JP2565263Y2 - Imager for solder inspection - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in an apparatus for imaging the state of soldering of an integrated circuit or an electronic component to a high-density mounting board.

[0002]

2. Description of the Related Art Image processing technology is used for inspection of a soldering state. In order to accurately determine the quality of the soldering state by image processing, the soldered portion to be inspected must be imaged in good condition by an industrial camera under appropriate illumination.

Conventionally, a plurality of industrial cameras and a light source for illumination have been used to image a soldered portion. However, these are fixed while changing the imaging direction and the illumination direction.
It has been difficult to image various types of ICs, such as gull-wing type leads and J-type leads, and small-sized electronic component leads from the most appropriate direction. In particular, when electronic components are installed in a high mounting density, it is necessary to perform imaging, illumination, and light amount adjustment in appropriate directions for each electronic component. Is becoming increasingly difficult.

[0004]

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to appropriately capture an image of a soldered portion according to a mounting direction of an electronic component and a form of a lead thereof.

[0005]

To achieve the above object, the present invention arranges an arc-shaped guide with four supports around a center line of a machine frame, and drives a moving body with respect to the guide by a driving means. The movable body is provided with an industrial camera and a plurality of light sources. This gives 4
Since the two industrial cameras can image the soldered part on the center line of the machine frame under appropriate illumination while changing the inclination angle from four directions, image processing for soldering inspection is effectively advanced. Thus, the reliability of the soldering condition is improved.

[0006]

FIG. 1, FIG. 2 and FIG. 3 show the construction of an image pickup device 1 for solder inspection. This soldering inspection device 1
In addition to the machine frame 2, the support 3, the guide 4, the moving body 5, and the driving means 6, the assembly is assembled by four industrial cameras 7 and a plurality of light sources 8.

The machine frame 2 is mounted horizontally on a support frame or the like of a device (not shown).
Is located around the center line of the machine frame 2 on the lower surface side of the machine frame 2.
They are installed in equal distribution. According to this embodiment,
The four supports 3 are tangential to an arc centered on the center line of the machine casing 2 and are attached along a vertical plane while forming an angle of 90 degrees.

The guides 4 are formed as circular arcs centered on the center line of the machine frame 2.
Attached to. In the case of this embodiment, the guide 4
Are integrally formed with an arc-shaped guide rail 9 and are combined with a plurality of, for example, four grooved guide rollers 10 attached to the moving body 5 at this portion. Moving object 5
Is configured as, for example, a trapezoidal plate, is integrated with the guide roller 10 by four roller shafts 11, and can be inclined at an appropriate angle with respect to the center line of the machine frame 2.

The driving means 6 is for moving the moving body 5 in the inclined direction, and is mounted on the moving body 5 with a motor 12 having a speed reducer mounted on the guide body 4 and capable of controlling the rotation amount. Arc-shaped rack 13, this rack 1
3 is constituted by a pinion 14 attached to the output shaft of the motor 12.

The industrial cameras 7 are mounted one downward for each of the four moving bodies 5 so as to be tiltable with respect to the center line of the machine frame 2. The light source 8 is attached to the inspection target soldering portion 23 while changing the illumination direction in the lower part of the moving body 5. The vertical position and the maximum tilt position of the industrial camera 7 are determined by the proximity sensors 15 and 16 attached to the support 3 and the dog 17 attached to the industrial camera 7 respectively.
Is detected by the corresponding relationship with.

The circuit board 18 is fixed on a positionable XY table 19 in a state perpendicular to the center line of the machine frame 2. The leads 21 of the electronic components 20 such as a plurality of IC packages are connected to the conductive patterns 2 on the circuit board 18.
2 are electrically connected and fixed to each other by a soldering portion 23. The electronic component 20 is positioned on the center line of the machine casing 2 by moving the XY table 19. At the same time as the positioning, the control device (not shown) controls an appropriate one of the four industrial cameras 7.
Is selected and the motor 12 is driven to determine the imaging angle of the industrial camera 7 and at the same time,
One or more light sources 8 to be used are turned on.

In this manner, the soldering portion 2 to be inspected is
In contrast, the industrial camera 7 and the light source 8 face each other in an appropriate imaging direction or illumination direction. In this state,
An image of the soldering portion 23 to be inspected is taken. Thereafter, the image information from the industrial camera 7 is read by an image processing device (not shown) from the brightness of the image of the soldering section 23, the presence or absence of a bright spot, the position and shape of the bright spot, and the like. The pass / fail status is identified.

[0013]

According to the present invention, four industrial cameras are arranged so as to be tiltable at four positions, and a plurality of light sources are selected simultaneously with the tilting of these cameras. Since the adjustment is performed, the soldering portion to be inspected can be imaged from an ideal imaging direction under appropriate illumination even on a high-density mounting board. Therefore, the quality of the soldered portion can be inspected and the form of the defect can be identified with high reliability in the field of image processing. These four industrial cameras are selected according to the form of the lead, the position of the soldering part, and the like, and are corrected to an appropriate imaging direction, so that not only the imaging direction and the illumination direction are appropriate, but also
By selecting four industrial cameras and a plurality of light sources, the amount of correction in their imaging directions and irradiation directions can be reduced, and the time required for imaging can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of a solder inspection imaging device according to the present invention.

FIG. 2 is a front view of a part of the imaging device for solder inspection according to the present invention;

FIG. 3 is a side view of a part of the imaging device for solder inspection according to the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Imaging device for solder inspection 2 Machine frame 3 Support 4 Guide 5 Moving body 6 Driving means 7 Industrial camera 8 Light source

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location // H05K 3/34 512 G06F 15/62 405A

Claims (2)

(57) [Scope of request for utility model registration] 1. Four supports (3) are arranged around a center line of a machine frame (2), and these supports (3) are attached to the machine frame (2).
And a guide (4) having an arc shape is fixed to each support (3), and a movable body (5) is provided on each guide (4) so as to be freely displaceable in an arc direction. Mobile (5)
And an industrial camera (7) and a plurality of light sources (8) attached to the moving body (5). 2. The camera according to claim 1, wherein four support bodies and an industrial camera are mounted in four equal positions around a center line of the machine casing. Imaging device for solder inspection (1).