JP3957839B2 - Non-contact positioning method and apparatus for chip parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for non-contact positioning of a chip component, and more specifically, a symmetrical chip component (and a minute object having a symmetrical shape) such as an IC, a resistor, or a capacitor is used as a substrate. The present invention relates to a mounting method and an apparatus for mounting the same accurately on the above.
[0002]
[Prior art]
The positioning of chip parts in the prior art uses a wide CCD sensor in the detection area to detect the width of both sides of the part projected by the nozzle and the part in the detection area, and compares these two data Thus, a method for obtaining the positional deviation is well known.
[0003]
[Problems to be solved by the invention]
However, the positioning using the CCD sensor described above has a problem that it is wide and requires detection of the light widths on both sides of the component, so that an expensive sensor is required.
[0004]
In addition, there is a problem that positioning by the CCD sensor requires complicated calculation.
[0005]
Therefore, there is a problem that an inexpensive sensor can be used and that it is necessary to solve the problem of improving mounting efficiency by using signal processing by a simple and fast calculation method.
[0006]
[Means for Solving the Problems]
The non-contact positioning method for a chip component according to the present invention that solves the above problem is symmetrical at a position where the edge of the light beam coincides with the center line of the suction nozzle that sucks the chip component in the detection area composed of parallel light beams. The chip component having a shape is rotated, and the chip component is positioned based on the projected width of the rotated chip component.
[0007]
Further, the chip component recognizes the position where the projected width of the position where it is first placed at the minimum value as the same direction as the parallel light beam, and the surface of the chip component and the parallel light beam from the position are in the same direction. The chip component is positioned based on the projected width rotated in this manner.
[0008]
A non-contact positioning device for a chip component includes a nozzle portion having a suction nozzle that moves a chip component having a symmetric shape in a rotatable manner, a light emitting unit that generates parallel light beams of a predetermined width, and a light receiving unit that receives the parallel light beams And the chip component is placed at a position where the edge of the light beam coincides with the center line of the suction nozzle that sucks the chip component in the parallel light beam detection area between the light emitting unit and the light receiving unit. Positioning means for positioning the chip component with a projection width obtained by rotating the.
[0009]
Further, the positioning means recognizes the position where the projection width of the chip component first placed in the detection area is minimized as the same direction as the parallel light beam, and the parallel light beam from the position to the surface of the chip component. In other words, the chip component is positioned with the projection width rotated so as to be in the same direction. This chip component is formed of four symmetrical quadrangular surfaces.
[0012]
The non-contact positioning method and apparatus for a chip component having such a configuration only needs to analyze the projection width by parallel rays, so that the structure for analyzing the component position can be simplified, Since the analysis can be performed very easily, the processing time can be greatly shortened, and the cost can be suppressed by providing a unit for irradiating and receiving parallel rays.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, an apparatus that embodies a non-contact positioning method for chip parts according to an embodiment of the present invention will be described with reference to the drawings.
[0014]
As shown in FIGS. 1 and 2, the chip component non-contact positioning device 10 constitutes a so-called parallel light linear sensor unit in which the chip component 11 is opposed to each other with a sufficient distance to move freely. The light emitting unit 12 and the light receiving unit 13, the sensor controller 14 for controlling the light emitting unit 12 and the light receiving unit 13, the arithmetic unit 15 for transmitting and receiving various signals to the sensor controller 14, and the main body for controlling the arithmetic unit 15 And a control unit 16.
[0015]
The chip component 11 is a symmetrical rectangular chip having four surfaces in the present embodiment, and the upper part is adsorbed by the nozzle unit 20 and is rotatably arranged at a predetermined position. In the embodiment, the chip is formed in a rectangular quadrilateral shape, but is not limited thereto.
[0016]
The light emitting unit 12 includes a parallel light irradiation unit 18 including a slit that irradiates a predetermined parallel light 17.
[0017]
The light receiving unit 13 is provided with a slit-shaped parallel light receiving unit 19 that receives the parallel light 17 from the parallel light irradiation unit 18.
[0018]
In the chip positioning device 10 having such a structure, first, as shown in FIG. 3, the edge of the light beam in the detection area of the parallel light beam 17 between the light emitting unit 12 and the light receiving unit 13 attracts the chip component. The chip component 11 is placed at a position that coincides with the center line of the nozzle. It is assumed that the surfaces S2 and S4 (X-axis direction) in the symmetric long direction and the surfaces S1 and S3 (Y-axis direction) in the short direction at this time are formed and projected onto the surface S1. Then, a projection portion is generated by the surface S1 irradiated with the parallel light beam 17.
[0019]
Next, as shown in FIG. 4, the center part P of the position where the projected portion X1 by the surface S1 of the chip component 11 is set to the minimum value is rotated. Assuming that the rotation angle is θc, the chip centerline θ from the center position in the longitudinal direction of the chip and the axis θ1 at the rotation angle θc are in the direction of the coaxial line with the parallel light beam 17 and the surface S1 of the chip component 11 is It is recognized that it is in the same direction as the parallel light beam 17.
[0020]
In this state, as shown in FIG. 5, when rotated 90 degrees rightward about the center position P, a direction θ2 orthogonal to the longitudinal centerline θ1 of the chip component 11 is obtained. At this time, the projected portion Y1 obtained on the surface S4 projected by the parallel light beam 17 is detected, and it is recognized that the surface S3 of the chip component and the parallel light beam 17 are in the same direction.
[0021]
Next, as shown in FIG. 6, when it is further rotated 90 degrees clockwise about the center position P, it becomes the position direction θ3 rotated by 180 degrees from the axis θ1 and is projected by the parallel rays 17 at this time. The projected portion X2 obtained on the surface S3 is detected to recognize that the parallel light beam 17 and the surface S2 of the chip component 11 are in the same direction.
[0022]
Next, as shown in FIG. 7, when it is further rotated 90 degrees clockwise about the center position P, it becomes the position direction θ4 rotated by 270 degrees from the axis θ1 and is projected by the parallel rays 17 at this time. The projected portion Y2 obtained on the surface S2 is detected to recognize that the surface S1 of the chip part 11 and the parallel light beam 17 are parallel.
[0023]
Now, the projection portions X1, Y1, X2, and Y2 detected in this way are detected while the chip component 11 is rotated. That is, as shown in FIGS. 2 and 8, the calculation unit 15 calculates the return signal from the main body control unit 16 and the encoder information. Specifically, by using encoder information of a θ-axis drive motor (not shown), a synchronization signal is output to the sensor controller 14 only when the angle reaches 90 degrees, 180 degrees, and 270 degrees, and the projection width output signal at that time is detected. To. The so-called continuous follow method using the projection width at that time as the bottom value is detected using the synchronization signal from the encoder. The procedure will be described below.
[0024]
First,
{Circle around (1)} When the chip component 11 is placed at a position where the parallel light beam 17 is blocked (the state shown in FIG. 3), a return signal is generated.
[0025]
(2) The sensor controller 14 detects the first bottom value (X1) by adjusting the projection portion X1 to the minimum value by the return signal (state shown in FIG. 4). The encoder signal at this time is 0 degrees. Further, the adjustment angle θc at this time is used for the chip component 11 to be placed next.
[0026]
{Circle around (3)} A synchronization signal when rotated 90 degrees from the calculation unit 15 is transmitted to the sensor controller 14.
(4) The sensor controller 14 detects the projection portion Y1, that is, the second bottom value (Y1) (state shown in FIG. 5).
[0027]
(5) When the chip component 11 is further rotated 90 degrees from the encoder (180 degrees in total), a synchronization signal is sent to the sensor controller 14.
(6) The sensor controller 14 detects the projection portion X2, that is, the third bottom value (X2) (state shown in FIG. 6).
[0028]
(7) When the chip component 11 is further rotated 90 degrees from the encoder (total of 270 degrees), a synchronization signal is sent to the sensor controller 14.
(6) The sensor controller 14 detects the projected portion Y2, that is, the fourth bottom value (Y2) (state shown in FIG. 7).
[0029]
The projection portions X1, X2, Y1, and Y2 of the four surfaces S1 to S4 obtained in this way are X1 and X2 and Y1 and Y2 are symmetric surfaces. The amount is given, and the total length is obtained by adding.
[0030]
This formula is
θ axis eccentricity θc
X-axis eccentricity Xc = 1/2 (X1-X2)
Y-axis eccentricity Yc = 1/2 (Y1-Y2)
Total length in X direction XL = X1 + X2
Total length in Y direction YL = Y1 + Y2
It becomes.
[0031]
It should be noted that the detection method described above detects all four surfaces, and thus takes some time. In the case of mass production, since the scale error of the chip part 11 itself is allowed, only the first chip part 11 is detected for all strokes (four faces), and the second chip part 11 is used to detect the two faces. The same calculation result can be obtained by using the detection result of the first chip component 11 together.
[0032]
This formula is
θ-axis eccentricity = θc
X-axis eccentricity XC = 1/2 (XL-2X1)
Y-axis eccentricity YC = 1/2 (YL-2Y1)
Total length in X direction XL First detection result of first component Y Total length in Y direction YL First detection result of component.
[0033]
Next, a non-contact positioning apparatus for chip parts according to a second embodiment of the present invention will be described with reference to FIGS.
[0034]
As shown in FIG. 9, the chip component non-contact positioning device 30 is composed of first and second light emitting units 31 and 32 and first and second light receiving units 33 and 34, and the chip to be arranged. The first light emitting unit 31 and the first light receiving unit 33 are opposed to each other with the component 11 as the center, and the second light emitting unit 32 and the second light receiving unit 34 are opposed to each other.
[0035]
Here, the chip component 11 has a rectangular shape consisting of four symmetrical planes, and its longitudinal axis is taken as the X axis, and its transverse axis is taken as the Y axis. And it is attracted | sucked by the nozzle part 20 and can move to the left-right up-down direction, and rotation.
The sensor controller, the calculation unit, and the main body control unit are the same as those described in the first embodiment shown in FIG.
[0036]
In such a configuration, first, when the chip component 11 is placed at the center position, as shown in FIG. 10, the parallel light beam 17 irradiated from the first light receiving unit 33 is blocked and the projection portion is projected by the first light receiving unit 33. Form. In addition, the parallel light beam 17 irradiated from the second light emitting unit 32 is blocked and the second light receiving unit 34 forms a projection portion.
[0037]
In this state, as shown in FIG. 11, the projection portion X1 (one surface of the chip part 11 in the X-axis direction) of the first light receiving unit 31 is rotated to a minimum, and the eccentric angle θc is obtained. . At the same time, the second light receiving unit 34 obtains the projected portion Y1 (one surface of the chip part 11 in the Y-axis direction). That is, in the initial adjustment, the projected portions of the two surfaces of the X-axis and Y-axis of the chip component 11 can be obtained.
[0038]
Next, as shown in FIG. 12, the projection part X2 in the X-axis direction when the chip component 11 is rotated 90 degrees is obtained by the second light receiving unit 34, and the projection part in the Y-axis direction is obtained by the first light receiving unit 33. Ask. That is, it is possible to obtain a projected portion of two surfaces of the other surface of the X-axis and the Y-axis of the chip component 11 only by rotation of 90 degrees.
[0039]
In this way, it is possible to detect all projected portions of the four surfaces of the square symmetrical chip component 11 by two operations, and to determine the positioning in a non-contact state.
[0040]
【The invention's effect】
As described above, the chip component non-contact positioning method and apparatus according to the present invention project parallel rays onto the surface of a symmetrical chip component, and the chip component is positioned at the projected portion. Thus, there is an effect that it is possible to perform quick and extremely accurate positioning without requiring complicated analysis and structure.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a non-contact positioning apparatus for chip parts according to a first embodiment of the present invention.
FIG. 2 is a schematic overall view of the apparatus.
FIG. 3 is an explanatory diagram showing an initial state (nozzle origin) when a chip component is mounted on the apparatus;
FIG. 4 is an explanatory diagram rotated by an angle θc from the origin of a nozzle on which chip components are mounted in the same apparatus, so that a projected portion X1 is minimized.
FIG. 5 is an explanatory diagram for detecting a projected portion Y1 when the chip component is rotated by 90 degrees.
FIG. 6 is an explanatory diagram for detecting a projection portion X2 when the chip component is further rotated by 90 degrees (180 degrees).
FIG. 7 is an explanatory diagram for detecting a projected portion Y2 when the chip component is further rotated by 90 degrees (270 degrees).
FIG. 8 is a graph showing a relationship between a synchronizing signal synchronized with the rotation of the same θ-axis rotating rotor and a projected portion of the light receiving unit.
FIG. 9 is a schematic perspective view in which a non-contact positioning device for chip parts according to a second embodiment of the present invention is placed in an orthogonal direction.
FIG. 10 is an explanatory view showing an initial state (nozzle origin) when a chip component is mounted on the apparatus;
FIG. 11 is an explanatory diagram showing a projection portion Y1 when the projection portion X1 is rotated by an angle θc so that the projection portion X1 is minimized from the origin of the nozzle on which the chip component is mounted in the apparatus.
12 is an explanatory diagram for detecting projected portions X2 and Y2 when the chip component is rotated 90 degrees. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10; Non-contact positioning device of chip components, 11; Chip components, 12; Light emitting unit, 13; Light receiving unit, 14: Sensor controller, 15; Arithmetic unit, 16: Main body control unit, 17: Parallel beam, 18; Irradiation unit, 19; parallel light receiving unit, 20; nozzle unit, 30; non-contact positioning device for chip components, 31; first light emitting unit, 32; second light emitting unit, 33; first light receiving unit, 34; Receiver unit

Claims (5)

In the detection area consisting of parallel rays, the tip of the symmetrical tip component is rotated at the position where the edge of the ray coincides with the center line of the suction nozzle that sucks the tip component, and the projected width of the rotated tip component A chip component non-contact positioning method characterized in that the chip component is positioned based on the above. The chip component recognizes the position where the projected width of the position where it is first placed at the minimum value as the same direction as the parallel light beam, and from this position, the surface of the chip component and the parallel light beam are in the same direction. 2. The non-contact positioning method for a chip part according to claim 1, wherein the chip part is positioned based on the rotated projection width. A nozzle part equipped with a suction nozzle for moving a symmetrically shaped chip part rotatably;
A light emitting unit for generating parallel light beams of a predetermined width;
A light receiving unit that receives the parallel rays;
The chip component is placed at a position where the edge of the light beam coincides with the center line of the suction nozzle that sucks the chip component in the parallel light beam detection area between the light emitting unit and the light receiving unit, and the chip component is rotated. Positioning means for positioning the chip component with the projected width,
A non-contact positioning device for chip parts. The positioning means includes
The position where the projected width of the chip component initially placed in the detection area is minimized is recognized as the same direction as the parallel light beam, and the surface of the chip component and the parallel light beam are in the same direction from the position. 4. The non-contact positioning apparatus for chip parts according to claim 3, wherein the chip parts are positioned with a rotated projection width. The chip component is
5. The non-contact positioning apparatus for chip parts according to claim 4, wherein the non-contact positioning apparatus is formed of four symmetrical quadrangular surfaces.

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