JP4011228B2 - Electronic component mounting method - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an electronic component mounting method for mounting electronic components on a substrate, capable of detecting electronic components sucked and held by a holding member quickly and with high accuracy, and shortening the mounting tact time. About.
[0002]
[Prior art]
Conventionally, when an electronic component is mounted on a printed circuit board by an electronic component mounting apparatus, while moving the posture of the electronic component held by the suction nozzle of the mounting head to the mounting portion of the printed circuit board, for example, Image information is obtained by imaging with a camera such as a CCD having an electronic shutter mechanism, and the electronic component is corrected on the basis of the image information according to predetermined data. It is mounted correctly in the above defined position.
[0003]
However, in the imaging of electronic parts, a CCD camera (full frame shutter camera) having an electronic shutter mechanism can only perform imaging at a fixed resolution, and is relatively expensive and has a peripheral circuit for handling the camera. There is a problem that the entire apparatus becomes complicated and the cost increases.
[0004]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems. In the process of sucking and holding the electronic component by the holding member of the mounting head and transferring it to the substrate, the detection means including the line sensor camera is continuously moved. In this method, the electronic component is mounted on the substrate after imaging the electronic component, and the electronic component sucked and held by the holding member is detected quickly and with high accuracy to shorten the tact time for mounting the electronic component. It is an object of the present invention to provide an electronic component mounting method that can be used.
[0005]
[Means for Solving the Problems]
The means of the present invention for achieving the above-described object is the electronic component in which the electronic component is continuously moved by moving the detection means including a line sensor camera in the process of sucking and holding the electronic component by a plurality of holding members and transferring it to the substrate. In the method of mounting the electronic component on the substrate after imaging, the imaging of the electronic component by the detection unit is performed at the time of illumination by the illumination unit, and the illumination of the illumination unit is an electron mounted on the substrate Depending on the part, control the amount of light I said By detection means Said The imaging of electronic components Said Attaching to the board Said Depending on the electronic component, only the imaging field of view Change the traveling speed of the line sensor camera When changing, only the resolution Change the number of readout pixels and the readout position If you change it, Change the travel speed of the line sensor camera Imaging field of view Change by changing the number of read pixels and the read position If you want to change both resolution and By switching electrical circuits The electronic component mounting method is performed by selection.
[0006]
【Example】
Next, an example of an electronic component mounting method according to the present invention will be described with reference to the drawings. 1 to 2, A is an electronic component mounting apparatus that employs the electronic component mounting method according to the embodiment of the present invention. An electronic component b such as a chip component or an IC component is received from the supply unit m and is transferred to the mounting unit n. The predetermined electronic component b is mounted at a predetermined position on the printed circuit board c in the mounting portion n.
[0007]
The mounting position is obtained in accordance with a predetermined program input to the control means 1 by a conventional computer or the like, and includes a mounting head 2 that arbitrarily moves in the X-axis and Y-axis directions. 2 includes a suction nozzle 3 that is a holding member of an electronic component that is arbitrarily moved in the Z-axis direction and that can obtain an arbitrary θ angle (rotation angle).
[0008]
In addition, as shown in FIG. 1, the supply part m of the above-described electronic component b has a large number of electronic components b placed on a tray, or many at predetermined positions as indicated by virtual lines in the figure. The tape feeders M and the like provided side by side are used, and these are provided in the machine body 4.
[0009]
The detailed structure is as follows. The advancing / retracting body 6 is attached to the airframe 4 and arbitrarily moved in the front / rear direction (Y axis) by the advancing / retreating means 5, and the advancing / retracting body 6 is attached to the advancing / retreating body 6 and moved in the left / right direction (X axis). The suction nozzle 3 is attached to the movable body 8 that is arbitrarily moved to and the mounting head 2 that is engaged with the movable body 8 so as to be lifted and lowered by the lifting and lowering means 9, and the rotation means 10 is arbitrarily connected to the vertical axis. The θ angle (rotation angle) is freely rotatable, and each of the driving means 5 and 7, 9, and 10 is operated with high accuracy by a servo motor or the like capable of numerical control.
[0010]
The mounting head 2 is provided with a suction nozzle type that sucks the upper surface of the electronic component b, a chucking type that grips the outer periphery thereof, etc., and may be a single head. As shown in FIG. 4, if the head is configured with a plurality of heads, the mounting efficiency of the electronic component b is improved.
[0011]
The movable body 8 or the mounting head 2 is provided with detection means 11, and the detection means 11 includes an imaging means 12 and an illumination means 13. Further, when the plurality of mounting heads 2, 2... Are provided, the traveling drive means 14 controlled in one direction (including reciprocation), that is, the movable body 8 is controlled by a numerically controllable servo motor or the like. Thus, the mounting head 2 is mounted so as to be movable in parallel in the parallel direction via the mounting body 15.
[0012]
The image pickup means 12 in the detection means 11 picks up and measures the shape and suction posture of the electronic component b taken out from the supply unit m in the machine body 4 by the mounting head 2. And means 17.
[0013]
Among these, the line sensor camera 16 is mounted on one side of the mounting body 15 and is disposed on the side with respect to the electronic component b held by the mounting head 2, and converts the optical video signal into an electrical signal. The image information of the electronic component b is obtained, and the obtained image signal is sent to the image processing means 1a connected to the control means 1 and compared with a predetermined numerical value inputted in advance. Thus, desired recognition of the electronic component b is performed.
[0014]
In the image recognition described above, the overall size of the electronic component b attracted and held by the suction nozzle 3, the overall position in the front-rear and left-right directions, the rotation angle (θ angle) of the electronic component b, the lead pitch, and the lead Check each bend, number of leads, etc. Do Thus, as a result of the position correction, the control means 1 makes the electronic component b match the correct position determined.
[0015]
The above-described light image incident means 17 is disposed on the other side of the mounting body 15 corresponding to the line sensor camera 16 and is mounted on the movement locus of the mounting body 15 just below the electronic component b of the mounting head 2. In other words, a prism or a surface-deposited mirror is used, and the light incident surface corresponds to the lower surface of the electronic component b adsorbed by the line sensor camera 16 and the adsorption nozzle 3, respectively. By capturing an image of the electronic component b indirectly projected by the light image incident means 17, the height dimension of the imaging means 12 can be shortened, and the entire electronic component mounting apparatus A can be made compact. Can be produced.
[0016]
In this light image incident means 17, when a surface vapor deposition mirror is used, there is an advantage that it is cheaper and does not take up space compared to a prism. When a prism is used, the reflectance is higher and clearer than the surface vapor deposition mirror. Image quality can be obtained. Further, as shown in FIG. 3 (a), the light image incident means 17 is provided as one, so that the exposure direction of the line sensor camera 16 becomes horizontal, and as shown in FIG. 3 (b), two light image incident means 17 are provided. The exposure direction of the line sensor camera 16 is vertical.
[0017]
Detection means described above 11 The illumination means 13 in FIG. 1 illuminates the electronic component b in the stopped state or the moving state, and improves the imaging accuracy of the electronic component b by the imaging means 12 as much as possible, and is a light emitting diode consisting of one or many groups. 13 a, which is fixed to the upper part of the light image incident means 17 in the imaging means 12 by the attachment body 15.
[0018]
In this illumination means 13, the light-emitting diode 13a is pulsed repeatedly (dynamic lighting, see FIG. 4) that repeats blinking in time, that is, apparently continuously lit with a short blinking interval. Apply the action that looks like. In imaging with the line sensor camera 16 in the imaging means 12, in order to prevent this flickering flickering, it is necessary to set the fundamental frequency of the flickering to 1 KHz or more.
[0019]
More specifically, as shown in FIG. 5A, when the lighting time of the light emitting diode 13a is substantially equal to the lighting time, an average light amount that is about half of the light amount when the light emitting diode 13a is turned on is obtained. Naturally, as shown in FIG. 5B, the average light quantity decreases as the turn-off time increases. Further, the current value and the voltage value are constant, and the average light amount can be controlled by changing the duty ratio (the ratio of the signal period in one cycle) between the lighting time and the light-off time.
[0020]
The duty ratio is expressed by duty ratio = lighting time / (lighting time + light-out time) = pulse width f / repetition period g (see FIG. 5A), and the amount of light decreases as the duty ratio decreases. It will be less.
[0021]
Further, in the illumination means 13, a plurality of light emitting diodes 13a are arranged in a plurality of stages as shown in FIG. 6, and the irradiation directions r1, r2, and r2 are provided for each stage. r3, rn and their angles are changed.
[0022]
The light emitting diode 13a in the illumination means 13 is one that emits light in blue, red, green, orange, white or the like. Of these, blue and red are particularly used for illuminating the imaging means 12. preferable. The illuminating means 13 may be composed of only the blue light emitting diode 13a, or may be a combination of the blue light emitting diode 13a and the above-described light emitting diodes of a plurality of colors. The selection of the color depends on, for example, the type of electronic component b to be image-processed.
[0023]
For example, when the electronic component b is BGA or μBGA, the electrode portion is silver and the wiring pattern color on the surface of the interposer is gold or orange and close to the red wavelength. When the light emitting diode 13a is used, the wiring part of the electronic component b is also reflected, and the image of the electrode part and the image of the wiring part to be measured are mixed, which hinders the positioning measurement of the electronic part b.
[0024]
However, by irradiating the electronic component b using the blue light emitting diode 13a that is complementary to the red color, the wiring portion absorbs the blue color and does not reflect it. Accurate acquisition is possible.
[0025]
In addition, when the blue light emitting diode 13a is used for the imaging illumination in the case of the electronic component b in which the base is black and a gold terminal is implanted in a proper position, the light emitted from both the base and the terminal is irradiated. Is absorbed and becomes a detection failure. Therefore, by using the red light emitting diode 13a for irradiation, light is reflected at the terminal portion and an image can be recognized.
[0026]
The detection means 11 travels at a high speed below the electronic component b held by the suction nozzle 3 by the travel drive means 14, and the travel drive means 14 follows the lateral guide 20. The mounting body 15 is attached to the traveling body 21 that moves, and the traveling body 21 is driven by a drive member (not shown) such as a servo motor capable of numerical control, and is controlled by the drive member. Any traveling speed of the traveling body 21 can be obtained.
[0027]
The control means 1 receives the detection signal of the image pickup means 12 and calculates based on predetermined data, and arbitrarily sets each of the means 5, 7, 9, 10 or the traveling drive means 14 individually. A conventional computer is used.
[0028]
In addition, a position detection member 22 that regulates the image pickup position of the image pickup means 12 and the irradiation position of the illumination means 13 (the same position as the image pickup position) is provided, for example, a suitable one such as a photoelectric tube or a proximity switch The detector 23 is attached to the movable body 8 corresponding to each mounting head 2 at the imaging position of the imaging means 12, that is, the irradiation position of the illumination means 13, and the detection corresponding to the detector 23. A body 24 is provided on the mounting body 15.
[0029]
The image pickup means 12 is operated along the image processing means 1a shown in the block diagram of FIG. 7. First, based on a clock supplied from an external clock generation circuit, various types of counter circuits are used. A pulse signal with a proper timing is generated. In response, the start pulse generation circuit generates a start pulse for the line sensor to start scanning one line. The drive clock generation circuit generates a pulse signal necessary for driving the line sensor. The line sensor outputs an analog video signal synchronized with the drive clock from the time when the start pulse is input. The peak hold circuit holds the pulsed analog video signal at the peak voltage in one pulse time. The sample hold circuit outputs a continuous waveform with a voltage obtained by sampling the analog video signal of the pulse output that has been peak-held in synchronization with the clock. The video signal amplifier circuit amplifies and outputs a weak voltage. The A / D converter converts the analog video signal output from the line sensor camera into a digital video signal. The memory address generation circuit generates an address signal for writing the digital video signal into the memory.
[0030]
Therefore, the electronic component mounting method according to the embodiment of the present invention configured as described above has the following effects. First, Of FIG. For example, as shown in FIG. 8, the mounting nozzle 2 has six mounting heads 2, and three different electronic components b are received from the supply unit m by the suction nozzle 3 as each holding member. Is held by adsorption.
[0031]
In addition, as shown in FIGS. 6 and 8, the illumination means 13 is irradiated with each of the light emitting diode groups 13a1, 13a2, and 13a3 in a number of light emitting diodes 13a including three stages of light emitting diode groups 13a1, 13a2, and 13a3. The light emitting diode groups 13a1, 13a2, and 13a3 are attached so that the directions are different from r1, r2, and r3, respectively. Further, the amount of light can be individually controlled for each of the light emitting diode groups 13a1, 13a2, and 13a3.
[0032]
The detection means 11 is moved in the direction indicated by the arrow p in FIG. 8 by the operation of the travel drive means 14, and in order from the electronic component b held by the suction nozzle 3 of the circle 1, the circle 2, circle 3, circle 4, 4 and 5 and the lower side of the electronic component b held by the respective suction nozzles 3 are moved to detect the holding state one after another.
[0033]
At this time, the control unit 1 includes, in advance, the light emitting diode groups 13a1, 13a2, and 13a3 in the illuminating unit 13 that are irradiated when detecting the electronic components b, b, and so on held by the six suction nozzles 3 and 3. The amount of light for each of the three different types of electronic components b is controlled, that is, as shown in FIG. 2 is adjusted so that the number of the electronic components b held by the circles 5 and 5 is slightly higher than that of the electronic components b held by the suction nozzles 3 and 6.
[0034]
At this time, as described above, the illumination unit 13 controls the amount of light emitted for each electronic component b, so that the electronic component b can be detected without detecting a defective image due to excessive or too small amount of light. Since the amount of light that provides the best image according to the type and characteristics is irradiated, information on all shapes and suction postures of each electronic component b is accurately read, and correction processing by the control means 1 is performed with higher accuracy. Thus, all the electronic components b are accurately mounted at predetermined positions on the printed circuit board c.
[0035]
next, Of FIG. For example, as shown in FIG. 9A, the electronic component b is received from the supply unit m and held by suction on the suction nozzle 3 of the mounting head 2.
[0036]
Here, the detection means 11 is moved in the direction indicated by the arrow p in FIG. 9A by the operation of the travel drive means 14, and the imaging means 12 is held by the suction nozzle 3 as the illumination means 13 is turned on. The holding state is detected by moving below the electronic component b.
[0037]
Now, as shown in FIG. 9B, when the traveling speed of the traveling drive means 14 is operated faster than the case shown in FIG. 9A (w1: traveling speed of the traveling drive means 14 in FIG. 9A). <W2: The traveling speed of the traveling drive unit 14 in FIG. 9B), the image of the electronic component b captured by the imaging unit 12 has a resolution in the traveling direction p as indicated by a circle 2 in FIG. 9B. Lower.
[0038]
Further, as shown in FIG. 9C, when the travel speed of the travel drive means 14 is operated slower than the case shown in FIG. 9A (w1: travel speed of the travel drive means 14 in FIG. 9A). > W3: The traveling speed of the traveling drive unit 14 in FIG. 9C), the image of the electronic component b captured by the imaging unit 12 has a resolution in the traveling direction p as indicated by a circle 3 in FIG. 9C. Get higher.
[0039]
Therefore, by adjusting the traveling speed of the detection means 11 for each electronic component b to the speed at which the best image matching the type and characteristics of each electronic component b is obtained, information on the shape and suction posture of the electronic component b is obtained. And the correction processing by the control means 1 can be performed with higher accuracy, and the electronic component b is accurately mounted at a predetermined position on the printed circuit board c. Further, since the processing speed can be changed depending on the type of the electronic component b, the mounting efficiency can be improved.
[0040]
next, Of FIG. For example, as shown in FIG. 10A, the electronic component b is received and held by the suction nozzle 3 of the mounting head 2 from the supply unit m.
[0041]
In addition, as shown in FIGS. 6 and 8, the illumination means 13 has a plurality of light emitting diode groups 13a1, 13a2 and 13a3, and the light emitting diodes 13a1, 13a2 The light emitting diode groups 13a1, 13a2, and 13a3 are attached so that the irradiation direction of 13a3 is different from r1, r2, and r3, respectively. Further, the amount of light can be individually controlled for each of the light emitting diode groups 13a1, 13a2, and 13a3.
[0042]
Here, the detection means 11 moves in one direction by the operation of the travel drive means 14, and when the illumination means 13 is turned on, the imaging means 12 moves below the electronic component b held by the suction nozzle 3. The holding state is detected.
[0043]
Now, as shown in FIG. 10A, when the suction nozzle 3 sucks and holds an electronic component b such as an SOJ or PLCC whose electrode part is a J lead, each light emitting diode group 13a1, 13a2, and so on. Irradiate using all of 13a3.
[0044]
Since the lead surface of the above-described J lead electronic component b is rough and the accuracy of the curved surface shape of the lead is often rough, an image cannot be accurately captured by irradiation from only one direction. By combining light sources with different irradiation angles of the diode groups 13a1, 13a2, and 13a3, diffused light can be generated and the J lead portion can be uniformly irradiated and imaged, and image deterioration due to halation or the like can be prevented. it can. In the J lead electronic component b, since the mold part is black, the mold part does not appear even if it is irradiated with diffused light combining light sources having different irradiation angles.
[0045]
Further, as shown in FIG. 10B, when the suction nozzle 3 sucks and holds an electronic component b such as a BGA or CSP whose ball portion is a ball shape, this bump portion is a ball-shaped electronic component b. Then, there is a wiring pattern or the like in the mold part, and as shown in FIG. 10 (a), when irradiated with diffused light combined with light sources having different irradiation angles, the part other than the ball also shines. As shown in FIG. 10 (b), only the light emitting diode group 13a1 in the horizontal direction is used, and only the ball portion is illuminated, so that the information on the shape and the suction posture of the electronic component b is accurately read. The correction process can be performed with higher accuracy, and the electronic component b is accurately mounted at a predetermined position on the printed circuit board c.
[0046]
next, Of FIG. Explaining an example, in the embodiment of the present invention, the imaging of the electronic component b by the detecting means 11 is (1) when only the imaging field of view is changed according to the electronic component b mounted on the printed circuit board c, (2) When changing only the resolution, it is performed by selecting any one of (3) changing both the imaging field of view and the resolution. First, in the case shown in FIG. 11 (a), using the 1024 pixel line sensor in the imaging means 12, only 512 pixel data at partially continuous positions are read from the 1024 pixels and written to the memory. This is referred to as “Case A”. Also, in the case shown in FIG. 11B, using the 1024-pixel line sensor in the image pickup means 12, only 512-pixel data is read out and written into the memory every other pixel out of the 1024 pixels. The running speed of the line sensor is double that of “Case A”. This is referred to as “Case B”. In the case shown in FIG. 11 (c), the image pickup means 12 uses a 1024 pixel line sensor to read out all the 1024 pixel data and writes it in the memory. The running speed of the line sensor is set to 1/2 of “Case A”. This is referred to as “Case C”.
[0047]
When “Case A” is used as a reference, in “Case B”, the resolution is ½ and the imaging field is doubled. In “Case C”, the resolution is the same and the imaging field is Doubled.
[0048]
When “Case B” is used as a reference, in “Case A”, the resolution is doubled and the field of view is halved, and in “Case C”, the resolution is twice and the field of view is the same. It becomes.
[0049]
Furthermore, when “Case C” is used as a reference, in “Case A”, the resolution is the same and the field of view is halved. B ”, The resolution is ½ and the imaging field of view is the same.
[0050]
In this way, by changing the running speed of the line sensor, the number of read pixels and the reading position of the data, the information on the shape and the suction posture of the electronic component b is read accurately, and the correction process by the control means 1 is performed with higher accuracy. All the electronic components b can be accurately mounted at predetermined positions on the printed circuit board c.
[0051]
In this example, as shown in FIG. 16A, in the case of “Case A”, a small size QFP with a narrow pitch that requires high positioning accuracy, and the like in FIG. 16B. As shown in FIG. 16C, in the case of “Case B”, a large size QFP with a coarse pitch that does not require high positioning accuracy, and in the case of “Case C”, It is suitable for image processing such as a large-size QFP with a narrow pitch that requires high positioning accuracy, and the work efficiency can be improved by changing the processing speed depending on the type of the electronic component b.
[0052]
Next, other Example In the explanation of Of FIG. Any one of (1) changing only the imaging field of view, (2) changing only the resolution, and (3) changing both the imaging field of view and resolution. When selected, the change is made by switching electrical circuits.
[0053]
This switching of the electrical circuit can change the image field of view and resolution by controlling the horizontal and vertical addresses for writing the video signal data converted into digital signals through the A / D converter to the frame memory. it can. The circuit that creates this address is counter: C and counter: F. (See FIGS. 7 and 12) Incidentally, a timing chart of the drive clock, the start pulse, and the video signal is shown in FIG.
[0054]
Now, when controlling the horizontal address, as shown in FIG. 12 and FIG. 14A, first, the outputs of the AND circuits A and B generated by the drive clock A and the enable signal B are A counter for generating a horizontal address is input to C.
[0055]
As shown in FIG. 14A, by using different enable signals for “Case A”, “Case B”, and “Case C”, the output signals of the AND circuits A and B are changed to those shown in FIG. As shown in b). In this way, the horizontal direction address for writing to the frame memory is created by the value obtained by counting the output signals of the AND circuits A and B, and the image field of view and resolution can be changed by controlling this address. .
[0056]
Next, when controlling the vertical address, as shown in FIG. 12 and FIG. 15A, first, the output of the AND circuit D · E generated by the start pulse signal: D and the enable signal: E Is input to a counter F that generates a vertical address.
[0057]
As shown in FIG. 15A, by using different enable signals for “Case A”, “Case B”, and “Case C”, the output signal of the AND circuit D · E is changed to FIG. As shown in b). As described above, the vertical address for writing to the frame memory is created by the value obtained by counting the output signals of the logical product circuits D and E, and the image field of view and resolution can be changed by controlling this address. .
[0058]
【The invention's effect】
As described above, according to the electronic component mounting method of the present invention, the illumination electronic circuit of the illuminating means in the detecting means can be simplified, and the image capturing speed of the detecting means depends on the type of the electronic component. Since it is possible to perform efficient illumination that controls the amount of light that can be imaged while controlling the field of view and resolution, it is possible for the detection means to capture an accurate image while traveling at high speed. For this reason, it is possible to further shorten the mounting tact time of the electronic component, improve the mounting accuracy of the electronic component, and provide special effects such as providing a low-cost device.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus schematically showing an embodiment of an electronic component mounting method according to the present invention.
FIG. 2 is a side view showing a main part of the electronic component mounting apparatus in FIG.
FIG. 3 is an explanatory diagram showing an example of detection means in FIG. 1;
4 is a circuit diagram showing an example of dynamic drive in the illumination means of the electronic component mounting apparatus in FIG. 1. FIG.
5 is an explanatory view showing a lighting state in the illumination means of the electronic component mounting apparatus in FIG. 1. FIG.
6 is an enlarged schematic side view showing detection means of the electronic component mounting apparatus in FIG. 1; FIG.
7 is a block diagram showing detection means of the electronic component mounting apparatus in FIG. 1. FIG.
8 is an explanatory view showing an operating state of detection means of the electronic component mounting apparatus in FIG. 1; FIG.
FIG. 9 is an explanatory view showing an operating state of another example of the detecting means of the electronic component mounting apparatus in FIG. 1;
10 is an explanatory view showing an operating state of still another example of the detecting means of the electronic component mounting apparatus in FIG. 1. FIG.
11 is an explanatory view showing an operating state of still another example of the detecting means of the electronic component mounting apparatus in FIG. 1; FIG.
12 is a block diagram showing a circuit for changing the imaging field of view and resolution of the detection means of the electronic component mounting apparatus in FIG. 1; FIG.
13 is a dynamic chart diagram of the circuit in FIG.
14 is an explanatory diagram showing an operating state of the circuit in FIG. 13;
15 is an explanatory diagram showing another operating state of the circuit in FIG. 13;
16 is an explanatory view showing each example of electronic components suitable for each case in FIG. 11. FIG.
[Explanation of symbols]
b Electronic components
c Substrate
2 Mounting head
3 Holding member (Suction nozzle)
11 Detection means
12 Imaging means
13 Illumination means
14 Traveling drive means
16 Line sensor camera

Claims (1)

In the process of attracting and holding the electronic component by a plurality of holding members and transferring it to the substrate, the detection unit comprising a line sensor camera is continuously moved to image the electronic component, and then the electronic component is mounted on the substrate. In the way,
The imaging of the electronic component by the detecting means is performed during illumination by the illumination means, the illumination of the illumination means in accordance with the electronic component to be mounted to the substrate, it has rows by controlling the amount of light that illuminated,
Imaging of the electronic component by the detection means, in response to the electronic component to be mounted to the substrate, when changing only the imaging field of view by changing the running speed of the line sensor camera, the number of read pixels of the resolution only data and When changing by changing the reading position , any one of changing the imaging field of view to be changed by changing the traveling speed of the line sensor camera, the number of read pixels of data, and the resolution to be changed by changing the reading position is changed. A method for mounting an electronic component, wherein the electronic component mounting method is performed by selecting an electric circuit .

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