JP5740082B2 - Board production line consisting of multiple surface mount devices - Google Patents

Description

  The present invention is a board production line composed of a plurality of surface mount devices, and in particular, an equipment for producing mounted substrates by sequentially mounting electronic components on the same substrate by a plurality of surface mount devices arranged in parallel. The present invention relates to a board production line composed of a plurality of surface mount apparatuses that are suitable for setting optimal illumination.

  2. Description of the Related Art Conventionally, a surface mounting device is used to produce a mounting substrate by mounting electronic components on a substrate. In such a surface mounting device, it is necessary to accurately mount an electronic component sucked and held by a mounting head movable in a plane direction at a target position on the substrate. Position recognition that accurately grasps the position is performed.

  This substrate position recognition is performed by, for example, imaging a substrate mark (target object) provided at a predetermined position on the substrate with a camera installed on the mounting head, and imaging the deviation of the substrate mark from the reference position. Image recognition detected by processing is performed.

  For this purpose, it is necessary to clearly capture the outline of the imaged substrate mark, and therefore setting of the illumination intensity (brightness) is important. Conventionally, the setting of the illumination intensity has been performed while adjusting the brightness of the light source just as the operator looks at the monitor screen for each device. It was inevitable that this error would occur. Therefore, in order to solve these disadvantages, Patent Document 1 proposes a technique for automatically adjusting and setting illumination to an appropriate brightness.

  On the other hand, when a mounting board is produced, electronic components are sequentially mounted on the same board by a board production line including a plurality of surface mounting devices arranged in parallel on the same line.

  In a board production line consisting of a plurality of such surface mounting devices, it is natural that the illumination is set to an appropriate brightness for each surface mounting device in order to recognize an object such as a board mark. Is extremely important.

Japanese Patent Laid-Open No. 10-62134

  However, since the illumination setting method in the conventional board production line composed of a plurality of surface mount devices often has different cameras and illuminations used in each surface mount device, the operator individually applies to each surface mount device. This requires a lot of time and effort for pre-production preparations, and there is a possibility that recognition errors may occur due to individual differences in the lighting settings for adjusting the brightness. there were.

  Even if the automatic setting technique proposed in Patent Document 1 is applied to the illumination setting for a plurality of surface mounting devices constituting the board production line, the setting operation is performed individually for each surface mounting device. Because of the necessity, the problem that preparation work before production takes time and labor still remains.

  The present invention has been made in order to solve the above-described conventional problems. For each surface mount device constituting a substrate production line composed of a plurality of surface mount devices, illumination is used by an installed camera. Thus, it is an object of the present invention to provide a technique that can easily set an appropriate illumination condition when imaging the same object, and can therefore greatly reduce preparation work before production.

The present invention provides a substrate production line including a plurality of surface mount devices including a plurality of surface mount devices arranged in a row and a server that manages each surface mount device, and the surface mount devices are carried in. Board image pickup means for picking up an image of an object on the board, and lighting means for lighting when the board image pickup means picks up the object, Along with the correlation table in which the illumination setting values of the respective surface mounting apparatuses are stored corresponding to each other so that the object can be set to the same illumination condition, it corresponds to a specific illumination condition in any surface mounting apparatus. setting the illumination preset value, the illumination settings that search lighting setting values corresponding to the remaining surface mount equipment in the correlation table, set to the same lighting conditions with respect to the object And have a lighting batch control means for setting a value for surface mounting apparatus 該残Ri, the illumination batch control means, the illumination setting value set in the arbitrary surface mounted device stored in said correlation table If not, obtain a difference obtained by subtracting the illumination setting value set by the arbitrary surface mounting device from the approximate illumination setting value stored in the correlation table closest to the illumination setting value, and the remaining surface The mounting problem is solved by setting the corresponding illumination setting value corresponding to the approximate illumination setting value and then setting the illumination setting value obtained by subtracting the difference from the corresponding illumination setting value . Is.

Incidentally, the lighting batch control means, setting the illumination set value corresponding to a particular illumination condition in the surface mounting apparatus of the board production line destination head, the surface mounting apparatus of the second and subsequent in said correlation table sequentially searching illumination settings corresponding against, may be adopted lower propagation method to set the same lighting conditions, also, the lighting conditions may be the illuminance.

  According to the present invention, the illumination setting values for setting the same illumination condition for each surface mounting device are stored in association with each other in the server that manages the plurality of surface mounting devices constituting the board production line. As a result, the server simply sets the lighting setting value that provides the optimal lighting conditions for the object in any surface mounting device, and the server sets the lighting setting for each remaining surface mounting device from the stored data based on that information. Since values can be retrieved and automatically set, preparation work before production can be greatly reduced.

Explanatory drawing which shows the outline | summary of the board | substrate production line in one Embodiment which concerns on this invention. Schematic perspective view showing the whole of one surface mounting apparatus constituting the board production line Block diagram showing the outline of the control system of the surface mount device Explanatory diagram illustrating the relationship between camera and lighting Explanatory drawing illustrating the relationship between the substrate and the object to be recognized Chart showing an example of a correlation table of illumination setting values for a plurality of surface mount devices Explanatory drawing showing the image of the illuminance adjustment screen provided on the surface mount device The flowchart which shows the procedure of the automatic setting of the illumination by the lower stage propagation system of 1st Example. The flowchart which shows the procedure of the automatic setting of the illumination by the all propagation system of 2nd Example.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In FIG. 1, the outline | summary of the board | substrate production line which consists of several surface mounting apparatus of one Embodiment which concerns on this invention is shown.

  In the board production line of this embodiment, a plurality of surface mount devices are arranged in the same row, and electronic components are sequentially placed on different target positions on the same substrate from the first surface mount device 1A to the final surface mount device 1M. By repeating the mounting operation, the same type of mounting board is produced, and the whole of the plurality of surface mounting apparatuses 1A to 1M is connected to the server 3 via the LAN cable 2, and the server 3 Each is managed.

  In FIG. 2, the whole electronic component mounting apparatus (surface mounting apparatus) which comprises the board | substrate production line of this embodiment is partially broken, and is shown.

  As shown in the figure, one electronic component mounting apparatus 1 is mounted on a substrate 10, disposed on the lower side of the drawing, with a substrate transport path 4 extending in the left-right direction slightly behind the center portion. A component supply unit 11 that supplies components, and an X-axis moving mechanism 12 and a Y-axis moving mechanism 14 disposed in the X direction and the Y direction, respectively, are provided.

  The X-axis moving mechanism 12 moves a mounting head portion (suction head portion) 13 including a suction nozzle 13a for sucking parts in the X-axis direction, and the Y-axis moving mechanism 14 includes the X-axis moving mechanism 12 and the mounting head. The part 13 is moved in the Y-axis direction. The mounting head unit 13 includes a Z-axis moving mechanism that moves the suction nozzle 13a up and down in the vertical direction (Z-axis direction), and rotates the suction nozzle 13a around the nozzle axis (suction axis). A shaft rotation mechanism is provided. In addition, a substrate recognition camera 17 that captures an image of a substrate mark formed on the substrate 10 is mounted on the mounting head unit 13 so as to be attached to a support member. In addition, a component recognition camera (imaging unit) 16 that images the component sucked by the suction nozzle 13a from below is disposed on the side of the component supply unit 11.

  FIG. 3 shows the configuration of the control system of the electronic component mounting apparatus 1. Reference numeral 20 denotes a microcomputer (CPU) that controls the entire apparatus, and a controller (control means) composed of RAM, ROM, etc., and each component shown by reference numerals 21 to 31 described below connected thereto. Control each.

  The X-axis motor 21 is a driving source for the X-axis moving mechanism 12 and moves the mounting head unit 13 in the X-axis direction. The Y-axis motor 22 is a driving source for the Y-axis moving mechanism 14 and is an X-axis moving mechanism. 12 is moved in the Y-axis direction, so that the mounting head portion 13 is movable in the X-axis direction and the Y-axis direction.

  The Z-axis motor 23 is a drive source of a Z-axis drive mechanism (not shown) that raises and lowers the suction nozzle 13a, and raises and lowers the suction nozzle 13a in the Z-axis direction (height direction). The θ-axis motor 24 is a drive source for a θ-axis rotation mechanism (not shown) of the suction nozzle 13a, and rotates the suction nozzle 13a around the nozzle center axis (suction axis).

  The image recognition device 27 performs image recognition of the component 18 sucked by the suction nozzle 13a, and includes an A / D converter 27a, a memory 27b, and a CPU 27c. The analog image signal output from the component recognition camera 16 that captured the picked-up component 18 is converted into a digital signal by the A / D converter 27a and stored in the memory 27b, and the CPU 27c is based on the image data. Recognize the sucked parts.

  That is, the image recognition device 27 calculates the component center and the suction angle, and recognizes the suction posture of the component. In addition, the image recognition device 27 calculates the substrate mark position by processing the image of the substrate mark captured by the substrate recognition camera 17.

  Further, the image recognition device 27 processes the image data of the component 18 imaged by the component recognition camera 16 and the board mark data imaged by the board recognition camera 17, and transfers both correction data to the control means 20.

  The keyboard 28 and mouse 29 are used for inputting data such as component data.

  The storage device 30 is configured by a flash memory or the like, and is used to store component data input by the keyboard 28 and the mouse 29, component data supplied from the server (host computer) 3, and the like.

  The display device (monitor) 31 displays component data, calculation data, an image of the component 18 captured by the component recognition camera 16, and the like on the display screen 31a.

  The mounting head unit 13 is equipped with an illumination device for capturing an object such as a substrate mark on the substrate 10 as a clear image together with the substrate recognition camera 17.

  FIG. 4 schematically shows an example of a camera and a lighting device equipped with a substrate.

  In the example of FIG. 4A, vertical illumination and angle illumination are provided, and prism plates A and B having both reflection and transmission functions are provided below the camera with respect to the optical axis. They are arranged at a position intersecting at 45 ° and a position orthogonal to each other.

  The light emitted from the vertical illumination is reflected toward the substrate by the prism plate A, passes through the second prism plate B, and reaches the substrate. Further, the light emitted from the angle illumination toward the camera is reflected toward the substrate by the prism plate B and reaches the substrate.

  In this example, the illuminance of the illumination is adjusted by the intensity of the two illuminations of the vertical illumination and the angle illumination, and the camera images through the two prism plates A and B.

  In the example of FIG. 4B, vertical illumination and a plastic plate are provided, and only the prism plate A is disposed below the camera.

  The light emitted from the vertical illumination is reflected by the prism plate A toward the substrate and reaches the substrate. Further, part of the light reflected by the prism plate passes through the plastic plate having a diffusion function and reaches the substrate.

  In this example, the illumination illuminance (brightness) is similarly adjusted by the vertical illumination and the plastic plate that transmits the reflected light, and the camera performs imaging through the single prism plate A.

  As an object on the substrate recognized by the substrate recognition camera 17, there are a barcode, a bad mark and the like in addition to the substrate mark as shown in FIG. 5A together with the relationship with the substrate 10.

  Here, the substrate marks are provided at a plurality of corners (three corners in this example) in order to correct distortion (deviation) from the reference position of the substrate that has been conveyed. Illustrate.

  The barcode is used for recognizing the substrate that has been transported or for indicating a production program applied to the substrate, and includes two-dimensional and three-dimensional barcodes as shown in FIG.

  The bad mark represents that an electronic component is not mounted, and there are a board bad mark and an area bad mark (circuit bad mark) as types. Incidentally, in FIG. 5A, in the two areas indicated by the broken-line rectangle, the left side has no bad mark as shown by the dotted line. On the other hand, since there is a bad mark on the right side, the electronic component P is not mounted as in the left side, and only the electrode portion is in the state. Also, since the bad mark is arbitrarily determined by the user, there is a handwritten one such as the right end as shown in FIG.

  In the board production line of this embodiment, the image recognition of the board mark will be described as an example. Since the electronic components must be accurately mounted in order from the first surface mounting apparatus 1A on the same board, It is necessary to capture the board mark on the board that has been carried and positioned in the mounting apparatus as an image with a clear outline. For this purpose, it is necessary to set appropriate brightness (illuminance) for the illumination used when the substrate mark is imaged by the camera 17 in any of the surface mounting apparatuses 1.

  However, the surface mount device has different illumination devices for each model, and even if the model is the same, the illuminance varies even if the same set value is selected due to deterioration over time.

  Therefore, in the present embodiment, in order to enable clear imaging of the board marks on the same substrate by all the surface mounting devices in the preparation stage before starting production, the server 3 is provided with each surface mounting device ( A correlation table of illumination setting values for each model) is provided.

  The correlation table of illumination setting values for each model is intended to enable each surface mount device to be set to the same illuminance (illumination conditions) even if the illumination device provided for each model is different. This is correlation data of illumination setting values (parameters) that can be used when searching for corresponding illumination setting values when adjusting the same illuminance between the surface mount devices.

  FIG. 6 shows an example of a correlation table of illumination setting values for the models A, B, and C. Each of these data is a parameter that is set in setting means (not shown) provided in each device in order to turn on the illumination of each surface mount device and adjust it to the same illuminance (brightness). Setting a parameter represented by a numerical value from 0 to 100% is equivalent to adjusting the current value for lighting, but the performance etc. is slightly different for each model. It is obtained in advance by, for example, measuring the illuminance after lighting and creating it as correlation data.

  Further, the server 3 has an illumination batch control function (illumination batch control means). When the illumination batch control function (illumination batch control means) sets illumination for any surface mounting apparatus with parameters, the server 3 And the corresponding illumination setting value (parameter) is automatically set for the other surface mounting apparatus.

  For example, if model A is manually set to a set value of 50%, 55% is automatically set for model B and model C, respectively.

  The manual setting of the illumination performed here is performed by actually picking up an image of the substrate mark by the camera 17 in the surface mount device and displaying it on the image area of the illuminance adjustment screen shown in FIG.

  When a board mark consisting of white circles is displayed on the screen, press the positioning button in the right setting area to enter the positioning mode, then move the board mark using the four-way key and align its center with the center of the image area Let

  Next, after pressing the illumination setting button to change to the setting mode, the% parameter is adjusted up and down using the up and down direction keys to adjust the illumination illuminance, and when the board mark becomes clear, the enter key is pressed to set.

When there is no corresponding data in the table, for example, when the model C is manually set to the set value 73%, the following formula X = (value closest to the manually set value in the table) − (manual setting) value)
The difference X is obtained by the above, and the value obtained by subtracting the difference X from the value closest to the manually set value is set for the other models A and B.

  That is, if the manual setting value is 73%, X = 75% −73% = 2%. Therefore, for model A and model B, 70% −2% = 68% from the setting value in the same row, Each value of 77% -2% = 75% is transmitted and automatically set.

  In the above configuration, a first embodiment using the lower propagation method will be described with reference to the flowchart of FIG.

  Here, the lower stage propagation method is a setting method for propagating the illuminance setting for the front surface mounting device to the surface mounting devices arranged behind it. Therefore, it is not necessary to adjust the illuminance for all the surface mount device illumination devices as preparation before production, and the illumination illuminance can be set when a new substrate is conveyed as a flow of production operation.

  First, the lower stage propagation method is set in the illumination collective control means (step 1).

  Next, when the substrate is transported to the front surface mounting apparatus (step 2), the mounting head portion 13 of the front surface mounting apparatus moves to the mark position, and the illumination is turned on at a preset reference illuminance ( Step 3).

  Since the mark imaged by the camera of the front surface mount device is displayed on the screen, the user manually sets the illumination on the screen as described above (step 4).

  When the user presses the Enter key to determine, the illumination batch control means obtains the illumination setting value manually set in step 4 (step 5).

  Next, the illumination collective control means searches the illumination data table held by the server 3 for the illumination setting values of the second and subsequent surface mount devices based on the illumination setting values acquired in step 5 above. (Step 6).

  Thereafter, when the illumination collective control means transmits the set value of the illumination searched in step 6 to the second and subsequent surface mounting devices (step 7), the setting of the illumination acquired by the second and subsequent surface mounting devices. Values are automatically set sequentially (step 8).

  As described above, according to the present embodiment, the following effects can be obtained.

  (1) By manually setting the illumination of the first surface mount device, it is possible to automatically set the illumination of the second and subsequent surface mount devices, so that the labor and time for preparation before production can be greatly reduced.

  (2) Since the setting value of the lighting of the second and subsequent surface mounting devices is retrieved from the lighting data table held by the server based on the setting value of the manual setting for the lighting of the first surface mounting device, the conventional surface It is possible to reduce recognition errors due to individual differences in lighting settings that occur when manual settings are individually made for the mounting apparatus, and to prevent recognition errors.

  Next, according to the flowchart of FIG. 9, a case where an all-propagation method is adopted will be described as a second embodiment according to the present invention.

  Here, the all-propagation method is a method in which the setting of the surface mounting apparatus can be propagated regardless of before and after the line. By using this all-propagation method, the surface mounting apparatus that performs the manual setting of illumination first does not have to be at the top. For this reason, when there is a specific surface mounting device in which a substrate mark recognition error is likely to occur, it can be set according to the illumination intensity of the specific surface mounting device.

  First, the entire propagation system is set in the illumination batch control means (step 11).

  Next, when the substrate is transported to any second and subsequent surface mounting devices (step 12), the mounting head portion 13 of the second and subsequent surface mounting devices moves to the mark position, and illumination is preset. It is lit at the reference illuminance (step 13).

  Since the marks picked up by the cameras of the second and subsequent surface mount devices are displayed on the screen, the user manually sets the illumination on the screen as described above (step 14).

  When the user presses the Enter key to decide, the illumination batch control means acquires the illumination setting value manually set in step 14 (step 15).

  Next, the illumination collective control means, based on the illumination setting value acquired in step 15 above, from the illumination data table that the server 3 has the illumination setting values of the remaining surface mount devices that are not manually set. Search (step 16).

  Thereafter, when the illumination collective control means transmits the set value of the illumination searched in the above step 16 to the remaining surface mount devices (step 17), the set value of the illumination acquired by these remaining surface mount devices is automatically set. (Step 18).

  As described above, according to the present embodiment, the following effects can be obtained.

  (1) By performing illumination manual setting for any second and subsequent surface mount devices, it is possible to automatically set the illumination for the remaining surface mount devices.

  (2) Therefore, when the production line is stopped due to a mark recognition error due to insufficient illuminance due to deterioration of the lighting device in the second and subsequent surface mounting devices, the surface mounting device in which the error has occurred is manually set. The error can be dealt with by re-adjusting and automatically setting the remaining surface mounting apparatus.

  In the above embodiment, the illumination condition is illuminance. However, the present invention is not limited to this, and the illumination condition may be adjusted to an appropriate contrast on an image actually captured by the camera.

  Further, in the above embodiment, the case where the lower propagation method and the entire propagation method are respectively set in the illumination collective control means has been shown. You may make it switch to a propagation system.

DESCRIPTION OF SYMBOLS 1 ... Surface mount apparatus 3 ... Server 10 ... Board | substrate 13 ... Mounting head part 13a ... Adsorption nozzle 12 ... X-axis moving mechanism 14 ... Y-axis moving mechanism 17 ... Board recognition apparatus (camera)

Claims (3)

In a board production line composed of a plurality of surface mount devices provided with a plurality of surface mount devices arranged in a row and a server for managing each surface mount device,
Each of the surface mount devices includes a board imaging unit that images a target object on a substrate that has been carried in, and an illumination unit that is turned on when the target is imaged by the board imaging unit,
The server is a correlation table in which the illumination setting values of the surface mount devices are stored in correspondence with each other so that the illumination means included in the surface mount devices can be set to the same illumination condition for the object. In addition, when an illumination setting value corresponding to a specific illumination condition is set in an arbitrary surface mounting device, the illumination setting value corresponding to each of the remaining surface mounting devices is searched in the correlation table, and the target object is searched. It has illumination batch control means for setting the illumination setting value to be set to the same illumination condition for the remaining surface mounting device ,
When the illumination setting value set in the arbitrary surface mounting apparatus is not stored in the correlation table, the illumination batch control means uses the illumination setting value set in the arbitrary surface mounting apparatus as the illumination setting. The difference obtained by subtracting the approximate illumination setting value stored in the correlation table closest to the value is obtained, and the corresponding illumination setting value corresponding to the approximate illumination setting value is obtained for each of the remaining surface mounting devices. in the substrate production line comprising a plurality of surface mount device comprising that you set the illumination settings of said difference by subtracting from each of the corresponding illumination setting. When the illumination collective control unit sets an illumination setting value corresponding to a specific illumination condition in the surface mounting device at the head of the board production line, the illumination corresponding to each of the second and subsequent surface mounting devices in the correlation table. 2. A substrate production line comprising a plurality of surface mount devices according to claim 1, wherein a lower propagation method is employed in which set values are sequentially retrieved and set to the same illumination condition.   The board production line comprising a plurality of surface mount devices according to claim 1, wherein the illumination condition is illuminance.

Images