JP3967120B2 - Recognition processing device for electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a recognition processing apparatus for an electronic component mounting apparatus that recognizes a reflected image by irradiating an electronic component sucked and held by a suction nozzle with a lighting device before mounting the electronic component on a printed circuit board, and the recognition processing thereof. Regarding the method.
[0002]
[Prior art]
In a conventional recognition processing apparatus and recognition processing method of this type, as shown in FIG. 9, in an electronic component 100 that is processed by reflection type recognition in a rectangular parallelepiped shape such as a resistor or a capacitor, an electrode 101 of the electronic component 100 is used. In the state in which the suction nozzle 102 has a larger outer diameter than that of the electronic component 100, the suction surface 102 is partially coated on the suction surface, or the electrode 101 of the electronic component 100 adheres to the suction surface. If the corner portion 103 of the suction nozzle 102 is imaged in a shining state (the background 104 is dark), “recognition abnormality” occurs.
[0003]
[Problems to be solved by the invention]
That is, in the conventional recognition processing apparatus, since the corner portion 103 of the electronic component 102 is detected, the chipping of the electrode 101 of the corner portion 103 of the electronic component 100 and the light of the suction nozzle 102 are obstructed as described above. There was a problem that it could not be detected.
[0004]
Therefore, the present invention makes it possible to accurately recognize and process the position and angle of a component without being affected even when there is a chip in the corner of the electronic component or when a portion of the suction nozzle shines. With the goal.
[0005]
[Means for Solving the Problems]
For this reason, the first invention is a recognition processing device for an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof. A long side recognition means for recognizing the edge of each electrode on both sides in the long side direction of the electronic component, a short side recognition means for recognizing the edge of each electrode on both sides in the short side direction of the electronic component, and the long side recognition When there is a plurality of edge candidates for at least one electrode by means of means recognition and there is an edge candidate with no difference in contrast, the length of the electronic component in the long side direction is set to all combinations of edge candidates including this edge candidate. determination hand calculation means calculating for, the difference between the long side direction of the length and part dimensions to the calculated detection means is calculated using the edge candidate there is no difference in contrast is determined whether within a predetermined range of the component dimensions When, it is provided with a determining means for determining the near edge candidate to the part dimensions to the next if within a predetermined range.
[0010]
According to a second aspect of the present invention, the determining means is such that the first long side length by edge candidates having no difference in contrast among the lengths in the long side direction calculated by the calculating means is closest to the component size. If the difference between the length in the first long side direction and the length in the second long side direction of the edge candidates closest to the next part dimension is within the predetermined range of the part dimension, It is characterized in that the edge candidates are determined to be close to each other, and if they are outside the predetermined range, the edge candidates having no difference in contrast are determined.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below based on the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and a plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by the positioning unit 5 (not shown), the discharge conveyor 6 To the downstream device.
[0018]
Reference numeral 8 denotes a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving a Y-axis motor 9, and a component take-out portion (component suction position) of the printed circuit board P or the component supply unit 3 is moved along a pair of left and right guides 11 ) Move upward in the Y direction individually.
[0019]
Each beam 8 is provided with a mounting head 7 that moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, in the X direction. Each mounting head 7 is equipped with two vertical axis motors 14 for vertically moving the two suction nozzles 13 and two θ-axis motors 15 for rotating around the vertical axis. Therefore, the suction nozzles 13 of the two mounting heads 7 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.
[0020]
Reference numeral 16 denotes a component recognition camera for component position recognition, which is provided in total of four corresponding to each of the mounting heads 7 so that the electronic component is attracted and held by how much the electronic component is displaced with respect to the suction nozzle 13. The electronic component is imaged for recognizing the position in the XY direction and the rotation angle, but two electronic components can be simultaneously imaged. Reference numeral 17 denotes a nozzle stocker for storing nozzles, and a maximum of 10 nozzles can be stored.
[0021]
In FIG. 2, the electronic component processed by the reflection-type recognition that is sucked and held so that the bottom surface of the suction nozzle 13 </ b> A used in the reflection-type recognition method is not illuminated when illuminated by the reflection ring illumination 18. A coating is applied to the outer side of the 19 adsorbing surface. Further, the bottom area of the suction nozzle 13A is formed wider than the top area of the electronic component 19 to be recognized.
[0022]
In FIG. 3, reference numeral 20 denotes a CPU (mounting control unit) as a control unit that performs overall control of the mounting apparatus 1. The CPU 20 is connected to a RAM (Random Access Memory) 22 and a ROM (Ready) via a bus line. De-only memory) 23 is connected. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 23 based on the data stored in the RAM 22.
[0023]
That is, the CPU 20 drives the X-axis motor 12 via the interface 24 and the drive circuit 25, drives the Y-axis motor 9 via the interface 24 and the drive circuit 28, and passes the interface 24 and the drive circuit 32. The drive of the θ-axis motor 15 is further controlled via the interface 24 and the drive circuit 30.
[0024]
The RAM 22 stores mounting data related to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle in the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 22 stores the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 3. Further, as shown in the component library data of FIG. 4, the RAM 22 stores component dimensions and component dimension allowable values in the X direction and the Y direction for each component ID of each electronic component.
[0025]
A recognition processing unit 33 is connected to the CPU 20 via the interface 24. The recognition processing unit 33 performs recognition processing of an image captured by the component recognition camera 16, and the processing result is sent to the CPU 20. Is sent out. That is, the CPU 20 outputs an instruction to the recognition processing unit 33 so as to perform recognition processing (calculation of misalignment amount, etc.) on an image captured by the recognition camera 16 and receives a recognition processing result from the recognition processing unit 33. is there.
[0026]
Reference numeral 34 denotes a keyboard as data registration means connected to the CPU 20 via the keyboard driver 35 and the interface 24. Reference numeral 36 denotes a monitor for displaying component images and the like. Further, means such as a touch panel may be used instead of the keyboard 34 as the data registration means.
[0027]
With the above configuration, the operation will be described based on the flowcharts of FIGS. First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism.
[0028]
Next, the CPU 20 confirms the mounting data stored in the RAM 22, that is, the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 22 for each step number, the rotation angle position around the vertical axis, the arrangement number, and the like. If the suction nozzle 13A corresponding to the component type of the electronic component 19 processed by the reflection type recognition of the mounting step number 001 is mounted and held on the mounting head 7 according to the specified mounting data, the mounting is performed with this suction nozzle 13A. The power electronic component 19 is sucked out from the predetermined component supply unit 3. That is, each mounting head 7 moves so as to be positioned above each component supply unit 3 that stores an electronic component to be mounted. However, in the Y direction, the Y-axis motor 9 is driven by the drive circuit 28 along the pair of guides 11. Then, the beam 8 moves, and in the X direction, the X-axis motor 12 is driven by the drive circuit 25 and the mounting head 7 moves. Since each of the predetermined supply units 3 has already been driven and components can be taken out at the component suction position, the vertical axis motor 14 is driven by the drive circuit 30 and the suction nozzles 13A are lowered and sucked. Take out.
[0029]
Next, each vertical axis motor 14 is driven to raise the nozzle 13A, the beam 8 moves along a pair of guides 11 in the Y direction, and the X direction motor is mounted along the guides 11 by driving the X axis motor 12. As the head 7 moves, the mounting head 7 moves to a position above the printed circuit board P. In the middle of this movement, it stops at a position above the recognition camera 16, is irradiated with light by the reflection ring illumination 18, the recognition camera 16 images the electronic component 19, and the position of the electronic component 19 relative to the nozzle 13A. Coarse recognition processing is executed by the recognition processing unit 33 based on the captured reflection image for the XY direction and the rotation angle regarding whether or not they are attracted and held.
[0030]
Next, detailed recognition is started. First, the left edge (outer edge of the electrode 19B) in the long side direction of the electronic component 19 is recognized, and further the right edge (outer edge of the electrode 19A) in the long side direction is recognized. recognize.
[0031]
Here, the CPU 20 determines whether there are two edge candidates in the long side direction. That is, in the normal case, in the reflected image, the background and the suction nozzle 13A are dark portions and the electrode 19A is a bright portion. Therefore, the edge is reversed from the dark portion to the bright portion (reversal from black to white). . However, as shown in FIG. 7, for example, if a part of the right electrode 19A is missing, the missing part becomes a dark part, so there are two inversion places. In this case, the CPU 20 has edge candidates. It is determined that there are two, and the routine proceeds to an edge selection rule routine as shown in FIG.
[0032]
That is, since two reversal points are found on the long side and the current recognition process is a long side edge selection routine, the length of the electronic component 19 is set to the CPU 20 based on the information from the recognition processing unit 33 in all combinations. Is calculated. That is, the length in the long side direction of the electronic component 19 is calculated with the first inversion part and the next inversion part as edges.
[0033]
Then, of the lengths in the long side direction of the electronic component 19 calculated based on the two edges described above, the CPU 20 selects an edge candidate close to the component dimensions (for example, 0.6 mm) shown in the parts library shown in FIG. Choose.
[0034]
Next, a long side edge selection routine, in which the CPU 20 determines whether there is an edge candidate in which there is no difference in contrast between the dark part and the bright part, that is, the degree of change from black to white is small. If there is no edge candidate with a small degree of change, the edge candidate closest to the part size shown in the parts library is determined. Then, if there is an edge candidate with a small degree of change, it is determined whether the difference between the length in the long side direction calculated using this edge candidate and the part dimension shown in the parts library is less than 10% of the part dimension, for example. If it is less than 10%, the edge candidate closest to the part dimension shown in the parts library is determined, and if it is less than 10%, the edge candidate closest to the part dimension shown in the parts library is determined.
[0035]
Furthermore, the long edge selection routine is performed, and the CPU 20 determines whether there is no difference in contrast between the dark part and the bright part, that is, the edge candidates having a small degree of change from black to white. If the edge candidates have little change, the edge candidate closest to the part size shown in the parts library may be determined. Then, if the edge candidates have a small degree of change, the edge in the long side direction calculated using these edge candidates and the edge whose calculated length next to this length is close to the part dimension (size) shown in the parts library It is determined whether or not the difference between the lengths of the candidates is less than 10% of the part dimensions, and if it is not less than 10%, the edge candidate closest to the part dimensions shown in the parts library is determined. Then, an edge candidate close to the part size shown in the part library may be determined.
[0036]
As described above, by determining edge candidates, even when edge candidates having no difference in contrast are generated, edge candidates that are as close to actual parts as possible can be determined. In particular, in the determination described later, edge candidates can be determined as accurately as possible even in the case of edge candidates with little change.
[0037]
On the other hand, if the CPU 20 determines that the long side edge selection rule routine ends or there are no two edge candidates described above, the lower edge in the short side direction of both electrodes 19A of the electronic component 19 is recognized, Furthermore, the upper edge in the short side direction of both electrodes 19A is recognized.
[0038]
Here, the CPU 20 determines whether or not there are two edge candidates in the short side direction. That is, in the normal case, in the reflected image, the background and the suction nozzle 13A are dark portions and the electrode 19A is a bright portion. Therefore, the edge is reversed from the dark portion to the bright portion (reversal from black to white). . However, as shown in FIG. 7, for example, if a part of the electrode 19A is chipped, the chipped part becomes a dark part, so there are two reversal points. In this case, the edge as shown in FIG. Move to the selection rule routine.
[0039]
That is, since it is not a routine for selecting an edge having a short side and a long side, edge candidates that do not have a difference in contrast between a dark part and a bright part, that is, a degree of change from black to white are excluded. In this case, it is dense that a low contrast is not an edge, and is excluded. Then, the CPU 20 selects an edge candidate close to the part size shown in the parts library, and determines again whether or not it is a long side edge selection routine.
[0040]
As described above, since it is not a routine for selecting an edge having a short side and a long side, it is determined whether only one edge on the opposite side of each electrode 19A is found. If more than one point is found, the angle between the lines connecting the left and right edge candidates is determined to be an edge candidate close to the opposite angle, and if not found, an edge candidate close to the part size shown in the parts library To decide.
[0041]
If the short side edge selection rule routine ends or if there are no two edge candidates in each short side, the CPU 20 determines whether all four upper and lower edges in the short side direction have been found. Calculates the position and angle of a part from two places in the long side direction and four places in the short side direction, and checks the size. If four locations are not found, the CPU 20 determines whether the next three top and bottom edges in the short side direction have been found. If three locations are not found, only two locations are found and an edge detection error is detected. If three locations are found as shown in FIG. 8, the position and angle of the part are calculated from the two locations in the long side direction and the three locations in the short side direction, and the size is checked and the process ends.
[0042]
Therefore, as described above, each edge is determined based on the edge candidates found on the long side and the short side, and how much the electronic component 19 is attracted and held with respect to the mounting head 7 in the XY direction and rotation. A recognition process is performed for each angle.
[0043]
For this reason, the beam 8 and the mounting head 7 are moved again, and the suction nozzle 13 mounts each electronic component 19 on the printed circuit board P while correcting the positional deviation in consideration of the recognition result. That is, the CPU 20 causes the beam 8 to move in the Y direction by driving the Y-axis motor 9, and causes the mounting head 7 to move in the X direction by driving the X-axis motor 12. Correction of the rotational angle position about the direction and the vertical axis is made, and after this correction, the vertical axis motor 14 is driven, the suction nozzle 13A is lowered, and one electronic component is mounted at a predetermined position on the printed circuit board P, Similarly, the other electronic component is mounted after correction.
[0044]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0045]
【The invention's effect】
As described above, according to the present invention, the position and angle of a component can be accurately recognized without being affected even in a state where an electrode of an electronic component is chipped or a portion of a suction nozzle shines.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a side view of a main part related to recognition of the electronic component mounting apparatus.
FIG. 3 is a control block diagram.
FIG. 4 is a diagram showing part library data.
FIG. 5 is a flowchart of an edge selection rule.
FIG. 6 is a flowchart of an edge selection rule.
FIG. 7 is a plan view of an electronic component having a chip in a part of an electrode.
FIG. 8 is a plan view of an electronic component in which the edge of an electrode is not clear.
FIG. 9 is a diagram illustrating a reflection image of an electronic component or the like when a part of the suction nozzle is missing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 7 Mounting head 13, 13A Suction nozzle 16 Component recognition camera 18 Reflection ring illumination 19 Electronic component 19A, 19B Electrode 20 CPU
22 RAM

Claims (2)

In the recognition processing device of an electronic component mounting device that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof, in the long side direction of the electronic component A long side recognizing means for recognizing the edge of each electrode on both sides of the electronic component, a short side recognizing means for recognizing the edge of each electrode on both sides in the short side direction of the electronic component, and at least one electrode by the recognition of the long side recognizing means A plurality of edge candidates, and when there is an edge candidate with no difference in contrast, a calculation means for calculating the length in the long side direction of the electronic component with all combinations of edge candidates including the edge candidate , and the calculation Determining means for determining whether the difference between the length in the long side direction calculated by using the edge candidate having no difference in contrast and the component size is within a predetermined range of the component size; and within the predetermined range Recognition processor of the electronic component mounting apparatus characterized in that a determining means for determining the near edge candidate to the part dimensions to the next. The determining means determines the first long side length by edge candidates having no difference in contrast among the lengths in the long side direction calculated by the calculating means when the length in the first long side direction is closest to the part dimension. If the difference between the length in the long side direction of 1 and the length in the second long side direction of the next edge candidates closest to the part dimension is within a predetermined range of the part dimensions, the next edge candidates closest to the part dimension are determined. 2. The recognition processing apparatus for an electronic component mounting apparatus according to claim 1, wherein edge candidates having no difference in contrast are determined if they are out of a predetermined range .

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