JPH071778B2 - IC lead recognition device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to recognition means for appearance inspection of semiconductor parts such as ICs and transistors.

2. Description of the Related Art For example, as shown in the side cross-sectional view of FIG.
The camera 1, the thin plate 10, and the displacement detection sensor 11 are used.

In FIG. 5, a camera 1 having an image sensor, for example,
Using a CCD camera, the leads were judged as images, and various image recognition processes were performed to detect the lead pitch P, the lead width W, and the number of leads of the IC device 7 shown in the plan view of FIG.

Further, regarding the upward bending or the downward bending of the lead, if the height S of the thin plate 10 as shown in FIG. 5 is set within the lead allowable limit of the lead and the defective lead comes into contact with it,
The sensor 11 installed on the thin plate 10 detects the voltage by converting it into a voltage displacement.

Problems to be Solved by the Invention Since such a conventional configuration is directly captured as an image, there is no problem in detecting the lead pitch P, the lead width W, and the number of leads, but regarding the upward bending or downward bending of the leads. However, due to the deflection, thickness, variation, etc. of the lead frame, it is difficult to make delicate settings around the defect tolerance limit, which makes it impossible to perform highly accurate detection.

The present invention has been made in view of the above drawbacks, and provides an inspection means with a simple configuration and high accuracy.

Means for Solving the Problems In order to solve the above problems, the present invention provides a lighting device that provides an appropriate amount of light necessary for capturing an image of a device, and an amount of light that is emitted to a device by changing an optical path due to reflection at an end. There is provided a light amount adjusting plate for displaying light and darkness on the leads of the device by a change, and at least an imaging device for recognizing the lightness and darkness of the leads of the device.

Effect With the configuration of the present invention, a dark portion having a proper length can be formed on a lead having a normal shape, and the dark portion of the upper bend is shorter than the proper dark portion,
On the other hand, the dark portion of the downward bend is longer than the proper dark portion. Therefore, by recognizing this, a slight up and down bend is detected by the imaging means.

Embodiment FIG. 1 and FIG. 2 are a side sectional view and a schematic plan view showing the structure of an IC lead recognition device according to an embodiment of the present invention.

Reference numeral 5 is a transfer rail for carrying the device 7 while the device 7 is in a semi-processed state while being attached to the lead frame, 8 is a guide cover, 6 is a transfer feed claw for carrying,
4a and 4b are light quantity adjusting plates, 3 is a high-frequency fluorescent lamp as an illumination source,
Reference numeral 2 is the same fluorescent lamp cover, and 1 is a camera for taking an image of an object to be inspected.

With the above configuration, the dark portion of the lead frame of the device 7 is captured by the camera 1 as an image, and the light amount adjusting plate 4a, 4a, in the inspection process of the upward bending 7a and the downward bending 7b as shown in the schematic side view of FIG.
By adjusting 4b, the optical path L is changed to form an area Z that appears as a dark portion, and a dark portion 1 having an appropriate length is formed on the lead 7c having a normal shape. The recognition image as shown in the schematic plan view of FIG. If the light quantity adjusting plate of the illumination is adjusted in the direction of the arrow B shown in FIG. 2 so that it can be done, the dark portion of the upper bend 7a becomes shorter than the dark portion 1 having an appropriate length by α, as shown in FIG. The dark portion of the downward bend 7b is longer than the dark portion 1 having an appropriate length by β.

Therefore, it is possible to compare and recognize the lead 7c having a normal shape at the binarization level in the image processing. Needless to say, at the same time, the lead pitch, width, and number of lines can be directly processed as image recognition processing of the image.

EFFECTS OF THE INVENTION As described above, the present invention performs image recognition processing for comparison based on the length of the dark portion of the lead caused by the light amount adjusting plate, and recognizes all images such as marks, packages, and leads only in one upward direction. It is very useful practically because it has a feature that it can be processed and, in addition, it allows non-contact and delicate upper and lower lead bending to be recognized as a large change in an appropriate binarization level for comparison.

[Brief description of drawings]

FIG. 1 is a side sectional view of an IC lead recognition device according to an embodiment of the present invention, FIG. 2 is a schematic plan view of the same plane, FIG. 3 is a schematic side view of a lead bending state, and FIG. FIG. 5 is a side sectional view of a device configuration in a conventional lead inspection, and FIG. 6 is a plan view of a conventional chip carrier type IC when a dark portion is set. 1 ... CCD camera, 2 ... cover, 3 ... high-frequency fluorescent lamp, 4a, 4b ... light intensity adjusting plate.

Claims (1)

[Claims] 1. A lighting device that provides an appropriate amount of light, a light amount adjusting plate that can adjust the amount of light by changing an optical path due to reflection at an end portion to expose light and darkness on a lead of a semiconductor device, and at least a lead of the semiconductor device. An IC lead recognition device comprising an imaging device for recognizing light and dark.