WO2016174763A1

WO2016174763A1 - Component inspecting machine and component mounting machine

Info

Publication number: WO2016174763A1
Application number: PCT/JP2015/062970
Authority: WO
Inventors: 一也小谷; 博史大池; 英矢黒田
Original assignee: 富士機械製造株式会社
Priority date: 2015-04-30
Filing date: 2015-04-30
Publication date: 2016-11-03
Also published as: JP6472873B2; JPWO2016174763A1

Abstract

This component mounting machine also serves as a component inspecting machine which inspects the state of arrangement of components mounted on a substrate. The component mounting machine captures, under prescribed imaging conditions, images of specific areas 76 defined inside an arrangement location 70 of a component P on a substrate, calculates the brightness within each specific area 76, from the captured images, and compares the brightnesses with a preset threshold to assess whether or not the component has been arranged within a permissible range in the arrangement location 70. It is thus not necessary to incorporate data used in a conventional substrate external appearance inspecting machine (in other words, component data required to assess discrepancies in the attitude or position of the component) in order to perform the assessment by comparing the brightnesses within the specific areas 76 with the threshold. The external appearance of the substrate can therefore be inspected in a simple manner.

Description

Parts inspection machine and parts placement machine

The present invention relates to a component inspection machine and a component mounting machine.

As a general electronic component mounting line, a solder printer, a printing inspection machine, a component mounting machine, a board appearance inspection machine, and a reflow furnace are arranged in this order. As a board appearance inspection machine, the posture or position deviation of the electronic component is determined using image data obtained by photographing the electronic component on the board. As a method for such determination, a method is known in which a sample image acquired by imaging a reference sample substrate is registered in advance and compared with an inspection image acquired by imaging an inspection substrate to be inspected. (For example, refer to Patent Document 1). In that case, the size, shape, etc. of the electronic component are input to the board appearance inspection machine in advance, and data is created so that the rotation angle (posture) and positional deviation of the electronic component can be understood by comparing the sample image with the inspection image. There is a need.

Japanese Patent Laid-Open No. 2015-1497

By the way, a shield component mounting machine for placing a shield component on a predetermined electronic component on the board may be arranged on the downstream side of the board appearance inspection machine and the upstream side of the reflow furnace in the electronic component mounting line. The shield component is mounted after the appearance of the electronic component is inspected by the board visual inspection machine and it is confirmed that all the electronic components are correctly mounted. In that case, it is necessary to further add a board appearance inspection machine that performs an appearance inspection of whether or not the shield component is correctly mounted on the downstream side of the shield component mounting machine and the upstream side of the reflow furnace.

However, when both a shield component mounting machine and a board appearance inspection machine are added to the electronic component mounting line, there is a problem that the entire line becomes longer and costs increase. If it is possible to provide a shielded component mounting machine with a board appearance inspection function, a shielded component substrate appearance inspection machine is not required, but the above-mentioned data creation is necessary to inspect shielded components. It was necessary and complicated to make, so it was not easy to realize. Therefore, it has been desired to develop a technique for easily performing a substrate appearance inspection.

The present invention has been made to solve these problems, and its main purpose is to easily perform a substrate appearance inspection.

The parts inspection machine of the present invention
A component inspection machine for inspecting the arrangement state of components mounted on a board,
Imaging means for imaging an image of a designated area defined on the inside and / or outside of the location of the component on the board under a predetermined imaging condition;
A determination unit that calculates the brightness of the designated area from the image and compares the brightness with a preset threshold value to determine whether or not the component is placed within an allowable range of the placement location;
It is equipped with.

In this component inspection machine, an image of a designated area defined on the inside and / or outside of a component placement location on a board is taken under a predetermined imaging condition, and the brightness of the designated area is calculated from the image, Is compared with a preset threshold value to determine whether or not the component is placed within the allowable range of the placement location. As described above, since the determination is made by comparing the brightness of the designated area with the threshold value, data used in the conventional board appearance inspection machine (that is, component data necessary to determine the orientation and positional deviation of the component). There is no need to build in. Therefore, the substrate appearance inspection can be easily performed.

Here, as the brightness of the designated area, for example, the average value of the brightness of the designated area can be used. Examples of the brightness index include brightness and luminance.

The parts inspection machine according to the present invention includes: an allowable range input unit that inputs the size of the allowable range; and an area setting unit that sets the designated area according to the allowable range, wherein the area setting unit includes the allowable range You may set so that the position of the said designated area may become near the outline of the said arrangement | positioning place, and / or the magnitude | size of the said designated area may become small, so that the range is small. In this way, the designated area is automatically and appropriately set according to the input allowable range. Incidentally, the closer the position of the designated area is to the outline of the placement location and the smaller the size of the designated area, the more easily the designated area is affected by parts that are not accurately placed at the placement location.

The component inspection machine according to the present invention includes: an allowable range input unit that inputs the size of the allowable range; and a threshold setting unit that sets the threshold according to the allowable range, wherein the threshold setting unit includes the allowable range. The threshold may be set so that the smaller the is, the closer the brightness of the designated area is when the component is accurately placed at the placement location. In this way, the threshold value is automatically and appropriately set according to the allowable range input by the operator. Incidentally, the closer the threshold is to the brightness of the designated area when the component is correctly placed at the placement location, the more the threshold is crossed (or) even if the amount of deviation of the component from the placement location is small.

In the component inspection machine according to the present invention, the component has a polygonal shape when viewed from above, the arrangement location is the same shape as the component, and the designated area includes at least two corner portions of the arrangement location. It may be set inside or outside, or may be set inside at least one corner portion of the arrangement place and outside each of two sides forming the corner portion. In this way, it is possible to accurately determine whether or not the part is arranged within the allowable range of the arrangement place with as few designated areas as possible. Particularly in the latter case, since it is only necessary to image one corner portion of the arrangement location, even if the size of the arrangement location exceeds the visual field range of the imaging means, it is often sufficient to perform one imaging.

The component inspection machine according to the present invention includes an automatic setting unit configured to set the designated area and the threshold based on brightness and coordinates of each pixel of a regular image when the component is accurately arranged at the arrangement location. You may have. This eliminates the need for the operator to set the designated area and threshold value.

The component mounting machine of the present invention is
A component mounting machine that images a mark on the substrate by a mark camera and recognizes coordinates from the captured mark, and picks up the component from a component supply unit by a nozzle and mounts the component on the substrate,
It has one of the parts inspection machines mentioned above,
The mark camera also serves as the imaging means of the component inspection machine,
Is.

Although this component mounting machine includes the above-described component inspection machine, since the mark camera is also used as the imaging means of the component inspection machine, compared with the case where the mark camera and the imaging means are individually provided. The device configuration is simplified and the cost is reduced. Further, as described above, since the component inspection machine can easily perform the board appearance inspection, the function of the component inspection machine can be mounted without imposing a burden on the component mounting machine.

The perspective view of the component mounting machine 10. FIG. An explanatory view showing electrical connection of controller. The perspective view of the reel 60. FIG. The flowchart of an inspection preparation routine. It is explanatory drawing which shows the setting procedure of the designation | designated area 76, (a) is explanatory drawing of the regular arrangement | positioning place 70, (b) is explanatory drawing of the tolerance | permissible_range T, (c) is explanatory drawing of the designation | designated area 76. The flowchart of a component inspection routine. Explanatory drawing of the designation | designated area 176. FIG. Explanatory drawing of the designation | designated area 276. FIG. Explanatory drawing of designation | designated area 376,377. Explanatory drawing of the designation area 76. FIG. Explanatory drawing of the designation | designated area 476. FIG. Explanatory drawing of the designation area 576. FIG.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the component mounting machine 10, FIG. 2 is an explanatory view showing the electrical connection of the controller 38, and FIG. 3 is a perspective view of the reel 60. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

As shown in FIG. 1, the component mounting machine 10 includes a board transfer device 12, a head 18, a nozzle 28, a mark camera 34, a parts camera 36, and a controller 38 (see FIG. 2) that performs various controls. The reel unit 40 is provided.

The substrate transport device 12 transports the substrate S from the left to the right by the conveyor belts 16 and 16 (only one is shown in FIG. 1) attached to the pair of left and

right support plates

14 and 14, respectively.

The head 18 is movable on the XY plane. Specifically, the head 18 moves in the left-right direction as the X-axis slider 20 moves in the left-right direction along the guide rails 22, 22, and the Y-axis slider 24 moves along the guide rails 26, 26. It moves in the front-rear direction as it moves in the front-rear direction.

The nozzle 28 uses pressure to adsorb components to the nozzle tip or release components adsorbed to the nozzle tip. The height of the nozzle 28 is adjusted by a Z-axis motor 30 built in the head 18 and a ball screw 32 extending along the Z-axis.

The mark camera 34 is installed at the lower end of the X-axis slider 20 so that the imaging direction faces the substrate S, and can move as the head 18 moves. The mark camera 34 is equipped with a light source (not shown), and can illuminate the subject to be imaged downward by coaxial incident light or side light. The mark camera 34 images a reference mark for positioning the substrate (not shown) provided on the substrate S, and outputs the obtained image to the controller 38.

The parts camera 36 is installed between the reel unit 40 and the substrate transport apparatus 12 so that the imaging direction is upward at the approximate center of the length in the left-right direction. The parts camera 36 images a part adsorbed by the nozzle 28 passing above, and outputs an image obtained by the imaging to the controller 38.

As shown in FIG. 2, the controller 38 is configured as a microprocessor centered on a CPU 38a, and includes a ROM 38b for storing processing programs, an HDD 38c for storing various data, a RAM 38d used as a work area, and the like. The controller 38 is connected to an input device 38e such as a mouse or a keyboard and a display device 38f such as a liquid crystal display. The controller 38 is connected to the feeder controller 58 and the management computer 80 built in the feeder 50 so as to be capable of bidirectional communication. The controller 38 can output control signals to the substrate transport device 12, the X-axis slider 20, the Y-axis slider 24, the Z-axis motor 30, the pressure adjustment device 28 a for the nozzle 28, the mark camera 34, and the parts camera 36. It is connected. The controller 38 is connected so as to be able to receive images from the mark camera 34 and the parts camera 36. For example, the controller 38 recognizes the position (coordinates) of the substrate S by processing the image of the substrate S captured by the mark camera 34 and recognizing the position of the reference mark. Further, the controller 38 determines whether or not a component is attracted to the nozzle 28 based on an image captured by the parts camera 36, and determines the shape, size, suction position, and the like of the component.

The reel unit 40 includes a device pallet 42 and a feeder 50 as shown in FIG. The device pallet 42 is detachably mounted on the component mounting machine 10 and has a slot 44 on the upper surface. The slot 44 is a groove into which the feeder 50 can be inserted, and a plurality of slots 44 are arranged in the left-right direction. The feeder 50 is inserted into the slot 44. The feeder 50 rotatably holds a reel 60 (see FIG. 3) around which the tape 62 is wound. A plurality of recesses 64 are formed in the tape 62 so as to be arranged along the longitudinal direction of the tape 62. Each recess 64 accommodates a component P. These components P are protected by a film 65 that covers the surface of the tape 62. The feeder 50 has a component suction position. The component suction position is a position determined by design in which the nozzle 28 sucks the component P. Each time the tape 62 is fed backward by a predetermined amount by the feeder 50, the parts P accommodated in the tape 62 are sequentially arranged at the parts suction position. The part P that has reached the part suction position is in a state where the film 65 has been peeled off and is sucked by the nozzle 28.

As shown in FIG. 2, the management computer 80 includes a personal computer main body 82, an input device 84, and a display 86, and can input signals from the input device 84 operated by an operator. An image can be output. Production job data is stored in the memory of the PC main body 82. In the production job data, it is determined which parts P are to be mounted on the substrates S in each component mounting machine 10 and in what order, and how many substrates S are mounted as such.

Next, an operation in which the controller 38 of the component mounting machine 10 mounts the component P on the board S based on the production job will be described. First, the controller 38 sucks the component P supplied from the feeder 50 of the reel unit 40 to the nozzle 28 of the head 18. Specifically, the controller 38 controls the X-axis slider 20 and the Y-axis slider 24 to move the nozzle 28 directly above the component suction position of the desired component P. Next, the controller 38 controls the Z-axis motor 30 and the pressure adjusting device 28 a of the nozzle 28 to lower the nozzle 28 and supply negative pressure to the nozzle 28. As a result, the desired component P is adsorbed to the tip of the nozzle 28. Thereafter, the controller 38 raises the nozzle 28, controls the X-axis slider 20 and the Y-axis slider 24, and moves the nozzle 28 that has attracted the component P at the tip thereof to a position above the substrate S. Then, at the predetermined position, the controller 38 lowers the nozzle 28 and controls the pressure adjusting device 28 a so that atmospheric pressure is supplied to the nozzle 28. Thereby, the component P adsorbed by the nozzle 28 is separated and mounted at a predetermined position on the substrate S. Other components P to be mounted on the substrate S are similarly mounted on the substrate S, and when all the components P have been mounted, the substrate S is sent downstream.

Next, the inspection preparation routine executed by the controller 38 will be described with reference to the flowchart of FIG.

When the start command for the inspection preparation mode is input from the input device 38e, the CPU 38a of the controller 38 reads the inspection preparation program installed in the HDD 38c and starts the inspection preparation routine.

First, the CPU 38a obtains an image (regular image) when the component to be inspected is accurately arranged at a predetermined regular arrangement place on the substrate S (step S110). Here, it is assumed that the regular image is stored in advance in the HDD 38c. However, it is also possible to actually produce a substrate S that is accurately placed at the placement location of the inspection target component, and obtain an image obtained by capturing it with the mark camera 34 as a normal image.

Next, the CPU 38a acquires the allowable range of the placement of the inspection target component (step S120). Specifically, the CPU 38a acquires data regarding the allowable range input by the operator using the input device 38e.

Next, the CPU 38a sets a designated area and a brightness threshold (step S130). Specifically, the CPU 38a recognizes the coordinates of the regular placement location based on the regular image, and sets the designated area and the brightness threshold based on the placement location and the allowable range. In the regular image, the color of the substrate S and the color of the component to be inspected are determined in advance so that the pixels of the inspection target component and the other pixels can be distinguished by brightness (for example, luminance or brightness gradation value). . For example, the component to be inspected is designed to appear whitish when exposed to light, and the substrate S is designed to appear dark even when exposed to light. When the brightness is expressed by a gray scale of 256 gradations, when comparing a designated area that is completely covered with parts and a designated area that is not covered at all, the gradation value of the brightness when light is applied is The former is a value close to 255, and the latter is a value close to 0. The CPU 38a recognizes an area composed of the pixels of the inspection target part in the regular image as an arrangement place of the part, and stores the coordinates in the RAM 38d or the HDD 38c. Further, the CPU 38a determines the coordinates of the designated area and the brightness threshold so that even if the actually placed component is displaced from the placement location, the placement state is determined to be good if the deviation is within an allowable range. Is stored in the RAM 38d or the HDD 38c. And CPU38a complete | finishes a test | inspection preparation routine, after performing the process of step S130.

For example, it is assumed that the shape of the arrangement place 70 viewed from above is a quadrangle as shown in FIG. Further, it is assumed that the allowable range T is a range (shaded portion) between the inner frame 72 and the outer frame 74 as shown in FIG. The allowable range T is a range in which the arrangement state of the component P is considered good if the outline of the component P is within this range. In such a case, as shown in FIG. 5C, for example, the designated area 76 may be a small quadrilateral inscribed in each of the four corners of the arrangement place 70. Here, the length of one side of the designated area 76 is the same as the distance d between the inner frame 72 and the outer frame 74. FIG. 5C also shows a state where the part P (rectangular with hatching) slightly protrudes the allowable range T. At this time, if the exposed area of all the designated areas 76 (the area of the portion not covered with the part P) is 3/4 or less, the exposed area of at least one designated area 76 exceeds 3/4 within the allowable range. This is outside the allowable range. Therefore, the brightness threshold of the designated area 76 is the brightness of the designated area 76 when the exposed area of the designated area 76 is 3/4. Note that the brightness of the designated area 76 is the average value of the brightness of the pixels existing in the designated area 76.

Next, a component inspection routine executed by the controller 38 will be described with reference to the flowchart of FIG. In the following description, for the sake of convenience, the component to be inspected will be described as being one component among a plurality of components mounted on the substrate S.

When the start command for the component inspection mode is input from the input device 38e, the CPU 38a of the controller 38 reads the component inspection program installed in the HDD 38c and starts the component inspection routine. Even if the start command for the component inspection mode is not input, the component inspection routine may be automatically started after the mounting of the component P on the board S is completed.

First, the CPU 38a moves the mark camera 34 to the designated area 76 on the substrate S (step S210). Specifically, the CPU 38a controls the X-axis slider 20 and the Y-axis slider 24 so that the mark camera 34 is positioned above one of the designated areas 76 for the inspection target part.

Next, the CPU 38a images the designated area 76 under predetermined imaging conditions (step S220). The predetermined imaging condition is the same as the imaging condition when a regular image is captured. As the imaging conditions, for example, illumination conditions are determined. As the illumination condition, it is determined whether light from a light source (not shown) built in the mark camera 34 is illuminated by coaxial epi-illumination, side-illumination, or both.

Next, the CPU 38a determines whether or not the brightness of the designated area 76 is equal to or greater than a threshold value (step S230). As described above, the brightness threshold of the designated area 76 is set to the brightness of the designated area 76 when the exposure area of the designated area 76 is 3/4. When the brightness of the designated area 76 is greater than or equal to this threshold value, 1/4 or more of the designated area 76 is covered with the inspection target component, so that the inspection target component is within the allowable range even if it is displaced from the placement location 70. It is within T. On the other hand, when the brightness of the designated area 76 is less than this threshold value, 3/4 or more of the designated area 76 is not covered with the inspection target part, so that the inspection target part has an allowable range T from the arrangement location 70. It will be shifted beyond. Therefore, if the brightness of the designated area 76 is less than the threshold value in step S230, the CPU 38a displays on the display device 38f that the inspection result of the inspection target component is defective (step S240), and ends this routine. To do.

On the other hand, if the brightness of the designated area 76 is equal to or greater than the threshold value in step S230, the CPU 38a determines whether or not the brightness judgment has been performed for all the designated areas 76 defined for the part to be inspected (step S230). S250) If the unexecuted designated area 76 remains, the process returns to step S210, and the process for the unimplemented designated area 76 is executed. On the other hand, if the brightness determination is performed for all the designated areas 76 in step S250, the inspection target component is arranged within the allowable range T of the arrangement place 70. Therefore, the CPU 38a displays on the display device 38f that the inspection result of the inspection target part is good (step S260), and ends this routine. Note that the test result may be output as a sound through a speaker instead of or in addition to the display on the display device 38f.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The component mounting machine 10 of the present embodiment corresponds to a device having the function of the component inspection machine of the present invention. In addition, the mark camera 34 of the present embodiment corresponds to the imaging unit of the present invention, the CPU 38a corresponds to the determination unit, the area setting unit, the threshold setting unit, and the automatic setting unit, and the input device 38e corresponds to the allowable range input unit. .

According to the component mounting machine 10 of the present embodiment described in detail above, the brightness of the designated area 76 is compared with the threshold value when inspecting whether or not the inspection target component is arranged within the allowable range T of the arrangement location 70. Therefore, it is not necessary to create data used in a conventional board appearance inspection machine (that is, component data necessary to determine the posture and positional deviation of the component). Therefore, the substrate appearance inspection can be easily performed.

In addition, the component mounting machine 10 automatically sets the designated area 76 and the threshold value based on the brightness and coordinates of each pixel of the regular image when the inspection target component is accurately placed at the placement location 70. There is no need for the operator to set the area 76 and the threshold value.

Furthermore, although the component mounting machine 10 has the function of the component inspection machine of the present invention, since the mark camera 34 is also used as the image pickup means of the component inspection machine, the mark camera 34 and the image pickup means are individually provided. Compared with the case where it is doing, an apparatus structure becomes simple and cost is also reduced. In addition, since the board appearance inspection can be easily performed as described above, the function of the component inspection machine can be mounted without imposing a burden on the component mounting machine 10.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

In the above-described embodiment, when the arrangement place 70 and the allowable range T are set as shown in FIG. 5B, the method of setting the designated area 76 and the brightness threshold will be described with reference to FIG. However, the setting method is not limited to the method of the above-described embodiment. For example, as shown in FIG. 7, the designated area 176 may be a small rectangle that is inscribed in the four corners of the inner frame 72. FIG. 7 also shows a state in which the part P (square with hatching) slightly deviates from the allowable range T. At this time, if the exposure area of all the designated areas 176 is zero, it is within the allowable range, and if the exposure area of at least one designated area 176 exceeds zero, it is outside the allowable range. Therefore, the brightness threshold of the designated area 176 is the brightness of the designated area 176 when the exposure area of the designated area 76 is zero. Even if it does in this way, the effect similar to embodiment mentioned above is acquired. In the example of FIG. 7, the length of one side of the designated area 176 may be set in any way.

In the embodiment described above, the case where the designated area 76 is set inside the four corners of the placement location 70 has been described. However, for example, as shown in FIG. 8, the corner of the outer frame 74 is formed outside the placement location 70. You may set the L-shaped designation | designated area 276 which touches 2 sides. In that case, if the exposure area of all the designated areas 276 is 100%, it is within the allowable range, and if the exposure area of at least one designated area 276 is less than 100%, it is out of the allowable range. Therefore, the brightness threshold of the designated area 276 is the brightness of the designated area 276 when the exposure area is 100%. Even if it does in this way, the effect similar to embodiment mentioned above is acquired. FIG. 8 also shows the state when the component P slightly deviates from the allowable range T.

In the embodiment described above, as shown in FIG. 5C, the designated areas 76 are provided at the four corners of the square-shaped arrangement place 70. However, the designated areas 76 are provided at least at the two diagonal positions. Just do it. Even if it does in this way, the effect similar to embodiment mentioned above is acquired. In addition, the inspection can be accurately performed with as few designated areas 76 as possible. Further, since the number of designated areas 76 is reduced, the number of times of repeating steps S210 to S230 is reduced, and the time required for the component inspection routine is reduced. This also applies to the designated

areas

176 and 276 in FIG. 7 and FIG.

In the embodiment described above, the case where the designated area 76 is set inside the four corners of the placement location 70 has been described. However, for example, as shown in FIG. You may set inside and outside. Specifically, one designated area (inner designated area) 376 is set so as to be inscribed in the corner of the inner frame 72, and the designated area (outer designated area) is circumscribed on the two sides of the corner of the outer frame 74. ) Set 377 one by one. In that case, if the exposed area of the inner designated area 376 is zero and the exposed areas of the two outer designated areas 377 are 100%, it is within the allowable range, the exposed area of the inner designated area 376 is greater than zero, or two outer designated areas. If the exposed area of at least one of the areas 377 is less than 100%, it is out of the allowable range. Therefore, the brightness threshold is the brightness when the exposed area is zero for the inner designated area 376, and the brightness when the exposed area is 100% for the outer designated area 377. Even if it does in this way, the effect similar to embodiment mentioned above is acquired. In addition, the inspection can be performed with high accuracy in as few designated

areas

376 and 377 as possible. Furthermore, since all the designated

areas

376 and 377 are imaged only by imaging one corner of the arrangement location 70, even if the size of the arrangement location 70 exceeds the visual field range of the mark camera 34, one imaging is performed. Can be inspected. FIG. 9 also shows the state when the component P slightly deviates from the allowable range T.

Note that there are many ways to determine the designated area and threshold value in the case of the allowable range T (distance d) other than FIG. 5 and FIGS.

The component mounting machine 10 according to the above-described embodiment may be adopted as one of the devices constituting the electronic component mounting line. Here, it is assumed that the electronic component mounting line includes a solder printer, a printing inspection machine, a component mounting machine, a board appearance inspection machine, a shield component mounting machine, and a reflow furnace arranged in this order. The shield component mounting machine is a device for placing a shield component on a predetermined electronic component on a substrate. The shield component is mounted after the appearance inspection of the electronic component is performed by the substrate appearance inspection machine and it is confirmed that all the electronic components are correctly mounted on the substrate. Although it is necessary to inspect the shield component for proper mounting, if the component mounting machine 10 described above is adopted as the shield component mounting machine, the appearance inspection can also be performed by the shield component mounting machine. As a result, there is no need to add an appearance inspection machine for shield parts, the entire line can be prevented from becoming long, and the cost can be avoided.

In the embodiment described above, the case where the allowable range T is set for the arrangement place 70 has been described. However, when the allowable range T is larger than that in FIG. 5B (for example, between the inner frame 172 and the outer frame 174). When the distance d between them is double), the designated area and the brightness threshold value may be set as in the following three examples, for example.

In the first example, as shown in FIG. 10, the position and size of the designated area 76 remain the same as in the above-described embodiment, and the threshold value is changed. In this example, if the exposure area of all the designated areas 76 is less than 100%, it is within the allowable range, and if the exposed area of at least one designated area 76 is 100% or more, it is out of the allowable range. Therefore, the brightness threshold of the designated area 76 is the brightness of the designated area 76 when the exposed area is 100%. Comparing the case where the allowable range T is small (see FIG. 5B) and the case where the allowable range T is large (see FIG. 10), the smaller the allowable range T, the more accurately the inspection target component is arranged at the arrangement location 70. In this case, the threshold value is set so as to approach the brightness of the designated area 76. If the position and size of the designated area 76 are the same, the closer the threshold is to the brightness of the designated area 76 when the component P is accurately placed at the placement location 70, the smaller the amount of deviation of the component from the placement location 70 is. In this case, the allowable range T becomes small. FIG. 10 also shows the state when the component P slightly deviates from the allowable range T.

In the second example, as shown in FIG. 11, the brightness threshold is the same as that in the above-described embodiment, and the length of one side is increased while the designated area 476 is inscribed in the four corners of the arrangement place 70. This is an example. Specifically, the length of one side of the designated area 476 is set to the distance 2d between the inner frame 172 and the outer frame 174 within the allowable range T. In that case, if the exposure area of all the designated areas 476 is less than 3/4, it is within the allowable range, and if the exposure area of at least one designated area 476 is 3/4 or more, it is out of the allowable range. Therefore, the brightness threshold is the brightness of the designated area 476 when the exposure area is 3/4. When the allowable range T is small (see FIG. 5B) and the allowable range T is large (see FIG. 11), the smaller the allowable range T, the smaller the designated area is set. When the brightness threshold is the same, the smaller the designated area is, the more easily the designated area is affected by parts that are not accurately placed at the placement location 70, and the allowable range T becomes smaller. FIG. 11 also shows the state when the component P slightly deviates from the allowable range T.

In the third example, as shown in FIG. 12, the brightness threshold and the size of the designated area 576 are the same as those in the above-described embodiment, and the position of the designated area 576 is set inside the arrangement place 70. is there. Specifically, the designated area 576 is set so that the center of the designated area 576 coincides with the corner of the inner frame 172. In this case, if the exposure area of all the designated areas 576 is less than 3/4, it is within the allowable range, and if the exposure area of at least one designated area 576 is 3/4 or more, it is out of the allowable range. Therefore, the brightness threshold is the brightness of the designated area 576 when the exposure area is 3/4. If the allowable range T is small (see FIG. 5B) and the allowable range T is large (see FIG. 12), the smaller the allowable range T, the more the position of the designated area becomes the outline of the arrangement place 70. It is set to be close. When the brightness threshold is the same, the closer the position of the designated area is to the outline of the placement location 70, the more easily the designated area is affected by parts that are not correctly placed at the placement location 70, and the allowable range T becomes smaller. FIG. 12 also shows the state when the component P slightly deviates from the allowable range T.

As can be seen from the examples of FIG. 5 and FIGS. 10 to 12, the designated area and threshold value are automatically and appropriately set according to the allowable range T. Note that there are many methods other than FIGS. 10 to 12 for determining the designated area and threshold value in the case of the allowable range T (distance 2d).

In the above-described embodiment, the component mounting machine 10 executes the inspection preparation routine and the component inspection routine. However, the component inspection machine that does not have the component mounting function is at least the component inspection routine of the inspection preparation routine and the component inspection routine. May be executed.

In the above-described embodiment, the component mounting machine 10 executes the inspection preparation routine to automatically set the placement location and designated area of the component. However, at least one of the placement location and designated area is not automatically set and is input by the operator. It may be input by the device 38e or acquired from an external memory or the like.

In the above-described embodiment, the component to be inspected is described as one component on the substrate S, but may be all of a plurality of components mounted on the substrate S. In that case, an inspection preparation routine or a part inspection routine may be executed for each of the plurality of parts.

In the above-described embodiment, when imaging the plurality of designated areas 76 of the inspection target component, the mark camera 34 is moved to an upper position of each designated area 76, and the imaging is performed. If all of them are entered, the brightness of each designated area 76 may be determined (step S230) with a single captured image.

In the embodiment described above, the allowable range is input by the operator using the input device 38e, but data stored in advance in the HDD 38c or the like may be acquired.

The present invention can be used for a component inspection machine for inspecting the arrangement state of components mounted on a board.

10 component mounting machine, 12 substrate transfer device, 14 support plate, 16 conveyor belt, 18 head, 20 X axis slider, 22 guide rail, 24 Y axis slider, 26 guide rail, 28 nozzle, 28a pressure adjusting device, 30 Z axis Motor, 32 ball screw, 34 mark camera, 36 parts camera, 38 controller, 38a CPU, 38b ROM, 38c HDD, 38d RAM, 38e input device, 38f display device, 40 reel unit, 42 device palette, 44 slots, 50 feeder, 58 feeder controller, 60 reels, 62 tapes, 64 recesses, 65 films, 70 locations, 72 inner frames, 74 outer frames, 76 designated areas, 80 management computers, 82 PCs, 8 Input device, 86 display, 172 within frame 174 outer frame, 176 the specified area 276 designated area, 376 inside the specified area 377 outside the specified area 476 designated area, 576 designated area.

Claims

A component inspection machine for inspecting the arrangement state of components mounted on a board,
Imaging means for imaging an image of a designated area defined on the inside and / or outside of the location of the component on the board under a predetermined imaging condition;
Determining means for calculating the brightness of the designated area from the image, comparing the brightness with a preset threshold value, and determining whether or not the component is arranged within an allowable range of the arrangement location;
Parts inspection machine equipped with.
The parts inspection machine according to claim 1,
An allowable range input means for inputting the size of the allowable range;
Area setting means for setting the designated area according to the allowable range;
With
The area setting means sets the position of the designated area to be closer to the outline of the placement location and / or the size of the designated area is smaller as the allowable range is smaller.
Parts inspection machine.
The parts inspection machine according to claim 1,
An allowable range input means for inputting the size of the allowable range;
Threshold setting means for setting the threshold according to the allowable range;
With
The threshold value setting means sets the threshold value so that the smaller the allowable range is, the closer the brightness of the designated area is when the component is accurately placed at the placement location,
Parts inspection machine.
The part has a polygonal shape when viewed from above,
The placement location is the same shape as the part,
The designated area is set inside or outside at least two corner portions of the placement location, or inside the at least one corner portion of the placement location and outside each of the two sides forming the corner portion. Set,
The parts inspection machine according to any one of claims 1 to 3.
The parts inspection machine according to any one of claims 1 to 4,
A component inspection machine comprising: automatic setting means for setting the designated area and the threshold based on brightness and coordinates of each pixel of a regular image when the component is accurately arranged at the arrangement location.
A component mounting machine that images a mark on the substrate by a mark camera and recognizes coordinates from the captured mark, and picks up the component from a component supply unit by a nozzle and mounts the component on the substrate,
A component inspection machine according to any one of claims 1 to 5,
The mark camera also serves as the imaging means of the component inspection machine,
Component mounting machine.