JP2000277999A - Electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting method, whereby the unit time for mounting an electronic component can be reduced by quickly and high accurately detecting the electronic component vacuum-chucked to a holder. SOLUTION: This electronic component mounting method is for mounting an electronic component b on a board c, after photographing vacuum chucking information of the component b with continuously moving detecting means 12, composed of a line sensor-camera 16 in a process of moving a component b vacuum chucked with a holder 3 of a mounting head 2 to the board c. The image pickup of component b by the detecting means 12 is made with illumination by illuminating means 13, this illumination being controlled according to the electronic component b to be mounted on the board c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the mounting of an electronic component on a substrate, and detects the electronic component sucked and held by a holding member quickly and with high accuracy, thereby shortening the mounting tact time. The present invention relates to a method for mounting electronic components.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is mounted on a printed circuit board by an electronic component mounting apparatus, the posture of the electronic component held by a suction nozzle of a mounting head is moved to a mounting portion of the printed circuit board. In the meantime, for example, image information is obtained by imaging with a camera such as a CCD having an electronic shutter mechanism, and based on the image information, the posture of the electronic component is corrected according to predetermined data,
The electronic component is accurately mounted at a predetermined position on a printed circuit board.

However, in imaging these electronic components, a CCD camera (full frame shutter camera) having an electronic shutter mechanism can only perform imaging at a fixed fixed resolution, and is relatively expensive and handles such cameras. There is a problem that the peripheral circuit becomes complicated and the cost of the entire device increases.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problem. In the process of transferring an electronic component to a substrate by sucking and holding it by a holding member of a mounting head, a line sensor camera is used. In the method of mounting the electronic component on the substrate after the electronic component is imaged by continuously moving the detecting means, the detection of the electronic component sucked and held by the holding member is performed quickly and with high accuracy. It is an object of the present invention to provide an electronic component mounting method capable of shortening a tact time for mounting components.

[0005]

Means of the present invention for achieving the above object are as follows. In a process of transferring an electronic component to a substrate by sucking and holding the electronic component by a holding member of a mounting head.
A method of mounting the electronic component on the substrate after continuously moving a detection unit including a line sensor camera to image the electronic component, wherein the imaging of the electronic component by the detection unit is performed by illumination by an illumination unit. The illumination is performed by the illumination means, and the illumination is performed by controlling the amount of light to be emitted according to the electronic component mounted on the substrate.

[0006] In the process of transferring the electronic component to the substrate by sucking and holding it by the holding member of the mounting head, the detecting means comprising the line sensor camera is continuously moved by the traveling drive means to image the electronic component. A method of mounting the electronic component on the substrate, wherein the driving of the detection unit by the travel driving unit is performed by controlling a traveling speed of the detection unit in accordance with the electronic component mounted on the substrate. In the component mounting method.

[0007] The illumination of the illuminating means used when the electronic means is picked up by the detecting means may be illuminated in a plurality of directions with respect to the electronic component. Select and do.

Further, the illumination of the illuminating means used when the electronic part is picked up by the detecting means may be illuminated in a plurality of directions with respect to the electronic part, depending on the electronic part mounted on the substrate. Separately, the irradiation is performed by controlling the amount of light.

Still further, the imaging of the electronic component by the detecting means is performed when only the imaging visual field is changed, when only the resolution is changed, or when both the imaging visual field and the resolution are changed according to the electronic component mounted on the board. Is performed by selecting any one of the following.

[0010] Further, the imaging of the electronic component by the detecting means is performed as follows.
Depending on the electronic component mounted on the board, if only the imaging field of view is changed, if only the resolution is changed, or if both the imaging field of view and the resolution are changed, the selection is made, and the change is performed. , By switching electrical circuits.

[0011]

Next, an embodiment of an electronic component mounting method according to the present invention will be described with reference to the drawings. 1 and 2, reference numeral A denotes an electronic component mounting apparatus that employs the electronic component mounting method according to the embodiment of the present invention, and receives an electronic component b such as a chip component or an IC component from a supply unit m to a mounting unit n. Transport,
A predetermined electronic component b is mounted at a predetermined location on the printed circuit board c in the mounting section n.

The mounting position is obtained according to a predetermined program inputted to the control means 1 by a conventional computer or the like, and includes a mounting head 2 which is arbitrarily moved in the X-axis and Y-axis directions. The mounting head 2 moves arbitrarily in the Z-axis direction, and
The suction nozzle 3 is a holding member for an electronic component that can obtain an angle (rotation angle).

The supply part m of the electronic component b is
As shown in FIG. 1, a plurality of electronic components b are placed on a tray, and a tape feeder M or the like provided in a large number at a predetermined position is used as shown by a virtual line in FIG. These are provided on the body 4.

The detailed structure is as follows: an advancing / retreating body 6 attached to the body 4 and arbitrarily moved in the front-rear direction (Y-axis) by the advancing / retreating means 5;
A movable body 8 arbitrarily moved in the left-right direction (X axis) by
The suction nozzle 3 is attached to the mounting head 2 engaged with the movable body 8 so as to be able to move up and down by means of elevating means 9, and the rotating means 10 makes it possible to freely rotate an arbitrary θ angle (rotation angle) about the longitudinal axis. In some cases, the means 5 and 7, 9, 10 for driving each are operated with high precision by a numerically controllable servomotor or the like.

The mounting head 2 is provided with a suction nozzle type for sucking the upper surface of the electronic component b, a chucking type for gripping the outer periphery thereof, etc., and may be a single head. As shown in FIG. 1, if the head is constituted by a plurality of heads, the mounting efficiency of the electronic component b is improved.

The movable body 8 or the mounting head 2 is provided with a detecting means 11, which comprises an imaging means 12 and an illuminating means 13. When a plurality of mounting heads 2, 2... Are provided, one direction (including reciprocation),
The mounting head 2 is attached via a mounting body 15 so as to be movable in parallel in a parallel direction by a traveling drive unit 14 controlled by a numerically controllable servomotor or the like.

The image pickup means 12 in the detection means 11
Captures the shape and suction attitude of the electronic component b taken out of the supply unit m of the machine body 4 by the mounting head 2.
It is for measuring, and is composed of a line sensor camera 16 and a light image incident means 17.

The line sensor camera 16 is mounted on one side of the mounting body 15 and is disposed on the side of the electronic component b held by the mounting head 2. The image signal of the electronic component b is obtained by converting the image signal into a signal.
The electronic component b is sent to the image processing means 1a connected to the electronic component b, and is compared with a predetermined numerical value input in advance to perform desired recognition of the electronic component b.

In the above-described image recognition, the size of the entire electronic component b sucked and held by the suction nozzle 3, the position of the entire electronic component b in the front-rear and left-right directions, and the rotation angle (θ
Angle), lead pitch, lead bending, number of leads, etc. are checked.
To make the electronic component b coincide with the determined correct position.

The light image incident means 17 is disposed on the other side of the mounting body 15 in correspondence with the line sensor camera 16.
Immediately below the electronic component b of the mounting head 2, it is mounted on the movement trajectory of the mounting body 15, and uses a prism or a surface evaporation mirror.
They correspond to the line sensor camera 16 and the lower surface of the electronic component b sucked by the suction nozzle 3, respectively. By capturing an image of the electronic component b indirectly projected by the light image incident means 17, the height dimension of the imaging means 12 can be reduced, and the entire electronic component mounting apparatus A can be made compact. Can be manufactured.

In the light image incidence means 17, when a surface-deposited mirror is used, there is an advantage that it is inexpensive and takes up less space than a prism, and when a prism is used, the reflectance is higher than that of a surface-deposited mirror. Higher and clearer image quality can be obtained. Also, as shown in FIG. 3A, by providing one light image incident means 17, the exposure direction of the line sensor camera 16 becomes horizontal, and by providing two light image incident means 17 as shown in FIG. The exposure direction of the line sensor camera 16 is vertical.

Illumination means 13 in detection means 3 described above
Illuminates the electronic component b in a stopped state or a moving state to improve the imaging accuracy of the electronic component b by the imaging means 12 as much as possible, and uses one or a plurality of light emitting diodes 13a. And the imaging means 12
Is fixed to the upper part of the light image incident means 17 by the mounting body 15.

In this illuminating means 13, the light emitting diode 13a performs pulse lighting (dynamic lighting, see FIG. 4) which repeats blinking with time, that is,
Applying the effect of seemingly continuous lighting due to the short blinking interval. In the imaging by the line sensor camera 16 in the imaging means 12, in order to prevent the flickering of the blinking, the fundamental frequency of the blinking needs to be 1 KHz or more.

More specifically, as shown in FIG. 5A, when the light-on time and the light-off time of the light emitting diode 13a are substantially equal, the average light amount of about half of the light amount when the light emitting diode 13a is turned on is reduced. can get. Naturally, as shown in FIG. 5B, the longer the light-off time, the smaller the average light amount.
Further, the current value and the voltage value are constant, and the average light amount can be controlled by changing the duty ratio (the ratio of the signal period in one cycle) between the lighting time and the lighting time.

The duty ratio is represented by the following: duty ratio = lighting time / (lighting time + lighting out time) = pulse width f / repetition period g (see FIG. 5A). As the light quantity decreases, the light quantity decreases.

In the illuminating means 13, a plurality of light emitting diodes 13a are provided in a plurality of stages, as shown in FIG. , R2, r3, rn and their angles are changed.

The light emitting diode 13a of the illuminating means 13 emits blue light, red light, green light, orange light, white light, or the like. Preferred for lighting. The configuration of the illuminating means 13 may include a case where the light emitting diode 13a includes only the blue light emitting diode 13a and a case where the lighting unit 13 further includes a combination of the blue light emitting diode 13a and the light emitting diode having the above-mentioned other colors. Is selected, for example, according to the type of the electronic component b to be image-processed.

For example, when the electronic component b is BGA or μBGA, the electrode portion is silver, and the wiring pattern color on the surface of the interposer is gold or orange, which is close to the red wavelength. When the red light emitting diode 13a is used, the wiring portion of the electronic component b is also reflected, and the image of the electrode portion to be measured and the image of the wiring portion are mixed, which hinders the positioning measurement of the electronic component b.

However, when the electronic component b is illuminated using the blue light emitting diode 13a having a complementary color relationship with red, the wiring portion absorbs and does not reflect the blue color. It is possible to obtain information with high accuracy.

When the blue light emitting diode 13a is used for imaging illumination in the case of an electronic component b in which the ground of the base is black and a gold terminal is implanted in a proper place, both the ground of the base and the terminal are illuminated. Since the emitted light is absorbed and the detection becomes defective, irradiation using the red light-emitting diode 13a reflects the light at the terminal portion, so that an image can be recognized.

The detecting means 11 is provided for the suction nozzle 3
The traveling drive means 14 travels at a high speed below the electronic component b sucked and held by the traveling drive means 14, and the traveling drive means 14 travels along a lateral guide 20.
The traveling body 21 is driven by a driving member (not shown) composed of a servomotor or the like capable of numerically controlling the traveling body 21. Is obtained.

It should be noted that the control means 1 described above
2 and receives the detection signal, calculates based on predetermined data, and controls each of the means 5, 7, 9, 10 or the traveling drive means 14 individually and arbitrarily. Can be

A position detecting member 22 for regulating the image pickup position of the image pickup means 12 and the irradiation position of the illumination means 13 (the same position as the image pickup position) is provided. An appropriate one is used, and a detector 23 is attached to the movable body 8 at an imaging position of the imaging unit 12, that is, an irradiation position of the illumination unit 13 in correspondence with each mounting head 2, and the detector 23 is attached to the detector 23. A corresponding detector 24 is provided on the mounting body 15.

The image pickup means 12 is operated in accordance with the image processing means 1a shown in the block diagram of FIG. 7. First, a counter circuit is provided based on a clock supplied from an external clock generation circuit. Then, pulse signals of various timings are generated. In response to this, the start pulse generation circuit generates a start pulse for the line sensor to start scanning one line. The drive clock generation circuit generates a pulse signal necessary for driving the line sensor. The line sensor outputs a pulse of an analog video signal synchronized with the drive clock from the time when the start pulse is input. In the peak hold circuit, the pulse-output analog video signal is held at a peak voltage within one pulse time. The sample-and-hold circuit outputs a continuous waveform with a voltage obtained by sampling a peak-held pulse-output analog video signal at a timing synchronized with a clock. The video signal amplifier circuit amplifies and outputs a weak voltage. The A / D converter converts an analog video signal output from the line sensor camera into a digital video signal.
The memory address generation circuit generates an address signal for writing a digital video signal to a memory.

Therefore, the electronic component mounting method according to the embodiment of the present invention configured as described above has the following effects. First, an embodiment of the present invention described in claim 1 will be described. As shown in FIG. 8, the suction nozzle 3 having six mounting heads 2 and each holding member, Three different types of electronic components b are received from the supply unit m and are suction-held.

Also, the lighting means 13 has a structure shown in FIGS.
As shown in FIG.
a2, 13a3, a number of light emitting diode groups 13a1, 13a
The irradiation directions of 2, 13a3 are r1, r2, r3, respectively.
And the light emitting diode group 13a so as to be at a different angle.
1, 13a2 and 13a3 are attached. Further, the respective light emitting diode groups 13a1, 13a2, 1
The light amount can be individually controlled for 3a3.

The detecting means 11 is moved in the direction indicated by the arrow p in FIG. 8 by the operation of the traveling driving means 14, and the electronic parts b held by the suction nozzle 3 are sequentially arranged in the order of. Is moved below the electronic component b held by the suction nozzle 3 to detect the holding state one after another.

At this time, 6
Each of the light emitting diode groups 13a1, 13a2, and 13a3 of the illuminating means 13 that irradiates the electronic components b, b,... Held by the suction nozzles 3, 3,.
The amount of light for different types of electronic components b is controlled, that is, as shown in FIG.
The electronic component b held by the suction nozzle is adjusted so that the amount of light is small, the electronic component b held by the suction nozzle is medium, and the electronic component b held by the suction nozzle is slightly increased. Have been.

At this time, since the illuminating means 13 controls the amount of light to be emitted for each electronic component b as described above, the illuminating means 13 does not detect a defective image caused by an excessive amount or an excessively small amount of the electronic component b. Since the amount of light that gives the best image suitable for the type and characteristics of the component b is emitted, information on all the shapes and suction attitudes of each electronic component b is accurately read, and the correction processing by the control unit 1 is performed with higher accuracy. , And all the electronic components b are accurately mounted at predetermined positions on the printed circuit board c.

Next, an embodiment of the present invention described in claim 2 will be described. As shown in FIG. 9A, an electronic component b is supplied to the suction nozzle 3 of the mounting head 2 by the supply unit m. And is held by suction.

Here, the detecting means 11 is a
By the operation of No. 4, it moves in the direction indicated by the arrow p in FIG. 9A, and when the illuminating means 13 is turned on, the imaging means 12 moves below the electronic component b held by the suction nozzle 3 and Detect the holding state.

Now, as shown in FIG. 9 (b), when the traveling speed of the traveling driving means 14 is operated faster than the case shown in FIG. 9 (a) (w1: traveling driving means 1 in FIG. 9 (a)).
4 <w2: traveling speed of the traveling drive unit 14 in FIG. 9B), and the electronic component b imaged by the imaging unit 12
As shown in FIG. 9B, the resolution of the image in the traveling direction p is low.

As shown in FIG. 9C, when the traveling speed of the traveling driving means 14 is set to be lower than that in the case shown in FIG. 9A (w1: traveling driving means 14 in FIG. 9A). Traveling speed> w3: traveling speed of the traveling driving unit 14 in FIG. 9C), and the image of the electronic component b captured by the imaging unit 12 has a resolution in the traveling direction p as shown in FIG. 9C. Will be higher.

Therefore, by adjusting the traveling speed of the detecting means 11 for each electronic component b to a speed at which the best image suitable for the type and characteristics of each electronic component b can be obtained, the shape and suction of the electronic component b can be obtained. The posture information can be accurately read, and the correction processing by the control means 1 can be performed with higher accuracy, and the electronic component b can be accurately mounted at a predetermined position on the printed circuit board c. Further, since the processing speed can be changed depending on the type of the electronic component b, the mounting efficiency can be improved.

Next, an embodiment of the present invention described in claim 3 will be described. As shown in FIG. 10 (a), an electronic component b is supplied to a suction section 3 of a mounting head 2 by a supply section m. And is held by suction.

Also, the lighting means 13 has the structure shown in FIGS.
As shown in FIG.
a2, 13a3, the light emitting direction of each of the light emitting diode groups 13a
The irradiation directions of 1, 13a2 and 13a3 are r1 and r, respectively.
The light emitting diode groups 13a1, 13a2, and 13a3 are attached at different angles from the light emitting diode groups 2 and r3. Furthermore, these respective light emitting diode groups 13a1, 13a
The light amounts can be individually controlled for a2 and 13a3.

Here, the detecting means 11 is a
4 moves in one direction by the operation of 4
With the lighting of 3, the imaging means 12 moves below the electronic component b held by the suction nozzle 3 to detect the holding state.

Now, as shown in FIG. 10A, when the suction nozzle 3 holds an electronic component b such as SOJ or PLCC whose electrode portion has a J-lead shape, each of the light emitting diode groups 13a1 , 13a2, and 13a3.

Since the lead surface of the J-lead electronic component b is rough and the accuracy of the curved surface shape of the lead is often rough, an image cannot be accurately captured by irradiation from only one direction. Is the light emitting diode group 13a
By combining light sources having different irradiation angles of 1, 13a2, and 13a3, diffused light can be generated to uniformly irradiate and image the J-lead portion, and image degradation due to halation and the like can be prevented. Also,
In the J-lead electronic component b, since the mold portion is black, the mold portion does not appear even when irradiated with diffused light combining light sources having different irradiation angles.

Further, as shown in FIG. 10B, when the suction nozzle 3 holds the electronic component b such as BGA or CSP having a ball-shaped bump portion, the bump portion has a ball-shaped electronic component b. In the electronic component b, there is a wiring pattern or the like in the mold portion, and as shown in FIG. 10A, when irradiating with diffused light combining light sources having different irradiation angles, portions other than the ball also shine, At 13,
As shown in FIG. 10 (b), by using only the light emitting diode group 13a1 in the horizontal direction and making only the ball portion shine, the information on the shape and the suction attitude of the electronic component b is accurately read, and The correction process can be performed with higher accuracy, and the electronic component b is accurately mounted at a predetermined position on the printed circuit board c.

Next, in the description of one embodiment of the present invention described in claim 4, since it is a combination of the above-described description of one embodiment of claims 1 and 3, the description thereof will be made. And is omitted here.

Next, an embodiment of the present invention described in claim 5 will be described.
The imaging of the electronic component b is performed according to the electronic component b mounted on the printed circuit board c, when only the imaging visual field is changed, when only the resolution is changed, or when both the imaging visual field and the resolution are changed. This is done by choosing one. First, FIG.
In the case shown in (a), only the data of 512 pixels at partially continuous positions from among 1024 pixels is read out from the 1024 pixels using the line sensor of 1024 pixels in the imaging unit 12 and written into the memory. This is referred to as “Case A”.
In the case shown in FIG. 11B, the image pickup unit 12 uses a 1024 pixel line sensor to
For every other pixel from among the pixels, only the data of 512 pixels is read out and written into the memory. The traveling speed of the line sensor is set to twice that of “Case A”. This is referred to as “Case B”. Also, in the case shown in FIG.
Using a 1024 pixel line sensor in
All data of the 024 pixels are read and written to the memory. The traveling speed of the line sensor is 1/2 of “Case A”
To This is referred to as “Case C”.

With reference to the above “Case A”, in the case of “Case B”, the resolution is で and the field of view is doubled, and in the case of “Case C”, the resolution is the same. The imaging field of view is doubled.

Based on the above “Case B”,
In the case of “Case A”, the resolution is doubled and the imaging field of view is 1 /
In case C, the resolution is twice and the field of view is the same.

Further, based on the above-mentioned "Case C", in the case of "Case A", the resolution is the same and the field of view becomes 1/2, and in the case of "Case C", the resolution is 1/1/2.
2, the imaging field of view becomes the same.

As described above, by changing the traveling speed of the line sensor, the number of pixels for reading data, and the reading position, the information on the shape and the suction attitude of the electronic component b is accurately read, and the correction processing by the control means 1 can be further improved. This can be performed with high accuracy, and all the electronic components b are accurately mounted at predetermined positions on the printed circuit board c.

In this example, as shown in FIG. 16A, in the case A, a QFP having a small pitch and a small size requiring high positioning accuracy is used. As shown in FIG. 16B, in the case of “Case B”, a large-size QFP with a coarse pitch that does not require high positioning accuracy is used. In the case of “Case C”, as shown in FIG. Therefore, it is suitable for image processing such as a large-size QFP with a narrow pitch that requires high positioning accuracy, and the processing efficiency can be improved by changing the processing speed depending on the type of the electronic component b.

Next, the description of an embodiment of the present invention described in claim 6 is a combination of the description of the embodiment of claim 5 described above, and only the imaging field of view is changed. In such a case, when only one of the resolutions is changed or when both the imaging field of view and the resolution are changed, the change is performed by switching an electric circuit.

The switching of the electric circuit can be performed by controlling horizontal and vertical addresses for writing video signal data converted into a digital signal through an A / D converter into a frame memory. Can be changed. Circuits for creating this address are a counter: C and a counter: F. (See FIGS. 7 and 12.) Incidentally, a timing chart of the driving clock, the start pulse, and the video signal is shown in FIG.

Now, when controlling the horizontal address, first, as shown in FIGS. 12 and 14A, the logical product circuits A and B formed by the drive clock: A and the enable signal: B The output is input to a counter C for generating a horizontal address.

As shown in FIG. 14A, “Case A”
By using different enable signals for "C" and "Case B" and "Case C", the output signals of the AND circuits A and B are
It changes as shown in FIG. As described above, the horizontal address for writing to the frame memory is created by the value obtained by counting the output signals of the AND circuits A and B. By controlling the address, the image field of view and the resolution can be changed. .

Next, when controlling the vertical address, as shown in FIGS. 12 and 15 (a), first, a logical product circuit D · formed by a start pulse signal: D and an enable signal: E is provided. The output of E is input to a counter F for generating a vertical address.

As shown in FIG. 15A, “Case A”
By using different enable signals for "Case B" and "Case C", the output signals of the AND circuits D and E are
It changes as shown in FIG. In this way, a value in which the output signals of the AND circuits D and E are counted is used to create a vertical address for writing to the frame memory. By controlling this address, the image field of view and the resolution can be changed. .

[0064]

As described above, according to the electronic component mounting method of the present invention, the lighting electronic circuit of the illuminating means in the detecting means can be simplified, and the detecting means can be changed depending on the type of the electronic component. Since it is possible to perform efficient illumination for controlling the amount of light that can be captured while controlling the image capture speed, the imaging field of view, and the resolution, accurate image capture can be performed while the detection unit travels at high speed. Therefore, it is possible to further shorten the mounting tact time of the electronic component and to improve the mounting accuracy of the electronic component, and to provide a special effect such that the device can be provided at low cost.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus schematically showing an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a side view showing a main part of the electronic component mounting apparatus in FIG. 1;

FIG. 3 is an explanatory diagram illustrating an example of a detection unit in FIG. 1;

FIG. 4 is a circuit diagram showing an example of dynamic driving in a lighting unit of the electronic component mounting device in FIG. 1;

FIG. 5 is an explanatory diagram showing a lighting state of a lighting unit of the electronic component mounting device in FIG. 1;

FIG. 6 is a schematic side view showing, in an enlarged manner, a detection means of the electronic component mounting apparatus in FIG. 1;

FIG. 7 is a block diagram illustrating a detection unit of the electronic component mounting device in FIG. 1;

FIG. 8 is an explanatory diagram showing an operation state of a detection unit of the electronic component mounting device in FIG. 1;

FIG. 9 is an explanatory diagram showing an operation state of another example of the detection means of the electronic component mounting device in FIG. 1;

FIG. 10 is an explanatory diagram showing an operation state of still another example of the detection means of the electronic component mounting device in FIG. 1;

FIG. 11 is an explanatory diagram showing an operation state of still another example of the detection means of the electronic component mounting device in FIG. 1;

FIG. 12 is a block diagram showing a circuit for changing an imaging field of view and a resolution of a detection unit of the electronic component mounting device in FIG. 1;

FIG. 13 is a dynamic chart diagram of the circuit in FIG. 12;

14 is an explanatory diagram showing an operation state of the circuit in FIG.

FIG. 15 is an explanatory diagram showing another operation state of the circuit in FIG. 13;

16 is an explanatory diagram showing each example of an electronic component suitable for each case in FIG. 11;

[Explanation of symbols]

 b Electronic component c Substrate 2 Mounting head 3 Holding member (suction nozzle) 11 Detecting means 12 Imaging means 13 Lighting means 14 Traveling driving means 16 Line sensor camera

Claims (6)

[Claims] In the process of sucking and holding an electronic component by a holding member of a mounting head and transferring the electronic component to a substrate, a detecting means comprising a line sensor camera is continuously moved to image the electronic component and then to the substrate. In the method of mounting the electronic component, the imaging of the electronic component by the detection unit is performed at the time of illumination by an illumination unit, and the illumination of the illumination unit is irradiated according to the electronic component mounted on the substrate. An electronic component mounting method characterized by controlling the amount of light to be transmitted. 2. A process of picking up and holding an electronic component by a holding member of a mounting head and transferring the electronic component to a substrate. A method of mounting the electronic component on the substrate, wherein the driving of the detection unit by the traveling drive unit is performed by controlling a traveling speed of the detection unit in accordance with the electronic component mounted on the substrate. Electronic component mounting method characterized by the above-mentioned. 3. The illumination of an illuminating means used when the electronic part is imaged by the detecting means is illuminated in a plurality of directions with respect to the electronic part in a plurality of directions. 2. The electronic component mounting method according to claim 1, wherein the electronic component mounting method is selected. 4. The illumination of an illuminating means used when an electronic component is imaged by a detecting means is illuminated in a plurality of directions with respect to the electronic component in a plurality of directions. 4. The electronic component mounting method according to claim 1, wherein the irradiation light amount is controlled separately. 5. The imaging of an electronic component by the detecting means is performed when only the imaging visual field is changed, when only the resolution is changed, or when both the imaging visual field and the resolution are changed according to the electronic component mounted on the board. 5. The electronic component mounting method according to claim 1, wherein the method is performed by selecting any one of them. 6. The imaging of an electronic component by the detection means is performed when only the imaging visual field is changed, when only the resolution is changed, or when both the imaging visual field and the resolution are changed according to the electronic component mounted on the board. 5. The electronic component mounting method according to claim 1, wherein the change is performed by selecting one of them, and the change is performed by switching an electric circuit.