JP3266524B2 - Chip component position detection method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for detecting a position of a chip component for detecting a suction state of a chip component sucked by a nozzle member in a mounting machine.

[0002]

2. Description of the Related Art Conventionally, a small chip component such as an IC is sucked from a component supply unit such as a tape feeder by a component mounting head unit having a nozzle member and is transferred onto a positioned printed circuit board. A mounting machine that is mounted at a predetermined position on a printed circuit board is generally known. In this type of mounting machine, for example, the head unit is movable in the X-axis direction and the Y-axis direction on a plane, and the nozzle member is movable and rotatable in the Z-axis direction. A mechanism is provided.

Further, in this type of mounting machine, an optical detecting means for irradiating the chip component adsorbed by the nozzle member with light to detect the projection of the chip component is provided. There is also generally known an apparatus that detects a component suction state by the nozzle member, for example, a deviation or inclination of a component suction position, and corrects a component mounting position in accordance with the detected state.

As an optical detecting means, an irradiating portion and a light receiving portion of the parallel light beam are arranged opposite to each other with a space through which the nozzle member passes, and the irradiating portion irradiates the component adsorbed by the nozzle member with the parallel light beam. The mainstream is to detect the projection width of the component at the light receiving section. However, this detection means emits a parallel light beam, so a laser source,
It is necessary to equip the irradiating section with a condenser lens, a mirror, a parallel light forming lens, and the like, and there has been a problem that the size of the optical detection means is increased or the cost is increased.

In order to solve this problem, the applicant of the present application irradiates the chip component with a diffused light from a point-like light source to the chip component while rotating the chip component adsorbed on the nozzle member around the nozzle axis. We have developed and filed an application for a device that checks the component suction state based on projection detection data from a light receiving unit using light and predetermined data indicating the positional relationship between the irradiating unit, light receiving unit, and nozzle member. Request 309
494).

[0006]

According to the above apparatus,
Since the diffused light can be used as it is, there is no need for a lens or the like for forming parallel rays. For this reason, it is possible to effectively suppress an increase in the size of the optical detection means, and the intended purpose can be achieved.

However, there is room for improvement in the following points.

That is, in the above-described apparatus, it is necessary to obtain the nozzle rotation angle and the minimum distance when the distance between the reference position of the light receiving section and the projection end is minimum, while rotating the nozzle member at a constant speed. It is required to process a lot of data such as projection detection data from a light receiving unit and rotation angle data from an encoder while sequentially sampling. Therefore, the processing for detecting the component suction state may take a relatively long time. Further, since the minimum distance to the projection end is checked while rotating the chip component, the detection time of the component suction state tends to vary according to the variation of the suction state of the chip component.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a chip component position detection method capable of increasing the processing efficiency of component suction state detection and making the time required for the processing uniform regardless of the component suction state. It is intended to provide the same device.

[0010]

To achieve the above object, the present invention provides an irradiating section for irradiating a chip component adsorbed on a nozzle member provided in a head unit of a mounting machine with light, A projection of the chip component is detected by an optical detection unit having a light receiving unit that receives light at a position facing the irradiation unit with the chip component interposed therebetween, and the chip adsorbed to the nozzle member based on the projection. In the method of detecting the position of a component, a plurality of point light sources for irradiating diffused light to the irradiating section are provided side by side, and the chip in the light receiving section is selectively irradiated with diffused light from the light sources to the chip component. Measure the projection of the component, as a process based on this component projection measurement, detect the distance from the predetermined reference position on the light receiving unit to the end of the projection, this distance,
The position of the corner of the chip component is determined from the known data about the positional relationship between the light source of the irradiation unit, the light receiving unit, and the nozzle member for the distance detection, and the position of the chip component adsorbed to the nozzle member is determined based on the position of the corner. The displacement and the inclination are determined.

According to this method, any one of the light sources of the irradiating section selectively emits light to the chip component, and the distance from the projected end on the light receiving section formed by this to the reference position, and this distance The position of the corner of the chip component is determined from known data on the positional relationship between the light source, the light receiving unit, and the nozzle member involved in the detection, and the positional deviation and inclination of the chip component are determined from the position of the corner. Therefore, as compared with the conventional apparatus that sequentially samples and processes the detection data of the distance and the nozzle rotation angle while rotating the nozzle member to obtain the minimum value of the distance, the positional deviation and inclination of the chip component are obtained with less detection data. It becomes possible.

In this method, the chip component is irradiated with diffused light sequentially from two different light sources among the plurality of point light sources, and a reference position on the light receiving section corresponding to the diffused light from each light source is obtained. By detecting the distances to the ends of the projections respectively, determining the position of one corner of the chip component based on these distances and the positional relationship between each of the light sources, the light receiving unit and the nozzle member, and repeating this process. If the positions of at least two corners of the chip component are obtained, and the positional deviation and inclination of the chip component adsorbed on the nozzle member are obtained based on the positions of these corners, the position of the chip component adsorbed on the nozzle member is obtained. The displacement and the inclination can be easily calculated.

The direction of arrangement of the irradiating section and the light receiving section is defined as the X-axis direction with the nozzle member as the origin, and the direction orthogonal to the X-axis direction is defined as the Y-axis direction. The chip component is sequentially irradiated with diffused light from two different light sources among the two light sources to determine the position of the corner in the Y-axis direction, and then different under a second nozzle rotation angle obtained by rotating the nozzle member by approximately 90 °. The chip component is sequentially irradiated with diffused light from the two light sources to determine the Y-axis position of the corner, and the Y-axis position of the corner under the second nozzle rotation angle is determined by the first rotation angle. If the position of the corner is determined as the position of the corner in the X-axis direction, the position of the corner can be determined more accurately.

According to the present invention, there is provided a mounting machine provided with an optical detecting means for irradiating a chip component adsorbed on a nozzle member provided in a head unit of the mounting machine with light to detect a projection of the chip component. An irradiating section having a plurality of point light sources and irradiating the chip component with diffused light from these light sources; and a light receiving section receiving light at a position opposed to the irradiating section with the chip component interposed therebetween. Means for selectively irradiating diffused light from a light source suitable for projecting a corner of a chip component among the respective light sources of the irradiating section, and configuring the optical detection means, and projection detection data from the light receiving section. The position of the corner of the chip component is determined based on predetermined data indicating the positional relationship between the light source of the irradiation unit, the light receiving unit, and the nozzle member according to the projection detection data, and the position of the corner is determined based on the position of the corner. It is provided with a a processing means for determining the positional deviation and inclination of the adsorbed chip component seal member.

According to this apparatus, it is possible to automatically determine the displacement and the inclination of the chip component adsorbed on the nozzle member based on the above method.

[0016]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show an example of a mounting machine provided with the apparatus of the present invention. As shown in the figure, a conveyor 2 for transporting a printed board is arranged on a base 1 of a mounting machine, and a printed board 3 is transported on the conveyor 2 and stopped at a predetermined mounting work position. It has become. A component supply unit 4 is arranged on the side of the conveyor 2. The component supply unit 4 includes a component supply feeder, for example, a multi-row tape feeder 4a.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located. In this embodiment, the head unit 5 is in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the X-axis on a horizontal plane). (In the direction perpendicular to the direction).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 driven to rotate by a Y-axis servomotor 9 are disposed on the base 1, and a head unit is mounted on the fixed rail 7. A support member 11 is provided, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. The support member 11 has X
An axially extending guide member 13 and an X-axis servomotor 1
The head unit 5 is movably supported by the guide member 13, and a nut portion (not shown) provided on the head unit 5 is attached to the ball screw shaft 14. It is screwed to the screw shaft 14. The operation of the Y-axis servomotor 9 causes the support member 11 to move in the Y-axis direction, and the operation of the X-axis servomotor 15 causes the head unit 5 to move in the X-axis direction with respect to the support member 11. Has become. The Y-axis servo motor 9 and the X-axis servo motor 15
Have encoders 10, which detect the respective drive positions,
16 are provided.

The head unit 5 is provided with a nozzle member 21 for sucking chip components. The nozzle member 21 is attached to the frame of the head unit 5 so as to be able to move in the Z-axis direction (vertical direction) and rotate around the R-axis (nozzle center axis). It is operated by a shaft servomotor 24. The Z-axis servo motor 22 and the R-axis servo motor 24 are provided with encoders 23 and 25 for detecting respective drive positions. Further, a negative pressure supply means is connected to the nozzle member 21 via a valve or the like, so that a negative pressure from the negative pressure supply means is supplied to the tip of the nozzle member 21 at a predetermined timing during component suction. ing.

At the lower end of the head unit 5, a detection unit 30 constituting optical detection means is mounted. As shown in FIGS. 3 and 4, the detection unit 30 irradiates light to the chip component 20 in a state where the chip component 20 is attracted to the nozzle member 21, and detects the projection of the component 20. The irradiation unit 31 and the light receiving unit 35 are provided at positions facing each other across a space 37 through which the nozzle member 21 moves up and down.

The irradiation unit 31 of the detection unit 30 includes
For example, a plurality of point light sources including LEDs are provided. In the illustrated example, eight light sources 32a to 32h (first light source 32a to eighth light source 32h) are provided side by side at predetermined intervals in the Y-axis direction.
A slit 34 extending substantially horizontally is formed in the wall plate 33 located in front of the irradiation direction (to the side facing the space 37) from the light source 32 to the diffused light that spreads substantially horizontally from the light source 32 through the slit 34. It is designed to be irradiated. On the other hand, the light receiving section 35 is provided with a line sensor 36 in which light receiving elements such as CCDs are linearly arranged.

FIG. 5 is a block diagram showing a schematic configuration of the control system. In this figure, a control device 40 mounted on a mounting machine includes a CPU 41 having a function as an arithmetic processing unit for checking a chip component suction state, a motor control unit 42 for driving the mounting machine, An A / D converter 43 and a data acquisition controller 44 for processing a signal from the light receiving unit 35, a memory 45, and light sources of the first light source 32a to the eighth light source 32h of the detection unit 30 are selectively made to emit light. And a light source controller 46.

The motor control unit 42 has a Y axis, an X axis, a Z axis,
The axis and R axis servo motors 9, 15, 22, and 24 are connected, and the drive of each servo motor 9, 15, 22, 24 is controlled by the motor control unit 42 in response to a command from the CPU 41. Has become. The CPU 4
The first light source 32a to the eighth light source 32h are selectively caused to emit light by the light source control unit 46 in response to a command from the first unit 1, and the measurement data sent from the light receiving unit 35 of the detection unit 30 is subjected to A / D conversion. The data is fetched by the data fetch control unit 44 via the unit 43 and stored in the memory 45, and this data is read by the CPU 41.

The CPU 41 includes the head unit 5
Suction by the nozzle member 21 of the detection unit 3
The motors 9, 15, 22, 24 are controlled via the motor control unit 42 so that the detection of the component suction state using the “0” and the mounting of the components on the printed circuit board 3 are sequentially performed. At the time of detection, the light source control unit 46
The first light source 32a to the eighth light source 32h are selectively irradiated with diffused light via the light source, and the data capture control unit 44 captures the projection detection data from the light receiving unit 35 of the detection unit 30. The projection detection data and the first
Based on predetermined data indicating the positional relationship between the light sources 32a to 32h, the light receiving unit 35, and the nozzle member 21, the component suction state by the nozzle member 21, that is, the positional shift and inclination of the chip component 20 with respect to the nozzle member 21 are determined. Find out.

The detection of the component suction state is carried out, for example, by detecting light in the detection unit 30 by sequentially irradiating diffused light from two predetermined light sources among the first light source 32a to the eighth light source 32h. The projection of the component is measured, and the distance from a reference position, which will be described later, to the end of the projection by each light source is detected on the light receiving unit 35. The distance and the two sets of light sources of the irradiation unit 31, the light receiving unit 35, and the nozzle The position of one corner of the chip component 20 is determined from known data on the positional relationship of the member 21. Similarly, two different sets of light sources sequentially emit light to determine the positions of the other two corners of the chip component 20, and based on the positions of the three total corners, the displacement of the chip component 20 sucked by the nozzle member 21. The displacement of the component center with respect to the nozzle center and the inclination are checked, and the X-direction correction amount ΔX, the Y-direction correction amount ΔY, and the rotation angle correction amount Δθ, which are the corresponding correction amounts of the mounting position, are calculated.

Such a process will be specifically described with reference to FIGS. In these figures, Cn is the center of the nozzle (the nozzle member 21) which is the center of rotation of the chip component.
, Cc is the center of the chip component 20, O is the light receiving section 3
5, a fourth light source 3 in the illustrated example.
2d. Ro is a center line connecting the light source 32 and the origin O, and Rc is a line passing through the nozzle center Cn at right angles to the center line Ro. Further, in the examples shown in these figures, the nozzle center Cn is located on the center line Ro.

For example, as shown in FIG.
In the suction state of X, X-
Considering the Y coordinate system, the coordinates of the center Cc of the chip component 20 are (X0, Y0), and the coordinates of the diagonal corners P1, P2 of the chip component 20 are (X1, Y1), (X2,
Assuming that Y2), the coordinates of the center Cc of the chip component 20, that is, the displacement of the chip component 20 are obtained as follows.

[0029]

X0 = (X1 + X2) / 2 Y0 = (Y1 + Y2) / 2 If the coordinates of the corner P3 other than the corners P1 and P2 are (X3, Y3), the inclination θ of the chip component 20
(Rotation angle) is obtained as follows.

[0030]

Tan θ = (Y3-Y1) / (X3-X1) Therefore, θ = arc tan {(Y3-Y1) / (X3-X1)} Therefore, first, the first light source 32a and the second light source 32b The projection is formed by sequentially irradiating diffused light, and the distance from the origin O on the light receiving unit 35 to the end of the component projection, that is, the light is blocked by the corner P1 from the origin O as shown in FIG. The distances L and L 'to the ends are measured, and the Y coordinate of the end of the component projected by the light from the light sources 32a and 32b is determined. Specifically, the Y coordinate can be easily obtained by considering the sign of the actually measured value.

Here, Zo: the distance from each of the light sources 32a to 32h to the nozzle center Cn Z; the distance from each of the light sources 32a to 32h to the light receiving unit 35 Le1 to Le8; the Y coordinate of each of the light sources 32a to 32h; If the Y coordinate of the end of the component projection by the light of the light source 32a is L1 and the Y coordinate of the end of the projection by the light of the second light source 32b is L2, the following two equations are established.

[0032]

(Zo-X1) / Z = (Le1-Y1) / (Le1-L1) (Zo-X1) / Z = (Le2-Y1) / (Le2-L2) Therefore, the corner P1 Are obtained as follows.

[0033]

## EQU4 ## Y1 = (Le1 · L2-Le2 · L1) / ｛(Le1
-L1)-(Le2-L2)｝ X1 = Zo-Z · (Le1-Le2) / ｛(Le1-L1)-
(Le2-L2)} Similarly, as shown in FIG. 7, the third light source 32c and the fourth light source 32d sequentially emit diffused light, and
The distances L and L 'from the origin O above to the projection end formed by blocking the light by the corner P2 are measured to determine the Y coordinate of the projection end by the light from the light sources 32c and 32d. . Here, assuming that the Y coordinate of the projection end by the light of the third light source 32c is L1, and the Y coordinate of the projection end by the light of the fourth light source 32d is L2, the following two equations are established.

[0034]

(Zo-X2) / Z = (Le3-Y2) / (Le3-L1) (Zo-X2) / Z = (Le4-Y2) / (Le4-L2) Therefore, the coordinates of the corner P2 are as follows. Is required.

[0035]

Y2 = (Le3 · L2-Le4 · L1) / ｛(Le3
−L1) − (Le4-L2)｝ X2 = Zo−Z · (Le3-Le4) / ｛(Le3-L1) −
(Le4-L2)｝ Further, as shown in FIG. 8, the fifth light source 32e and the sixth light source 32f sequentially emit diffused light, and the light is blocked by the corner P3 from the origin O on the light receiving unit 35. The distance to the formed projection end is measured, and the Y coordinate of the projection end by the light of each of the light sources 32e and 32f is determined. Here, assuming that the Y coordinate of the projection end by the light of the fifth light source 32e is L1 and the Y coordinate of the projection end by the light of the sixth light source 32f is L2, the following two equations are established.

[0036]

(Zo-X3) / Z = (Le5-Y3) / (Le5-L1) (Zo-X3) / Z = (Le6-Y3) / (Le6-L2) Therefore, the coordinates of the corner P3 are as follows. Is required.

[0037]

Y8 = (Le5 · L2-Le6 · L1) / ｛(Le5
−L1) − (Le6-L2)｝ X3 = Zo−Z · (Le5-Le6) / ｛(Le5-L1) −
(Le6−L2)｝ That is, Zo, Z and Le1 to Le6 are known values checked in advance, and therefore, the distances L and L ′ from the origin O on the light receiving unit 35 to the component projection end are detected. Then, the coordinates of the corners P1, P2, and P3 are obtained.
From Equation 2 and Equation 2, the displacement and inclination of the chip component 20 are obtained. Then, based on the displacement and the inclination, X
Direction correction amount ΔX, Y direction correction amount ΔY, and rotation angle correction amount Δ
θ is required.

By the way, as described above, each corner P
In the process of obtaining the coordinates of 1, P2, and P3, there is a difference between the detection accuracy in the X-axis direction and the detection accuracy in the Y-axis direction.

That is, as shown in FIG. 12, when the chip component 20 (shown by a solid line) is displaced by the same distance (PΔX = PΔY) in the X-axis direction and the Y-axis direction, respectively, When α is sufficiently small, as compared with the variation ΔLY when the chip component 20 is displaced in the Y-axis direction as shown in FIG. , The amount of change ΔLX when displaced in the X-axis direction becomes extremely small.

Therefore, as a device for obtaining the coordinates in the X-axis direction with higher accuracy, the nozzle member 21 is rotated by 90 ° from the state shown in FIGS. 6 to 8, and in this state, the light is diffused from the first light source 32a to the eighth light source 32h. By irradiating light, the distance from the origin O on the light receiving unit 35 to the end of the component projection is measured, and the Y-axis coordinates of the corners P1, P2, and P3 are obtained in the same manner as described above. That is, by rotating the chip component 20 by 90 degrees and detecting the Y-axis coordinates of the corners P1, P2, and P3, the corners P1, P2, and P before rotation are detected.
The X-axis coordinate of No. 3 is converted into the Y-axis coordinate to be detected.

Specifically, as shown in FIG. 9, the fifth light source 32e and the sixth light source 32f sequentially emit diffused light, and the light is blocked by the corner P1 from the origin O on the light receiving section 35. The distances L and L 'to the ends of the component projections thus formed are measured, and the Y coordinates of the projection ends of the light sources 32e and 32f are obtained based on the measured distances. Then, assuming that the Y coordinate of the projection end by the light of the fifth light source 32e is L1, the Y coordinate of the projection end by the light of the sixth light source 32f is L2, and the coordinates of the corner P1 are (X1 ', Y1').

[0042]

(Zo-X1 ') / Z = (Le5-Y1') / (Le5-L1) (Zo-X1 ') / Z = (Le6-Y1') / (Le6-L2) From these equations, the Y-axis coordinate of the corner P1 is obtained as follows.

[0043]

Y1 '= (Le5 · L2-Le6 · L1) / ｛(L
e5-L1)-(Le6-L2)} Accordingly, the X-axis coordinates of the corner P1 before the component rotation are as follows.

[0044]

X1 = -Y1 'Similarly, as shown in FIG. 10, diffused light is sequentially emitted from the seventh light source 32g and the eighth light source 32h, and the light is blocked by the corner P2 from the origin O on the light receiving section 35. Then, the distances L and L 'to the projection end formed as a result are measured to determine the Y coordinate of the projection end by the light from the light sources 32g and 32h. Then, the Y coordinate of the projection end by the light of the seventh light source 32g is L1, the Y coordinate of the projection end by the light of the eighth light source 32h is L2, and the coordinates of the corner P2 are (X2 ', Y
2 ')

[0045]

(Zo−X2 ′) / Z = (Le7−Y2 ′) / (Le7−L1) (Zo−X2 ′) / Z = (Le8−Y2 ′) / (Le8−L2) From these equations, the Y-axis coordinate of the corner P2 is obtained as follows.

[0046]

Y2 ′ = (Le7 · L2-Le8 · L1) / ｛(L
e7-L1)-(Le8-L2)｝ Accordingly, the X-axis coordinates of the corner P2 before the component rotation are as follows.

[0047]

X2 = -Y2 'Further, as shown in FIG. 11, the third light source 32c and the fourth light source 32d sequentially emit diffused light, and the light is blocked by the corner P3 from the origin O on the light receiving section 35. Then, the distances L and L 'to the projection end formed by the measurement are measured, and the Y coordinate of the projection end by the light from the light sources 32c and 32d is obtained. Then, the Y coordinate of the projection end of the light from the third light source 32c is L1, the Y coordinate of the projection end of the light of the fourth light source 32d is L2, and the coordinates of the corner P3 are (X3 ', Y
3 ')

[0048]

(Zo-X3 ') / Z = (Le3-Y3') / (Le3-L1) (Zo-X3 ') / Z = (Le4-Y3') / (Le4-L2) From these equations, the Y-axis coordinate of the corner P3 is obtained as follows.

[0049]

Y3 '= (Le3 · L2-Le4 · L1) / ｛(L
e3-L1)-(Le4-L2)} Accordingly, the X-axis coordinates of the corner P3 before the component rotation are as follows.

[0050]

X3 = -Y3 'Thus, each corner P1, P2 of the chip component 20 is obtained.
And the X-axis coordinates of P3, the detection accuracy in the X-axis coordinates and the detection accuracy in the Y-axis direction can be made substantially equal.

Next, an example of control for component mounting performed by the control device 40 will be described with reference to the flowchart of FIG.

When the process shown in the flowchart of FIG. 13 starts, first, the movement of the head unit 5 in the X and Y directions toward the component supply unit and the rotation (θ movement) of the nozzle member 21 are performed (step S1), When the nozzle member 21 is moved to the position, the nozzle member 21 is lowered (step S2), and the chip component 20 is sucked (step S3). Next, the nozzle member 2 is moved until the chip component 20 reaches a component detection height position corresponding to the irradiation unit 31 and the light receiving unit 35 of the detection unit 30.
1 is raised (step S4). Upon reaching the component detection height position, the process proceeds to a component position detection process described below.

In the component position detecting process, the diffused light is sequentially emitted from the first light source 32a and the second light source 32b of the irradiating section 31, and the light receiving section 35 of the detecting unit 30 is correspondingly illuminated. Is read, and the Y-axis coordinate (Y1) of the corner P1 of the chip component 20 is read.
Is obtained (steps S5 to S7). Similarly, diffused light is sequentially emitted from the third light source 32c and the fourth light source 32d, and measurement data from the light receiving unit 35 of the detection unit 30 is read in response to each of these illuminations. The Y-axis coordinate (Y2) of P2 is obtained, and the measurement data from the light receiving unit 35 for irradiation from the fifth light source 32e and the sixth light source 32f is read.
The Y-axis coordinates (Y3) of the corner P3 of the chip component 20 are obtained (Steps S8 to S13).

Then, after the nozzle member 21 is rotated by about 90 ° (step S14), the fifth light source 3
2e and the sixth light source 32f sequentially irradiate diffused light, read measurement data from the light receiving unit 35 of the detection unit 30 corresponding to each irradiation, and determine a Y-axis coordinate (Y1 ') based on the data. As a result, the X-axis coordinate (X
1) is obtained (step S15 to step S1)
7). Similarly, the seventh light source 32g and the eighth light source 32h
From the light receiving unit 35 of the detection unit 30 corresponding to each of these irradiations, and the X-axis coordinates (X
2) is obtained, and further, measurement data from the light receiving unit 35 for irradiation from the third light source 32c and the fourth light source 32d is read, and the Y-axis coordinates (X
3) is obtained (Steps S18 to S2)
3).

Then, the correction amounts ΔX, ΔY, Δθ are obtained based on the coordinate data of the corners P1, P2, and P3 obtained in the processing of steps S5 to S23 (step S24).

After completion of the component position detection process, the mounting position is corrected based on the correction amounts ΔX, ΔY, and Δθ (step S25). That is, the correction amount ΔX,
The X-axis servomotor 15 and the Y-axis servomotor 9 are controlled such that the nozzle member 21 reaches the target mounting position in the X and Y directions corrected by ΔY, and the nozzle member 21 is controlled.
The R-axis servomotor 24 is controlled such that the rotation angle of the R becomes the target rotation angle corrected by the correction amount Δθ. Then, the nozzle member 21 is lowered and the component 20 is mounted on the printed board 3 (Step S26).

According to the apparatus of the above-described embodiment, the first light source 32 of the irradiation unit 31 is
a to the eighth light source 32h are selectively emitted, and the detection data of the distance from the projection end to the origin O on the light receiving unit 35 formed by the light source and the first light source 32a to the eighth light source 32h,
Known data indicating the positional relationship between the light receiving unit 35 and the nozzle member 21 (the distance Zo from the light source 32 to the nozzle center Cn,
The positions of the corners P1, P2 and P3 of the chip component 20 are obtained from the distance Z from the light source 32 to the light receiving portion 35 and the distances Le1 to Le8 from the straight line Rc to the light sources 32a to 32h, and based on this, the nozzle center is determined. The correction amounts ΔX, ΔY, Δθ according to the positional deviation between the position Cn and the component center position Cc and the angular deviation in the nozzle rotation direction are obtained.
Therefore, compared to a conventional device that sequentially samples and processes the above-described distance and nozzle rotation angle detection data while rotating the nozzle member to obtain the minimum value of the distance to the projection end on the light receiving unit, the chip component is Very little data needs to be detected and processed to check for positional deviations, etc.
Therefore, it is possible to effectively reduce the time required for processing for examining the displacement of the chip component and the like.

In particular, in the conventional apparatus that performs processing while rotating the nozzle member to obtain the minimum value of the distance to the projection end, the time required to detect the minimum value differs depending on the amount of displacement of the chip component. Although the time required for the processing for checking the positional deviation and the like will vary, the apparatus of the above-described embodiment does not require the processing for detecting the minimum value unlike the related art, and therefore, regardless of the amount of deviation of the chip component. It is possible to check the displacement of the chip component or the like in a fixed time.

The device of the present invention is not limited to the above embodiment, but can be variously modified.

For example, the irradiation unit 3 of the detection unit 30
In No. 1, the first to eighth light sources 32a to 32h are arranged side by side at predetermined intervals in the Y-axis direction to selectively emit light. Are the size of the chip component 20 to be detected, the detection width of the line sensor 36, or the allowable chip component 2
Corner P of the chip component 20 according to the displacement of 0, etc.
1, P2 and P3 may be appropriately selected so that they can be appropriately detected. In this case, a dedicated light source can be provided for each detection of the X-axis coordinates and the Y-axis coordinates of the corners P1, P2, and P3 of the chip component 20, but, as in the above embodiment, for example, the Y-axis of the corner P2 If a configuration is adopted in which the coordinate detection (steps S8 and S9) and the X-axis coordinate of the corner P3 (steps S21 and S22) can be performed using a common light source (the third light source 32c and the fourth light source 32d). The configuration of the irradiation unit 31 can be simplified by reducing the number of light sources.

Although not particularly described in the above embodiment, in the case where two projection ends are formed on the light receiving section 35 due to the number of light sources to be installed and the arrangement interval, for example, a corner may be used. In the case where the position of P1 is obtained, if light is blocked by a portion other than the corner P1 and a projection end is formed on the light receiving unit 35, the position of the chip component 20 may be estimated. Within the range, the light receiving unit 3
The data regarding the area of the projection end by the corner P1 formed on the surface 5 is obtained in advance, and at the time of actual measurement, the projection end by the corner P1 is detected based on this data to determine the origin O.
The distance from to the projection end may be measured.
However, when the projected end portion of the two corners can be formed on the light receiving portion 35 at the same time, the positions of the two corners can be detected at the same time. Alternatively, the distance from to both projection ends may be measured.

In the above embodiment, the chip component 20
Correction amounts .DELTA.X, .DELTA.Y, .DELTA..theta. Are obtained based on the positions of the corners P1, P2, and P3 of the chip component 20, however, the shape of the chip component 20 is stored as known data in advance, and for example, the corners P1 and The position of P3 may be determined, and the corner P2 may be calculated from this data and the known data indicating the part shape.

Further, in the above embodiment, the chip component 2
From the viewpoint of improving the detection accuracy of the corners P1, P2, and P3 of the X-axis in the X-axis direction, the chip component 20 is rotated by 90 ° to determine the Y-axis coordinates of the corners P1, P2, and P3. The conversion is made to the X-axis coordinates before rotation. Of course, in the case where the Y-axis coordinates obtained by the above formulas 4, 6, and 8 can be adopted in consideration of the mounting accuracy, the chip is not necessarily used. It is not necessary to rotate the component 20 by 90 degrees to perform the process of detecting the positions of the corners P1, P2 and P3.

[0064]

According to the present invention, an optical detecting means is provided by an irradiating section for irradiating the chip component adsorbed by the nozzle member with diffused light and a light receiving section opposed to the irradiating section with the chip component interposed therebetween. Along with the configuration, a plurality of point light sources are arranged in the irradiating section, and diffused light is selectively irradiated from these light sources to the chip component to measure the projection of the component in the light receiving section. The position of the corner of the chip component is determined from the distance from the predetermined reference position to the end of the projection and the known data on the positional relationship between the light source, light receiving unit, and nozzle member for this distance detection. Since the positional deviation and inclination of the chip component adsorbed on the nozzle member are obtained based on the nozzle member, the nozzle member is rotated while obtaining the minimum value of the distance to the end of the projection on the light receiving unit. Serial distance and sequentially samples the detection data of the nozzle rotation angle, compared to the conventional apparatus for processing,
The data to be detected and processed in order to check the displacement of the chip component and the like can be reduced, so that the processing efficiency of the component suction state detection can be improved. In addition, since the process for obtaining the minimum value of the distance is not required, the time required for the process can be made uniform irrespective of the component suction state.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an example of a mounting machine to which the present invention is applied.

FIG. 2 is a schematic front view of the same.

FIG. 3 is a main part plan view showing an example of a detection unit according to one embodiment of the present invention.

FIG. 4 is a perspective view of the same.

FIG. 5 is a block diagram showing a control system of the mounting machine.

FIG. 6 is an explanatory diagram showing a specific stage (detection of a Y-axis coordinate of a corner P1) in detecting a position of a chip component.

FIG. 7 is an explanatory diagram showing a specific stage (detection of a Y-axis coordinate of a corner P2) in chip component position detection.

FIG. 8 is an explanatory diagram showing a specific stage (detection of Y-axis coordinates of corner P3) in position detection of a chip component.

FIG. 9 is an explanatory diagram showing a specific stage (detection of the X-axis coordinate of the corner P1) in the position detection of the chip component.

FIG. 10 is an explanatory diagram showing a specific stage (detection of an X-axis coordinate of a corner P2) in position detection of a chip component.

FIG. 11 is an explanatory view showing a specific stage (detection of the X-axis coordinate of the corner P3) in the position detection of the chip component.

FIG. 12 is a diagram illustrating the difference between the detection accuracy in the X-axis direction and the detection accuracy in the Y-axis direction in detecting the position of the chip component.

FIG. 13 is a flowchart illustrating a component mounting operation including a process of detecting a position of a chip component.

[Explanation of symbols]

 Reference Signs List 5 head unit 20 chip component 21 nozzle member 24 R-axis servo motor 30 detection unit 31 irradiation unit 32a to 32h first light source to eighth light source 35 light receiving unit 36 line sensor 40 control device

Claims (4)

(57) [Claims] An irradiation unit for irradiating light to a chip component adsorbed on a nozzle member provided in a head unit of a mounting machine, and light at a position opposed to the irradiation unit with the chip component interposed therebetween. The projection of the chip component is detected by optical detection means having a light receiving portion for receiving light , and
A method for detecting a position of the chip component attracted to the upper Symbol nozzle member on the basis of it the diffused light to the irradiation unit
A plurality of point light sources to be illuminated and illuminated are provided side by side, and the projection of the chip component in the light receiving unit is measured by selectively irradiating the chip component with diffused light from these light sources.As a process based on the component projection measurement, Detect the distance from the predetermined reference position on the light receiving unit to the end of the projection, this distance,
The position of the corner of the chip component is determined from the known data about the positional relationship between the light source of the irradiation unit, the light receiving unit, and the nozzle member for the distance detection, and the position of the chip component adsorbed to the nozzle member is determined based on the position of the corner. What is claimed is: 1. A method for detecting a position of a chip component, comprising: obtaining a displacement and an inclination. 2. A method of irradiating diffused light to the chip component sequentially from two different light sources among the plurality of point light sources, and projecting the projected light from a reference position on the light receiving unit corresponding to the diffused light from each light source. Detecting the distances to the ends, obtaining the position of one corner of the chip component based on these distances and the positional relationship between the light source, the light receiving unit and the nozzle member, and repeating this process, 2. The chip component position detecting method according to claim 1, wherein the positions of at least two corners are obtained, and the positional deviation and inclination of the chip component sucked by the nozzle member are obtained based on the positions of these corners. Wherein the said irradiator nozzle member as the origin the arrangement direction of the light receiving portion with the X-axis direction, a direction orthogonal to the Y-axis direction, the under first nozzle rotation angle
A chip component is irradiated with diffused light sequentially from two different light sources among a plurality of point light sources to determine a position of a corner in the Y-axis direction, and then a second nozzle rotation angle obtained by rotating the nozzle member by approximately 90 ° By irradiating the chip component sequentially with diffused light from two different light sources below, the position of the corner in the Y-axis direction is obtained,
The position of the corner is determined as the position of the corner in the Y-axis direction under the second nozzle rotation angle as the position of the corner in the X-axis direction under the first rotation angle. The method for detecting the position of a chip component described in the above. 4. A mounting machine provided with an optical detecting means for irradiating light to a chip component adsorbed on a nozzle member provided in a head unit of the mounting machine and detecting the projection of the chip component. The optical detection is performed by an irradiating section having a light source having a rectangular shape and irradiating the chip component with diffused light from these light sources, and a light receiving section receiving light at a position opposed to the irradiating section with the chip component interposed therebetween. Means for selectively irradiating diffused light from a light source suitable for projecting a corner of a chip component among light sources of the irradiation unit, and projection detection data from the light receiving unit and the projection detection data. The position of the corner of the chip component is determined based on predetermined data indicating the positional relationship between the light source, the light receiving unit, and the nozzle member of the irradiating unit, and the position of the corner is determined based on the position of the corner. A chip component position detecting device provided with arithmetic processing means for calculating the positional shift and inclination of the chip component.