KR20020050046A - Reuse system of PCB's scrap by brushing - Google Patents

Reuse system of PCB's scrap by brushing Download PDF

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Publication number
KR20020050046A
KR20020050046A KR1020000079404A KR20000079404A KR20020050046A KR 20020050046 A KR20020050046 A KR 20020050046A KR 1020000079404 A KR1020000079404 A KR 1020000079404A KR 20000079404 A KR20000079404 A KR 20000079404A KR 20020050046 A KR20020050046 A KR 20020050046A
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KR
South Korea
Prior art keywords
grinding
circuit board
parts
scrap
copper
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KR1020000079404A
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Korean (ko)
Inventor
박종순
Original Assignee
박종순
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Application filed by 박종순 filed Critical 박종순
Priority to KR1020000079404A priority Critical patent/KR20020050046A/en
Publication of KR20020050046A publication Critical patent/KR20020050046A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE
    • B09B3/00Destroying solid waste or transforming solid waste into something useful or harmless
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/52Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

PURPOSE: Provided is a reuse system of printed circuit board scrap by grinding which can recover pewter and copper by grinding and makes it possible to separate IC chips and reusable parts from waste materials without damage to circuit board and can recover gold and silver by sorting valuable metals and can reuse resin that is one of the main ingredients of printed circuit board. CONSTITUTION: The system comprises a grinding roller which has moderate hardness for grinding just pewter and copper without damage to other parts; a guide roller which helps to maintain suitable pressure in the transfer process of wasted circuit board scraps; a dust collector which collects minute dust discharged by grinding. Dust of metals and resins can be separated by sorting of specific gravity and the metals is concentrated by metal concentrator.

Description

폐 전자스크랩의 연삭가공에 의한 재활용 시스템{Reuse system of PCB's scrap by brushing}Reuse system of PCB's scrap by brushing}

금속회수 기술에는 습식법과 건식법이 있다.Metal recovery techniques include wet and dry methods.

습식법은 금과 은을 회수하는 기능이 다르며, 금류는 왕수를 용해 후 중화를 시킨다음 환원을 통해 회수하고, 은류는 초산으로 용해한 다음 침전, 환원제로 환원시킨다음 전해법으로 정제시켜 회수한다.The wet method differs in the function of recovering gold and silver, and the gold is neutralized after dissolving the aqua regia, and then recovered by reduction.

건식법은 폐전자스크랩을 파쇄하여 하소처리한후 소각잔재물을 농축하여 유가금속을 회수하며, 이때 회수를 위하여 전기를 걸어 극판에 붙은 금속을 회수하는 공정이다. 건식법과, 습식법은 효율면에서 떨어지고 또한 공정이 복잡하다 보니 금속을 회수하는 비용이 많이 들어 경쟁력에서 떨어지는 실정이다. 또한 전자스크랩을 파쇄하여 금속을 회수하다 보니 재활용 가능한 부품을 회수 할 수 없으며 2차적으로 폐기물이 다량 배출되므로 환경오염을 유발하고 폐기물 처리비용이 많이 드는 실정이다.The dry method is a process of recovering valuable metals by crushing waste electronic scraps, calcining and then incineration residue to recover valuable metals. The dry method and the wet method are inferior in terms of efficiency and the process is complicated, so the cost of recovering the metal is high. In addition, as the electronic scrap is crushed to recover the metal, it is impossible to recover the recyclable parts. Secondly, a large amount of waste is discharged, which causes environmental pollution and waste disposal costs.

이와 같은 문제를 해결하기위해서 연삭롤러를 통한 공정으로 폐전자스크랩에서 땝납과 동을 연삭을 통해 금속을 회수하며, 기판의 부품에는 손상을 주지 않고 IC칩과 재사용 가능한 부품들을 분리 선별가능하게하고 기타의 부속물은 적정 처리하거나 프린트기판에 함유되어 있는 유가금속을 사전에 선별하여 금과 은등을 회수하고, 프린트 기판을 이루고 있는 주요 성분중의 하나인 수지 또한 재활용을 할수있으며 공해를 유발하지 않는 시스템이라 할 수 있다.In order to solve this problem, the grinding roller is used to recover metal from solder and copper from waste electronic scrap, and to separate and select IC chips and reusable parts without damaging the parts of the board. 'S attachments are properly treated or pre-selected valuable metals contained in the printed board to recover gold and silver, and the resin, one of the main components of the printed board, can also be recycled and does not cause pollution. This can be called.

도1 본 발명에따른 시스템의 구성도1 is a configuration diagram of a system according to the present invention

1. 연삭롤러 2. 구동모터 3. 집진기1. Grinding roller 2. Driving motor 3. Dust collector

4. 가이드롤러 5. 비중선별기 6. 부품회수 컨베어4. Guide roller 5. Specific gravity sorter 6. Parts recovery conveyor

7. 금속회수 농축기 8. 수지선별세정기7. Metal Recovery Thickener 8. Resin Sorting Cleaner

본 발명에 따르는 장치는 연삭롤러(1)가 주 핵심으로서 롤러는 구동모터(2)를 통해 고속회전을 하게되며 가이드롤러(4)에 의해 폐전자스크랩이 이동하면서 기판의 부품에 손상을 주지 않고 땜납과 동을 연삭하며 가이드롤러(4)가 위에서 또한 적당한 힘으로 눌러줌으로 해서 기판의 부품에는 손상을 주지 안으며 폐 전자스크랩을 이동시켜 줌으로 폐전자스크랩의 붙어 있는 땜납과 동을 적절히 연삭하도록 도움을 주는 장치이다. 집진기(3)에서는 연삭을 통해 미세분말이 된 금속과 수지를 포집하는 장치이다. 포집된 분말은 비중선별기(5)에서는 비중에 의해 금속과 수지가 선별되며 선별된 금속은 금속회수 농축기(7)에서 동과 납으로 선별되어 농축된다. 수지선별세정기(8)에서는 포집된 수지를 세척 전조를 하여 재활용 할수 있는장치이다.In the device according to the present invention, the grinding roller 1 is the main core, and the roller is rotated at high speed through the driving motor 2, and the waste electronic scrap is moved by the guide roller 4 without damaging the components of the substrate. Grind the solder and copper and press the guide roller 4 with the appropriate force from above to damage the components of the board without moving the scrap electronic scrap so that the solder and copper of the scrap electronic scrap can be properly ground. It is a device that helps. In the dust collector 3, it is a device which collects the metal and resin which became fine powder by grinding. The collected powder is selected from metal and resin by specific gravity in the specific gravity sorter (5), and the selected metal is selected and concentrated by copper and lead in the metal recovery concentrator (7). In the resin sorting washing machine (8) is a device that can be recycled by washing the collected resin.

폐 전자스크랩의 재활용에 있어서 연삭롤러(1)를 사용하여 부품이 부착되어 있지 않은 배면을 갈아내며 이때 연삭롤러(1)의 경도를 적절한 수준으로 유지하여 고속으로 회전시킴으로서 부품의 리드에는 손상을 주지 않으며 1차적으로 땜납만을 분말상태로 기판에서 분리해내며 분리된 납 분말은 집진기(3)로 흡인되며, 계속해서 다음의 연삭롤러(1)에 의해서 동과 프린트기판의 수지가 분말상태로 나오게되며, 기판에 부착된 부품은 기판에서 탈리되어 부착되어있는 부품들은 부품회수장치(6)을 통하여 따로이 배출된다. 또 집진기(3)로 포집된 금속을 함유한 분말은 비중선별기(5)에의하여 금속과 합성수지로 분리되며 선별된 금속은 재차 금속농축기(7)에의하여 농축하게된다.In the recycling of waste electronic scraps, the grinding roller (1) is used to grind the back surface where the parts are not attached. At this time, the hardness of the grinding roller (1) is maintained at an appropriate level and rotated at high speed, thereby preventing damage to the leads of the parts. Firstly, only solder is separated from the substrate in a powder state, and the separated lead powder is sucked into the dust collector (3), and the resin of the copper and the printed circuit board comes out in the powder state by the next grinding roller (1). The components attached to the substrate are detached from the substrate and the components attached to the substrate are separately discharged through the component recovery device 6. In addition, the powder containing the metal collected by the dust collector (3) is separated into a metal and a synthetic resin by the specific gravity separator (5), and the selected metal is concentrated again by the metal concentrator (7).

이러한 일련의 수단을 통하여 폐 전자스크랩으로부터 전자부품과 땜납, 동등을 적절히 회수 농축하며 이때 발생된 수지 성분들도 별도로 분리할 수 있게된다. 따라서 기존의 폐 전자스크랩을 재활용하는 수단에 비하여 공해의 발생이 없으며 유가물들을 안전하고 고순도로 농축 회수가 가능한 시스템이라 할 수 있다.Through such a series of means, it is possible to properly recover and concentrate electronic components, solder, and equivalents from the waste electronic scrap, and separate resin components generated at this time. Therefore, there is no pollution compared to the means for recycling the old waste electronic scrap, and it can be said that the system can recover the valuables safely and with high purity.

Claims (5)

폐 전자스크랩을 연삭하는 방법으로 재활용하는 시스템.Recycling system by grinding waste electronic scrap. 상기 1항의 연삭에 있어서 부품들의 리드는 손상되지 않고 땜납과 동만을 연삭 가능한 적절한 경도를 갖는 연삭롤러.The grinding roller of claim 1, wherein the lead of the parts is not damaged and has a suitable hardness for grinding only solder and copper. 상기 1항의 연삭에 있어서 폐전자스크랩들이 이송되는 과정에서 연삭롤러와 적절한 압력을 유지할 수 있도록 보지해주는 가이드롤러를 구성한 것.In the grinding of 1, the guide roller is configured to hold the grinding roller and the appropriate pressure in the process of conveying the waste electronic scraps. 상기 1항의 연삭을 통하여 배출되는 미세 분말을 포집 선별 가능한 집진기를 부착한 것.Attached to the dust collector capable of collecting and sorting the fine powder discharged through the grinding of claim 1. 상기 1항의 연삭을 통하여 부품들은 부품회수컨베어를 통하여 배출될 수 있도록하며, 연속적으로 집진기를 통하여 포집된 금속분말과 수지분말은 비중선별 방식으로 분리될 수 있도록 하고 금속들은 금속회수 농축기를 통하여 농축될 수 있도록 하는 것을 특징으로 하는 장치.Through the grinding of 1, the parts can be discharged through the parts recovery conveyor, and the metal powder and the resin powder collected through the dust collector can be separated in a specific gravity sorting method, and the metals are concentrated through the metal recovery concentrator. Device, characterized in that.
KR1020000079404A 2000-12-20 2000-12-20 Reuse system of PCB's scrap by brushing KR20020050046A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737634B1 (en) * 2006-07-31 2007-07-10 호서대학교 산학협력단 Emi shielding coating composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326894A (en) * 1994-05-31 1995-12-12 Sanyo Electric Co Ltd Automatic electronic parts mounting device
JPH08148823A (en) * 1994-11-16 1996-06-07 Senju Metal Ind Co Ltd Method for recovering valuable material from printed board and its equipment
US5676318A (en) * 1994-03-09 1997-10-14 Nec Corporation Method of recovering valuable substances from printed circuit board
KR19980068107A (en) * 1997-02-14 1998-10-15 구자홍 Printed Circuit Board Recycling Method And Device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676318A (en) * 1994-03-09 1997-10-14 Nec Corporation Method of recovering valuable substances from printed circuit board
JPH07326894A (en) * 1994-05-31 1995-12-12 Sanyo Electric Co Ltd Automatic electronic parts mounting device
JPH08148823A (en) * 1994-11-16 1996-06-07 Senju Metal Ind Co Ltd Method for recovering valuable material from printed board and its equipment
KR19980068107A (en) * 1997-02-14 1998-10-15 구자홍 Printed Circuit Board Recycling Method And Device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737634B1 (en) * 2006-07-31 2007-07-10 호서대학교 산학협력단 Emi shielding coating composition

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