WO2004021760A1

WO2004021760A1 - Electronic cicuit part mounting machine and mounting position accuracy inspection method for the mounting machine

Info

Publication number: WO2004021760A1
Application number: PCT/JP2003/010803
Authority: WO
Inventors: Tosuke Kawada
Original assignee: Fuji Machine Mfg. Co., Ltd.
Priority date: 2002-08-29
Filing date: 2003-08-26
Publication date: 2004-03-11
Also published as: JP4224268B2; JP2004095672A

Abstract

An electronic circuit part mounting machine capable of accurately inspecting a part mounting accuracy, wherein a large number of parts (20) are mounted on the upward part mounting surface of an inspected substrate (300), the inspected substrate (300) is made of a transparent material, a pressure sensitive adhesive double coated tape made of a transparent material is stuck on the part mounting surface, and the parts are pressingly fixed to the adhesive double coated tape, circular marks (302) are formed on a large number of lattice points on the inspected substrate (300) and the parts (20) are mounted on the inspected substrate (300) at predicted mounting positions apart equal distances from four circular marks (302) adjacent to each other, the inspected substrate (300) is inversed upside down and held on a wiring board holding device (18) through an inspection jig (304), and the parts (20) and the circular marks (302) around the periphery thereof are imaged by a reference mark camera (152) from the rear side of the parts through the inspected substrate (300) and the pressure sensitive adhesive double coated tape to detect the mounting positions of the parts (20) based on the relative position of the parts (20) to the circular marks (302).

Description

Description Electronic circuit component mounting machine and its mounting position accuracy inspection method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit component mounting machine that holds an electronic circuit component (hereinafter, abbreviated as a component unless otherwise required) by a holding head and mounts the component on a circuit board. The present invention relates to an inspection of the accuracy of the mounting position. Background art

The electronic circuit component placement machine receives a component from the component supply device using a component supply device that supplies components, a board holding device that holds a circuit board, and a holding head, and mounts the component on the circuit board held by the circuit board holding device. It is configured to include a component mounting device. In order to inspect the mounting position accuracy of the electronic circuit component mounting machine, that is, the accuracy of the mounting position of the component on the circuit board, it is described in, for example, JP-A-2001-1360000. As described above, an inspection board provided with a plurality of mounting position reference marks is used. Usually, a plurality of mounting positions are set on the inspection board, and a plurality of mounting position reference marks are provided near each mounting position. The accuracy of the mounting position of the test chip on the test board is detected based on the relative positions of the mounted test chips with respect to the plurality of mounting position reference marks.

At that time, conventionally, the surface of the test chip mounted on the test board is imaged by an imaging device, and the relative position of the image of the test chip obtained as a result with respect to the mounting position reference mark has been detected. If the side surface of the test chip is exactly perpendicular to the surface of the test substrate, this may be acceptable, but in practice, it does not always form a right angle. The side surface of the inspection chip and the surface of the inspection substrate form an acute angle or an obtuse angle. As a result, the outline of the front surface and the outline of the back surface of the inspection chip may be shifted from each other in a direction parallel to the surface of the inspection substrate. This is particularly likely when actual components are used as test chips. In such a case, it is desirable to detect the relative position of the surface image of the inspection chip with respect to the mounting position reference mark. Often not.

For example, when a test chip is mounted on a test substrate, a position error of the test chip held by the holding head is often corrected. With the test chip held by the holding head, the back surface of the test chip is imaged by the imaging device, and based on the image of the back surface, an error in the holding position of the test chip by the holding head is detected. The error is corrected and mounted on the circuit board. In this case, if the outline of the front surface and the outline of the back surface of the inspection chip are displaced from each other, the position of the image on the back surface is accurate, but the mounting position accuracy based on the position of the image on the front surface is detected. In 查, the accuracy is determined to be poor, or the accuracy is determined to be good despite the poor accuracy. Disclosure of the invention

The present invention has been made in view of the above circumstances as an object to improve the accuracy of mounting position accuracy inspection of an electronic circuit component mounting machine. A mounting position accuracy inspection method, mounting position accuracy inspection device, and electronic circuit component mounting machine can be obtained. Similar to the claims, each mode is divided into sections, each section is numbered, and the number of another section is quoted as necessary. This is for the purpose of facilitating the understanding of the present invention and should be construed as limiting the technical features and combinations thereof described in this specification to those described in the following sections. is not. In addition, when two or more items are described in one section, the items need not always be adopted together. It is also possible to select and adopt only some of the items.

(1) A method of mounting a test chip on a test board using an electronic circuit component mounting machine and detecting the mounting position, thereby inspecting the mounting position accuracy of the electronic circuit component mounting machine.

A mounting position accuracy detection method for an electronic circuit component mounting machine, comprising: detecting a mounting position of the test chip on the test substrate at a position on a back surface of the test chip.

Detecting the mounting position of the test chip on the test board at the position on the back side of the test chip, compared to the conventional case of detecting the position on the front surface, mounts the electronic circuit component mounting machine. In many cases, the position accuracy can be properly evaluated.

(2) A commercially available electronic circuit component is used as the inspection chip. The mounting position accuracy inspection method according to (1).

If a commercially available component is used as the inspection chip to inspect the mounting position accuracy of the electronic circuit component mounting machine, there is no need to prepare a dedicated inspection chip, and the inspection cost can be reduced. However, commercially available components often have a shape in which the front outline and the rear outline are shifted from each other in a direction parallel to the front surface of the inspection board. Therefore, the effect of applying the present invention is particularly large.

(3) The test chip is held by a holding head, an error of the holding position of the test chip by the holding head is obtained by imaging the test chip, and the obtained holding position error is corrected and applied to the test board. Attachment The mounting position accuracy inspection method described in (1) or (2).

It is not indispensable if the holding head is to accurately position and hold the component, but if the position error of the test chip is acquired, corrected and mounted on the test board, the mounting position can be detected. Accuracy can be improved.

(4) The mounting position accuracy inspection method according to (3), wherein the imaging of the inspection chip for acquiring the holding position error is performed on a back surface of the inspection chip.

According to the present invention, when the holding position error is obtained by imaging the back surface of the inspection chip to obtain the corrected holding position error and mounted on the inspection substrate, the mounting position is detected by imaging the back surface of the mounted inspection chip according to the present invention. In addition, the precision inspection of the electronic circuit component mounting machine can be performed particularly well.

(5) The mounting position accuracy inspection method according to (4), wherein the imaging of the back surface of the test chip for acquiring the holding position error is performed while illuminating the back surface with an illumination device.

By illuminating the back surface of the inspection chip and imaging the back surface, the position of the back surface can be particularly accurately detected.

(6) A plurality of mounting position reference marks are provided near the mounting position of the test chip on the test board, and the positions of the test chips are detected based on the mounting position reference marks (1) to (5). Item 5. The mounting position accuracy inspection method according to any one of the above items. It is also possible to detect the position of the inspection chip based on the reference point on the imaging surface of the imaging device Noh. However, in this case, it is inevitable that the detection result is affected by a feed error of a relative movement device that relatively moves the imaging device and the inspection board in a direction parallel to the surface of the inspection board. On the other hand, if the position of the test chip is detected with reference to the mounting position reference mark, the influence of the feed error of the relative moving device can be eliminated. It is relatively easy to form a plurality of mounting position reference marks on the inspection board at accurate relative positions, and the mounting position can be accurately detected.

(7) The planned mounting positions are set in a state where they are regularly arranged in two directions orthogonal to each other on the surface of the detection substrate, and the plurality of mounting position reference marks are provided for the plurality of planned mounting positions. The mounting position accuracy inspection method described in (6).

The mounting position may be set at one location, but setting multiple locations can increase the reliability of the inspection. In particular, as described in this section, if the setting is made in such a way as to be regularly arranged in two directions orthogonal to each other on the surface of the inspection board, it is possible to inspect the mounting position accuracy over the entire electronic circuit component mounting machine. it can. It is desirable that the inspection substrate has a small thermal expansion, such as a glass substrate.

(8) At the time of mounting, the position of the substrate reference mark provided on the inspection substrate was detected to detect the position of the entire inspection substrate, and the position error of the inspection substrate was acquired based on the detected position. The mounting position accuracy inspection method according to any one of (1) to (7), wherein the inspection chip is mounted while correcting a position error of the inspection substrate.

For example, it is not indispensable when the position of the inspection board can be accurately defined, or when the mounting position accuracy is detected by comparing positional errors of the test chips at a plurality of planned mounting positions. If the position error of the inspection substrate is corrected based on the position of the substrate reference mark, the effect of improving the inspection accuracy or facilitating the inspection can be obtained.

(9) The test substrate is made of a light-transmitting material, a test chip is mounted on the front surface of the test substrate, and the test chip is imaged from the back side of the test substrate to reduce the position of the rear surface of the test chip. Detecting The mounting position accuracy detecting method according to any one of (1) to (8).

If the test substrate is made of a light transmitting material and the test chip is imaged from the back surface side of the test substrate, the relative position of the test chip with respect to the test substrate can be easily detected based on the position of the rear surface of the test chip. The light transmitting material includes not only a transparent material but also a translucent material. Inspection 材料 It is sufficient if the material has a light transmittance enough to image the test chip through the substrate.

(10) A double-sided pressure-sensitive adhesive sheet is pasted on the test substrate, and the test chip is fixed to the test substrate by the double-sided pressure-sensitive adhesive sheet. The mounting position accuracy test method according to any one of the above modes (1) to (9) .

When the test chip is mounted on the test board, the test chip can be simply placed on the test board or temporarily fixed with a temporary fixing agent such as an adhesive or creamy solder. However, if the double-sided adhesive sheet is used, it is possible to prevent the inspection chip once mounted on the inspection substrate from being displaced satisfactorily, or the temporary fixing agent protrudes from the gap between the inspection chip and the inspection substrate. Thus, it is possible to prevent the detection of the exact position of the test chip from being hindered.

(11) The mounting position accuracy inspection method according to the item (10), wherein a light transmissive sheet is used as the double-sided pressure-sensitive adhesive sheet.

If a double-sided PSA sheet smaller than the back side of the part is used, it is not necessary to make the double-sided PSA sheet light-transmitting. However, if it has a light transmitting property, the double-sided adhesive sheet can be made larger than the back surface of the component tape, and the work of attaching the double-sided adhesive sheet to the inspection substrate becomes easy. For example, a double-sided pressure-sensitive adhesive sheet can be stuck all at once on the entire area where the inspection substrate mounting position is set. It is desirable that the double-sided pressure-sensitive adhesive sheet is also transparent. It is desirable that both the sheet and the adhesive applied to both sides of the sheet have as high a transparency as possible.However, a material having light transmittance enough to image the test chip through the test substrate and the double-sided pressure-sensitive adhesive sheet Should be fine.

(12) The test chip is mounted on the test board with the front side of the test board facing up, and then the test board is turned upside down to pass the test board from above through the rear face of the test chip. The mounting position accuracy inspection method according to the above mode (10) or (11), wherein an image is taken.

It is convenient to mount the test chip on the test board with the front side of the test board facing up, and it is often convenient to image the back surface of the test chip from above. An embodiment described in the section (18) described below is one example. (13) A plurality of mounting position reference marks are provided near the mounting position of the test chip on the test board, and the inspection is performed at a mounting position relatively determined with respect to the plurality of mounting position reference marks. After mounting the chip, the imaging device is positioned at a position directly facing each of the plurality of mounting position reference marks, and each mounting position reference mark is imaged to acquire the position of each mounting position reference mark. The mounting position accuracy according to any one of paragraphs (9) to (12), wherein the imaging device is positioned at a position directly opposite to the mounting position determined based on the position of the mounting position reference mark, and the inspection chip is imaged. Inspection methods.

It is also possible to simultaneously image a plurality of mounting reference marks and an inspection chip with an imaging device and detect the relative positions of the plurality of mounting position reference marks and the inspection chips based on their relative positions on the screen. The aspect is also one embodiment of the present invention. However, in this case, if the inspection chip is positioned at the center of the screen, the plurality of mounting position reference marks will be located at the periphery of the screen, and the image will be taken from an oblique direction. At the same time, it is unavoidable that the detection accuracy of the position of the mounting position reference mark decreases due to the influence of the lens aberration. On the other hand, if the method of this section is adopted, since each of the plurality of mounting position reference marks and the inspection chip can be imaged in a state where they are almost at the center of the screen, the plurality of mounting position reference marks can be taken. The detection accuracy of the relative position between the inspection chip and the inspection chip can be improved.

(14) The mounting position accuracy inspection method according to the above mode (13), wherein each mounting position reference mark is illuminated by epi-illumination when the mounting position reference mark is imaged.

When the mounting position reference mark is acquired as a bright image, such as when the mounting position reference mark can be regarded as a mirror surface, if it is imaged by epi-illumination, the mounting position reference mark is acquired as an image with sufficient contrast And its position can be detected with high accuracy.

(15) The mounting position accuracy inspection method according to the above mode (14), wherein the imaging of the inspection chip is performed by illuminating the inspection chip from a direction inclined with respect to the surface of the inspection substrate.

When the mounting position reference mark can be regarded as a mirror surface, if the illumination is performed from a direction inclined with respect to the surface of the inspection board, the reflected light from the mounting position reference mark hardly enters the imaging device, and the mounting position reference mark The image becomes darker, while the image The diffusely reflected light enters the imaging device, and the image on the back surface of the inspection chip is obtained as a bright image. When detecting the position of the inspection chip, it is possible to prevent the presence of the reflected light itself from the mounting position reference mark or the presence of the image of the mounting position reference mark from disturbing.

(16) When mounting the inspection chip on the surface of the inspection board, the inspection board is held by the substrate holding device with the surface of the inspection board facing up. (9) to (15) The mounting position accuracy inspection method according to any one of the above. ^Three

(17) When the test chip is imaged from the back side, the test board is held by the board holding device with the front side down, and the image is picked up from above (17). Inspection methods.

(18) When mounting the test chip on the surface of the test board, at least one board reference mark provided on the test board is imaged from above by an image pickup device to acquire a position error of the test board, The position error is corrected, the test chip is mounted on the test board, and the test board is held by the board holding device in a state where the test board is turned upside down. The mounting position accuracy inspection method according to the above mode (17), wherein the position of the inspection chip is detected by imaging through the camera.

The same imaging device can be used for both imaging of the substrate reference mark and imaging of the back surface of the inspection chip, which can reduce the cost of the device and increase the accuracy of the mounting position inspection.

(19) When the inspection substrate is held by the substrate holding device in a state where the inspection substrate is turned upside down, a holding jig is interposed between the inspection substrate and the substrate holding member, and the imaging jig is used as the holding jig. Item (18) is a device which holds the inspection substrate so that the focal point of the device is located on the surface of the inspection substrate both when imaging the substrate reference mark and when imaging the inspection chip. Inspection position accuracy inspection method.

By using the holding jig, the focus of the imaging device can be accurately adjusted both when imaging the substrate reference mark provided on the front side of the inspection substrate and when imaging the inspection chip from the back side of the inspection substrate. The image can be adjusted to the target to be imaged, and good images can be obtained together. Strictly speaking, the focus of the imaging device is located on the front surface of the inspection board when imaging the substrate reference mark, and is located on the back surface of the inspection chip when imaging the back surface of the inspection chip. It is desirable to do so. When the back side of the test chip is in close contact with the front side of the test board, they match, but when the test chip is fixed to the test board by the double-sided pressure-sensitive adhesive sheet, it differs by the thickness of the double-sided pressure-sensitive adhesive sheet . However, here, the thickness of the double-sided adhesive sheet is ignored, and in the latter case, the focus of the imaging device may be located on the surface of the inspection substrate both when imaging the substrate reference mark and when imaging the inspection chip. Shall be assumed.

(20) An apparatus for testing the mounting position accuracy of an electronic circuit component mounting machine by mounting a test chip on a test board by an electronic circuit component mounting machine and detecting the mounting position,

An inspection board, which is a flat plate made of a light-transmitting material, on which a plurality of mounting positions are set on the surface and a plurality of mounting position reference marks are provided for each of the mounting positions;

An imaging device capable of imaging the back surface of the inspection chip mounted at the mounting position on the front surface of the inspection substrate and the plurality of mounting position reference marks from the back surface side of the inspection substrate;

A mounting position accuracy acquisition unit for causing the imaging device to image the mounting position reference mark and imaging the inspection chip, and acquiring the mounting position accuracy of the electronic circuit component mounting machine based on the imaging result;

A mounting position accuracy inspection device for electronic circuit component mounting machines, including:

The mounting position accuracy detecting device described in this section is suitable for implementing the method invention of the above (1). Each feature described in each of the above paragraphs (2) to (5) and (7) to (19) is also applicable to the mounting position accuracy inspection apparatus of this paragraph.

(2 1) a component supply device for supplying electronic circuit components;

A board holding device for holding a circuit board,

A component mounting device that receives an electronic circuit component from the component supply device by a holding head and mounts the electronic circuit component on a circuit board held by the circuit board holding device;

An imaging device for imaging a substrate fiducial mark provided on the circuit board;

An electronic circuit component mounting machine comprising:

It has a flat shape, and a plurality of mounting positions are set. A plurality of mounting position reference marks are provided for each position, and a detection board held by the circuit board holding device;

An inspection chip mounting control unit for holding the inspection chip on the holding head, and mounting the inspection chip at each of the mounting expected positions;

In a state where the inspection board on which the inspection chip is mounted is turned upside down and held by the circuit board holding device, the mounting position reference mark is placed on the imaging device through the inspection substrate from the back side of the inspection substrate. A mounting position accuracy obtaining unit for obtaining an image of the back surface of the test chip mounted on the test board and obtaining a mounting position accuracy of the electronic circuit component mounting machine based on a result of the imaging.

Electronic circuit component mounting machine.

In the electronic circuit component mounting machine of this section, since the imaging device for imaging the substrate reference mark provided on the circuit board is also used for imaging the mounting position reference mark of the inspection substrate and the back surface of the inspection chip, To that extent, the configuration of the device is simple, and the cost of the device can be reduced. The features described in each of the above paragraphs (2) to (5), (7) to (11), (13) to (15), and (19) are described in the electronic circuit of this section. It is also applicable to component mounting machines. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view showing an electronic circuit component mounting machine according to an embodiment of the present invention. FIG. 2 is a side view showing the electronic circuit component mounting machine.

FIG. 3 is an enlarged side view (partial cross section) showing a main part of the electronic circuit component mounting machine.

FIG. 4 is a side view showing an epi-illumination device of the electronic circuit component mounting machine.

FIG. 5 is a block diagram showing a control device for controlling the electronic circuit component mounting machine. FIG. 6 is (a) a plan view and (b) a front view showing an inspection board for performing a component mounting accuracy inspection.

FIG. 7 is a plan view showing a state where components are mounted on the inspection board.

FIG. 8 is a front view showing a state in which a circle mark on the inspection substrate is imaged.

FIG. 9 is a plan view showing a substrate jig for holding the inspection substrate. FIG. 10 is a front view showing the substrate jig.

FIG. 11 is a front view showing a state in which the back surface of the component mounted on the inspection board is imaged.

FIG. 12 is a diagram showing an image obtained by capturing an image of an inspection board by epi-illumination.

FIG. 13 is a diagram showing an image obtained by capturing an image of an inspection board by illumination from an oblique direction. FIG. 14 is a diagram for explaining image processing.

FIG. 15 is a graph showing the detection result of the mounting accuracy, which is a graph in the case where an image is taken from the back side of the test board and detected.

FIG. 16 is a graph showing a detection result of the mounting accuracy, which is a graph in a case where an image is detected from the component mounting surface side of the inspection board and detected. BEST MODE FOR CARRYING OUT THE INVENTION

An electronic circuit component mounting machine 10 according to one embodiment of the present invention is shown in FIGS. The electronic circuit component mounting machine 10 is already known in, for example, Japanese Patent No. 2824378, and will be briefly described.

In FIG. 1, reference numeral 12 denotes a base as a machine main body of the electronic circuit component mounting machine 10. On the base 12, a printed circuit board conveyor 16 for transporting a printed circuit board 14, which is a type of circuit board, in the X-axis direction (left and right in FIG. 1), and a board holding device for holding the printed circuit board 14 Parts are mounted on the component 18 and the component mounting device 22 for mounting electronic circuit components 20 (see FIG. 3; hereinafter, abbreviated as components 20) on the printed wiring board holding device 18 and the printed wiring board 14. A component supply device 24 for supplying 20 is provided.

The printed wiring board 14 is placed horizontally on a pair of conveyor belts, and is conveyed while being guided by a pair of guide rails 26 and 28 by rotating the conveyor belt. One guide rail 26 is a fixed guide rail provided to fix the position, and the other guide rail 28 is a movable guide rail provided to be able to approach and separate from the fixed guide rail. Hereinafter, the guide rail 26 is referred to as a fixed guide rail 26, and the guide rail 28 is referred to as a movable guide rail 28. The movable guide rail 28 is provided with an access / separation device or It is moved in the Y-axis direction (the direction perpendicular to the transport direction) by the width changing device, and the distance between the fixed guide rail 26 and the printed wiring board 12 is adjusted. The printed wiring board 14 is stopped at a predetermined work position, and is held by a printed wiring board holding device 18 provided at a portion corresponding to the work position of the base 12. At a position adjacent to the wiring board conveyor 16, a component supply device 24 is provided stationary. In the present embodiment, the component supply device 24 is a feeder-type component supply device.

The component supply device 24 includes a component supply table 3 in which a number of feeders 30 are arranged on a feeder support table 32, and component supply units are arranged in a line, for example, in a line parallel to the X-axis direction. With 4. Each feeder 30 holds the component 20 on a carrier tape and supplies the component 20 from the taped electronic circuit component. The component mounting device 22 transports the component 20 by moving the component holding head 60 shown in FIG. 3 in a direction having components in the X-axis direction and the Υ-axis direction which are orthogonal to each other, and conveys the component 20. It is supposed to be mounted on the upper surface of the plate 14. Therefore, as shown in FIG. 1, the component mounting device 22 includes an X-axis slide 66 and an X-axis slide moving device 68 for moving the X-axis slide 66, and the X-axis slide 66. Is moved to any position in the direction parallel to the X axis. The X-axis slide moving device 68 includes an X-axis slide drive motor 70 as a drive source, and the rotation of the X-axis slide drive motor 70 rotates the pole screw 64 to rotate the X-axis slide. 6 6 is moved. The X-axis slide 66 has a length exceeding the wiring board conveyor 16 from the component supply device 24 as shown in FIG.

A Υ-axis slide 82 is provided on the X-axis slide 66 so as to be relatively movable in the Υ-axis direction. The Υ-axis slide moving device 84 is capable of moving to an arbitrary position in the Υ-axis direction. I have. The Υ-axis slide moving device 84 includes a Υ-axis slide driving motor 86 as a drive source, and the rotation of the motor 86 is transmitted to the ball screw 92 via gears 88, 90. Υ to move the axis slide 82. The X-axis slide 66, the X-axis slide moving device 68, the Υ-axis slide 82, and the Υ-axis slide moving device 84 constitute a Χ Υ moving device 96, and the component holding head 60 Is moved by the 位置 Υ moving device 96 to an arbitrary position in a horizontal plane which is a plane parallel to the Υ Υ coordinate plane. Can be done.

As shown in FIG. 3, the support portion 102 provided on the Y-axis slide 82 has a head axial movement for raising and lowering the component holding head 60 and the component holding head 60. The apparatus is provided with a head elevating device 104, a head rotating device 106 for rotating the component holding head 60 around its axis, and these component holding heads 60, etc. The component mounting unit 108 is configured. The component mounting unit 108 of the present embodiment has the same configuration as the component mounting unit described in Japanese Patent No. 3093339, and will be briefly described. A shaft 110 is provided on the supporting portion 102 so as to be movable in a direction parallel to the axial direction and rotatable around the axis, and a suction nozzle 111 is provided by a holder 112 provided at a lower end thereof. 4 is detachably held. In the present embodiment, the shaft 110 and the holder 111 constitute a component holding head 60.

The suction nozzles 1 14 suction the component 20 by negative pressure and mount it on the printed wiring board 14. Therefore, the suction nozzles 114 are connected to a negative pressure source (not shown), a positive pressure source (not shown), and the atmosphere, and are switched by an electromagnetic directional switching valve device (not shown). It is alternatively connected to the atmosphere.

The fiducial mark camera 152 (see FIG. 1), which is an image pickup device for imaging a plurality of fiducial marks 150 provided on the printed wiring board 14, is fixed to the 固定 -axis slide 82. In the present embodiment, the fiducial mark camera 152 is constituted by a CCD camera which is a type of a surface imaging device. A ring-shaped illumination device 154 is provided around the fiducial mark camera 152 as shown in FIG. 4, and illuminates the fiducial mark 150 and its periphery.

In the present embodiment, an epi-illumination device 158 that illuminates the imaging target object with illumination light substantially parallel to the optical axis of the fiducial mark camera 152 is provided. Below the reference mark camera 152, a half mirror 160 is provided at an angle of 45 degrees with respect to the optical axis of the reference mark camera 152. The half mirror 160 is irradiated with light from a horizontally arranged halogen lamp 162. A concave mirror 16 6 is provided on the opposite side of the half mirror 16 0 of the halogen lamp 20, and light emitted from the halogen lamp 16 2 to the opposite side of the half mirror 16 0 is a half mirror. The light is reflected toward 160. Halogen lamp 1 6 2 and concave mirror 1 ⁶ 6 cooperates to emit light that is substantially uniform from the entire surface of the concave mirror 16 6 facing the half mirror 16 0 and is substantially perpendicular to the optical axis of the reference mark camera 15 2. It is composed.

Part of the light emitted from the light source 170 to the half mirror 160 is reflected downward in the direction of the axis of incidence, that is, vertically downward, but the rest passes through the half mirror 160 . On the opposite side of the half mirror 16 0 from the halogen lamp 16 2, a non-reflective paper 1 7 4 as a transmitted light absorbing member is provided vertically to absorb the light transmitted through the half mirror 1 6 0. I do. Non-reflective paper 1 74 is black paper with a particularly low surface reflectivity. These half mirrors 1 60, light source 1 70 and anti-reflective paper 1 74 are epi-illumination devices 1 5 8 Is composed.

The fiducial mark camera 15 2, the illumination device 15 5 and the epi-illumination device 15 8 constitute an imaging system, and when imaging the printed wiring board 14 and the mounted components 20, etc. Either the illumination device 154 or the epi-illumination device 158 is selectively turned on to perform an imaging operation.

The X-axis slide 66 is located between the component supply device 24 and the printed wiring board 14 and at a position corresponding to the ball screw 64 that just moves the X-axis slide 66. 80 is immovably mounted. As shown in FIG. 3, the component imaging device 180 includes a component camera 182 for capturing an image of the component 20 and a light guiding device 18 4, and the light guiding device 18 4 serves as a reflecting device. It has reflecting mirrors 186 and 188. In the present embodiment, the component camera 18 2 is a CCD camera, like the fiducial mark camera 15 2.

An illumination device 198 is provided just below the movement path of the suction nozzles 114 in the Y-axis direction and near the light guide device 184. The lighting device 198 is equipped with a strobe 200 for irradiating ultraviolet rays and a luminous plate 200 for absorbing visible light and emitting visible light.The component camera 18 2 projects the component 20 Capture an image. The illuminating device 198 further includes another strobe 204 that emits visible light, and the reflected light from the bottom of the component 20 causes the component power lens 18 2 to form a front view of the component 20. Take an image. The imaging device 180, the light guide device 184, and the lighting device 198 constitute an imaging system. The electronic circuit component mounting machine 10 includes a control device 250 shown in FIG. 5 as control means. Have. The control device 250 is mainly composed of a CPU 25 2, a ROM 25 4, a RAM 25 6, and a computer 260 having a bus connecting them. The bus is further connected to an input / output interface 266, and a drive circuit 264 drives the X-axis slide drive motor 70, the Y-axis slide drive motor 86, and the head lifting / lowering device. 104, a head rotating device 106 and the like are connected. The control device 250 is connected with an image processing computer 26 6, a reference mark camera 15 2, and a component camera 18 2. The control device 250 is further connected to an input device 268 such as a keypad, and also connected to a display device 274 as a display device via a control circuit 272.

The motors as drive sources of the X-axis slide drive motor 70, the Y-axis slide drive motor 86, the head lifting / lowering device 104, and the head rotation device 106 are all provided. Each of them is also constituted by a servomotor, and its rotation angle is detected by the encoder 276 and inputted to the computer 260. FIG. 5 representatively shows an encoder 276 provided on the X-axis slide drive motor 70. The ROM 254 and the RAM 256 of the controller 250 store various programs such as a main routine, an electronic circuit component mounting routine, and data necessary for executing the programs. It is remembered. Further, the computer 260 is connected to a parts data generator (PDG) 278 which is a database storing various data of the parts 20 (abbreviated as part information).

Next, the operation will be described. The mounting operation for mounting the component 20 on the printed wiring board 14 is described briefly in the aforementioned Japanese Patent No. 2824378, etc., and will be briefly described. Will be described. In the electronic circuit component mounting routine, data of a component receiving position where the component holding head 60 should receive the component 20 from the feeder 30 and the component 20 are mounted on the printed wiring board 14. The data of the component mounting position, which is the power position, and the component information of each component 20 supplied from the part data generator (PDG) 278 are included.

First, the printed wiring board 14 is transported to a work position (or mounting space) where the component 20 is mounted by the wiring board conveyor 16, and is positioned and held by the printed wiring board holding device 18. Component mounting unit 1 08 with XY moving device 96 In both cases, the fiducial mark camera 152 is positioned at the fiducial mark imaging position where the fiducial mark 150 provided on the printed wiring board 14 is imaged, and the two fiducial marks 150 are respectively imaged. As a result, the position error of the printed wiring board 14 is obtained by image processing of the obtained reference mark 150. ,

Next, the component holding head 60 is moved by the XY moving device 96 to a component receiving position for receiving the component 20 from the feeder 30. When the component holding head 60 reaches the component receiving position, the component holding head 60 is moved up and down by the head elevating device 104, and negative pressure is supplied to the suction nozzles 114. As a result, the component 20 is sucked.

The component holding head 60 holding the component 20 is moved from the component receiving position to a component mounting position facing a component mounting point preset on the printed wiring board 14. The X-axis slide 66 passes over the light guide device 184 fixed at a position between the component receiving position and the component mounting position. Regardless of whether the component receiving position and the component mounting position are on the component supply device 24 or the printed wiring board 14, the component holding head 60 must be moved from the component receiving position to the component mounting position without fail. It moves on the X-axis slide 66 in the Y-axis direction and passes through a portion between the component supply device 24 and the printed wiring board 14. Therefore, the component holding head 60 always passes over the light guide device 18 4 fixed to the portion of the X-axis slide 66 located between the component receiving position and the component mounting position, and A part 20 is imaged by the camera 18. The position at which the component holding head 60 is located on the light guide device 184 and is imaged by the component camera 182 is referred to as a component holding position detection position or an imaging position.

If the rotation position of the component 20 differs between the time of suction and the time of mounting, the component holding head 60 is moved from the suction to the position of the component holding position detection position by the head rotating device 10 6 And the component 20 is rotated and changed to the rotational position at the time of mounting. Then, when the component holding head 60 reaches the component holding position detection position, the component 20 is imaged. Since the imaging device 180 and the strobes 200 and 204 are provided on the X-axis slide 66, the movement of the component holding head 60 is stopped in the Y-axis direction. The component 20 is imaged while being moved in the axial direction. The data of the captured image is stored in the image processing computer 266. The data is compared with the data of the normal image without the holding position error, and the holding position error, that is, the translational position error (often the center position error) and the rotational position error of the predetermined reference point are calculated.

Before the component holding head 60 moves to the component mounting position, the component holding head 60 is rotated by the head rotating device 106 to cancel the rotational position error, and The coordinates of the component mounting position are corrected so that the position error of the printed wiring board 14 and the translational position error of the component 20 (including the translational position error generated due to the cancellation of the rotational position error) are cancelled. The component 20 is mounted at the correct mounting point on the printed wiring board 14 at the correct rotation position. This completes one cycle of mounting work. Next, the mounting position accuracy inspection work will be described. A dedicated inspection board is used for the inspection work.

As shown in FIG. 6, the inspection substrate 300 is made of colorless and transparent glass and is formed in almost the same shape as the printed wiring board 14, and circle marks 3002 are formed on a large number of grid points on the component mounting surface on the front side. Are accurately formed in shape and position. At the position surrounded by four adjacent circle marks 302 of the inspection substrate 300, the component 20 is mounted in the same manner as the mounting operation described above. The front and back are reversed, and the back surface of the component 20 is imaged through the detection board 300, and the mounting position accuracy of the component 20 is detected. The details will be described below.

First, the inspection board 300 is transported to a mounting space by the wiring board conveyor 16 and positioned and held by the printed wiring board holding device 18. Next, the reference mark camera 152 captures a part of the circle mark 302 so that the position of the inspection board 300 is obtained. Since the inspection substrate 300 does not have a dedicated mark corresponding to the reference mark 150, two circular marks 3 02 at two corners located on two diagonal lines are provided. Each image is taken, the position of the mark center, which is the center of the image of each circle mark 302, is acquired, and the holding position of the inspection substrate 300 is acquired, considering the center of the four mark centers as a reference point. You.

The circle mark 302 is a mirror surface obtained by etching the surface of the inspection substrate 300 and applying a very thin metal plating. Therefore, as shown in FIG. 8, the reference mark camera 15 2 is positioned directly above the circle mark 302, and If the illumination device 158 illuminates from directly above, the portion of the circle mark 302 is totally reflected and an image brighter than the surrounding area can be captured. The fiducial mark cameras 15 2 capture images of the four circle marks 302 from directly above by epi-illumination, and obtain the position of the reference point, which is the center of each circle mark, based on the positions of these reference points. The position of the inspection board 300 is obtained. Note that a reference mark may be provided separately from the circle mark 302 in a margin of the inspection board 300 or the like.

Next, the component 20 is mounted on the inspection board 300. Although an inspection chip dedicated to the inspection work may be used, in the present embodiment, the inspection work is performed by mounting a component 20 which is a commercially available electronic circuit component. Similarly to the mounting operation, the component holding head 60 receives the component 20 from the feeder 30 at the component supply position, and is moved toward the component mounting position by the XY moving device 96. While passing over the light guide device 184 on the way, the back surface of the component 20 is imaged by the component camera 182. The strobe light 204 that emits visible light is turned on, and a reflected image of the back surface of the component 20 is captured. By the time the component holding head 60 reaches the component mounting position, image processing is executed to acquire the component holding position, and the holding position error of the inspection board 300 and the holding position error of the component 20 are eliminated. The mounting position is corrected so that the component 20 is mounted on the inspection board 300. This completes one cycle of mounting work. Note that a colorless and transparent double-sided adhesive tape (not shown) is previously attached to the entire component mounting surface of the inspection substrate 300, and the component 20 held by the suction nozzles 114 is attached to the inspection substrate 300. If placed on top, it will be fixed by the adhesive tape. In the following description, the thickness of the double-sided adhesive tape is assumed to be negligible.

As shown in FIG. 7, the component 20 is preset at each position equidistant from four adjacent circle marks 302 of a large number of circle marks 302 of the inspection board 300, as shown in FIG. The components 20 are mounted on the large number of mounting positions in the same manner as in the mounting operation described above. The component 20 is mounted on the mounting area of the detection board 300, that is, the entire area where the circle mark 302 is provided. FIG. 7 shows a state in which all of the components 20 are mounted at the rotational position where they are supplied from the feeder 30. However, even if they are mounted alternately at a rotation position rotated 90 degrees from the rotation position, 2003/010803

18

Alternatively, it may be mounted repeatedly at four rotational positions. In addition, all the components 20 are mounted at the rotational positions as supplied from the feeder 30 at a plurality of mounting positions of the inspection board 300, and a plurality of mounting positions of another inspection board 300 are mounted. The mounting position can be set at various rotation positions, such as at a rotation position rotated 90 degrees, and a plurality of additional mounting positions of the inspection board 300 can be set at rotation positions further rotated 90 degrees. It is also possible to do so.

When all the components 20 are mounted, the operator turns the inspection board 300 over and sets it on the wiring board holding device 18, and the reference mark camera 15 2 passes the inspection board 300 through the inspection board 300. The back surface of the component 20 is imaged, and the mounting position of the component 20 is detected. First, the completion of the mounting work of the component 20 is notified to the operator, and the holding of the test board 300 by the wiring board holding device 18 is released. The operator takes out the inspection board 300 based on the work completion information, turns the board upside down, and mounts the board on the board jig 304.

As shown in FIGS. 9 and 10, the substrate jig 304 has a generally flat plate shape, supports the inspection substrate 300 from below, and contacts or approaches both side surfaces of the inspection substrate 300. To define the horizontal position. The board jig 304 supports the inspection board 300 with the component mounting surface of the inspection board 300 facing down, so that it does not interfere with the component 20 already mounted on the component mounting surface. The portion opposing the area where the circle mark 302 is formed has a constant depth (for example, 5 mm) except for the support surface 303 that contacts and supports the edge of the lower surface of the inspection substrate 300. mm) Depressed. The inspection board 300 is held by the wiring board holding device 18 via the board jig 304. The board jig 304 has a height of the component mounting surface, that is, the back surface of the component 20, in a state where the inspection board 300 is held by the wiring board holding device 18 via the board jig 304. Is designed to hold the inspection board 300 at a height that matches the focus of the fiducial mark camera 152. Specifically, for example, assuming that the thickness of the inspection substrate 300 is t and the refractive index of the glass is 1.5, the focal length inside the glass increases by 1.5 times. As shown in Fig. 10, the inspection board 300 is mounted so that the component mounting surface is located at a position that is one-third the thickness t lower than the component mounting surface height h at the time of component mounting. It is made to hold. The inspection board 300 has a height-adjusted component mounting surface when the component 20 is mounted. Since the upper surface of the substrate jig 304 is pressed against the fixed surface 308 and held, the component mounting surface of the inspection substrate 300 is raised when the upper surface of the substrate jig 430 is pressed and held against the surface 308. The thickness is set to be lower by one third of the thickness t of the inspection substrate 300 from the specified surface 308.

Since the board jig 304 is wider than the inspection board 300, the width of the wiring board conveyor 16 is adjusted according to the board jig 304. That is, the movable guide rail 28 is moved in a direction away from the fixed guide rail 26 until the distance between the movable guide rail 28 and the fixed guide rail 26 matches the width of the board jig 304. Here, the circuit board holding device 18 (FIGS. 1 and 2) (not shown) is brought into a state in which the substrate jig 304 can be held. Thereafter, if the operator places the inspection board 300 on the wiring board holding device 18 via the inspection jig 304, the operator notifies the control device via the input device 268. It is transmitted to 250. Based on this information, the control device 250 sets the wiring board holding device 18 in a state in which the test jig 304 is fixedly held, and as a result, the test board 300 is detected and fixed. It is fixedly held through the tool 304.

Next, the mounting position of the component 20 is detected by imaging the back surface of the component 20. In the present embodiment, for each mounting position of the component 20, the positions of four surrounding circular marks 302 are acquired, and the mounting position is determined based on the relative positions of the circular marks 302 and the component 20. A shift is detected.

Hereinafter, the work of detecting the mounting position accuracy of one component 20 will be described.

First, four circle marks 302 around the component 20 are sequentially imaged. Specifically, the fiducial mark camera 15 2 is positioned at a position that should be located directly above the circle mark 30 2 to be imaged this time, and the epi-illumination device 15 8 8 is coaxial with the fiducial mark camera 15 2. Illuminates the circle mark 302, and a reflected image is captured. An example of an image obtained by being illuminated by the epi-illumination device 158 is shown in FIG. 12. ing. This is to make it easier to compare with FIG. 13 which is an image obtained by being illuminated from an oblique direction by the illumination device 154. In the present embodiment, the circle mark 302 is usually located at the center of the image pickup. The image is taken to be located. The circle mark 302 is almost totally reflected and a relatively bright image is formed, whereas the back surface of the part 210 disturbs the illumination light. Reflection results in a relatively dark image. Further, portions other than the circle mark 302 and the component 20 (referred to as background) are darker images. Therefore, if the image of the circle mark 302 is binarized by a threshold value set so that the image of the circle mark 302 is bright and the part 20 and the background are dark, only the image of the circle mark 302 is acquired as a bright image. And the position of the circle mark 302 can be easily detected. In the present embodiment, the fiducial mark camera 15 2 is imaged while being directly opposed to each of the circle marks 302, and the planned position of the center of the circle mark 302 (in this embodiment, the fiducial mark The direction and distance from the center of the imaging surface of the camera 152 are detected as misregistration.

As shown in FIG. 14, in the image obtained by imaging, a plurality of seek lines 310 are preset in the vicinity of the position where the image of the circle mark 302 should exist, and The boundary position between the light part and the dark part is obtained for the seek line 310. The boundary position is the position of the outline of the circle mark 302, and the center of a plurality of boundary positions on the seek line 310 is calculated as the mark center position which is the center of the circle mark 302.

Next, the reference mark camera 152 is positioned at the center of the four mark center positions, that is, at a position equidistant from the four mark center positions. As described above, since the mounting position of the component 20 is set at a position equidistant from the center of the four marks, the fiducial mark camera 152 is positioned just above the mounting position and imaging is performed. It is done. When the component 20 is imaged, as shown in FIG. 11, the epi-illumination device 244 is turned off and the illumination device 154 is turned on, and the imaging is performed. By illuminating the back surface of the component 20 from an oblique direction, the component 20 is obtained as a relatively bright image, but the reflected light of the substantially circular mirror mark 302 is not reflected. Since almost no light enters the fiducial mark camera 15 2, the circle mark 302 becomes relatively long as shown in FIG. Therefore, if the image is binarized by an appropriately set threshold value, only the image on the back surface of the component 20 is obtained as a bright image. Image processing is performed on this image data, and the horizontal displacement of the component 20 is obtained based on the displacement in the imaging plane. Further, the inclination of the inspection board 300 is also calculated based on the four mark center positions, and the rotational displacement of the component 20 in the rotation direction is also calculated based on the inclination of the inspection board 300 and the inclination of the component 20. Is obtained. That is all The work of inspecting the accuracy of the mounting position of the ital is completed. Note that the inclination of the inspection substrate 300 is such that after the inspection substrate 300 is held by the wiring board holding device 18 via the inspection jig 304, of the many circle marks 402, The positions of the circle marks 302 at the two corners or the four corners of the inspection board 300 may be detected, and the positions may be calculated based on the detection results.

Fig. 15 and Fig. 16 show the detection results (Fig. 15 (a), (b)) when the same test board 300 is imaged from the back side, and the image from the front side (component mounting surface) side. The detection results (Figs. 16 (a) and (b)) are shown in comparison. In FIG. 15 (a) and FIG. 16 (a), the detection results of the horizontal displacement of the mounting position of the component 20 are shown for each mounting direction. The bar graphs in FIG. 15 (b) and FIG. 16 (b) show 3σ, which is the variation in the mounting position, in the X-axis direction and the Y-axis direction.

As is clear from this figure, when detecting the mounting accuracy of the same inspection board 300, the variation is smaller when imaging from the back side than when imaging from the front side (component mounting surface). It turns out that the detection accuracy is high.

In the present embodiment, when the component 20 is mounted, the component holding position is acquired based on the reflection image of the back surface of the component 20, and after mounting, the back surface of the reproduced component 20 is imaged and the mounting position is detected. Therefore, mounting accuracy can be more properly evaluated when imaging from the back side than when imaging from the front side.

The operation of turning over the inspection board 300 may be performed on the inspection board 300 discharged from the electronic circuit component mounting machine 10. Specifically, for example, if all the components 20 are mounted on the inspection board 300, they are conveyed downstream from the wiring board conveyor 16 in the same manner as the printed wiring board 14, and once the electronic circuit component mounting machine is mounted. Emitted from 10 If the inspection board 300 is mounted on a board jig 304 by an operator and the width of the wiring board conveyor 16 is adjusted, the board is set upstream of the electronic circuit component mounting machine 10. It is positioned by being fed transportable to the attachment space by the wiring board Konpeya 1 ⁶ again. The use of the substrate jig 304 is not essential. If not used, the jig is ejected from the wiring board conveyer 16 from the electronic circuit component mounting machine 10 and then turned over by the upside down device. Then, the electronic circuit component mounting machine 10 can be transported again to the work position, and the mounting position inspection can be fully automated. Further, in the above embodiment, the component mounting machine is of the XY robot type. However, the component mounting machine may have another mode. For example, a plurality of component holding heads may be held by an intermittent rotating body. It may be a so-called index table type component mounting machine that mounts components.

As described above, some embodiments of the present invention have been described. However, these are merely examples, and the present invention is directed to the aspects described in the section [Problems to be Solved by the Invention, Problem Solving Means and Effects]. Initially, the present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art.

Claims

The scope of the claims

1. A method for inspecting the mounting position accuracy of an electronic circuit component mounting machine by mounting an inspection chip on an inspection board using an electronic circuit component mounting machine and detecting the mounting position.

A method for inspecting the mounting position accuracy of an electronic circuit component mounting machine, wherein a mounting position of the inspection chip on the inspection substrate is detected at a position on a back surface of the inspection chip.

2. The mounting position accuracy inspection method according to claim 1, wherein a commercially available electronic circuit component is used as the inspection chip.

3. The test chip is held by a holding head, and an image of the test chip is taken to obtain an error of a holding position of the test chip by the holding head, and the obtained holding position error is corrected to be applied to the test substrate. The mounting position accuracy inspection method according to claim 1 or 2, wherein the mounting position is mounted.

4. The mounting position accuracy inspection method according to claim 3, wherein the imaging of the inspection chip for acquiring the holding position error is performed on a back surface of the inspection chip.

5. The mounting position accuracy inspection method according to claim 4, wherein the imaging of the back surface of the inspection chip for acquiring the holding position error is performed while illuminating the back surface with an illumination device.

6. A plurality of mounting position reference marks near the mounting position of the test chip on the test board, and detecting the position of the test chip based on the mounting position reference marks. The mounting position accuracy detection method according to any of the above items.

7. The planned mounting positions are set in a state where they are regularly arranged in two directions orthogonal to each other on the surface of the inspection substrate, and the plurality of mounting position reference marks are provided for each of the plurality of planned mounting positions. The mounting position accuracy detection method according to claim 6, wherein the method is provided.

8. At the time of mounting, the position of the board reference mark provided on the test board is detected to detect the position of the entire test board, the position error of the test board is acquired based on the detected position, and the acquired test board is acquired. Contraction for mounting the inspection tip while correcting the position error of the 9. The mounting position accuracy inspection method according to any one of claims 1 to 7.

9. The test substrate is made of a light-transmitting material, a test chip is mounted on the front surface of the test substrate, and the position of the rear surface of the test chip is detected by imaging the test chip from the rear surface side of the test substrate. The mounting position accuracy inspection method according to any one of claims 1 to 8.

10. The mounting position accuracy according to any one of claims 1 to 9, wherein a double-sided adhesive sheet is pasted on the inspection substrate, and the inspection chip is fixed to the inspection substrate by the double-sided adhesive sheet. Inspection methods.

11. The mounting position accuracy inspection method according to claim 10, wherein a light transmissive sheet is used as said double-sided pressure-sensitive adhesive sheet.

1 2. Mounting the test chip on the test board with the front side of the test board facing up, and then flipping the test board upside down to image the back surface of the test chip from above through the test board 12. The mounting position accuracy inspection method according to claim 10 or 11.

13. A plurality of mounting position reference marks are set in the inspection board near the mounting position of the test chip, and the inspection is performed at mounting positions relatively determined with respect to the plurality of mounting position reference marks. After mounting the chip, the imaging device is positioned at a position directly facing each of the plurality of mounting position reference marks, and the position of each mounting position reference mark is obtained by imaging each mounting position reference mark. 13. The imaging device according to claim 9, wherein the imaging device is positioned at a position directly opposite to the mounting position determined based on the positions of the plurality of mounting positions and the reference marks, and the test chip is imaged. Inspection position accuracy inspection method.

14. The mounting position accuracy inspection method according to claim 13, wherein each mounting position reference mark is illuminated by epi-illumination when the mounting position reference mark is imaged.

15. The mounting position accuracy inspection method according to claim 14, wherein the imaging of the inspection chip is performed by illuminating the inspection chip from a direction inclined with respect to the surface of the inspection substrate.

16. The mounting method according to claim 9, wherein when mounting the inspection chip on the surface of the inspection substrate, the inspection substrate is held by the substrate holding device with the inspection substrate facing upward. Item 5. The mounting position accuracy inspection method according to any one of the above items.

17. The mounting according to claim 16, wherein, when imaging the inspection chip from the back side, the inspection substrate is held by the substrate holding device with the front side down, and imaging is performed from above. Position accuracy inspection method.

18. At the time of mounting the test chip on the surface of the test substrate, at least one substrate fiducial mark provided on the test substrate is imaged from above by an imaging device to obtain a position error of the test substrate, and A position error is corrected, the test chip is mounted on a test board, and the test board is held by the board holding device in a state where the test board is turned upside down, and the back surface of the test chip is passed through the test board by the imaging device. 18. The mounting position accuracy inspection method according to claim 17, wherein the position of the inspection chip is detected by imaging.

1 9. When holding the inspection substrate in the substrate holding device in a state where the inspection substrate is turned upside down, a holding jig is interposed between the inspection substrate and the substrate holding member. 19. The apparatus according to claim 18, wherein a focus is used to hold the inspection substrate so that the focal point is located on the surface of the inspection substrate both when imaging the substrate reference mark and when imaging the inspection chip. Inspection position accuracy inspection method.

20. An apparatus for inspecting the mounting position accuracy of an electronic circuit component mounting machine by mounting an inspection chip on a test board by an electronic circuit component mounting machine and detecting the mounting position.

A test board, which is a flat plate made of a light transmitting material, on which a plurality of mounting positions are set on the surface and a plurality of mounting position reference marks are provided for each of the mounting positions;

An imaging device capable of imaging the back surface of the test chip mounted on the mounting position on the front surface of the test board and the plurality of mounting position reference marks from the back side of the test board;

A mounting position accuracy acquisition section for causing the imaging device to image the mounting position reference mark and imaging the inspection chip, and acquiring the mounting position accuracy of the electronic circuit component mounting machine based on a result of the imaging; When

2 1. A component supply device that supplies electronic circuit components, A board holding device for holding a circuit board,

A component mounting device that receives an electronic circuit component from the component supply device by a holding head, and mounts the electronic circuit component on a circuit board held by the circuit board holding device;

An electronic circuit component mounting machine comprising:

An inspection board, which has a flat plate shape, is provided with a plurality of planned mounting positions, is provided with a plurality of mounting position reference marks for each of the planned mounting positions, and is held by the circuit board holding device;

A test chip mounting controller for holding the test chip on the holding head and mounting the test chip at each of the mounting positions;

In a state where the test board on which the test chip is mounted is turned upside down and held by the circuit board holding device, the mounting position reference mark is imaged on the image pickup device through the test board from the back side of the test board. And a mounting position accuracy obtaining unit for obtaining the mounting position accuracy of the electronic circuit component mounting machine based on a result of the imaging by imaging the back surface of the test chip mounted on the inspection board.

Electronic circuit component mounting machine.