体６へ向って照
射された光を部分的に遮光することにより、光拡散体６
に対する光の照射位置を変更する。Reference numeral B denotes an observation device, which includes a ring-shaped light source 11, a camera 12 provided below the light source 11, and a cylindrical shutter 13 provided inside the light source 11. A nut 14 is mounted on the side of the shutter 13. Reference numeral 15 denotes a vertical feed screw screwed to the nut 14, and reference numeral 16 denotes a motor. Accordingly, when the motor 16 is driven, the shutter 13 moves up and down, and partially blocks light emitted from the light source 11 toward the light diffuser 6, whereby the light diffuser 6
The irradiation position of the light on.
第１図（ａ）は、小形の電子部品P1を観察するため
に、シャッター13を下降させている。この状態で、光源
11から照射された光は、シャッター13に遮られることな
く、光拡散体６の内方位置イに照射され、その反射光
は、電子部品P1の側縁部を通って、カメラ12に入射し、
そのシルエットを明瞭に観察できる。FIG. 1A shows a state in which the shutter 13 is lowered to observe the small electronic component P1. In this state, the light source
The light emitted from 11 is applied to the inner position a of the light diffuser 6 without being blocked by the shutter 13, and the reflected light is incident on the camera 12 through the side edge of the electronic component P1. ,
The silhouette can be clearly observed.
また第１図（ｂ）は、大形の電子部品P2を観察するた
めに、シャッター13を上昇させている。この状態で、光
源11から照射された光は、シャッター13に部分的に遮ら
れて、光拡散体６の外方位置ロに照射され、その反射光
は、電子部品P2の側縁部を通って、カメラ12に入射する
ので、そのシルエットを明瞭に観察できる。このよう
に、光拡散体６に対する光の照射位置を変更する照射位
置変更手段であるシャッター13やその昇降手段14,15,16
を設けることにより、大小様々の電子部品を明瞭に観察
できる。In FIG. 1B, the shutter 13 is raised to observe the large electronic component P2. In this state, the light emitted from the light source 11 is partially blocked by the shutter 13 and is emitted to the outer position b of the light diffuser 6, and the reflected light passes through the side edge of the electronic component P2. Since the light enters the camera 12, the silhouette can be clearly observed. As described above, the shutter 13 as the irradiation position changing means for changing the irradiation position of the light to the light diffuser 6 and the elevating means 14, 15, 16
By providing, electronic components of various sizes can be clearly observed.
（発明の効果） 以上説明したように本発明によれば、電子部品の寸法
に応じてシャッターを昇降させ、シャッターで光源から
光拡散体へ照射される光を部分的に遮光することによ
り、寸法が異る大小様々の電子部品を下方のカメラで明
瞭に観察することができる。(Effect of the Invention) As described above, according to the present invention, the shutter is moved up and down in accordance with the size of the electronic component, and the shutter partially blocks light emitted from the light source to the light diffuser, thereby reducing the size. The electronic components of different sizes can be clearly observed with the camera below.
図は本発明の実施例を示すものであって、第１図は電子
部品を観察中の側面図、第２図は従来手段の側面図であ
る。 Ａ……移載ヘッド Ｂ……観察装置 ５……ノズル ６……光拡散体 11……光源 12……カメラ 13……シャッター 14……ナット 15……送りねじ 16……モータFIG. 1 shows an embodiment of the present invention. FIG. 1 is a side view of an electronic component during observation, and FIG. 2 is a side view of a conventional means. A: Transfer head B: Observation device 5: Nozzle 6: Light diffuser 11: Light source 12: Camera 13: Shutter 14: Nut 15: Feed screw 16: Motor
Claims (1)
の観察装置であって、上記ノズルの基端部側に設けられ
た光拡散体へ向って光を照射するリング状の光源と、こ
のリング状の光源の下方にあってこの光拡散体に反射さ
れた光を受光するカメラと、この光源から光拡散体に対
する光の照射位置を変更する照射位置変更手段とを備
え、この照射位置変更手段が、リング状の光源の内方に
設けられて上記光源から上記光拡散体へ向って照射され
た光を部分的に遮光する円筒状のシャッターと、このシ
ャッターを昇降させる昇降手段から成ることを特徴とす
る電子部品の観察装置。An apparatus for observing an electronic component adsorbed on a nozzle of a transfer head, comprising: a ring-shaped light source for irradiating light to a light diffuser provided on a base end side of the nozzle; A camera located below the ring-shaped light source and configured to receive light reflected by the light diffuser, and an irradiation position changing unit configured to change an irradiation position of the light from the light source to the light diffuser; The changing means includes a cylindrical shutter provided inside the ring-shaped light source and partially blocking light emitted from the light source toward the light diffuser, and an elevating means for moving the shutter up and down. An electronic component observation device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2227029A JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2227029A JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04107992A JPH04107992A (en) | 1992-04-09 |
| JP2811938B2 true JP2811938B2 (en) | 1998-10-15 |
Family
ID=16854404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2227029A Expired - Fee Related JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2811938B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3222982B2 (en) * | 1993-05-18 | 2001-10-29 | 三洋電機株式会社 | Component recognition device |
| JP4709017B2 (en) | 2006-01-12 | 2011-06-22 | ソニー株式会社 | Earphone device |
| JP5740595B2 (en) * | 2010-12-01 | 2015-06-24 | シーシーエス株式会社 | Outline detection method and outline detection apparatus |
| JP2013156222A (en) * | 2012-01-31 | 2013-08-15 | Waida Seisakusho:Kk | Shape measuring instrument, and shape measurement method |
-
1990
- 1990-08-28 JP JP2227029A patent/JP2811938B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04107992A (en) | 1992-04-09 |
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