JP4123447B2 - Electronic component imaging method and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component imaging method and an electronic component mounting apparatus capable of stably and reliably recognizing an image of an electronic component by an imaging means and performing high-speed processing of the electronic component.

  2. Description of the Related Art Conventionally, in the industry of assembling and mounting electronic components, it is known to obtain measurement values by image recognition using a CCD camera. This measuring means is incorporated in an electronic component mounting apparatus.

  In this electronic component mounting apparatus, in order to mount the electronic component with high accuracy, the electronic component is imaged by the CCD camera while the electronic component is sucked and held by the suction nozzle and moved to the mounting portion, The captured image information was converted into an electrical signal, and image processing was performed to obtain a measured value.

  And based on this measured value, during the movement of the electronic component, the mounting position was corrected and the electronic component was mounted on the printed circuit board.

  In order to obtain an image with high accuracy with few errors, it is necessary to use an illumination device having a light amount greater than or equal to a predetermined amount. Means such as continuous lighting with a lamp were used.

  However, these strobes and halogen lamps have a short life span and cannot be obtained with a stable light quantity for a long period of time in an electronic component mounting device, so it is necessary to replace the bulbs frequently. It was.

  In particular, halogen lamps are expensive, and due to their structure, the entire lighting device is large, and in an electronic component mounting device where each mechanism is relatively dense, there is no room for installation space. Is not fully available.

  On the other hand, when a conventional CCD camera used for imaging an electronic component does not have a shutter function, when the moving electronic component b is imaged, as shown in FIG. Since the part b exposes the odd-numbered part (ODD) scanning line as shown by the circle 2 and then exposes the even-numbered part (EVEN) scanning line as shown by the circle 3, it causes temporal image blurring. As shown by the circle 4, the frame image has a drawback of blurring.

  Further, even when the moving electronic component b is imaged by a normal camera having a shutter function, the electronic component b in the circle 1 is an odd part (as shown in the circle 2) as shown in FIG. Since only ODD scanning lines are exposed, there is no even-numbered (EVEN) exposure as shown by circle 3, and the half resolution is shown in circle 4, so in either case However, accurate image information of the electronic component b could not be obtained.

  Further, the video signal output in the conventional CCD camera is a single line, and as shown in FIG. 12 (a), after the odd-numbered (ODD) video signal is output, the even-numbered (EVEN) video signal is output. Therefore, as shown in FIG. 12 (b), the video signal output time is twice as long as that of the camera capable of outputting the video signal with double lines.

  For this reason, the time for recognizing the image of the electronic component b is lengthened, the mounting tact time of the electronic component b is shortened, and the great purpose of speeding up the operation of the entire electronic component mounting apparatus is not achieved. Etc. have various problems.

  The present invention has been made in order to solve the above-described problems, and illuminates an electronic component in a stopped state or a moving state with an illuminating unit composed of a light emitting diode, and images the electronic component during the illumination. The illumination by the illumination means is strobe illumination by a plurality of stages of light emitting diodes, and each of the plurality of stages of light emitting diodes flashes individually and simultaneously. It is an object of the present invention to provide an electronic component imaging method and an electronic component mounting apparatus capable of stably and reliably performing image recognition of an electronic component by an imaging means by selectively performing according to the type of the electronic component. Yes.

Means of the present invention for achieving the above-described object is achieved by using an electronic component adsorbing member that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by each driving means by numerical control. was removed from the supply unit and held by suction, in its way to be mounted in a predetermined position on the substrate which are positioned in the mounting portion, illuminating the electronic component in the Riutsu dynamic state by the illumination means comprising a light emitting diode, In the electronic component imaging method for obtaining image information by imaging the electronic component at the time of illumination with an imaging means,
Said illumination means is a stroboscopic illumination with a plurality of stages of the light emitting diode, the light emitting diodes in a plurality of stages, the case in which the respective stages individually to flash, and a case of flash respective stages simultaneously to the type of the electronic component depending selectively rows that have been, the plurality of stages of stages of blue light-emitting diode on the light emitting diode, and the lower stage other colors of light-emitting diodes, the blue light emitting diode, electrons held in the electronic component suction member The electronic component imaging method irradiates light from the side surface direction of the component.

Also, stages a blue light emitting diode on a plurality of stages of the light emitting diode, a lower stage other colors of light-emitting diodes. Further, at least a part of the light emitting diode irradiates light from the side surface direction of the electronic component held by the electronic component adsorption member.

And the illumination which consists of the advancing / retreating body which moves to the front-back direction, the movable body which moves to the left-right direction, the suction nozzle which can be moved up and down which moves the supply part and mounting part of an electronic component, and the light emitting diode which illuminates an electronic component An electronic component mounting apparatus comprising: means and an imaging means for illuminating an electronic component in a moving state and imaging the electronic component at the time of illumination,
Said illumination means is a stroboscopic illumination with a plurality of stages of the light emitting diode, the light emitting diodes in a plurality of stages, the case in which the respective stages individually to flash, and a case of flash respective stages simultaneously to the type of the electronic component depending selectively rows that have been, the plurality of stages of stages of blue light-emitting diode on the light emitting diode, and the lower stage other colors of light-emitting diodes, the blue light emitting diode, electrons held in the electronic component suction member The electronic component mounting apparatus irradiates light from the side of the component.

Also, stages a blue light emitting diode on a plurality of stages of the light emitting diode, a lower stage other colors of light-emitting diodes. Further, at least a part of the light emitting diode irradiates light from the side surface direction of the electronic component held by the electronic component adsorption member.

  As described above, the present invention uses a light emitting diode for the illumination means, so that the life of the illumination means is extended, the construction of the illumination means itself can be made compact, and it can be used even in a small installation space.

  In particular, the imaging of the electronic component of the imaging unit by using the illumination unit described above is performed while the imaging unit is moving below the electronic component, that is, in a series of continuous moving states without stopping the imaging unit. The image reading process can be greatly shortened, and the imaging process in the position measurement in the image processing of the electronic component sucked and held by the suction nozzle can be greatly speeded up.

  The position measurement by imaging and image processing of the electronic component by the imaging means is completed in the process in which the suction nozzle sucks and holds the electronic component in the supply unit and then moves to the mounting unit in the body. The purpose of significant time savings is achieved.

  Since the imaging unit captures an image of the electronic component that is indirectly projected by the light image incident unit, the size of the imaging unit in the height direction can be reduced, and the movement distance of the Z axis can be shortened. Therefore, it is possible to shorten the mounting time of the electronic component.

  The illuminating means is a stroboscopic illumination composed of only blue light emitting diodes or composed of light emitting diodes of a plurality of colors including blue light emitting diodes, so that good image information can be obtained for a plurality of electronic component types having different colors. Can be obtained.

  The blue light-emitting diode in the illumination means is arranged at a position where light can be irradiated from the side surface direction of the electronic component held by the electronic component adsorption member, so that the light emitted from the blue light-emitting diode reaches only by irradiation from the front. It is possible to illuminate even difficult electronic components.

  By providing a filter that blocks the wavelength of a predetermined region before the light image is incident on the visual sensor, the imaging unit can block disturbance light in the illumination of the electronic component. It has a special effect such as.

  Next, an example of an electronic component imaging method and an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.

  2 and 6, A is an electronic component imaging apparatus that employs the electronic component imaging method of the embodiment of the present invention, and is due to the detection means 3 including the imaging means 1 and the illumination means 2, and the control means 4. The electronic component mounting apparatus W shown in FIG. 1 and FIG.

  As shown in FIG. 1, the electronic component mounting apparatus W receives an electronic component b such as a chip component or an IC component from the supply unit m and transfers the electronic component b to the mounting unit n. A predetermined electronic component b is mounted at a predetermined position on c.

  The mounting position is obtained in accordance with a predetermined program input to the control means 4 by a conventional computer or the like, and includes a mounting head 5 that arbitrarily moves in the X-axis and Y-axis directions. 5 includes a suction nozzle 6 that is an electronic component suction member that is arbitrarily moved in the Z-axis direction and that can obtain an arbitrary θ angle (rotation angle).

  In addition, as shown in FIG. 1, the supply part m of the electronic component b described above is arranged in a large number in a predetermined parallel as shown in FIG. The provided tape feeder M or the like is used, and these are provided in the machine body 7.

  The detailed structure is as follows. The advancing / retracting body 9 is attached to the body 7 and arbitrarily moved in the front-rear direction (Y-axis) by the advancing / retreating means 8, and the left-right direction (X-axis) is attached to the advancing / retreating body 9 by the moving means 10. The suction nozzle 6 is attached to the movable body 11 arbitrarily moving to the movable body 11 and the mounting head 5 engaged with the movable body 11 so that the suction nozzle 6 can be moved up and down by the lifting and lowering means 12. The θ angle (rotation angle) is freely rotatable, and each of the driving means 8, 10, 12, and 13 is operated with high accuracy by a servo motor capable of numerical control.

  The mounting head 5 is provided with a suction nozzle type that sucks the upper surface of the electronic component b, a chucking type that grips the outer periphery thereof, etc., and may be a single head. As shown in FIG. 4, if the head is configured with a plurality of heads, the mounting efficiency of the electronic component b is improved.

  The movable body 11 or the mounting head 5 is movable in one direction (including reciprocation) in the electronic component imaging apparatus A in the electronic component imaging apparatus A, that is, in the case of a plurality of heads. The mounting head 5 is attached to the body 11 through a mounting body 15 so that the mounting head 5 can be translated in parallel by reciprocating means 14 controlled by a servo motor or the like capable of numerical control.

  The image pickup means 1 picks up and measures the suction posture of the electronic component b taken out from the supply unit m in the machine body 7 by the mounting head 5, and includes a visual sensor 16 and a light image incident means 17. .

  Among these, the visual sensor 16 is attached to one side of the attachment body 15 and is disposed laterally with respect to the electronic component b held by the mounting head 5 and uses a CCD (charge coupled device). If an electronic camera is used to convert an optical video signal into an electrical signal to obtain image information of the electronic component b, and this CCD camera has a shutter function, the illumination means 2 to be described later will cause disturbance light. The electronic shutter speed can be arbitrarily converted according to camera settings, but the exposure time is controlled in the range of about 1/60 to 1 / 100,000 seconds. Preferably, about 1/1000 to 1 / 10,000 seconds is appropriate.

  The obtained image signal is sent to an image processing means 4a connected to the control means 4 to be described later, and is compared with a predetermined numerical value inputted in advance, and a desired recognition of the electronic component b is made. .

  In the image recognition described above, the overall size of the electronic component b sucked and held by the suction nozzle 6, the overall position in the front-rear and left-right directions, the rotation angle (θ angle) of the electronic component b, the lead pitch, and the lead Each check such as bending and the number of leads is performed. As a result of the position correction, the control means 4 matches the electronic component b with the correct position.

  The above-described light image incident means 17 is disposed on the other side of the attachment body 15 corresponding to the visual sensor 16, and is attached on the movement locus of the attachment body 15 just below the electronic component b of the mounting head 5. In other words, a prism or a surface-deposited mirror is used, and the light emission surface corresponds to the lower surface of the electronic component b adsorbed by the visual sensor 16 and the adsorption nozzle 6, respectively.

  By capturing an image of the electronic component b indirectly projected by the light image incident means 17, the height dimension of the imaging means 1 can be shortened, and the entire electronic component mounting apparatus W can be made compact. it can.

  In this light image incident means 17, when a surface vapor deposition mirror is used, there is an advantage that it is cheaper and does not take up space compared to a prism. When a prism is used, the reflectance is higher and clearer than the surface vapor deposition mirror. Image quality can be obtained.

  Further, as shown in FIG. 4 (a), the light image incident means 17 is provided as one, so that the exposure direction of the visual sensor 16 becomes horizontal, and as shown in FIG. The exposure direction of the sensor 16 is vertical.

  The illuminating means 2 in the detecting means 3 described above illuminates the electronic component b in a stopped state or moving state instantaneously (flashing), and improves the imaging accuracy of the electronic component b by the imaging means 1 as much as possible. 1 or a group of light-emitting diodes, which are formed in a square or annular hollow frame shape as shown in FIG. 2R> 2 and FIG. The fixing member 18 is fixed to the upper part of the image incident means 17.

  In general, when the electronic component b is detected by the imaging unit 1 with the illumination unit 2 that travels with respect to the electronic component b in a stationary state, or the imaging unit 1 with the illumination unit 2 in a stationary state is detected. On the other hand, when detecting the electronic component b that travels, the imaging means 1 having a shutter function is used for detection at the time of traveling. In this case, the conventional illumination device obtains an image sufficient for measurement. Therefore, the necessary amount of light cannot be obtained.

  The embodiment of the present invention focuses on this problem, that is, the flash time of the light emitting diode described above flashes within the exposure time by the electronic shutter speed of the image pickup means 1, and this flash time is adjusted. As a result, the light amount of the illumination means 2 can be adjusted.

  Further, as the light amount of the light-emitting diode, the larger the current value flowing through the light-emitting diode, the larger the light amount is obtained. Usually, only a current of 10 to 20 mA (rated current value, which differs depending on each light-emitting diode) flows. Absent.

  However, if the duty ratio of the flashing time in the light emitting diode (the ratio of the signal period in one cycle) is 1/10 or less, it is possible to flow a current of up to about 100 mA to the same light emitting diode. An amount of light about 10 times that at the time of light emission (in current value) is obtained.

  That is, as indicated by circle 1 in FIG. 5, when the flash of the light emitting diode is in the same cycle as that of the non-flash, the duty ratio becomes 1/2 and the time for the next flash becomes extremely short. Only a current equal to or lower than the rated current value can flow through the light emitting diode, and therefore, a light amount greater than the light amount based on the rated current value cannot be obtained.

  However, as shown by circles 2 and 3 in FIG. 5, if the light emitting diodes are set to flash at a predetermined interval, the duty ratio becomes 1/10 and 1/24, so that the light emitting diodes can be used once. A current exceeding the rated current value when the light emitting diode is continuously lit, that is, a current about 10 times the rated current value can be instantaneously passed to the flashlight. It will flash with a light quantity greater than the light quantity when it is lit.

  Note that the above-described duty ratio is obtained by “pulse width f / repetition period g” in the circle 4 shown in FIG. 5. The pulse allowable forward current e flowing through the light emitting diode is determined by the pulse width f and the duty cycle. The allowable value varies depending on the driving condition such as the ratio, and is obtained from a predetermined characteristic diagram.

  For example, in the case of the light-emitting diode (product name: TLRA125, manufactured by Toshiba Corporation) used in the present embodiment, the duty ratio is naturally set by appropriately setting the pulse width f that is the flashing time of the light-emitting diode and the repetition period g. It is determined to be 1/10 or less.

  Note that the light emitting diodes in the illumination unit 2 described above are those that emit blue, red, green, orange, white, and the like, and among these, blue and red are particularly preferable for illumination of the imaging unit 1. .

  And the structure of this illumination means 2 may be a combination of a blue light-emitting diode and a light-emitting diode composed of a plurality of other colors as described above, in the case of consisting only of a blue light-emitting diode. The blue light emitting diode and the light emitting diodes of other colors can be selectively flashed individually and simultaneously.

  The selection of the color of the light emitting diode in the illuminating means 2 depends on, for example, the type of electronic component b to be mounted.

  For example, when the electronic component b is BGA or μBGA, the electrode portion is silver and the wiring pattern color on the surface of the interposer is gold or orange and close to the red wavelength. When the light emitting diode is used, the wiring part of the electronic component b is also reflected, and an image of the electrode part to be measured and an image mixed with the wiring part are formed, which hinders positioning measurement of the electronic part b.

  However, since the entire electronic component b is flashed using a blue light emitting diode having a complementary color relationship with red, the wiring portion absorbs this blue and does not reflect, so the image information of the electrode portion that reflects the light is reflected. High-accuracy acquisition is possible.

  In addition, when a blue light emitting diode is used for imaging illumination in the case of an electronic component b in which the base is black and a gold terminal is implanted in the appropriate place, the light emitted from both the base and the terminal is irradiated. Since it is absorbed and becomes a detection failure, the red light emitting diode is used for flashing to reflect the light at the terminal portion so that the image can be recognized.

  Further, the blue light emitting diode in the illumination means 2 is disposed at a position where light can be irradiated from the side surface direction of the electronic component b held by the suction nozzle 6 which is an electronic component suction member, as shown in FIG. In addition, a blue light emitting diode 2a is disposed at a position closest to the electronic component b, and a color other than the blue light emitting diode 2a, for example, a red light emitting diode 2b is disposed at a position below the blue light emitting diode 2a.

  Thereby, in the case of an electronic component b having a protruding electrode portion such as a BGA, even when the protrusion of the electrode portion is low, the amount of light emitted by the blue light emitting diode 2a can be sufficiently obtained without reduction, and clear image information can be obtained. Is obtained.

  Further, when the illumination unit 2 using the blue light emitting diode 2a and the red light emitting diode 2b is used, it is in the imaging unit 1, and before the light image is incident on the visual sensor 16, that is, the electronic component b and the visual sensor. 16, a filter 20 for blocking a wavelength in a predetermined region is disposed.

  That is, the filter 20 is a magenta filter (for example, a product name dichroic filter manufactured by Nippon Vacuum Optics Co., Ltd.) having a characteristic of transmitting only blue and red wavelengths. The magenta filter 20 has a wavelength of, for example, 480. ˜620 nm region, that is, light capable of blocking light of wavelengths other than blue and red. For example, other light (disturbance light) such as a fluorescent lamp for indoor lighting in an electronic component mounting factory This can be cut off, and the accuracy of the image information of the electronic component b is further improved.

  The control means 4 receives the detection signal from the image pickup means 1, calculates based on predetermined data, and arbitrarily controls each of the means 8, 10, 12, 13 or the reciprocating means 14 individually. A conventional computer is used.

  Further, a position detection member 21 that regulates the image pickup position of the image pickup means 1 and the flash position of the illumination means 2 (the same position as the image pickup position) is provided. For example, an appropriate one such as a photoelectric tube or a proximity switch is provided. The detector 22 is attached to the movable body 11 corresponding to each mounting head 5 at the imaging position of the imaging means 1, that is, the flash position of the illumination means 2, and the detection corresponding to the detector 22 is performed. A body 23 is provided on the mounting body 15.

  Therefore, the electronic component imaging method and electronic component mounting apparatus W according to the embodiment of the present invention configured as described above have the following operations.

  On the printed circuit board c, a predetermined number of electronic components b are respectively mounted at predetermined positions. In this work, each set value, operation order, and the like are determined in advance by the control means 4. Is programmed.

  The electronic component b is mounted by moving the mounting head 5 to the supply part m of the electronic component b by operating the advancing / retreating means 8 and the moving means 10, the lifting / lowering means 12, and the rotating means 13 which are driving means. The electronic component b is sucked and held.

  Then, the reciprocating means 14 attached to the mounting head 5 is actuated, and the imaging means 1 provided on the mounting body 15 together with the illuminating means 2 is laterally moved with respect to the mounting head 5 (in the direction of arrow p in FIG. 3). Move to).

  When the detection body 23 in the position detection member 21 corresponds to the detector 22 that is the imaging position of the imaging means 1, it detects that the imaging position has been reached, emits a trigger signal, and causes the light emitting diode in the illumination means 2 to While being supplied with power, the electronic shutter of the visual sensor 16 operates, and an image is captured by the visual sensor 16 via the light image incident means 17 and transmitted to the image processing means 4 a and the control means 4.

  At this time, the flashing time of the light emitting diode is set to flash within the exposure time of the visual sensor 16.

  In particular, the illumination by the illumination means 2 is instantaneously supplied with a current exceeding the rated current value of the light-emitting diode when the light-emitting diode is continuously lit to the plurality of light-emitting diodes. Since the light quantity larger than the light quantity of the rated current value of the light emitting diode when the light emitting diode is continuously turned on can be obtained, sufficient illumination for imaging the electronic component b is performed.

  Furthermore, by using blue and red light emitting diodes for the illumination means 2, it is possible to obtain desired image information regardless of the coloring state of the electronic component b that is the object to be imaged.

  Moreover, the blue and red light emitting diodes can be flashed individually or simultaneously, and can be synchronized and flashed at the same time, depending on the type of electronic component b to be imaged, etc. A flash operation of a plurality of types of light emitting diodes can be performed selectively.

  Further, the blue light emitting diode is disposed so as to be able to irradiate flash light from the side surface direction of the electronic component b held by the suction nozzle 6, that is, as shown in FIG. Even when the blue light emitting diode 2a is disposed and the red light emitting diode 2b is disposed below the blue light emitting diode 2a, even in the case of the electronic component b having a low electrode portion such as a BGA, this electronic component The amount of light emitted from the blue light emitting diode 2a to b can be sufficiently obtained without reduction, and clear image information of the electronic component b can be obtained.

  As described above, good image information of the electronic component b can be obtained by the flash of the blue light emitting diode and the red light emitting diode. Further, in order to perform this processing reliably, the light image is incident on the visual sensor 16. The accuracy is further improved by providing the magenta filter 20 in front.

  As a result, only the blue and red wavelengths emitted from the light emitting diodes can be transmitted and the image of the electronic component b can be recognized more clearly. Since there are many fluorescent lamps and the like, and the sensitivity wavelength of the CCD camera that is the visual sensor 16 is also high in green, the influence of disturbance light can be reduced by blocking this green wavelength by the magenta filter 20.

  Note that the imaging operation of the imaging unit 1 may be in either the stopped state or the moving state. However, if the imaging unit 1 is in a moving state that does not stop, the time is increased accordingly. There is no loss, and high-speed electronic component b can be mounted.

  Furthermore, when the imaging unit 1 stops corresponding to the electronic component b that is sucked and held each time, vibrations occur in the reciprocating unit 14 and the imaging unit 1 due to the action of inertial force and the like. If the image pickup means 1 is in a moving state that does not stop, the vibration generation is eliminated and the waiting time is completely eliminated. The mounting time of the part b can be shortened.

  Along with this, the control means 4 performs an operation based on the measurement signal and previously input data, and performs image information processing of the electronic component b to obtain a correction numerical value.

  In this way, in the case of the 4-head type as shown in FIGS. 1 and 3, the same process is performed on the remaining 3 heads 5, and the suction nozzles 6 attached to the respective mounting heads 5. The image processing unit 4 and the control unit 4 perform correction processing by a series of continuous operations without stopping the imaging unit 1 at the imaging position of the electronic component b held by suction.

  These operations are all completed in the process in which the suction nozzle 6 sucks and holds the electronic component b in the supply unit m and then moves to the mounting unit n in the machine body 7. When the mounting nozzle n reaches the mounting unit n, the printing is immediately performed. Since the electronic component b can be mounted on the substrate c, there is no loss in the mounting time of the electronic component b.

  Next, the operation when the camera (visual sensor 16) provided with the shutter function capable of imaging in the full frame described in detail above is used as the imaging means 1 in the electronic component mounting apparatus W is a block shown in FIG. This will be described with reference to the flowcharts shown in FIGS.

  First, when the electronic component mounting apparatus W starts operation, the driving units 8, 10, 12, 13 are operated by signals from the control unit 4, and the plurality of mounting heads 5 provided on the mounting body 15 are supplied to the supply unit m. The desired electronic component b is sucked and held by the suction nozzle 6.

  At this time, with respect to the plurality of suction nozzles 6, the electronic component b is sucked and held by all or necessary portions or by the required number of suction nozzles 6.

  Then, the mounting head 5 moves from the supply unit m to the mounting unit n in the XY-axis direction, and the reciprocating means 14 attached to the mounting head 5 is activated to provide the mounting body 15 with the mounting head 15. The imaging unit 1 moves together with the illumination unit 2 in the left-right direction (the direction of the arrow p in FIG. 3) with respect to the mounting head 5.

  Then, when the detection body 23 in the position detection member 21 corresponds to the detector 22 that is the imaging position of the imaging means 1, it is detected that the imaging position has been reached, and at this time, a trigger that matches the timing of image capture from the outside A signal is input to the random shutter generation circuit (interrupt processing).

  In this random shutter generation circuit, a part of the signal of the synchronization signal generation circuit is reset by the input of the trigger signal and restarted in synchronization with the external trigger signal.

  At this time, power is supplied to the light emitting diode in the illumination means 2 and the shutter of the visual sensor 16 (CCD camera) is operated, and the visual sensor 16 takes in the full frame image information via the light image incident means 17. In the synchronization signal generation circuit, a vertical synchronization signal and a horizontal synchronization signal necessary for driving the CCD camera are generated and sent to the timing generation circuit.

  The signal generated by the CCD driver is transmitted to the CCD camera (visual sensor 16), and ODD (odd field) and EVEN (even field) are simultaneously output from the CCD camera, and all the pixels of the electronic component b are output. Reading is performed, and each ODD video signal and EVEN video signal are simultaneously output through the video amplifier and the video signal processing circuit, and transmitted to the image processing means 4a and the control means 4.

  In FIG. 7, the CCD read timing signal is a signal indicating the timing or period of reading the video signal output from the CCD camera 16, and the clock signal is the video signal output from the CCD camera 16. This is a synchronization signal that is a source of a signal for reading.

  In the control means 4, based on the image information of the electronic component b obtained by the imaging means 1 by the above-described process, the calculation information is compared with the mounting information of the electronic component b input to the control means 4 in advance, and the result If there is a positional deviation, the amount of correction is numerically controlled for each means 8, 10, 12, 13 etc. in the electronic component mounting apparatus W, and the holding state of the electronic component b held by the suction nozzle 6 is determined. All the correction operations are completed until the mounting position of the substrate c of the mounting portion n is reached.

  The image pickup of the electronic component b of the image pickup means 1 is performed in a series of continuous moving states while the image pickup means 1 moves below the electronic component b by the reciprocating means 14, that is, without stopping the image pickup means 1. The image reading process can be greatly shortened, and the synergistic effect by the cooperation with the illuminating means 2 described above allows the electronic component b held by the suction nozzle to be held by the suction nozzle. The imaging process at the time of position measurement in image processing is significantly speeded up, and as a result, the purpose of greatly shortening the mounting tact time of the electronic component b is achieved.

  In the case of a plurality of mounting heads 5, as shown in FIG. 10, in the entire movement process h of the imaging means 1, the movement by the reciprocating means 14 from the standby position to the movement end position is in a state where the movement amount is zero. Is moved from the mounting head 5 of NO1 to the mounting head 5 of NO4 at an equal speed when a predetermined speed is reached. After the imaging is completed, the electrons by the suction nozzle 6 are decelerated. It stops at a position that does not hinder the mounting operation of the component b.

  At this time, the imaging unit 1 may immediately return to the start position in the forward path, but in accordance with the operation of sucking and holding the next electronic component b, the process is performed from the movement end position, that is, from the standby position to the movement end position on the return path You may move while doing.

1 is a schematic plan view showing an example of implementation of an electronic component mounting apparatus employing an electronic component imaging method according to the present invention. FIG. 2 is a schematic side view of the apparatus in FIG. 1. It is a schematic perspective view of the apparatus in FIG. It is explanatory drawing which shows each example of the optical image incident means of the imaging means of the apparatus in FIG. It is explanatory drawing which shows each example of the duty ratio of the illumination means of the apparatus in FIG. It is explanatory drawing which shows notionally the detection means part of the apparatus in FIG. It is a block diagram which shows the imaging process of the imaging means of the apparatus in FIG. It is a flowchart figure which shows the imaging start of the imaging process of the imaging means of the apparatus in FIG. It is a flowchart figure which shows the imaging process of the imaging means of the apparatus in FIG. It is explanatory drawing of the operation | movement which shows the imaging process of the imaging means of the apparatus in FIG. It is explanatory drawing at the time of using a full frame shutter camera for the imaging means in the electronic component imaging method concerning this invention. 11A and 11B are explanatory views showing the output state of the video signal of the image pickup means in FIG. 11, where FIG. 11A shows a conventional example, and FIG.

Explanation of symbols

W Electronic component mounting apparatus b Electronic component c Printed circuit board m Supply unit n Mounting unit 1 Imaging unit 2 Illumination unit 2a Blue light emitting diode 2b Red light emitting diode 3 Detection unit 8, 10, 12, 13 Driving unit 16 Visual sensor 17 Optical image incidence Means 20 Filter

Claims (2)

The electronic component is sucked and held by the electronic component suction member that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by each of the driving means by numerical control, and the mounting portion is positioned. in its way to be mounted on and predetermined positions on the substrate, illuminating the electronic component in by the Riutsu dynamic state lighting means comprising a light emitting diode, an image by imaging the electronic component at the time of illumination by the image pickup means In an electronic component imaging method for obtaining information,
Said illumination means is a stroboscopic illumination with a plurality of stages of the light emitting diode, the light emitting diodes in a plurality of stages, the case in which the respective stages individually to flash, and a case of flash respective stages simultaneously to the type of the electronic component depending selectively row of stomach,
It said plural stages of stages of blue light-emitting diode on the light emitting diode, a lower stage other color light emitting diodes,
The blue light emitting diode irradiates light from the side surface direction of the electronic component held by the electronic component adsorption member. An advancing / retracting body that moves in the front-rear direction, a movable body that moves in the left-right direction, a suction nozzle that can move up and down to move between the supply part and the mounting part of the electronic component, and an illumination means that includes a light-emitting diode that illuminates the electronic component , An electronic component mounting apparatus comprising an imaging means for illuminating an electronic component in a moving state and imaging the electronic component at the time of illumination,
Said illumination means is a stroboscopic illumination with a plurality of stages of the light emitting diode, the light emitting diodes in a plurality of stages, the case in which the respective stages individually to flash, and a case of flash respective stages simultaneously to the type of the electronic component depending selectively row of stomach,
It said plural stages of stages of blue light-emitting diode on the light emitting diode, a lower stage other color light emitting diodes,
The blue light emitting diode emits light from the side surface direction of the electronic component held by the electronic component adsorption member.

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