JP2003165080A - Method and device for teaching positional off-set of component recognition camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance precision when a relative position of a component recognition camera to a substrate recognition camera is taught as an off-set condition without providing a teaching-exclusive illumination. <P>SOLUTION: A teaching jig 35 is mounted on a top face part 31A of a component recognition device 31, a reflection image of the jig 35 is image-picked up by the component recognition camera 30, a position of a dot matrix of the jig 35 is confirmed, and a component recognition processing part measures matrix center position coordinates and a magnification based on the image center, and calculates a position of a dot matrix center. Then, an installation head 7 is moved to position the substrate recognition camera 18 in an upper position of the jig 35, a transmission image of the jig 35 is image-picked up by the substrate recognition camera 18 to recognize the position of a dot matrix, matrix center position coordinates and a magnification based on the image center are measured to calculate a dot matrix center position. A CPU calculates a component recognition off-set data based on the both dot matrix center positions, to be stored in a RAM. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition which teaches a relative position of a substrate recognition camera which images a mark on a printed circuit board and a component recognition camera which images an electronic component sucked and held by a suction nozzle as an offset. The present invention relates to a camera position offset teaching method and teaching device.

[0002]

2. Description of the Related Art Conventionally, when teaching the relative position of a board recognition camera and a component recognition camera as an offset, the following method has been used. That is, first, the teaching jig is sucked by the suction nozzle, the suction nozzle is moved to the position of the component recognition camera, and the position of the jig is imaged by the component recognition camera to recognize the position. Next, the jig is detached from the suction nozzle and placed on the surface emitting illumination (illumination dedicated to teaching), the substrate recognition camera is moved above the surface emitting illumination, and an image is recognized by the substrate recognition camera for recognition. . Then, the offset value was calculated based on the result.

[0003]

However, according to the above-mentioned conventional method, when the jig is replaced on the surface emitting illumination (illumination dedicated to teaching), a deviation occurs, which adversely affects the accuracy. It was

Therefore, an object of the present invention is to improve the accuracy when teaching the relative position of the board recognition camera and the component recognition camera as an offset without providing a teaching-only illumination.

[0005]

Therefore, the first invention is
A component recognition camera position offset teaching method for teaching, as an offset, a relative position between a substrate recognition camera that captures a mark on a printed circuit board and a component recognition camera that captures an image of an electronic component sucked and held by a suction nozzle. A teaching jig having a dot matrix is placed on the top surface, the component recognition camera captures a reflection image of the teaching jig, the dot matrix position is recognized, and the dot matrix center position is calculated. Then, the board recognition camera is positioned above the teaching jig, the board recognition camera takes a transmission image of the jig, the dot matrix position is recognized, and the dot matrix center position is calculated. The feature is that the component recognition offset data is calculated from both dot matrix center positions and stored in the memory. That.

A second aspect of the present invention is a component recognition camera that teaches, as an offset, a relative position between a substrate recognition camera that captures an image of a mark on a printed circuit board and a component recognition camera that captures an image of an electronic component sucked and held by a suction nozzle. In a position offset teaching device, a teaching jig that has a dot matrix and is placed on the top surface of the component recognition device, and a reflection image of the teaching jig are captured by the component recognition camera, and the position of the dot matrix And the first calculating means for calculating the dot matrix center position, and the substrate recognition camera picks up the transmission image of the teaching jig to recognize the dot matrix position and determine the dot matrix center position. Second calculating means for calculating, and third calculating means for calculating the component recognition offset data from both dot matrix center positions, And a memory for storing the calculation result by the third calculating means.

Further, in a third aspect of the present invention, the first and second calculating means calculate each dot matrix center based on a position coordinate of each dot matrix center based on an image pickup result and a magnification by a focus position shift of each recognition camera. -It is characterized in that the position is calculated.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 are provided on a base 2 of the apparatus 1 for supplying various electronic components to the component unloading portion (component suction position), respectively. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the units 3 facing each other. The supply conveyor 4 conveys the printed circuit board P received from the upstream to the positioning section 5,
After electronic components are mounted on the substrate P positioned by the positioning unit 5 by a positioning mechanism (not shown), they are conveyed to the discharge conveyor 6.

Numeral 8 is a pair of beams which are long in the X direction, and Y
The screw shaft 10 is rotated by the drive of the shaft driving motor 9 and individually moved in the Y direction along the pair of left and right guides 11 above the printed circuit board P and the component pick-up portion (component suction position) of the component supply unit 3. .

Each beam 8 is provided with a mounting head 7 which moves along a guide (not shown) by an X-axis drive motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7 is equipped with two vertical axis driving motors 14 for vertically moving the suction nozzle 7A, and is also equipped with a θ axis driving motor 15 for rotating around the vertical axis. . Therefore, the suction nozzle 7A of each mounting head 7 has X
It is movable in the Y direction and the Y direction, rotatable about a vertical line, and movable up and down.

Reference numeral 17 denotes a nozzle stocker for accommodating the suction nozzle 7A, which can accommodate a maximum of 10, but 9 of them.

Reference numeral 18 denotes a board recognition camera for board position recognition of the board recognition device 19 for recognizing a positional deviation of the printed circuit board P provided on the mounting head 7 and positioned by the positioning mechanism by the positioning section 5. The positioning mark is imaged.

Reference numeral 20 is a disc-shaped diffusion plate fixed to the upper portion of the suction nozzle 7A. Reference numeral 21 is a cylindrical body in which a board recognizing scope 22 is built in, and a board recognizing illuminating device 23 which is lit by an illuminating lighting circuit 24 is fixed to the lower portion of the outer periphery of the cylindrical body 21.

Reference numeral 30 denotes a component recognition camera for recognizing the position of the transparent component of the component recognition device 31. A component recognition scope 32 is arranged immediately above the component recognition camera 30, and the inner cylinder 3 is further provided.
In the upper part of the component recognition scope 32 in FIG. 3, a component recognition illumination device 34 that is illuminated by the illumination lighting circuit 24 is arranged. The component recognition camera 31 is provided corresponding to each of the mounting heads 7 and recognizes the position of the electronic component with respect to the suction nozzle 7A with respect to the suction nozzle 7A by the suction and the XY directions and the rotation angle. In order to image the electronic component.

A teaching jig 35 as shown in FIG. 3 is placed on the top surface portion 31A of the component recognition device 31. The teaching jig 35 is made of, for example, transparent glass, and dots are provided in a matrix on the upper surface thereof. More specifically, the plurality of dot matrices 36 in the central portion are for substrate recognition, and a dot matrix 37 for component recognition is provided around the dot matrix 36 to surround the area.

FIG. 4 is a control block diagram of the electronic component mounting apparatus 1. Reference numeral 40 denotes a CPU as a control unit for integrally controlling the operation relating to the mounting of the main mounting apparatus, 41 denotes X direction, Y direction and angular position information in the printed circuit board P for each mounting order of electronic components, and each component supply unit. RAM (random access memory) for storing mounting data, part library data, etc., which is composed of arrangement number information, and 42 is a ROM (read only memory) for storing programs. is there.

Based on the data stored in the RAM 41, the CPU 40 generally controls the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 42. That is, the CPU 40 controls the drive of the X-axis drive motor 12, the Y-axis drive motor 9, the vertical axis drive motor 14, and the θ-axis drive motor 15 via the drive circuit 43. To do.

Reference numeral 44 denotes a component recognition processing section connected to the CPU 40 via an interface 45. The recognition processing section 44 performs the recognition processing of the image captured by the component recognition camera 30 and taken in. The processing result is sent to the CPU 40. That is, the CPU 40 uses the component recognition camera 3
An instruction is output to the recognition processing unit 44 to perform recognition processing (calculation of the amount of positional deviation, etc.) on the image captured at 0, and the recognition processing result is received from the recognition processing unit 44.

Reference numeral 46 denotes a board recognition processing section connected to the CPU 40 via an interface 45, and the recognition processing of the image captured by the board recognition camera 18 is carried out by the recognition processing section. At 46, the processing result is sent to the CPU 40. That is, the CPU 40 outputs an instruction to the recognition processing unit 46 to perform recognition processing (calculation of the amount of positional deviation, etc.) on the image captured by the board recognition camera 18, and receives the recognition processing result from the recognition processing unit 46. Is.

Therefore, when the positional deviation amount is recognized by the recognition processing of the recognition processing units 44 and 46, the result is C
It is sent to the PU 40, and the CPU 40 moves the beam 8 in the Y direction by driving the Y-axis drive motor 9 and moves the mounting head 7 in the X direction by driving the X-axis drive motor 12, and Rotate θ by the θ-axis drive motor 15 to move X,
The rotation angle position is corrected in the Y direction and around the vertical axis.

When picked up by the component recognition camera 30 and the board recognition camera 18, the picked-up image is displayed on the display circuit 4.
It is displayed on the monitor 48 via 7.

Reference numeral 52 is an operating portion, which is a keypad for inputting numbers, a cursor key 54, and S for setting a mode.
ET key 55, teaching key 56 for setting the electronic component mounting device in the teaching mode, automatic key 57 for setting the device in the automatic operation mode, and manual operation mode for the device. A manual key 58, a starting key 59, an operating key 60 and a stopping key 61 are provided.

With the above construction, the flow of FIG.
The teaching operation will be described based on the chart. First, the operator places the teaching jig 35 on the top surface portion 31A of the component recognition device 31, but it may be automatically placed by suction by the suction nozzle 7A. Then, the operator teaches the key 56.
When is pressed, the CPU 40 lights the component recognition lighting device 34 via the lighting lighting circuit 24.

Next, the CPU 40 causes the component recognition camera 30 to capture the reflected image of the teaching jig 35, and the component recognition processing unit 4
The image is stored in the memory of 4. Then, the position of the dot matrix 37 of the teaching jig 35 is recognized, and the component recognition processing unit 44 moves from the image center on the monitor 48 to the matrix center position coordinates (X1, Y1, θ1).
Since the focus position P1 of the component recognition camera 30 is displaced, the magnification (Xa, Ya) is measured. Then, the CPU 40 sets the dot matrix center position to Xa1 = X1 × Xa.
And Ya1 = Y1 × Ya.

Next, the CPU 40A drives the beam Y-axis drive motor 9 and the X-axis drive motor 12 to move the mounting head 7, and the board recognition camera 18 causes the component recognition camera 18 to move. 30, component recognition lighting device 34
It is moved so as to come above the teaching jig 35. In this way, since the teaching jig 35 remains mounted and does not need to be replaced, the deviation can be avoided and the accuracy of offset data described below can be improved.

Then, the CPU 40 causes the board recognition camera 18 to pick up the transmission image of the teaching jig 35, takes the image into the memory of the board recognition processing section 46, and illuminates the parts recognition device 34.
To turn off.

Next, the position of the dot matrix 36 is recognized, and the matrix center position coordinates (X2, Y2, θ2) and the focus position P2 of the substrate recognition camera 18 are displaced from the image center, so that the magnification (Xb, Yb) is obtained. To measure. The CPU 40 is a dot matrix center.
The position is calculated from Xb2 = X2 × Xb and Yb2 = Y2 × Yb.

From the above, the CPU 40 outputs the component recognition offset data as X = Xa1-Xb2, Y = Ya1-Yb2.
And θ = θ1-θ2, and the calculation result is stored in the RAM.
41 and teach it. As described above, since it is not necessary to provide a dedicated illumination in order to obtain the component recognition offset data, it is possible to reduce the cost.

The CPU 40 uses the calculation result stored in the RAM 41 as correction data when actually mounting electronic components. That is, when the operator presses the automatic key 57 to set the component mounting device to the automatic operation mode and presses the start key 59 to automatically operate the component mounting device, the calculation result is used. The Rukoto.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention can be carried out in various ways without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.

[0031]

As described above, according to the present invention, it is possible to improve the accuracy when teaching the relative position between the board recognition camera and the component recognition camera as an offset, without providing an illumination dedicated to teaching. Moreover, according to the invention of claim 3, the accuracy can be further improved even if the teaching jig is out of focus of the recognition camera.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting device.

FIG. 2 is a front view of a main part of an electronic component mounting device.

FIG. 3 is a plan view of a teaching jig.

FIG. 4 is a control block diagram.

FIG. 5 is a diagram showing a flowchart.

[Explanation of symbols]

1 Electronic component mounting device 9 mounting head 18 Board recognition camera 23 Illumination device for board recognition 30 parts recognition camera 34 Illumination device for component recognition 35 Teaching jig 36 dot matrix 37 dot matrix 40 CPU 41 RAM 44 Parts recognition processing unit 46 Board recognition processing unit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toshiaki Wada             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F-term (reference) 3C007 AS01 AS08 BS03 DS01 FS01                       KS03 KT02 KT05 KT06 KT09                       LS02 LT14 LT17 MT01 NS10                 5B057 AA03 CA12 CB20 CH01

Claims (3)

[Claims] 1. A component recognition camera position offset teaching method for teaching, as an offset, a relative position between a substrate recognition camera that captures a mark on a printed circuit board and a component recognition camera that captures an electronic component sucked and held by a suction nozzle. , A teaching jig having a dot matrix is placed on the top surface of the component recognition device, the component recognition camera captures a reflected image of the teaching jig to recognize the position of the dot matrix, and Calculate the center position, position the board recognition camera above the teaching jig,
The transparent image of the jig is picked up by the substrate recognition camera, the position of the dot matrix is recognized, the dot matrix center position is calculated, and the component recognition offset data is calculated from both dot matrix center positions and the memory is calculated. A component recognition camera position offset teaching method, characterized in that it is stored in. 2. A component recognition camera position offset teaching device that teaches, as an offset, a relative position between a substrate recognition camera that captures a mark on a printed circuit board and a component recognition camera that captures an electronic component sucked and held by a suction nozzle. , A teaching jig having a dot matrix and placed on the top surface of the component recognition device, and the component recognition camera picks up a reflection image of the teaching jig to recognize the position of the dot matrix A first calculating means for calculating the matrix center position; and a second calculating means for calculating the dot matrix center position by recognizing the dot matrix position by capturing the transmission image of the teaching jig by the substrate recognition camera. Calculating means, third calculating means for calculating the component recognition offset data from both dot matrix center positions, and the third calculating means. Component recognition camera position offset teaching apparatus characterized by comprising a memory for storing the calculation result by. 3. The first and second calculating means, based on each dot matrix center position coordinate based on an imaging result and a magnification by a focus position shift of each recognition camera,
The component recognition camera position offset teaching device according to claim 2, wherein each dot matrix center position is calculated.