JP2000046651A - Wire appearance inspection device - Google Patents

Wire appearance inspection device

Info

Publication number
JP2000046651A
JP2000046651A JP10212070A JP21207098A JP2000046651A JP 2000046651 A JP2000046651 A JP 2000046651A JP 10212070 A JP10212070 A JP 10212070A JP 21207098 A JP21207098 A JP 21207098A JP 2000046651 A JP2000046651 A JP 2000046651A
Authority
JP
Japan
Prior art keywords
wire
light source
color
wires
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10212070A
Other languages
Japanese (ja)
Inventor
Noritsugu Hamada
徳亜 濱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP10212070A priority Critical patent/JP2000046651A/en
Publication of JP2000046651A publication Critical patent/JP2000046651A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a light source adjustment means capable of obtaining a stable image signal via a means for uniformly lighting the surface of a three- dimensional inspection object and under the maintenance of an initially set gate level. SOLUTION: This device has a light source 3 controlled by lightness preliminarily stored in an arithmetic operation device 4 and a plurality of wires 102 as inspection objects on an inspection stage 1. In addition, the device has light guide 5 for guiding the light source 3 to a position above the inspection objects as downward lighting 3a, and a hollow cylindrical frosted glass 6. In this case, the color image signals of the wires 102 photographed with a camera 2 positioned above the hollow light guide 5 are compared with signals obtainable from conversion into hue, chroma and lightness in the arithmetic operation device 4 for the every preliminarily stored color of the wires 102, and picture elements within a preset threshold value are extracted for making judgement about the sequence of covering color and foreign matter in a cover removal part, and measuring the array distance of the cover removal part from a reference point, thereby making judgement about acceptance and non-acceptance.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電力線又は信号線
としてパソコン等の内部配線に使用されるカラー被覆ワ
イヤーを束ねたワイヤハーネスの外観検査を画像処理技
術を用いて実施するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention carries out an appearance inspection of a wire harness in which color-coated wires used for internal wiring of a personal computer or the like as power lines or signal lines are bundled using an image processing technique.

【0002】[0002]

【従来の技術】画像処理技術を用いて製品の外観検査を
実施するためには、検査対象物により様々の手段が提案
されている。中でも検査対象物の形状のみならず色彩を
も識別するため、カラー画像信号を明度、色相、彩度に
変換して判別する手段が、特開平10−2725号公報
に提案されている。
2. Description of the Related Art Various means have been proposed for inspecting the appearance of a product using an image processing technique depending on the inspection object. In particular, Japanese Patent Application Laid-Open No. 10-2725 proposes means for converting a color image signal into lightness, hue, and saturation to determine not only the shape but also the color of the inspection object.

【0003】この従来技術の被検査物は、半導体素子が
実装されているフィルムキャリアである。検査対象は、
半導体素子の形状欠陥と異物の付着、リード線の回路欠
陥、及び半導体素子表面の識別文字のエリア確認等であ
る。
The object to be inspected in the prior art is a film carrier on which a semiconductor element is mounted. The inspection target is
Examples include shape defects of semiconductor elements and attachment of foreign substances, circuit defects of lead wires, and confirmation of areas of identification characters on the surface of semiconductor elements.

【0004】そして該装置は、カメラで撮像されたカラ
ー画像信号を受信して予め設定された被検査対象物の色
分布を抽出して2値化するカラー画像処理装置と、カラ
ー画像処理装置によって2値化された画像から、半導体
チップを検出してそのサイズを検定するチップサイズ検
定部と、半導体チップの内部にある異物やキズを検出し
てそのサイズを検出する内部異物検定部と、半導体チッ
プの外形線を検出してその直線性を検定する境界線検定
部と、半導体チップ上に捺印された文字のエリアを検出
して文字品質の検査を行う文字検定部と、最終的な良否
の判定を行う判定部からなる認識処理部から構成されて
いる。
The apparatus includes a color image processing apparatus that receives a color image signal captured by a camera, extracts a predetermined color distribution of an object to be inspected, and binarizes the color distribution, and a color image processing apparatus. A chip size verification section for detecting a semiconductor chip from a binarized image and verifying its size, an internal foreign substance verification section for detecting a foreign substance or a scratch inside the semiconductor chip and detecting the size, and a semiconductor. A boundary verification section for detecting the outline of the chip and verifying its linearity; a character verification section for detecting the area of the character stamped on the semiconductor chip and inspecting the character quality; It is composed of a recognition processing section comprising a judgment section for making a judgment.

【0005】この装置では、半導体チップの境界線の直
線性から良否判定をするので、半導体チップの位置を認
識するデータが不用となる。又、半導体チップの欠けや
異物付着は、白黒反転した白部分の面積によって判別さ
れ、半導体チップの周辺にリード検出エリアを自動的に
形成し、リード検出エリア生成のためのデータを不用と
すると共に、位置決めの補正演算が不用となる。さら
に、文字エリアを予め検出することにより、文字部をキ
ズまたは異物と誤認識することを避けられる等の効果が
あると説明している。
In this device, the quality is determined based on the linearity of the boundary of the semiconductor chip, so that data for recognizing the position of the semiconductor chip becomes unnecessary. Further, chipping of the semiconductor chip and adhesion of foreign matter are determined based on the area of the white portion which has been inverted between black and white, a read detection area is automatically formed around the semiconductor chip, and data for generating the read detection area is unnecessary. This eliminates the need for positioning correction calculation. Further, it is described that by detecting the character area in advance, there is an effect that it is possible to avoid erroneously recognizing a character portion as a flaw or a foreign substance.

【0006】[0006]

【発明が解決しようとする課題】ところが、ワイヤーは
立体的な被検査物である。平面的な照明では、曲面の表
面が同一の色彩であっても陰影の生じることにより、特
定の明度を閾値とするゲイトレベルで画像信号を処理し
ても実像を認識できない。また、実像を認識する手段が
確立されても、検査装置の設置されている環境の明るさ
や検査装置自体の光源の強さが変動すればゲイトレベル
を調整する必要がある。本発明は、立体的な被検査物の
表面を均一に照明する手段と、当初に設定したゲイトレ
ベルを変更することなく、安定した画像信号の得られる
光源の調整手段を提案する。
However, the wire is a three-dimensional object to be inspected. In planar illumination, even if the surface of the curved surface has the same color, shading occurs, so that a real image cannot be recognized even if an image signal is processed at a gate level having a specific brightness as a threshold. Even if a means for recognizing a real image is established, it is necessary to adjust the gate level if the brightness of the environment in which the inspection device is installed or the intensity of the light source of the inspection device itself fluctuates. The present invention proposes a means for uniformly illuminating the surface of a three-dimensional object to be inspected, and a means for adjusting a light source capable of obtaining a stable image signal without changing an initially set gate level.

【0007】[0007]

【課題を解決するための手段】演算装置に予め記憶して
いる明度に制御される光源と、検査ステージ上に被検査
物としての複数のワイヤーを横たえ、光源を被検査物の
上方に落射照明として誘導するライトガイドと中空円筒
型のすりガラスを備え、中空のライトガイドの上方から
覗くカメラにて撮像された前記ワイヤーのカラー画像信
号を、予め記憶している前記ワイヤーの色毎に、演算装
置にて色相、彩度、明度に変換して得られた信号と比較
し、所定の閾値内の画素を抽出してワイヤーの被覆色の
順序、被覆除去部分の異物、基準点からの被覆除去部の
配列位置の寸法を計測して合否を判定する。
A light source controlled to have brightness stored in an arithmetic unit in advance and a plurality of wires as an object to be inspected are laid on an inspection stage, and the light source is illuminated by incident light above the object to be inspected. A light guide and a hollow cylindrical frosted glass for guiding, and a color image signal of the wire imaged by a camera viewed from above the hollow light guide, for each wire color stored in advance, an arithmetic unit The pixels are converted to hue, saturation, and lightness, and the pixels within a predetermined threshold value are extracted to determine the order of the coating color of the wire, foreign matter in the coating removal portion, and the coating removal portion from the reference point. Is measured by measuring the size of the array position.

【0008】中空のライトガイドに誘導される落射照明
は、中空円筒型のすりガラスを経由して拡散しながら被
検査物である複数のワイヤーの上方から照明するので、
曲面を有するワイヤー表面の陰影は消去され、均一なカ
ラー画像信号が得られる。
[0008] Epi-illumination guided by a hollow light guide illuminates from above a plurality of wires to be inspected while diffusing through a hollow cylindrical frosted glass.
The shading on the curved wire surface is eliminated, and a uniform color image signal is obtained.

【0009】[0009]

【発明の実施の形態】本発明の被検査物である電線は、
例えば、図7の平面図に示すように数μmの薄い使い捨
てのポリエチレン樹脂から成るトレー101に、仮配線
されている。識別のため着色されているウレタン樹脂に
て被覆された極細ワイヤー102を束ねたワイヤハーネ
ス103は、トンネル状のクリップ101aに仮止めさ
れ、検査窓A、B内で所定の配列で、基準ピン穴104
から所定の位置に被覆除去部分102aが整列されてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electric wire which is an object to be inspected according to the present invention is:
For example, as shown in the plan view of FIG. 7, provisional wiring is performed on a tray 101 made of a thin disposable polyethylene resin having a thickness of several μm. A wire harness 103, which is a bundle of ultra-fine wires 102 coated with urethane resin colored for identification, is temporarily fixed to a tunnel-shaped clip 101a, and has a predetermined pin hole in the inspection windows A and B. 104
And the coating removal portions 102a are arranged at predetermined positions.

【0010】このワイヤハーネス103は外観検査終了
後、パソコン等の内部に予めレイアウトされている順序
で、基準ピン穴104をガイドに載置し、被覆除去部分
102aを半田付け等により電気的に接続して組付けら
れる。その後、トレー101は鋏等により適宜切除され
る。
After the appearance inspection of the wire harness 103 is completed, the reference pin holes 104 are placed on the guides in a sequence laid out in advance in a personal computer or the like, and the cover-removed portions 102a are electrically connected by soldering or the like. Assembled as Thereafter, the tray 101 is appropriately cut off with scissors or the like.

【0011】従来は、検査窓A、B内のワイヤー102
の被覆色の順序、被覆除去部分102aに付着している
異物、基準点からの被覆除去部分の配列位置の寸法を目
視にて検査していたが、時間の経過と共に識別能力が低
下し、検査結果に対する信頼性に問題があった。さら
に、熟練した検査員を確保することも困難である。
Conventionally, wires 102 in inspection windows A and B
Was visually inspected for the order of the coating color, the foreign matter adhering to the coating removal portion 102a, and the dimension of the arrangement position of the coating removal portion from the reference point. There was a problem with the reliability of the results. Further, it is difficult to secure skilled inspectors.

【0012】そこで本発明は、図1に概要を示すワイヤ
ーの外観検査装置を用いて自動的に検査する。図1にお
いて、検査ステージ1の上に図7の被検査物であるトレ
ー101内の検査窓AまたはBを横たえ、カメラ2の視
野の一隅に光源3の明るさの基準となる白色評点(図示
せず)を捕らえてその明度を演算装置4に記憶し、光源
3からの照明は中空のライトガイド5を経由して、中空
円筒型のすりガラス6に誘導され、拡散しながら落射照
明としてワイヤー102の上方を照らす。仮に、検査装
置の設置されている環境の明るさや検査装置自体の光源
の劣化や電圧が変化し落射照明の強さが変動しても、演
算装置に記憶されている白色評点の明るさに自動的に調
整されるから、画像を2値化するためのゲイトレベルを
変更しなくてもよい。
Therefore, the present invention automatically performs inspection using a wire appearance inspection apparatus shown in FIG. In FIG. 1, the inspection window A or B in the tray 101 as the inspection object in FIG. 7 is laid on the inspection stage 1 and a white score (see FIG. The light from the light source 3 is guided to the hollow cylindrical frosted glass 6 via the hollow light guide 5 and diffused, while the wire 102 is diffused as epi-illumination. Illuminate the area above. Even if the brightness of the environment in which the inspection device is installed or the deterioration or voltage of the light source of the inspection device itself and the intensity of the epi-illumination fluctuate, the brightness of the white score stored in the arithmetic unit is automatically adjusted. Therefore, the gate level for binarizing the image need not be changed.

【0013】一方、カメラ2は、ライトガイド5及びす
りガラス6の中空部を透過してワイヤー102の上方か
らカラー画像を撮像する。この画像は、RGB(R;
赤、G;緑、B;青)の3原色の信号として画像取込装
置7に入力され、HSI(H;色相、S;彩度、I;明
度)信号に変換し、事前に記憶されている各ワイヤー1
02の信号と比較した上、所定の閾値内の画素を抽出し
て各計測項目別にモニター8に2次元画像として表示
し、定量的に合否を判定する。
On the other hand, the camera 2 captures a color image from above the wire 102 through the light guide 5 and the hollow portion of the frosted glass 6. This image is RGB (R;
The signals are input to the image capturing device 7 as signals of three primary colors of red, G; green, B; blue), converted into HSI (H; hue, S; saturation, I; lightness) signals, and stored in advance. Each wire 1
After comparing with the signal of No. 02, pixels within a predetermined threshold value are extracted and displayed as a two-dimensional image on the monitor 8 for each measurement item, and pass / fail is quantitatively determined.

【0014】図2は、ライトガイド5を経由した光源が
すりガラス6により拡散された落射照明としてワイヤー
102を照らすことで、立体的な被検査物であるワイヤ
ー102の表面の陰影が消去されるのを模式的に示した
説明図である。つまり、ライトガイド5を経由した光源
3aは、すりガラス6により拡散されて、検査ステージ
1上に横たわるワイヤー102の表面を照らし、少なく
とも上半分の表面上の陰影を消去する。従って上半分の
表面は、同一の明るさを有するカラー画像信号となって
画像取込装置7に入力される。
FIG. 2 shows that a light source passing through the light guide 5 illuminates the wire 102 as epi-illumination diffused by the frosted glass 6, thereby eliminating the shadow on the surface of the wire 102 which is a three-dimensional object to be inspected. It is explanatory drawing which showed typically. That is, the light source 3a passing through the light guide 5 is diffused by the frosted glass 6 and
1. Illuminate the surface of the overlying wire 102 and eliminate any shading on at least the upper half surface. Accordingly, the upper half surface is input to the image capturing device 7 as a color image signal having the same brightness.

【0015】すりガラス6による落射照明によっても、
ワイヤー102の上半分は完全に同一の明るさにならな
いから、RGB信号をHSI信号に変換すれば、H、S
のみによって色を抽出することで、明るさの違いがあっ
ても正しく色を抽出することができる。その理由は、同
じ色でも明るさが違えばRGB信号の値は変ってしまう
が、HSI信号では明度Iを独立パラメータとして分離
しているので、明るさが違ってもH、Sの値は原理的に
変化しないからである。
[0015] By the epi-illumination by the frosted glass 6,
Since the upper half of the wire 102 does not have exactly the same brightness, if the RGB signal is converted to the HSI signal, H, S
By extracting a color only by itself, a color can be correctly extracted even if there is a difference in brightness. The reason is that if the brightness is different even for the same color, the value of the RGB signal changes. However, in the HSI signal, the brightness I is separated as an independent parameter. This is because it does not change.

【0016】そして、予め演算装置4に登録されている
HSIのデータと比較し、各ワイヤー102毎に所定の
閾値内の画素を抽出してモニター8に2次画像として表
示する。先ず、ワイヤー102の被覆色の順序の確認
は、図3に示す被覆色が仮にイが緑、ロが青、ハが赤、
ニが黒であった場合、その順序が予め演算装置4に記憶
されているHSIのパターンに合致するか否かにより合
否を表示する。この工程は、複数のワイヤー102の中
には信号や電源用のワイヤーが混在するので、誤配線を
防ぐ重要な検査である。
Then, the data is compared with HSI data registered in advance in the arithmetic unit 4, and pixels within a predetermined threshold for each wire 102 are extracted and displayed on the monitor 8 as a secondary image. First, the order of the coating colors of the wire 102 is confirmed by assuming that the coating colors shown in FIG. 3 are green for green, blue for blue, red for ha,
If d is black, pass / fail is displayed based on whether or not the order matches the HSI pattern stored in the arithmetic unit 4 in advance. This step is an important inspection to prevent erroneous wiring, since wires for signals and power are mixed in the plurality of wires 102.

【0017】次に、ワイヤー102の被覆除去部分の異
物の確認は、図4に示すホの異物又は被覆の不完全除去
部分のパターンを認識し、演算装置4に記憶されている
健全なパターンと比較してモニター8に合否を表示す
る。この工程は、半田付けロボットないしフロー半田付
けを実施する際、被覆除去部分に異物が存在することに
よる障害を事前に排除するため必要である。
Next, the confirmation of the foreign matter at the portion where the coating of the wire 102 is removed is performed by recognizing the pattern of the foreign material or the incompletely removed portion of the coating shown in FIG. The pass / fail status is displayed on the monitor 8 for comparison. This step is necessary in order to eliminate in advance the trouble caused by the presence of foreign matter in the coating removal portion when performing the soldering robot or the flow soldering.

【0018】そして、ワイヤー102の基準ピン穴10
4からの被覆除去部102aの配列位置の寸法確認は、
予め演算装置4に記憶されている寸法精度の許容値と比
較しモニター8に合否を表示する。図5に、基準ピン穴
104からの寸法計測個所を示す。ワイヤー102のイ
に対しては、被覆除去長さをイa、イbから、被覆除去
部の配列位置をイcから認識する。この工程は、所定の
端子部にワイヤーの被覆除去部分102aを半田付けロ
ボットで正確かつ確実に接続するために必要である。
Then, the reference pin hole 10 of the wire 102 is
The dimension confirmation of the arrangement position of the coating removal unit 102a from No. 4
The pass / fail status is displayed on the monitor 8 by comparing with the allowable value of the dimensional accuracy stored in the arithmetic unit 4 in advance. FIG. 5 shows a dimension measurement position from the reference pin hole 104. For the wire 102, the length of the coating removal is recognized from Ia and Ib, and the arrangement position of the coating removal portion is recognized from Ic. This step is necessary in order to accurately and surely connect the wire-removed portion 102a to a predetermined terminal portion by a soldering robot.

【0019】図1に示すワイヤーの外観検査装置を用い
て自動的に検査するためには、図6のフローチャートの
工程に従えばよい。先ず、(1)検査ステージ上に被検
査物を手動にてセットする。(2)カメラで捕らえる白
色評点の明度を基準値として演算装置に記憶する。
(3)ライトガイドにて自動調節されている光源を中空
円筒型のすりガラスに誘導する。(4)すりガラスにて
拡散した落射照明により被検査物を照らす。(5)カメ
ラでカラー画像を撮像し画像取込装置に入力する。
In order to automatically inspect using the wire appearance inspection apparatus shown in FIG. 1, the steps in the flowchart of FIG. 6 may be followed. First, (1) the inspection object is manually set on the inspection stage. (2) The brightness of the white score captured by the camera is stored in the arithmetic unit as a reference value.
(3) The light source automatically adjusted by the light guide is guided to the hollow cylindrical frosted glass. (4) The inspection object is illuminated by epi-illumination diffused by frosted glass. (5) A color image is captured by the camera and input to the image capturing device.

【0020】(6)画像取込装置にてRGB信号をHS
I信号に変換する。(7)演算装置でカラー画像を2値
化する。(8)ワイヤーの被覆色の順序を確認する。
(9)ワイヤーの被覆除去部分の異物の付着又は不完全
除去の存在を確認する。(10)ワイヤーの被覆除去部
の配列位置を基準ピン穴から確認する。(11)演算装
置に記憶されているパターンと比較し合否を判定する。
(12)モニター画面上に合否を表示する。不合格品に
対しては赤字表示にて注意を喚起するのが好ましい。以
上で一連の検査は終了するので、被検査物を順次交換し
モニター画面をリセットすればよい。
(6) The RGB signal is converted to HS by the image capturing device.
Convert to I signal. (7) The color image is binarized by the arithmetic unit. (8) Check the order of the coating colors of the wires.
(9) Check the presence or absence of foreign matter adhesion or incomplete removal of the wire coating removal portion. (10) The arrangement position of the wire coating removal portion is confirmed from the reference pin hole. (11) The pass / fail is determined by comparing the pattern with the pattern stored in the arithmetic unit.
(12) Pass / Fail is displayed on the monitor screen. It is preferable to call attention to a rejected product by displaying it in red. Thus, a series of inspections is completed, and the inspection object may be sequentially replaced and the monitor screen may be reset.

【0021】[0021]

【発明の効果】本発明は、光源からライトガイドに誘導
される落射照明を、中空円筒型のすりガラスを経由して
拡散しながら被検査物の上方から照明するので、ワイヤ
ーのように立体的な曲面を有する被検査物であっても、
表面の陰影は消去され均一なカラー画像信号が得られ
る。
The present invention illuminates the epi-illumination guided from the light source to the light guide from above the object to be inspected while diffusing through the hollow cylindrical frosted glass. Even if the inspection object has a curved surface,
Shading on the surface is eliminated, and a uniform color image signal is obtained.

【0022】また、検査装置の設置されている環境の明
るさや検査装置自体の光源の劣化や電圧が変化し落射照
明の強さが変動しても、カメラの視野の一隅に光源の明
るさの基準となる白色評点を捕らえ演算装置に記憶させ
て置き、常に白色評点の明るさの範囲に自動的に調整す
るから、画像を2値化する時の明るさのゲイトレベルを
変更しなくてもよい。
Further, even if the brightness of the environment in which the inspection device is installed, the deterioration of the light source of the inspection device itself, or the voltage changes, and the intensity of the epi-illumination fluctuates, the brightness of the light source is located at one corner of the field of view of the camera. Since the reference white score is captured and stored in the arithmetic unit and automatically adjusted to the brightness range of the white score, the brightness level when binarizing the image can be changed without changing the gate level. Good.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のワイヤーの外観検査装置の概要図であ
る。
FIG. 1 is a schematic diagram of a wire appearance inspection apparatus of the present invention.

【図2】本発明の被検査物に対する光源がすりガラスに
より拡散されることを模式的に示す説明図である。
FIG. 2 is an explanatory view schematically showing that a light source for an inspection object of the present invention is diffused by ground glass.

【図3】本発明のワイヤーの被覆色順序をカメラで捕ら
える状態を示す。
FIG. 3 shows a state in which the coating color sequence of the wire of the present invention is captured by a camera.

【図4】本発明のワイヤーの被覆除去部分の異物をカメ
ラで捕らえる状態を示す。
FIG. 4 shows a state in which a foreign matter in a portion of the wire where the coating is removed is captured by a camera.

【図5】本発明のワイヤーの被覆除去部の配列位置をカ
メラで捕らえる状態を示す。
FIG. 5 shows a state in which the arrangement position of the wire removing portion of the present invention is captured by a camera.

【図6】本発明の検査工程を示すフローチャートを示す
図である。
FIG. 6 is a view showing a flowchart illustrating an inspection process of the present invention.

【図7】本発明の被検査物を俯瞰した平面図である。FIG. 7 is a plan view of the inspection object of the present invention as viewed from above.

【符号の説明】[Explanation of symbols]

1;検査ステージ 2;カメラ 3;光源 4;演算装置 5;ライトガイド 6;すりガラス 7;画像取込装置 8;モニター 101;トレー 102;ワイヤー 104;基準ピン穴 DESCRIPTION OF SYMBOLS 1; Inspection stage 2; Camera 3; Light source 4; Calculation device 5; Light guide 6; Ground glass 7; Image capture device 8;

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 演算装置に予め記憶している明度に制御
される光源と、検査ステージ上に被検査物としての複数
のワイヤーを横たえ、前記光源を前記被検査物の上方に
落射照明として誘導するライトガイドと中空円筒型のす
りガラスを備え、中空の前記ライトガイドの上方から覗
くカメラにて撮像された前記ワイヤーのカラー画像信号
を、予め記憶している前記ワイヤーの色毎に、前記演算
装置にて色相、彩度、明度に変換して得られた信号と比
較し、所定の閾値内の画素を抽出してワイヤーの被覆色
の順序、被覆除去部分の異物、基準点からの被覆除去部
の配列位置の寸法を計測して合否を判定するワイヤーの
外観検査装置。
1. A light source controlled to a brightness stored in a computing device in advance and a plurality of wires as an object to be inspected are laid on an inspection stage, and the light source is guided above the object to be inspected as epi-illumination. A color image signal of the wire captured by a camera that is viewed from above the hollow light guide, the color image signal of the wire being stored in advance for each color of the wire. The pixels are converted to hue, saturation, and lightness, and the pixels within a predetermined threshold value are extracted to determine the order of the coating color of the wire, foreign matter in the coating removal portion, and the coating removal portion from the reference point. A wire appearance inspection device that measures the dimensions of the arrangement positions of the wires to determine pass / fail.
JP10212070A 1998-07-28 1998-07-28 Wire appearance inspection device Pending JP2000046651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10212070A JP2000046651A (en) 1998-07-28 1998-07-28 Wire appearance inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10212070A JP2000046651A (en) 1998-07-28 1998-07-28 Wire appearance inspection device

Publications (1)

Publication Number Publication Date
JP2000046651A true JP2000046651A (en) 2000-02-18

Family

ID=16616376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10212070A Pending JP2000046651A (en) 1998-07-28 1998-07-28 Wire appearance inspection device

Country Status (1)

Country Link
JP (1) JP2000046651A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004125434A (en) * 2002-09-30 2004-04-22 Ngk Spark Plug Co Ltd Appearance examining method and device for electronic circuit component and method of manufacturing electronic circuit component
JP2005188991A (en) * 2003-12-24 2005-07-14 Nagoya Electric Works Co Ltd Abnormality detection method for conical or truncated conical bump, and abnormality detector for the conical or truncated conical bump
JP2007263671A (en) * 2006-03-28 2007-10-11 Tateyama Machine Kk Coating inspection device
JP2009150792A (en) * 2007-12-21 2009-07-09 Gunze Ltd Film inspecting apparatus
CN101865667A (en) * 2009-04-17 2010-10-20 住友电装株式会社 The generating apparatus of image for appearance inspection of wire harness and generation method
CN103134427A (en) * 2013-03-07 2013-06-05 苏州吉视电子科技有限公司 Recognizing device and method for ring parts
CN107727664A (en) * 2017-11-30 2018-02-23 四川恒匀通科技有限公司 Metal plate vision-based detection acquisition terminal and method
CN108141945A (en) * 2015-10-15 2018-06-08 飞利浦照明控股有限公司 Lighting arrangements, computer program product, mobile communication equipment and lighting system
WO2018104078A1 (en) * 2016-12-09 2018-06-14 Kromberg & Schubert Gmbh Wiring harness fabrication and apparatus for wiring harness fabrication
CN108603751A (en) * 2016-02-08 2018-09-28 Ntn株式会社 The manufacturing method of form measuring instrument and target object to be coated

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004125434A (en) * 2002-09-30 2004-04-22 Ngk Spark Plug Co Ltd Appearance examining method and device for electronic circuit component and method of manufacturing electronic circuit component
JP2005188991A (en) * 2003-12-24 2005-07-14 Nagoya Electric Works Co Ltd Abnormality detection method for conical or truncated conical bump, and abnormality detector for the conical or truncated conical bump
JP4606734B2 (en) * 2003-12-24 2011-01-05 名古屋電機工業株式会社 Abnormality detection method for cone-shaped or frustum-shaped bumps
JP2007263671A (en) * 2006-03-28 2007-10-11 Tateyama Machine Kk Coating inspection device
JP2009150792A (en) * 2007-12-21 2009-07-09 Gunze Ltd Film inspecting apparatus
CN101865667A (en) * 2009-04-17 2010-10-20 住友电装株式会社 The generating apparatus of image for appearance inspection of wire harness and generation method
CN103134427A (en) * 2013-03-07 2013-06-05 苏州吉视电子科技有限公司 Recognizing device and method for ring parts
CN108141945A (en) * 2015-10-15 2018-06-08 飞利浦照明控股有限公司 Lighting arrangements, computer program product, mobile communication equipment and lighting system
CN108141945B (en) * 2015-10-15 2020-06-16 飞利浦照明控股有限公司 Lighting arrangement and system, computer readable storage medium and mobile communication device
CN108603751A (en) * 2016-02-08 2018-09-28 Ntn株式会社 The manufacturing method of form measuring instrument and target object to be coated
CN108603751B (en) * 2016-02-08 2020-09-01 Ntn株式会社 Shape measuring device and method for producing target object to be coated
WO2018104078A1 (en) * 2016-12-09 2018-06-14 Kromberg & Schubert Gmbh Wiring harness fabrication and apparatus for wiring harness fabrication
CN109843513A (en) * 2016-12-09 2019-06-04 克龙贝格和舒伯特有限公司 Device bunch of cables manufacture and manufactured for bunch of cables
CN109843513B (en) * 2016-12-09 2022-09-13 克龙贝格和舒伯特有限公司 Apparatus and method for evaluating state of cable bundle
CN107727664A (en) * 2017-11-30 2018-02-23 四川恒匀通科技有限公司 Metal plate vision-based detection acquisition terminal and method

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