JP2003017899A - Method and apparatus for correcting illuminance of electronic component assembling apparatus, and method and apparatus for detecting duration of life of lighting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a printed board in a proper state by allowing a suitable recognition process to be executed by deciding non-defective or defective state of an illumination, with respect to the aging changes of the illumination in terms of recognition, and automatically dimming a brightness of a light source unit, based on the decision. SOLUTION: A method for correcting an illuminance of an electronic component assembling apparatus comprises the steps of first measuring a gradation value B, and comparing whether or not this actually measured gradation value B is a reference gradation value A or more to be stored in a RAM 32 of an image process controller 30 by a CUP 31. The method further comprises the steps of checking the illumination (S1), and this routine is finished, if the checked illumination is the reference value A or more, but executing a work if the illumination is the value A or less. The method also comprises the steps of setting the CPU 31 by teaching of the illuminance data previously implemented, extracting the present illuminance data D stored in the RAM 32 and referring to it (S2). The method also comprises steps of obtaining and deciding the data, according the formula D+αC(1-B/A) by the CPU 31 (S3), where αis the amount of change of the data per gradation. The method also comprises the steps of re-checking the illumination as described above (S1), and finishing the automatic correction of the illumination, if the data is the value A or more.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminance correction method, an illuminance correction device, a life detection method for a lighting device, and a life detection in recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board. Regarding the device.

[0002]

2. Description of the Related Art Conventionally, for example, with respect to a change with time of illumination in board recognition and component recognition of an electronic component mounting apparatus, the illumination check function determines whether or not this illumination is appropriate. Based on this, the gain level of the image processing unit (image processing unit) is changed by software, or the volume of the light source device is changed by manual operation to set the illumination to an appropriate brightness. In particular, it did not detect the illumination life.

[0003]

If the brightness of the illumination for recognition is not appropriate, the image will have a low contrast. On the other hand, if the gain level is softly changed in order to make the brightness (gradation value) appropriate, the noise component is also emphasized, which is disadvantageous in recognition processing. Further, changing the volume of the light source device solves the former problem, but it is a hardware change and the workability is not good. In addition, the life of the lighting required replacement of the lighting to identify whether the lighting was not suitable or was caused by others.

Therefore, according to the present invention, the quality of the illumination is judged with respect to the change with time of the illumination in the recognition, and the brightness of the light source device is automatically adjusted on the basis of the determination to perform an appropriate recognition process. The purpose is to enable printed circuit boards to be produced in good condition.

[0005]

Therefore, the first invention is
An illuminance correction method in the recognition of an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board, wherein a background image is captured by a camera to obtain a gradation value B, and a background reference gradation value. When the illumination check result is compared with A, and the result of the illumination check is not appropriate, the current illuminance data D that is set to be the reference gradation value C by teaching the illuminance data is referred to, and the background It is characterized in that new illuminance data E is determined based on the reference gradation value A, the gradation value B, the reference gradation value C and the current illuminance data D.

A second aspect of the present invention is an illuminance correction device for recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board. And an illumination check unit for comparing with the reference gradation value A of the background, and when the check result by the checking unit is not appropriate, the current gradation value is set to the reference gradation value C by teaching the illuminance data. Means for referring to the illuminance data D, the reference gradation value A of the background,
Means for determining new illuminance data E on the basis of the gradation value B, the reference gradation value C, and the current illuminance data D.

A third aspect of the present invention is a method for detecting the life of an illuminating device in recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board. With reference to the illuminance data X set so as to obtain the gradation value B by measuring when the illumination device is turned on with the illuminance data X, the reference gradation value A and the actually measured gradation value B are obtained. And the life of the lighting device is judged based on the judgment reference gradation value C.

A fourth aspect of the present invention is a method of detecting the life of an illuminating device in recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board. With reference to the illuminance data X set so that the illuminance device X is turned on, the tone value B is measured to obtain the tone value B, and the reference tone value A is obtained.
The value obtained by subtracting the actually measured gradation value B from the judgment reference gradation value C
If it is larger, it is determined that the lighting device has reached the end of its life.

A fifth aspect of the present invention is a life detecting device for an illuminating device in recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board, and has a reference gradation value A of a saturation level. Means for referring to the illuminance data X that is set to: and means for obtaining a gradation value B by measuring when the illuminating device is turned on with the illuminance data X,
And a means for judging the life of the lighting device based on the reference gradation value A, the actually measured gradation value B and the judgment reference gradation value C.

A sixth aspect of the present invention is a life detecting device for an illuminating device in recognizing an electronic component assembling device that performs a predetermined work for assembling electronic components on a printed circuit board, and has a saturation level reference gradation value A. Means for referring to the illuminance data X that is set to: and means for obtaining a gradation value B by measuring when the illuminating device is turned on with the illuminance data X,
A value obtained by subtracting the measured gradation value B from the reference gradation value A is
And a means for judging that the illuminating device has reached the end of its life when it is larger than the judgment reference gradation value C.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 are provided on a base 2 of the apparatus 1 for supplying various electronic components to the component pick-up portions (component suction positions). It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit groups 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream side device to the positioning section 5, and after the electronic parts are mounted on the board P positioned by the positioning mechanism (not shown) by the positioning section 5, the discharge conveyor 6 To the downstream device.

Reference numeral 8 is a pair of beams long in the X direction, and Y
The screw shaft 10 is rotated by driving the shaft motor 9, and Y is individually moved along the pair of left and right guides 11 above the printed circuit board P and the component pick-up portion (component suction position) of the component supply unit 3.
Move in the direction.

Each beam 8 is provided with a mounting head 7 which moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7 is equipped with two vertical shaft motors 14 for vertically moving the two suction nozzles 13, and two θ-axis motors 15 for rotating the suction nozzles 13 about the vertical axis.
Therefore, the suction nozzles 13 of the two mounting heads 7 are movable in the X direction and the Y direction, rotatable about the vertical line, and vertically movable.

Reference numeral 16 denotes a component recognition camera for recognizing the position of a component. Two components are provided for each of the mounting heads 7, and a total of four components are provided. The electronic component is imaged for recognizing the position depending on whether it is held or in the XY direction and the rotation angle, but two electronic components can be imaged at the same time.
Reference numeral 17 denotes a nozzle stocker for storing nozzles, which can store a maximum of 10, but 9 of them.

Reference numeral 18 denotes a board recognition camera for board position recognition, which is provided on the mounting head 7 and has its positioning mark M for recognizing the positional deviation of the printed board P positioned by the positioning mechanism by the positioning unit 5. The image is taken.

FIG. 2 is a control block diagram of the electronic component mounting apparatus 1 of the present invention. For convenience of explanation, the X-axis motor 12, the Y-axis motor 9, and θ.
Only one each of the shaft motor 15 and the vertical shaft motor 14 is illustrated and described below.

Reference numeral 20 denotes an apparatus control section for controlling the main mounting apparatus 1, which has a CPU (control section) 21 and a RAM (random access control) as a control section for integrally controlling the mounting-related operation.
Memory) 22 and ROM (read only memory)
23 and the like. In the RAM 22, the X direction and the Y direction in the printed circuit board P are set for each mounting order of electronic components.
The direction and angular position information, the arrangement number information of each component supply unit 3, and the like are stored.

Based on the data stored in the RAM 22, the CPU 21 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 23. That is, the CPU 21 drives the X-axis motor 12 via the drive circuit 24, drives the Y-axis motor 9 via the drive circuit 25, and drives the θ-axis motor 15 via the drive circuit 26. Further, the drive of the vertical axis motor 14 is controlled via a drive circuit 27.

An image processing control unit (image processing board) 30 is connected to the device control unit 20 via the VME bus 28, and is a CPU (image processing unit) as a control unit for integrally controlling the operation related to image processing. 31, RAM (random access memory) 32, image memory 33, board recognition camera interface 34 to which the board recognition camera 18 is connected, parallel IO 35, parts recognition camera interface 36 to which the parts recognition camera 16 is connected, parallel The IO 37 and the monitor interface 38 are included.

A monitor 39 is connected to the monitor interface 38, and displays images and the like picked up by the board recognition camera 18 and the component recognition camera 16. The parallel IOs 35 and 37 output the data representing the illuminance of 256 gradations to the lighting control boards 40 and 41, respectively, and the boards 40 and 41 generate a predetermined current based on the received data, and the lighting devices 42 and 43, respectively. Shed on.

Then, the recognition processing of the component image data imaged by the component recognition camera 16 and taken into the image memory 33, and the positioning process taken by the board recognition camera 18 and taken into the image memory 33. The recognition processing of the mark image data is performed by the image processing control unit 30, and the processing result is sent to the CPU 21 of the device control unit 20. That is, the CPU 21 of the device control unit 20 outputs an instruction to the CPU 31 of the image processing control unit 30 to perform recognition processing (calculation of the amount of displacement, etc.) of the images captured by the component recognition camera 16 and the board recognition camera 18. In addition, the recognition processing result is received from the image processing control unit 30.

Reference numeral 44 is a keyboard as an input means connected to the device control section 20 via a keyboard driver 45.

Next, referring to FIG. 3, the mounting head 7 is provided with a disc-shaped diffusion plate 19 above the suction nozzle 13, and a plurality of illuminating lamps constituting the illuminating device 43. The light from the illuminating device for transmission having the above-mentioned light impinges on the diffusion plate 19, and a transmission image (silhouette image) of the chip component A sucked by the suction nozzle 13 is picked up by the component recognition camera 16 via the lens 29, and Light from a reflection illuminating device having a plurality of illuminating lamps constituting the illuminating device 43 hits the chip component A adsorbed by the adsorption nozzle 13, and its reflected image is captured by the component recognition camera 16 via a lens 29. It is what is done.

With the above configuration, the operation will be described below. First, the printed board P is positioned by the conveyor (not shown) from the upstream side device via the supply conveyor 4 and the positioning unit 5
The sheet is transported to and fixed by a positioning mechanism (not shown).

Next, according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 22 for each step number, the rotational angle position around the vertical axis, the arrangement number, etc. are designated, the mounting is performed first. Step number 000
The electronic components to be mounted by the suction nozzles 13 corresponding to the component types of the electronic components 1 and 0002 are sucked and taken out from the predetermined component supply unit 3. That is, each mounting head 7 moves so as to be positioned above each component supply unit 3 that houses the electronic component to be mounted, but in the Y direction, the Y-axis motor 9 is driven by the drive circuit 25 to move along the pair of guides 11. The beam 8 moves, and the driving circuit 24 drives the X-axis motor 12 to move the mounting head 7 in the X direction.

Since the predetermined supply units 3 are already driven and the component can be taken out at the component suction position, the vertical axis motor 14 is driven by the drive circuit 27 and the nozzle 13 descends to suck the component. Then take it out. In this case, the two suction nozzles 13 of the one mounting head 7 suction the electronic components simultaneously or individually.

Next, each vertical axis motor 14 is driven to raise the nozzle 13, the beam 8 moves along the pair of guides 11 in the Y direction, and the X direction follows the guides by the drive of the X axis motor 12 in the X direction. The mounting head 7 moves to a position above the printed circuit board P by the mounting head 7 moving.
During this movement, it stops at a position above both recognition cameras 16 and both cameras 16 pick up images, and how much the electronic component is displaced and held by suction with respect to the head. The position is recognized by the control unit 30.

Similarly, the component picking and recognition operation by the other mounting head 7 is performed.

Next, in order to perform the substrate recognition operation for each beam 8, the beam 8 and the mounting head 7 are moved to recognize each mark M by the substrate recognition camera 18 in order to recognize the position of the mark on the printed circuit board P. The image is picked up, the recognition processing is performed by the image recognition processing unit 30, the RAM 32 stores the image, the beam 8 and the mounting head 7 are moved again, and the suction nozzle 13 recognizes the component on the printed board P based on the board recognition result. Each electronic component A while correcting the positional deviation by adding the result
Put on. That is, the CPU 21 controls the beam 8 in the Y direction by driving the Y-axis motor 9 and the mounting head 7 in the X-axis motor 1.
By moving in the X direction by driving 2
The shaft motor 15 rotates θ to correct the rotational angle position in the X and Y directions and around the vertical axis. After this correction, the vertical shaft motor 14 is driven and the suction nozzle 13 descends to move on the printed circuit board P. One electronic component is mounted at a predetermined position, and then the vertical shaft motor 14 raises the nozzle. Similarly, the other electronic component is also corrected and then mounted.

Before starting the production operation, during maintenance, or during the production operation, when the printed circuit board P is conveyed from the upstream side device to the positioning section 5 via the supply conveyor 4, and the electronic signal to the printed circuit board P is transferred. The illumination is automatically corrected when it is conveyed to the discharge conveyor 6 after the components are mounted or when it is conveyed from the discharge conveyor 6 to the downstream side device, which will be described with reference to the flowchart of FIG.

First, the illumination is checked (S1). That is, the disc-shaped diffuser plate 19 of the mounting head 7 which is the background is irradiated with light from the illumination device 43, and the light is captured by the component recognition camera 16 via the lens 29, and the image processing control unit 3
The recognition process is performed with 0, the gradation value B is measured, and the CPU 31 compares whether the measured gradation value B is equal to or higher than the reference gradation value A stored in the RAM 32 of the image processing control unit 30.
In this illumination check, if the reference gradation value is A or more, this routine ends, but if it is less than the following, the following work is performed.

That is, the CPU 31 extracts and refers to the illuminance data D peculiar to the currently operating apparatus, which is set by the teaching of the illuminance data which has been executed in advance and stored in the RAM 32 (S2). In addition, the teaching of the illuminance data is such that the jig is attracted to the suction nozzle 13 and light is applied from the illuminating device 43, and the reflected image is picked up by the component recognition camera 16, and the reference gradation value C of the illuminance data is obtained. The illuminance data D is determined while adjusting the light amount. Here, C is a reference gradation value when the jig is used.

Next, it is estimated how much the illuminance should be increased, and new illuminance data E is determined (S3). The new illuminance data E is obtained from the equation D + αC (1-B / A). Here, α is the amount of change in the illuminance data per gradation. According to the above formula, new illuminance data E is calculated by the CPU 31.
Is calculated and stored in the RAM 32 (S4), the illumination check as described above is performed again (S1), and the reference gradation value A is calculated.
If it is above, this automatic correction of illumination is completed.

As a result, it is possible to change the brightness to an appropriate level in response to the change with time of illumination in recognition.

Next, the detection of the life of the illumination will be described with reference to the flowchart of FIG. Similar to the automatic correction of the illumination, this detection is also performed before the production operation is started, during maintenance, or when the printed circuit board P is conveyed from the upstream side device to the positioning unit 5 via the supply conveyor 4 during the production operation. Further, it is carried out when the electronic components are mounted on the printed circuit board P and then conveyed to the discharge conveyor 6, or when conveyed from the discharge conveyor 6 to a downstream side device, which will be described in detail below.

First, the CPU 31 refers to the saturation level illuminance data X stored in the RAM 32 (S11).
As described above, the jig is sucked to the suction nozzle 13 and the light is emitted from the illumination device 43, and the reflected image is picked up by the component recognition camera 16, and the gradation value at that time is checked while raising the illuminance. Then, the illuminance data X is set so as to become the reference gradation value A of the saturation level, and the illuminance data X is already stored in the RAM 3
It is stored in 2.

Next, the CPU 31 causes the illuminance data X
Then, the illumination device 43 is turned on (S12). When the light is turned on, the gradation value B is obtained by measurement and stored in the RAM 32.

Then, the CPU 31 judges whether the value obtained by subtracting the actually measured gradation value B for the illuminance data X from the saturation level reference gradation value A is larger than the judgment reference gradation value C (S1).
3). At this time, if the CPU 31 is not large, it is determined that the illumination life is still ahead (S14), and if it is large, it is determined that the illumination life is long (S15), and the process ends.

Therefore, from this judgment, it is possible to determine that the cause when the illumination for recognition is not appropriate is the life of the illumination.

Although the present embodiment has been described with respect to component recognition, it can also be applied to board recognition.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention includes the above-described various modifications without departing from the spirit thereof. It is intended to cover alternatives, modifications or variations.

[0042]

As described above, according to the present invention, the quality of the illumination is determined with respect to the temporal change of the illumination in the recognition, and the brightness of the light source device is automatically adjusted based on the determination. A proper recognition process is possible, and a printed circuit board can be produced in a good condition.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting device.

FIG. 2 is a control block diagram of an electronic component mounting device.

FIG. 3 is an enlarged view of each part related to recognition.

FIG. 4 is a flowchart of automatic illumination correction.

FIG. 5 is a flow chart for detecting the life of the illumination.

[Explanation of symbols]

1 Electronic component mounting device 7 mounting head 13 Suction nozzle 16 parts recognition camera 18 Board recognition camera 19 Diffuser 20 Device control unit 21 CPU 22 RAM 30 Image processing control unit 31 CPU 32 RAM 40, 41 Lighting control board 43 Lighting equipment

Continued front page    (72) Inventor Jun Asai             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F term (reference) 3K073 AA35 AA67 AA87 AB07 BA24                       BA28 CF13 CG02 CG06 CG42                       CJ05 CJ19 CJ22                 5B047 AA12 AB02 BA01 BB04 BC11                       BC14 CB04 CB22 CB30 DC07                 5E313 AA01 AA11 DD12 EE02 EE03                       EE24 EE50 FG10

Claims (6)

[Claims] 1. A illuminance correction method in recognition of an electronic component assembling apparatus that performs a predetermined operation for assembling an electronic component on a printed circuit board, comprising: capturing a background with a camera to obtain a gradation value B; When the illumination check result is not appropriate, the current illuminance data D which is set to be the reference tone value C by teaching the illuminance data is referred to. A new illuminance data E is determined based on the background reference gradation value A, the gradation value B, the reference gradation value C, and the current illuminance data D. Illuminance correction method in recognition. 2. An illuminance correction device for recognizing an electronic component assembling apparatus that performs a predetermined operation for assembling electronic components on a printed circuit board, wherein a background image is captured by a camera to obtain a gradation value B, and the background value is calculated. When the check result of the illumination is not appropriate, the current illuminance data D set to be the reference tone value C by teaching the illuminance data is used. And a means for determining new illuminance data E based on the reference gradation value A of the background, the gradation value B, the reference gradation value C and the current illuminance data D. Illumination correction device for recognition of electronic component assembly device. 3. A method for detecting the life of an illuminating device in recognizing an electronic component assembling apparatus that performs a predetermined work for assembling electronic components on a printed circuit board, wherein the reference gradation value A of a saturation level is set. The gradation value B is obtained by measuring the illuminance data X being displayed and measuring the lighting device with the illuminance data X, and the reference gradation value A, the actually measured gradation value B and the judgment reference floor A method for detecting the life of an illuminating device in the recognition of an electronic component assembling apparatus, characterized in that the life of the illuminating device is judged based on a control value C. 4. A method of detecting the life of an illuminating device in recognizing an electronic component assembling apparatus that performs a predetermined operation for assembling electronic components on a printed circuit board, wherein the saturation level is set to a reference gradation value A. Value obtained by subtracting the actually measured gradation value B from the reference gradation value A by referring to the illuminance data X being displayed, measuring the lighting device with the illuminance data X, and measuring the gradation value B. But,
A method for detecting the life of an illuminating device in recognizing an electronic component assembling apparatus, characterized in that the illuminating device is judged to have reached the end of its life when it is larger than a judgment reference gradation value C. 5. A life detecting device for an illuminating device in recognition of an electronic component assembling apparatus which performs a predetermined work for assembling electronic components on a printed circuit board, and is set so as to have a reference gradation value A of a saturation level. Means for referring to the displayed illuminance data X, means for measuring the gradation value B when the illumination device is turned on with the illuminance data X, the reference gradation value A, and the actually measured gradation value B And a means for judging the life of the illuminating device based on the judgment reference gradation value C, the life detecting device for the illuminating device in the recognition of the electronic component assembling apparatus. 6. A life detecting device for an illuminating device in recognition of an electronic component assembling apparatus that performs a predetermined operation for assembling electronic components on a printed circuit board, and is set so as to have a reference gradation value A of a saturation level. Means for referring to the displayed illuminance data X, means for obtaining a gradation value B by measuring when the illuminating device is turned on with the illuminance data X, and the actually measured gradation value B from the reference gradation value A. The value obtained by subtracting
A lighting device life detecting device for recognizing an electronic component assembling device, comprising: means for judging that the lighting device has reached the end of its life when it is larger than a judgment reference gradation value C.