JPH06204700A - Chip component mount inspecting apparatus - Google Patents

Abstract

PURPOSE:To provide a chip component mount inspecting apparatus in which presence/absence of a component is effectively detected without overdetection and a component position can be rapidly inspected with suitable accuracy. CONSTITUTION:The chip component mount inspecting apparatus comprises a color imaging unit 14, a color converter 16 for converting color image data to lightness, hue and saturation, and a color extractor 17 for extracting only colors of position where color distribution preset for body colors of a chip component 15 to be inspected exists. Further, the apparatus comprises a presence/absence deciding unit 18 for deciding presence/absence of the component from the present position of the color distribution, a land position-shape confirming unit 26, an electrode intersection detector 27 for retrieving an intersection of an outer peripheral edge and an electrode of the component along the outer peripheral edge of the land, and a deciding unit 21 for retrieving overhang of the electrode overhanging the intersection from the land and deciding propriety of a mounting deviation according to the retrieved extension.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting inspection device for inspecting the mounting state of chip components.

[0002]

2. Description of the Related Art In recent years, mounting parts have been miniaturized, and ultra-fine angle chip parts and fine pitch IC parts have been mounted on substrates. When inspecting the mounting state of these components, the limit that can be inspected by human visual inspection has been reached, and the need for a chip component mounting inspection device that is well suited for these inspections is extremely high.

The conventional chip component mounting inspection apparatus detects an edge position of an electrode portion of a chip component to be inspected from an image pickup portion for picking up a gray image of a mounted mounting substrate to be inspected and edge position detection from the gray image data. Section, the presence / absence determination section for comparing the detected edge position with a reference edge position to determine the presence / absence of a chip part to be inspected, and calculating the mounting deviation amount of the chip part to be inspected from the detected edge position. The mounting deviation amount calculation unit that performs the above-described operation, and the determination unit that performs the quality determination by comparing the preset mounting deviation amount allowable value with the calculated mounting deviation amount.

FIG. 6 is a schematic diagram showing the inspection algorithm of the above-described conventional example using a part of the grayscale image obtained by imaging the mounted inspection target mounting board, and printing on the inspection target mounting board. A grayscale image of a state in which the electrode portion 2 of the chip component 1 is mounted on the cream solder 3 thus formed is shown. 4 is a scanning line in the longitudinal direction of the chip component 1, and 12 is a grayscale distribution diagram on the scanning line 4. Reference numeral 5 is a scanning line in the short direction of the chip component 1, and 13 is a grayscale distribution diagram on the scanning line 5. 6, 7 and 8, 9, 10, and 11 are the edge positions of the grayscale distribution maps 12 and 13, respectively.

In order to determine the presence or absence of each chip component to be inspected, in FIG. 6, first, the edge position detecting section detects the edge positions 6 and 7 of the electrode section 2 on the scanning line 4. Next, the presence / absence determining unit determines that “there is a component” when both the edge positions 6 and 7 are detected, and indicates “there is no component” when both of the edge positions 6 and 7 or one of them is not detected.
If the distance between the edge positions 6 and 7 is different from the component size, it is determined to be "component size difference".

Further, the edge position detecting section detects the edge positions 8 and 9 of the electrode section 2 on the scanning line 5 and 1 for the scanning line 5 as well.
0 and 11 are detected. Next, the presence / absence determining unit determines that “there is a component” when both the edge positions 8 and 9 and both of the edge positions 10 and 11 are detected, and when any of the edge positions 8, 9, 10, and 11 is not detected. Judges that there are no parts.

Further, in order to inspect the mounting deviation of each inspection target chip component, the mounting deviation amount calculation unit calculates the mounting deviation amount by comparing each edge position with the reference position, and the determination unit
A pass / fail judgment is performed by comparing the preset mounting deviation amount allowable value with the calculated mounting deviation amount.

[0008]

However, in the structure of the above-mentioned conventional example, in the grayscale image picked up by the image pickup section, the land which is the background of the electrode section of the chip component is oxidized,
When the electrode part itself of the chip component is oxidized, a lot of noise is included in the grayscale distributions 12 and 13 in FIG. 6 due to the influence of the color change and the change of the light reflection state due to the oxidation. However, there is a problem in that an accurate edge position of the electrode portion cannot be detected, and there is an over-detection of detecting "no component" even though there is a component.

Further, in the conventional example, since a large number of edge positions of the electrode portion are used for calculating the mounting deviation amount, there is a problem that it takes time to detect and calculate a large number of edge positions.

It should be noted that the electrodes of the electronic components mounted on the solder-printed board move to some extent by the self-alignment phenomenon when the printed solder melts, so that the edge position of the electrode portion may be detected by It is not necessary to have a higher precision than the limit.

The present invention solves the above problems, maintains the required accuracy, and reliably detects the presence or absence of a component without excessive detection,
An object of the present invention is to provide a chip component mounting inspection device that can inspect a component position quickly with appropriate accuracy.

[0012]

In order to solve the above-mentioned problems, a chip component mounting inspection apparatus according to the first invention of the present application processes image data to perform a chip component mounting inspection. A color image pickup unit for picking up an image of the target mounting board and outputting color image data; and a color image data converting unit for converting the three primary color image data of the inspection target mounting board into image data of lightness, hue, and saturation.
A color extraction unit that extracts only the color at the position where each color distribution preset for each body color of each mounted inspection target chip component is compared, and the existence position of each color distribution is compared with a reference position to Presence / absence determining unit that determines the presence or absence of an inspection target chip component, an edge position detection unit that detects the edge position of the electrode portion of each inspection target chip component from the brightness image data, and the detected edge position as a reference position. Judgment to perform pass / fail judgment by comparing the mounting deviation amount calculation unit that calculates the mounting deviation amount of each inspection target chip component by comparison with the preset mounting deviation amount allowable value and the calculated mounting deviation amount And a part.

In order to solve the above-mentioned problems, the chip component mounting inspection device of the second invention of the present application images the mounting target inspection board in the chip component mounting inspection device which processes image data and performs chip component mounting inspection. And a color image pickup unit for outputting color image data, and the inspection target mounting board
A color image data conversion unit that converts primary color image data into image data of lightness, hue, and saturation, and the color at the position where each color distribution preset for each body color of each mounted inspection target chip component exists. A color extraction unit that extracts only the presence / absence determination unit that compares the existing position of each color distribution with a reference position to determine the presence or absence of each of the inspection target chip parts; and compares the brightness image data with the reference position / shape. And a land position / shape confirmation unit for confirming the position and shape of each land of the inspection target mounting board, and an intersection of the outer peripheral edge of each confirmed land and the electrode portion of each inspection target chip component. The electrode crossing point detection unit to be searched, and the amount of protrusion of the electrode portion protruding from the intersection with respect to the land is searched, and the retrieved amount of protrusion is compared with a preset allowable amount of protrusion amount. And having a determining unit that performs quality determination of the mounting deviation amount.

[0014]

In the chip component mounting inspection, in the conventional example in which the edge position of the component electrode portion is detected by a grayscale image in order to determine the presence or absence of the mounted chip component, the electrode portion and the land in the background are made of metal. Therefore, there is a problem that it is easily affected by oxidation and an error is easily generated in edge position detection due to oxidation, but it is difficult to detect the position of the component using the color distribution of the component body that is not easily affected by oxidation. In this case, the adverse effect of oxidation can be prevented.

According to the first aspect of the present invention, in order to prevent the adverse effect of oxidation as described above, the color image pickup section picks up an image of the mounting board to be inspected and outputs color image data, and the color image data converting section makes the mounting board to be inspected. 3 primary color image data is converted into image data of lightness, hue and saturation, and the color at the position where each color distribution preset for each body color of each chip component to be inspected in which the color extraction unit is mounted exists The presence / absence determining unit compares the existing position of each color distribution with a reference position to determine the presence / absence of each of the inspection target chip components.

Further, in the inspection of the mounting displacement amount of each inspection target chip component, the lightness image data of the three primary color image data is used after determining the presence or absence of each inspection target chip component as described above. For example, the mounting deviation amount can be inspected in the same manner as the conventional example. Therefore, in the first invention of the present application, after the presence / absence determining unit compares the existence position of each of the color distributions with a reference position to determine the presence / absence of each of the inspection target chip components, the edge position detecting unit determines the presence / absence from the brightness image data. The edge position of the electrode portion of the inspection target chip component is detected, the mounting deviation amount calculation unit calculates the mounting deviation amount of each of the inspection target chip components by comparing the detected edge position with a reference position, and the determination unit The acceptability determination is performed by comparing the preset mounting deviation amount allowable value with the calculated mounting deviation amount.

The second invention of the present application has the same configuration and operation as the first invention of the present application until the presence / absence of the mounted chip component is determined, but the inspection of the mounting deviation amount of each of the inspection target chip components is performed. Has done the following for quick inspection.

As described above, the electrode of the electronic component mounted on the solder-printed substrate moves a little due to the self-alignment phenomenon when the printed solder melts, so that the mounting deviation amount of the electrode portion is detected. Does not require high precision above a certain limit. Therefore, in the detection of the mounting deviation amount of the second invention of the present application, the conventional example calculates the position of the electrode portion from a large number of edge positions of the electrode portion by directly measuring the positional relationship between the land and the electrode, and the calculated position The complicated calculation of inspecting by comparing with the reference position is eliminated.

That is, in the inspection of the mounting deviation amount of each inspection target chip component in the second invention of the present application, first, the land position / shape confirmation unit compares the lightness image data with the reference position / shape to mount the inspection target. Check the position and shape of each land on the board, set the search route along the outer edge of each land,
The electrode intersection point detection unit searches along the above-described confirmed outer peripheral edge search route of each land to detect the intersection point between the outer peripheral edge of the land and the electrode portion of each of the chip components to be inspected, The protrusion amount of the electrode portion on the side protruding from the land is used as a starting point, and the determination unit searches the protrusion amount of the electrode portion protruding from the intersection with respect to the land, and the retrieved protrusion amount and the preset amount are set in advance. The quality of the mounting deviation amount is judged by comparing it with the protrusion amount allowable value.

With this configuration, when a large number of ultra-fine angle chip components and fine-pitch IC components are mounted on the substrate, the edge position of each electrode of these components is detected and the mounting deviation amount is calculated. Since the complicated process of performing is unnecessary, the inspection time can be shortened.

[0021]

[Embodiment] 1 of chip component mounting inspection apparatus of the first invention of the present application
An embodiment will be described with reference to FIGS.

FIG. 1 is a block diagram showing the configuration of this embodiment. A color camera 14 takes a color image of a chip part 15 to be inspected on a printed circuit board, and the color image information is
The A / D-converted three-primary color image data is converted into color conversion unit 1
In step 6, it is converted into image data of lightness, hue and saturation. The color extracting unit 17 extracts only the color at the position where each preset color distribution of each body color of each mounted inspection target chip component exists.

The presence / absence determining unit 18 compares the existing position of each color distribution with a reference position to determine the presence / absence of each of the chip components to be inspected. The edge position detection unit 19 detects the edge position of the electrode portion of each inspection target chip component from the brightness image data. The mounting deviation amount calculation unit 20 compares the detected edge position with a reference position to calculate the mounting deviation amount of each inspection target chip component. The determining unit 21 compares the preset mounting deviation amount allowable value with the calculated mounting deviation amount to make a pass / fail judgment. Inspection result display unit 22
Displays the inspection result.

The operation of this embodiment will be described with reference to FIGS.

In the inspection for the presence / absence of the inspection target chip component 15, the color camera 14 images the inspection target mounting board on which the inspection target chip component 15 is mounted, and the color image information is A / D converted to obtain three primary color image. As data, the color conversion unit 16 converts the three primary color image data of the inspection target mounting board into image data of lightness, hue, and saturation, and the color extraction unit 17 mounts each inspection target as shown in FIG. For each body color 23 of the chip component 15, only the color at the position where each preset color distribution exists is extracted, and the presence / absence determination unit 1
Reference numeral 8 compares the existing position of each color distribution with a reference position to determine the presence or absence of each of the inspection target chip components 15.

In the inspection of the mounting deviation amount of each inspection target chip component, after the presence or absence of each inspection target chip component 15 is determined as described above, the edge position detection unit 19 determines each of the above from the brightness image data. Detecting the edge positions 24 and 25 of the electrode part 2 of the inspection target chip component 15, the mounting displacement amount calculation unit 20 compares the detected edge position with a reference position, and mounts the mounting displacement amount of each inspection target chip component 15. Is calculated, the determination unit 21 compares the preset mounting deviation amount allowable value with the calculated mounting deviation amount to determine whether the mounting deviation amount is good or bad, and the inspection result display unit 22 displays the inspection result. .

Next, one embodiment of the chip component mounting inspection device of the second invention of the present application will be described with reference to FIGS.

FIG. 3 is a block diagram showing the configuration of this embodiment, in which the color camera 14 takes a color image of the chip component 15 to be inspected on the printed circuit board, and the color image information thereof is
The A / D-converted three-primary color image data is converted into color conversion unit 1
In step 6, it is converted into image data of lightness, hue and saturation. The color extraction unit 17 extracts only the color at the position where each preset color distribution exists for each body color of each mounted inspection target chip component, and the presence / absence determination unit 18 determines the existence position of each color distribution. The presence or absence of each of the above-described chip parts to be inspected is determined by comparing with the reference position.

The process up to the presence / absence determination is similar to that of the first invention of the present application, but the configuration and operation of the mounting deviation amount inspection of the chip component to be inspected are different from those of the first invention of the present application, and are as follows.

That is, in the inspection of the mounting deviation amount of the inspection target chip component of the second invention of the present application, in FIG.
The shape confirmation unit 26 compares the lightness image data with a reference position / shape to confirm the position and shape of each land of the mounting board to be inspected.

The electrode intersection detection unit 27 detects the intersection between the confirmed outer peripheral edge of each land and the electrode portion of each inspection target chip component.

The determination unit 21 searches for the amount of protrusion of the electrode portion on the side protruding from the intersection with respect to the land, and compares the retrieved amount of protrusion with a preset allowable amount of protrusion amount. The quality of the mounting deviation amount is determined.

Next, the operation of this embodiment will be described with reference to FIGS.

The process up to the presence / absence determination is the same as that of the first invention of the present application, and therefore its explanation is omitted.

In the inspection of the mounting deviation amount of the chip component to be inspected, the land position / shape confirmation unit 26 compares the existing position of each color distribution with the reference position / shape to compare the position of each land of the substrate to be inspected. And the shape, and set a search route along the outer peripheral edge of each land. In this embodiment, as shown in FIGS. 4 and 5, the circumscribed quadrangle 30 of the land 29 corresponds to the edge 3 of the chip component 15 to be inspected.
Edge, that is, search start position 28 to search end position 34
Is used as the search route. This search route 28-34
Exists on the opposite edge of the chip component 15 to be inspected, so that the land 29 and the electrode portion 31 are searched by searching for the three sides at both edges.
The position relationship with can be defined.

When the electrode intersection detection unit 27 searches the above-mentioned search routes 28 to 34 and there is no deviation amount between the land 29 and the electrode unit 31, there is no intersection point and there is an deviation amount as shown in FIG. For example, there is an intersection 32 as shown in FIG.

The judging section 21 makes an intersection 3 with the land 29.
The amount of protrusion 33 of the electrode portion 31 on the side protruding from 2
Is searched, and the retrieved protrusion amount 33 is compared with a preset protrusion amount allowable value to determine whether the mounting deviation amount is good or bad.

The chip component mounting inspection device of the present invention is not limited to the above-described embodiment, but various modes are possible. For example, as for the search route, in the embodiment, since the chip component to be inspected is rectangular and the electrode part is square, the search route is preferably rectangular.
The shape of this search route can be freely designed according to the shape of the land or electrode.

[0039]

According to the chip component mounting inspection apparatus of the first invention of the present application, in the conventional chip component mounting inspection apparatus, the presence or absence of the inspection target chip component is detected, and the edge position of the electrode portion of the inspection target chip component is detected. Since it is inspected by doing, the edge position cannot be detected due to the adverse effect of the oxidation of the electrodes and lands made of metal, and the parts actually mounted are
Although there is a problem of over-detecting that there is no component, the presence or absence of the inspection target chip component is determined by extracting the color distribution of the body color that is not related to the oxidation of the inspection target chip component. The effect of not being adversely affected by oxidation is exerted.

The chip component mounting inspection apparatus of the second invention of the present application achieves the above effects of the chip component mounting inspection apparatus of the first invention of the present application, and in the conventional chip component mounting inspection apparatus, the mounting deviation of the chip component to be inspected. Since the quantity inspection is performed by detecting the edge position of the electrode portion of the inspection target chip component, a large number of ultra-fine angle chip components and fine pitch I
One of C parts, if mounted on the board 1
While the complicated process of detecting the edge position of one electrode and calculating the mounting displacement amount is required, the outer peripheral edge of the land and the electrodes of each of the chip components to be inspected along the outer peripheral edge of the land. Since the intersection of the electrode and the land is searched and the protruding amount of the electrode portion on the side protruding from the intersection is searched, the processing is simplified and the inspection can be speeded up. Play.

[Brief description of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the first invention of the present application.

2 is an operation diagram of FIG. 1. FIG.

FIG. 3 is a block diagram showing the configuration of an embodiment of the second invention of the present application.

FIG. 4 is an operation diagram of FIG.

5 is an operation diagram of FIG. 3. FIG.

FIG. 6 is a schematic view showing a conventional inspection algorithm.

[Explanation of symbols]

 14 Color Camera (Color Imaging Section) 15 Chip Component to be Inspected 16 Color Conversion Section (Color Image Data Conversion Section) 17 Color Extraction Section 18 Presence / Absence Determination Section 19 Edge Position Detection Section 20 Mounting Deviation Detection Section 21 Determination Section 23 Body Color 24 , 25 Edge position 26 Land position / shape confirmation unit 27 Electrode intersection detection unit

Claims (2)

[Claims] 1. A chip component mounting inspection apparatus for processing image data to perform a chip component mounting inspection, a color image pickup unit for capturing an image of a mounting substrate to be inspected and outputting color image data, and a mounting substrate to be inspected. A color image data conversion unit that converts primary color image data into image data of lightness, hue, and saturation, and the color at the position where each color distribution preset for each body color of each mounted inspection target chip component exists. A color extraction unit that extracts only the presence / absence determination unit that compares the existence position of each color distribution with a reference position to determine the presence or absence of each of the inspection target chip components, and the each of the inspection target chip components from the brightness image data. An edge position detection unit that detects the edge position of the electrode unit, and compares the detected edge position with a reference position to calculate the mounting deviation amount of each of the chip components to be inspected. 2. A chip component mounting inspection device, comprising: a mounting deviation amount calculating unit; and a determining unit that compares a preset mounting deviation amount allowable value with the calculated mounting deviation amount to determine pass / fail. 2. A chip component mounting inspection apparatus for processing image data to perform a chip component mounting inspection, a color image pickup unit for capturing an image of a mounting substrate to be inspected and outputting color image data, and 3 of the inspection target mounting substrate. A color image data conversion unit that converts primary color image data into image data of lightness, hue, and saturation, and the color at the position where each color distribution preset for each body color of each mounted inspection target chip component exists. A color extraction unit that extracts only the presence / absence determination unit that compares the existing position of each color distribution with a reference position to determine the presence or absence of each of the inspection target chip parts; and compares the brightness image data with the reference position / shape. And a land position / shape confirmation unit for confirming the position and shape of each land of the inspection target mounting board, the outer peripheral edge of each confirmed land and the inspection target chip component. An electrode intersection detection unit that searches for an intersection with the electrode portion, and a protrusion amount of the electrode portion that protrudes from the intersection with respect to the land is searched, and the retrieved protrusion amount and a preset protrusion amount allowable value are set. A chip component mounting / inspection apparatus, comprising: a determination unit that compares and determines a mounting displacement amount.