JPH04107992A - Observation apparatus for electronic part - Google Patents
Observation apparatus for electronic partInfo
- Publication number
- JPH04107992A JPH04107992A JP2227029A JP22702990A JPH04107992A JP H04107992 A JPH04107992 A JP H04107992A JP 2227029 A JP2227029 A JP 2227029A JP 22702990 A JP22702990 A JP 22702990A JP H04107992 A JPH04107992 A JP H04107992A
- Authority
- JP
- Japan
- Prior art keywords
- light
- electronic part
- shutter
- electronic component
- observe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 abstract 4
- 239000003990 capacitor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Image Analysis (AREA)
- Automatic Assembly (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は電子部品の観察装置に関し、詳しくは、移載ヘ
ッドに吸着された寸法が異る大小様々の電子部品のシル
エットを観察して、その位置ずれを検出するための装置
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component observation device, and more specifically, it observes the silhouettes of electronic components of various sizes and sizes that are attracted to a transfer head. The present invention relates to a device for detecting the positional deviation.
(従来の技術)
IC,LSI、抵抗チップ。コンデンサチップなどの電
子部品を、移載へ、ドのノズルに吸着して基板に移送搭
載する途中において、電子部品を観察し、その位置ずれ
を検出する装置として、特開昭60−28298号公報
に記載されたものが知られている。(Conventional technology) IC, LSI, resistance chip. Japanese Unexamined Patent Publication No. 60-28298 discloses an apparatus for observing electronic components and detecting positional deviations during the transfer of electronic components such as capacitor chips onto a board by adsorption to a nozzle. Those described in are known.
このものは、第3図に示すように、移載ヘッド100の
ノズル101の基端部側に設けられた光拡散体102へ
向って、光源103から光を照射し、その反射光をカメ
ラ104に入射させることにより、電子部品PI、P2
のシルエットを観察するようになっており、電子部品P
1、P2を基板へ移送しながら、その位置ずれを検出で
きる長所を有している。As shown in FIG. 3, this device irradiates light from a light source 103 toward a light diffuser 102 provided on the base end side of a nozzle 101 of a transfer head 100, and the reflected light is sent to a camera 104. By making it incident on the electronic components PI, P2
The silhouette of the electronic component P is observed.
1. It has the advantage of being able to detect displacement of P2 while transferring it to the substrate.
(発明が解決しようとする課題)
上記手段にあっては、光源103から照射された光が、
電子部品の下面に当って、その反射光がカメラ104に
入射すると、電子部品が明るく輝き、そのシルエットを
明瞭に観察することはできない。したがって光源103
がら照射された光が、電子部品の下面に照射されないよ
うにしなければならない。(Problem to be Solved by the Invention) In the above means, the light emitted from the light source 103 is
When the reflected light hits the bottom surface of the electronic component and enters the camera 104, the electronic component shines brightly and its silhouette cannot be clearly observed. Therefore, the light source 103
It is necessary to prevent the light irradiated from the bottom surface of the electronic component from being irradiated onto the bottom surface of the electronic component.
ところが電子部品の寸法は大小様々であり、1辺が1m
以下の小形のものから、数(2)以上の大形のものまで
基板に搭載されることから、光の照射位置を小形の電子
部品PLに合わせると、その光aは大形の電子部品P2
の下面に反射されてしまい、大形の電子部品P2を明瞭
に観察できず、また光の照射位置を大形の電子部品P2
に合わせると、その光すは小形の電子部品P1からかな
り離れた部分で反射されることから、電子部品P1は暗
く観察されて、そのシルエットを明瞭に観察できない問
題があった。However, the dimensions of electronic components vary in size, and each side is 1 m.
Since the following small items to larger items (2) or more are mounted on the board, when the light irradiation position is adjusted to the small electronic component PL, the light a will be transmitted to the large electronic component P2.
The light is reflected off the bottom surface of the large electronic component P2, making it impossible to clearly observe the large electronic component P2.
, the light beam is reflected from a part quite far away from the small electronic component P1, so the electronic component P1 is observed darkly, and there is a problem that its silhouette cannot be clearly observed.
そこで本発明は、寸法が異る大小様々の電子部品のシル
エットを、明瞭に観察できる手段を提供することを目的
とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a means for clearly observing the silhouettes of electronic components of various sizes and sizes.
(課題を解決するための手段)
本発明は、ノズルの基端部側に設けられた光拡散体へ向
って光を照射する光源と、この光拡散体に反射された光
を受光するカメラと、この光源から光拡散体に対する光
の照射位置を変更する照射位置変更手段とから電子部品
の観察装置を構成している。(Means for Solving the Problems) The present invention includes a light source that irradiates light toward a light diffuser provided on the base end side of a nozzle, and a camera that receives light reflected by the light diffuser. , and irradiation position changing means for changing the irradiation position of light from the light source to the light diffuser, forming an electronic component observation apparatus.
(作用)
上記構成によれば、電子部品の寸法に応して、光拡散体
に対する光の照射位置を変えることにより、寸法が異る
大小様々の電子部品を明瞭に観察することができる。(Function) According to the above configuration, by changing the irradiation position of light on the light diffuser according to the dimensions of the electronic components, it is possible to clearly observe various large and small electronic components having different dimensions.
(実施例1) 次に、図面を参照しながら本発明の詳細な説明する。(Example 1) Next, the present invention will be described in detail with reference to the drawings.
第1図(a)、 (b)は、小形の電子部品P1と大
形の電子部品P2を観察している様子を示すものである
。1は移載ヘッドAの本体であり、下方に突出するホル
ダー2に、ノズル部3が装着されている。ノズル部3は
、ホルダー2に着脱自在に装着される装着体4と、ノズ
ル5と、ノズル5の基端部側につば状に外方に突出する
円板状の光拡散体6から構成されており、ノズル5の下
端部に、電子部品PL、P2を真空吸着する。FIGS. 1(a) and 1(b) show how a small electronic component P1 and a large electronic component P2 are observed. 1 is a main body of a transfer head A, and a nozzle part 3 is attached to a holder 2 that projects downward. The nozzle part 3 is composed of a mounting body 4 that is detachably attached to the holder 2, a nozzle 5, and a disc-shaped light diffuser 6 that protrudes outward in the shape of a brim from the base end of the nozzle 5. The electronic components PL and P2 are vacuum-adsorbed to the lower end of the nozzle 5.
Bは観察装置であって、リング状の光源11と、この光
#11の下方に設けられたカメラ12と、この光#11
の内方に設けられた円筒状のシャッター13から構成さ
れている。シャッター13の側部にはナフト14が装着
されている。15はこのナフト14に螺合する垂直な送
りねし、16はモータである。したがってモータ16が
駆動すると、シャッター13は上下動し、光源11から
光拡散体6へ向って照射された光を部分的に遮光するこ
とにより、光拡散体6に対する光の照射位置を変更する
。B is an observation device, which includes a ring-shaped light source 11, a camera 12 provided below this light #11, and a ring-shaped light source 11;
It is composed of a cylindrical shutter 13 provided inside. A napht 14 is attached to the side of the shutter 13. 15 is a vertical feeder screwed into this napft 14, and 16 is a motor. Therefore, when the motor 16 is driven, the shutter 13 moves up and down to partially block the light emitted from the light source 11 toward the light diffuser 6, thereby changing the irradiation position of the light onto the light diffuser 6.
第1図(a)は、小形の電子部品P1を観察するために
、シャッター13を下降させている。In FIG. 1(a), the shutter 13 is lowered to observe a small electronic component P1.
この状態で、光源11から照射された光は、シャッター
13に遮られることなく、光拡散体6の内方位置イに照
射され、その反射光は、電子部品P1の側縁部を通って
、カメラ12に入射し、そのシルエットを明瞭に観察で
きる。In this state, the light emitted from the light source 11 is irradiated onto the inner position A of the light diffuser 6 without being blocked by the shutter 13, and the reflected light passes through the side edge of the electronic component P1. The light enters the camera 12, and its silhouette can be clearly observed.
また第1図(b)は、大形の電子部品P2を観察するた
めに、シャッター13を上昇させている。この状態で、
光#11から照射された光は、シャッター13に部分的
に遮られて、光拡散体6の外方位置口に照射され、その
反射光は、電子部品P2の側縁部を通って、カメラ12
に入射するので、そのシルエットを明瞭に観察できる。Further, in FIG. 1(b), the shutter 13 is raised in order to observe the large electronic component P2. In this state,
The light emitted from the light #11 is partially blocked by the shutter 13 and is emitted to the outer opening of the light diffuser 6, and the reflected light passes through the side edge of the electronic component P2 and reaches the camera. 12
, so its silhouette can be clearly observed.
このように、光拡散体6に対する光の照射位置を変更す
る照射位置変更手段であるシャッター13やその昇降手
段14,15.16を設けることにより、大小様々の電
子部品を明瞭に観察できる。In this way, by providing the shutter 13, which is an irradiation position changing means for changing the irradiation position of light on the light diffuser 6, and its lifting/lowering means 14, 15, 16, electronic components of various sizes can be clearly observed.
(実施例2)
第2図において、上記ナフト14は光源11に装着され
ており、モータ16が駆動すると、光源11は上下動す
る。したがって同図(a)に示すように、小形の電子部
品P1を観察する場合は、光源11を下降させることに
より、光源11から照射された光を、光拡散体6の内方
位置イに入射させ、また同図(b)に示すように、大形
の電子部品P2を観察する場合は、光源11を上昇させ
ることにより、外方位置口に入射させる。(Embodiment 2) In FIG. 2, the napht 14 is attached to the light source 11, and when the motor 16 is driven, the light source 11 moves up and down. Therefore, when observing a small electronic component P1, as shown in FIG. When observing a large electronic component P2, the light source 11 is raised to cause the light to enter the outer position opening, as shown in FIG. 2(b).
(発明の効果)
以上説明したように本発明は、ノズルの基端部側に設け
られた光拡散体へ向って光を照射する光源と、この光拡
散体で反射された光を受光するカメラと、この光源から
光拡散体に対する光の照射位置を変更する照射位置変更
手段とから電子部品の観察装置を構成しているので、寸
法が異る大小様々の電子部品のシルエットを明瞭に観察
することができる。(Effects of the Invention) As explained above, the present invention includes a light source that irradiates light toward a light diffuser provided on the base end side of a nozzle, and a camera that receives light reflected by the light diffuser. and an irradiation position changing means for changing the irradiation position of the light from the light source to the light diffuser, making up an electronic component observation device, so that the silhouettes of electronic components of various sizes and sizes can be clearly observed. be able to.
11・・・光源 12・・・カメラ 13〜1 照射位置変更手段11...Light source 12...Camera 13-1 Irradiation position changing means
Claims (1)
であって、 上記ノズルの基端部側に設けられた光拡散体へ向って光
を照射する光源と、この光拡散体に反射された光を受光
するカメラと、この光源から光拡散体に対する光の照射
位置を変更する照射位置変更手段とから成ることを特徴
とする電子部品の観察装置。[Scope of Claim] A device for observing electronic components adsorbed by a nozzle of a transfer head, comprising: a light source that irradiates light toward a light diffuser provided on the base end side of the nozzle; 1. An electronic component observation device comprising: a camera that receives light reflected by a diffuser; and an irradiation position changing unit that changes the irradiation position of light from the light source to the light diffuser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2227029A JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2227029A JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04107992A true JPH04107992A (en) | 1992-04-09 |
JP2811938B2 JP2811938B2 (en) | 1998-10-15 |
Family
ID=16854404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2227029A Expired - Fee Related JP2811938B2 (en) | 1990-08-28 | 1990-08-28 | Observation device for electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2811938B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334390A (en) * | 1993-05-18 | 1994-12-02 | Sanyo Electric Co Ltd | Component recognition device |
WO2012073730A1 (en) * | 2010-12-01 | 2012-06-07 | シーシーエス株式会社 | Profile line detecting method and profile line detecting apparatus |
JP2013156222A (en) * | 2012-01-31 | 2013-08-15 | Waida Seisakusho:Kk | Shape measuring instrument, and shape measurement method |
US8913773B2 (en) | 2006-01-12 | 2014-12-16 | Sony Corporation | Earphone device |
-
1990
- 1990-08-28 JP JP2227029A patent/JP2811938B2/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334390A (en) * | 1993-05-18 | 1994-12-02 | Sanyo Electric Co Ltd | Component recognition device |
US8913773B2 (en) | 2006-01-12 | 2014-12-16 | Sony Corporation | Earphone device |
US9491533B2 (en) | 2006-01-12 | 2016-11-08 | Sony Corporation | Earphone device |
US9826300B2 (en) | 2006-01-12 | 2017-11-21 | Sony Corporation | Earphone device |
US9930437B2 (en) | 2006-01-12 | 2018-03-27 | Sony Corporation | Earphone device |
US9949007B2 (en) | 2006-01-12 | 2018-04-17 | Sony Corporation | Earphone device |
US9961428B2 (en) | 2006-01-12 | 2018-05-01 | Sony Corporation | Earphone device |
WO2012073730A1 (en) * | 2010-12-01 | 2012-06-07 | シーシーエス株式会社 | Profile line detecting method and profile line detecting apparatus |
JP2012117943A (en) * | 2010-12-01 | 2012-06-21 | Ccs Inc | Contour line detection method and contour line detection device |
JP2013156222A (en) * | 2012-01-31 | 2013-08-15 | Waida Seisakusho:Kk | Shape measuring instrument, and shape measurement method |
Also Published As
Publication number | Publication date |
---|---|
JP2811938B2 (en) | 1998-10-15 |
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