KR0144334B1 - Lead inspecting equipment - Google Patents

Abstract

The present invention relates to a lead inspection device of an integrated circuit that can accurately check the fluctuation or fine bending of the lead by using a CCD camera, the filter of the material that distinguishes the brightness of the place where the part to be inspected and the area not touched (8 ), A camera (3) (3a) installed at the upper and lower parts of the filter for acquiring an image of a component by illumination, a switching means for selecting the output of the camera, and a selected camera image for acquiring and checking the component for abnormality It comprises a video acquisition means.

Description

Lead inspection device of integrated circuit

1 is a schematic diagram for inspection of SMC type IC in Chorae IC production process

2 is a configuration diagram for the inspection of the SMC type IC in the assembly process using a conventional IC

Figure 3 (a) is a block diagram for the inspection of the SMC type IC in the assembly process using the IC of the present invention

(b) is an image diagram obtained by (a)

4 (a) is a block diagram for inspection of the dip IC of the present invention

(b) (c) is an image drawing obtained by the camera in (a)

5 is a configuration diagram for inspection of the SMC type IC of the present invention.

(b) (c) is an image drawing obtained by the camera in (a)

* Explanation of symbols for main parts of the drawings

2: part 2a: lead

3,3a: camera 4: image acquisition device

5: Image Processor 7: SMC Mounter

8: filter

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead inspection apparatus of an integrated circuit (IC), and in particular, it is possible to accurately check the fluctuation, bending, and the like of a lead using a CCD (solid-state imaging device) camera.

In general, in semiconductor IC production, IC chips are inspected for defects before shipping, and only good products are shipped, thus increasing the reliability of the products.

In addition, in the process of assembling the product using the IC, the productivity of the lead is improved by inspecting the abnormality of the lead before inserting or mounting the IC.

In the conventional IC production process, there is a method of visual inspection, and there is a method of inspecting an abnormality of a lead by acquiring an image of the lead portion of the IC from the side.

Looking at the latter case in more detail, for example, as shown in FIG. 1, when the part enters the inspection area, the lid 2 is illuminated by the LED illumination 1.

Then, an image is acquired by the camera 3 on the side, and the image is recognized through the image acquisition apparatus 4 and the image processor 5 to recognize the size of the characters painted on the ceramic of the part and output the result.

On the other hand, in the assembling process using the IC, a vision function, that is, a visual recognition function, is inspected on a Q.F.P (Quad Flat Package) mounter to check the abnormality of the lid 2 before mounting on the substrate.

In this case, as shown in FIG. 2, when the component is held in the QFP header 6 and enters the inspection area, the image is acquired by the image acquisition device 4 using the camera 3 and then the image processor 5 is used. The image is processed and the result (Δθ, Δх, Δу error, etc.) is transmitted to the SMC (surface mounting component) mounter, so that the position is corrected by this data in the SMC mounter 7 and mounted on the substrate.

However, in the conventional lead inspection apparatus as described above, by directly projecting the illumination to the portion to be inspected, a slight error occurs depending on the degree of light scattering, and thus there is a drawback that precision measurement cannot be performed.

The present invention has been made in view of the above-mentioned drawbacks, and its object is to provide a device that can accurately check the presence or absence of a lead using a medium without using light scattering in the lead portion as in the prior art.

Hereinafter, with reference to the accompanying drawings, an embodiment of the present invention for achieving the above object will be described in detail.

3 shows an example of the SMC type IC in the assembly process using the IC of the present invention. When the head 6 of the SMC mounter holds a part and is placed on the filter 8 in the inspection area, the camera 3 is used. Acquire the video.

Then, through the image acquisition device 4 and the image processor 5, the results Δх, Δу (movement from the center), Δθ (rotation of the parts), and errors (bad leads) are sent to the SMC mounter. .

In this case, the filter 8 is made of a filter with a material that gives a difference in brightness between the surface where the object touches the filter 8 and the area that is not touched with a minute accuracy (± 0.01m). The obtained image is shown in FIG. 3 (b). Appears on the monitor (9).

4A shows a filter 8 placed beneath the component 2a in the configuration diagram of the first embodiment of the present invention (dip IC), an LED lighting 1 for projecting light onto the component 2a, Image acquisition for acquiring an image by selecting one through a switch (SW) from a CCD camera (3) (3a) provided at the upper and lower portions of the filter for acquiring an image from the component (2a) and the camera (3) (3a). Device 4 and an image processor 5 for processing the image and outputting the result.

In the operation in this case, when the contact portion of the switch SW is attached to the A side, the image of the camera 3 is acquired by the image acquisition device 4, and when it is attached to the B side, the image of the camera 3a is acquired by the acquisition device 4. .

If the image of the camera 3 is obtained by the image acquisition device 4 through the contact point A of the switch SW, it becomes an image as shown in FIG. 4 (b), and the image is processed by the image processor 5. When the good decision is made, the switch SW is shorted toward B to acquire an image.

Subsequently, the image acquired through the camera 3 is for obtaining the painting state of the part and the kind of the part.

In addition, when the switch SW is shorted to the B side, it is possible to check whether or not the lead 2 of the component 2a is abnormal through the camera 3a.

In other words, the image obtained by the camera 3a becomes the image as shown in FIG.

In this case, the brightness of the image is changed by the filter 8. In FIG. 4C, the black point is a part where the lead 2 touches the filter 8, and when the part is not minutely touched, the image is a black point. Because it does not appear, it does not appear by using this effect. Therefore, it is possible to check the bending, moxibustion, etc. of the lead by using this effect.

In other words, in the present invention, by placing the component 2a on the filter 8 and projecting illumination from above, the scattering of the light is not affected by measuring the area where the light is not projected, unlike the conventional method.

FIG. 5 shows an embodiment of the SMC type IC. Since the same operation as in the embodiment of FIG. 4 is performed, description thereof will be omitted.

As described above, the present invention provides a filter (under the lid 2) to be in contact with the lid 2 without inspecting the abnormality of the lead by means of projecting light onto the lead 2 and using the scattering of light. 8) is used to remove the scattering of light, so there is an effect that can accurately check the fluctuation of the lead, bending, etc.

Claims (1)

A filter 8 having a material for distinguishing the brightness of the part to be inspected from and the part not to be inspected, and a camera 3 mounted on the upper and lower parts of the filter to acquire an image of the part by illumination (3a) And a switching means for selecting an output of the camera, and an image acquiring means for acquiring an image of an optional camera to check an abnormality of a component and then outputting it.