KR101231185B1 - Chip mounter having apparatus for recognizing absorption condition of chip, method for mounting chip and method for recognizing absorption condition of chip - Google Patents

Abstract

The present invention relates to a component mounter having a component adsorption state recognition device, a component mounting method of the component mounter, and a component adsorption state recognition method.

In the component adsorption state recognition method of the present invention, in the component adsorption state recognition method of recognizing the adsorption state of the component by irradiating a laser beam to the component while descending the component adsorbed to the pickup nozzle, the light source is adsorbed on the pickup nozzle Irradiating a laser beam on the component; And a detector receiving a laser beam irradiated from the light source, and incident only a laser beam in a center of the laser beams of the light source through a slit provided in front of the detector, wherein the detector is descending the pickup nozzle. It changes according to the position of the component adsorbed on, characterized in that for detecting the intensity change of the laser beam of the central portion incident through the slit.

Component Suction Recognition, Slit

Description

Chip mounter having apparatus for recognizing absorption condition of chip, method for mounting chip and method for recognizing absorption condition of chip}

The present invention relates to a component mounter for recognizing and mounting a component, and more particularly, to a component mounter having a component adsorption state recognition device capable of precisely recognizing even a small component, a component mounting method of the component mounter, and a component adsorption state recognition method. will be.

In recent years, the size of electronic components is getting smaller due to the tendency of thin and short electronic products. As a result, in a component mounter such as a chip mounter, when a component is adsorbed and mounted, a tendency to accurately recognize the adsorption and mounting state of the component is used to remove the uninserted and misinserted parts in advance. have.

As a device for recognizing the adsorption state of the microchip in the component mounter, a laser sensor is used, and the prior arts include Patent Nos. 0133963 and Patent No. 0573394.

1 is a view showing a conventional adsorption failure detection device.

Referring to FIG. 1, a conventional adsorption failure detection apparatus has a predetermined distance corresponding to a laser sensor 2 and a laser sensor 2 that emit light with a width of a predetermined height. When the component C is located therebetween, the light-receiving amount is reduced and the output voltage is relatively reduced, and the light-shielding provided to the laser sensor 3 and the laser sensor 3 are relatively reduced. And a main control unit (not shown) for storing the data corresponding values obtained by dividing the area into minute units and subdividing the standard output voltage at this time into minute units.

Conventional adsorption failure detection device is a component (C) adsorbed to the pick-up nozzle (4) passing through the optical path therebetween by a laser sensor (2) and a laser sensor (3) Detects the presence or absence of adsorption.

Then, by comparing the data of the main control unit and the output voltage according to the amount of light received according to the light shielding area of the light-receiving laser sensor (Laser Sensor) 3 to determine the presence and absence of abnormal adsorption.

FIG. 2 is a conceptual view illustrating part recognition of a conventional component mounter, and FIG. 3 is a perspective view of a conventional component mounter.

As shown in FIGS. 2 and 3, in the case of the conventional component mounter 10, a mirror 12 is provided at a lower end of the pickup nozzle 11 that absorbs the component C, thereby providing the component C. ) Can be obtained by the CCD camera 13. When the component C is absorbed or mounted, the mirror 12 is rotated in order to avoid interference with the component C, so that the component C can be avoided from the movement path of the component C.

However, as the size of the component C gradually decreases, when the component is recognized by the CCD camera 13, various foreign substances such as solder paste on the pickup nozzle 11 may be incorrectly recognized as the component. Often occurs. This is a problem that causes a decrease in the reliability of the equipment.

In order to solve the problem of misrecognizing the foreign matter on the pickup nozzle as a part, a separate device for recognizing the state of adsorption of parts, such as Patent No. 0333963, Patent No. 073394 is required.

However, in the sensor used to recognize the microchip, the beam diameter of the light source is too large compared to the part size, so that the part covered by the part is small, and thus the beam intensity of the light source in the detector ( Intensity change is very small.

In addition, the beam intensity change according to the change of the adsorption state of the component is often ambiguous, so there is a difficulty in distinguishing the wrong adsorbed.

Figure 4 is a graph showing the result of recognizing the adsorption state of the parts using the component recognition device as shown in FIG.

In Fig. 4, the horizontal axis represents the Z axis value of the pickup nozzle, and the vertical axis represents the beam intensity change of the light source obtained by the detector.

Referring to FIG. 4, a state in which a component is normally adsorbed (1) and a state in which the component is not adsorbed (2) can be distinguished from each other, but a state in which the component is normally adsorbed (1) and the component are in Moroccan (Manhattan) and As such, it is difficult to clearly distinguish the abnormal adsorption state 3.

The reason for the result as in FIG. 4 will be described below with reference to FIGS. 5A-5C.

FIG. 5A illustrates the adsorption state recognition of the microchip according to the dropping of the pick-up nozzle. FIG. 5A illustrates the normal adsorption. FIG. 5B illustrates the abnormal adsorption. FIG. 5C illustrates the non-adsorption.

5A-5C, the beam B of the light source is obscured by the component C while the pickup nozzle 1 is lowered. The reason for the result as shown in FIG. 4 is that the light intensity of the light source (Intensity) of the light source tends to decrease toward the edge as well as the adsorption of the component because the beam (B) diameter of the light source is too large compared to the size of the component. This is because they do not recognize the state correctly.

In general, a laser that is used a lot has a Gaussian distribution, and thus, the intensity of the portion where the component C starts to cover the beam B of the light source is very small and hardly affects the overall beam intensity change.

In other words, the Z-axis position at which the component starts covering the beam of the light source has a different value depending on the adsorption state of the component. This difference is indicated by the change in beam intensity of the light source as in FIG.

In theory, however, there should be a clear distinction between abnormal adsorption of components and normal adsorption of components, but the actual detection result in component mounting is not, and there is a problem in that it is not possible to accurately recognize the state of component adsorption because the difference does not appear.

Therefore, the present invention has been devised in view of the above problems, and maximizes the change in the beam intensity of the light source by the part covering the light source beam, thereby distinguishing between normal adsorption and non-adsorption of the part, The present invention provides a component mounter having a component adsorption state recognition device capable of accurately distinguishing between normal adsorption and abnormal adsorption.

In order to achieve the above object, a component mounter having a device adsorption state recognition apparatus according to an embodiment of the present invention includes a pickup nozzle for picking up a component; A light source for irradiating a laser beam to the component picked up by the pickup nozzle; A detector installed at a position facing the light source and receiving a laser beam emitted from the light source; And a light shielding film installed on the front surface of the detector and having a slit formed at the center thereof so that only the laser beam at the center portion of the entire laser beams incident on the front surface of the detector can be incident. In this case, the detector changes depending on the position of the component adsorbed to the pickup nozzle descending in the Z-axis direction, and detects a change in intensity of the laser beam incident through the slit, and the light shielding film may be a film. It may be a laser.

According to another embodiment of the present invention, a component mounter having a component adsorption state recognition apparatus includes: a pickup nozzle configured to pick up a component; A light source for irradiating a laser beam to the component picked up by the pickup nozzle; And a detector installed at a position facing the light source, the detector having a slit on the front surface thereof to allow only the laser beam at the center of the entire laser beams irradiated from the light source to be incident thereon, wherein the detector descends in the Z-axis direction. It varies depending on the position of the component adsorbed to the pickup nozzle, it detects the change in the intensity of the laser beam incident through the slit.

A component mounting method of a component mounter according to the present invention includes the steps of picking up a component by a pickup nozzle and recognizing and correcting a position of the component by a vision system; Recognizing a suction state of the component by a component suction state recognition unit while lowering the component in the Z-axis direction to mount the recognized component at a predetermined position on a printed circuit board; As a result of the recognition, the abnormally adsorbed parts are put into a dump box without being mounted on the printed circuit board, and the feedback of the part adsorption, part position recognition, and correction steps are fed back; And as a result of the recognition, mounting the normally adsorbed component on the printed circuit board.

The adsorption state recognition step of the component, the light source irradiating the laser beam to the component adsorbed to the pickup nozzle; And a detector receiving the laser beam irradiated from the light source, and injecting only the laser beam at the center of the laser beams of the light source through the slit provided in front of the detector.

Meanwhile, the component adsorption state recognition method of the component mounter according to the present invention recognizes the component adsorption state to recognize the adsorption state of the component by irradiating a laser beam to the component while the component adsorbed on the pickup nozzle is lowered in the Z-axis direction. A method, comprising: irradiating a laser beam to a component adsorbed by the light source by a light source; And a detector receiving the laser beam irradiated from the light source, such that only the laser beam at the center of all the laser beams of the light source is incident through the slit provided at the front of the detector. It is changed depending on the position of the components adsorbed to the pickup nozzle, it characterized in that for detecting the intensity change of the laser beam of the center incident through the slit.

As described above, the present invention maximizes the change in beam intensity of the light source by the part covering the beam of the light source, thereby distinguishing between normal adsorption and non adsorption of the part, as well as normal adsorption and abnormality of the part. Adsorption can be distinguished accurately, which increases the reliability of the product.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

6 is a perspective view illustrating a component mounter according to an embodiment of the present invention, FIG. 7 is a configuration diagram of FIG. 6, and FIG. 8 is a conceptual view illustrating component recognition of a component mounter according to an embodiment of the present invention. 9 is a front view illustrating a light shielding film of a component mounter according to an exemplary embodiment of the present invention.

6 to 9, the component mounter 100 according to the exemplary embodiment of the present invention includes a pickup nozzle 110 for picking up a component; A light source 120 irradiating a laser beam B to the component C picked up by the pickup nozzle 110; A detector 130 installed at a position facing the light source 120 and receiving a laser beam emitted from the light source 120; And a laser beam (B1: hatched portion in FIG. 9) of a central portion of the entire laser beam B incident on the front surface of the detector 130 and installed at the front surface of the detector 130. The light blocking film 140 on which the slits 141 are formed is included. The light blocking film 140 may be any other member capable of blocking the laser beam B as well as a film. As the light source 120, a conventional laser may be used.

10 is a block diagram showing a component mounting apparatus according to another embodiment of the present invention, Figure 11 is a conceptual diagram of a component mounting apparatus according to another embodiment of the present invention, Figure 12 is a component thread according to another embodiment of the present invention It is a front view showing the detector of an organ.

10 to 12, the component mounter 200 according to another embodiment according to the present invention includes a pickup nozzle 210 for picking up the component (C); A light source 220 irradiating a laser beam to a component picked up by the pickup nozzle; And a laser beam B1 (hatched portion of FIG. 12) in the center of the entire laser beam B irradiated from the light source 220 and installed at a position facing the light source 220. The detector 230 includes a slit 231.

13 is a view for explaining a component mounting method of the component mounter according to the present invention.

Referring to FIG. 13, the component mounting method of the component mounter according to the present invention includes a step of picking up a component by a pickup nozzle and recognizing and correcting a position of the component by a vision system (S110); Recognizing a suction state of the component by a component suction state recognition unit while the component is lowered in the Z-axis direction for mounting the recognized component at a predetermined position on the printed circuit board (S120); As a result of the recognition, the abnormally adsorbed parts are put in a dump box without being mounted on the printed circuit board, and feedback the part adsorption, part position recognition and correction steps (S130); And as a result of the recognition, the normally adsorbed component is mounted on the printed circuit board (S140).

14 is a view for explaining a component adsorption state recognition method of the component mounter according to the present invention.

Referring to FIG. 14, in the component adsorption state recognition method of the component mounter according to the present invention, a component adsorption state recognition for recognizing the adsorption state of the component is performed by irradiating a laser beam to the component while descending the component adsorbed on the pickup nozzle. A method, comprising: irradiating a laser beam to a component adsorbed on the pickup nozzle by a light source (S121); And a detector receiving the laser beam irradiated from the light source, and injecting only the laser beam at the center of all the laser beams of the light source through the slit provided in front of the detector (S122).

15 is a graph showing the beam intensity of the light source when using the component adsorption state recognition method of the component mounter according to the present invention.

In FIG. 15, the horizontal axis represents the Z-axis value of the pickup nozzle, and the vertical axis represents the beam intensity change of the light source obtained by the detector.

Referring to FIG. 15, by using the component adsorption state recognition method of the component mounter according to the present invention, the component is normally adsorbed (1), the component is not adsorbed (2), the state is abnormally adsorbed (3) ) Can be clearly distinguished. In other words, even a minute component can be accurately recognized according to the adsorption state of the component, thereby increasing the reliability of the product.

As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications can be made without departing from the scope of the present invention Of course.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.

1 is a view showing a conventional adsorption failure detection device

2 is a conceptual diagram illustrating the component recognition of the conventional component mounter

3 is a perspective view of a conventional component mounter

4 is a graph showing the results of recognizing the adsorption state of the parts using the component recognition device as shown in FIG.

FIG. 5A illustrates the adsorption state recognition of the microchip according to the dropping of the pick-up nozzle. FIG. 5A illustrates normal adsorption. FIG. 5B illustrates abnormal adsorption. FIG. 5C illustrates non-adsorption.

6 is a perspective view of a component mounter according to an embodiment of the present invention.

7 is a configuration diagram of FIG. 6.

8 is a conceptual diagram illustrating the component recognition of the component mounter according to an embodiment of the present invention.

9 is a front view showing a light shielding film of a component mounter according to an embodiment of the present invention.

10 is a block diagram showing a component mounter according to another embodiment of the present invention

11 is a conceptual view of a component mounter according to another embodiment of the present invention.

12 is a front view showing a detector of a component mounter according to another embodiment of the present invention.

13 is a view for explaining a component mounting method of the component mounter according to the present invention.

14 is a view for explaining a component adsorption state recognition method of the component mounter according to the present invention.

15 is a graph showing the beam intensity of the light source when using the component adsorption state recognition method of the component mounter according to the present invention

* Description of main parts

100: parts mounter

110: pickup nozzle

120: light source

130: Detector

140: light shielding film

141: slit

210: pickup nozzle

220: light source

230: detector

231: slit

B: laser beam

B1: laser beam in the center

C: parts

Claims (7)

Pickup nozzles for picking up parts; A light source for irradiating a laser beam to the component picked up by the pickup nozzle; A detector installed at a position facing the light source and receiving a laser beam emitted from the light source; And It is installed on the front of the detector, and includes a light shielding film formed with a slit in the center so that only the laser beam in the center of the laser beam incident on the front of the detector is incident, And the detector changes depending on the position of the component adsorbed to the pick-up nozzle descending in the Z-axis direction, and has a component adsorption state recognition device for detecting a change in intensity of the laser beam incident through the slit. Claim 2 has been abandoned due to the setting registration fee. The method of claim 1, And the light shielding film is a film. Claim 3 has been abandoned due to the setting registration fee. The method of claim 1, And the light source is a laser. Pickup nozzles for picking up parts; A light source for irradiating a laser beam to the component picked up by the pickup nozzle; And A detector installed at a position facing the light source, the detector having a slit at a front surface thereof so as to allow only a laser beam at the center of the laser beam irradiated from the light source; And the detector changes depending on the position of the component adsorbed to the pick-up nozzle descending in the Z-axis direction, and has a component adsorption state recognition device for detecting a change in intensity of the laser beam incident through the slit. Pick-up nozzles picking up parts and recognizing and correcting the position of parts by vision system; Recognizing a suction state of the component by a component suction state recognition unit while lowering the component in a Z-axis direction to mount the recognized component at a predetermined position on a printed circuit board; As a result of the recognition, the abnormally adsorbed parts are put into a dump box without being mounted on the printed circuit board, and the feedback of the part adsorption, part position recognition, and correction steps are fed back; And And mounting the normally absorbed component on the printed circuit board as a result of the recognition. 6. The method of claim 5, The adsorption state recognition step of the component Irradiating a laser beam onto a component adsorbed by the light source by the light source; And And a detector receiving the laser beam irradiated from the light source, and injecting only the laser beam at the center of the laser beams of the light source through the slit provided in front of the detector. In the component adsorption state recognition method for recognizing the adsorption state of the component by irradiating a laser beam to the component while the component adsorbed on the pickup nozzle, Irradiating a laser beam onto a component adsorbed by the light source by the light source; And A detector receives the laser beam irradiated from the light source, and injects only the laser beam in the center of the laser beam of the light source through a slit provided in front of the detector, The detector is changed depending on the position of the component adsorbed to the pick-up nozzle is descending, the component adsorption state recognition method of the component mounter, characterized in that for detecting the change in the intensity of the laser beam in the center incident through the slit.

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