KR100190941B1 - Mounting apparatus for electronic parts - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounter for mounting an electronic component at a predetermined position of a printed plate. The present invention relates to an image of a suction state of an electronic component adsorbed by a patent major adsorption sensitization and an arrangement (mounting) position of a printed plate. It relates to a device to.

The object of the present invention is to shorten the adsorption or mounting time of electronic components, to simplify the configuration of equipment, to reduce costs, to provide space, and to improve identification accuracy.

In order to solve the above problems, a camera, an electronic component adsorption unit having a sensation for adsorbing electronic components disposed in parallel with the camera, on a head moved in response to the adsorption and mounting of the electronic components of the electronic component mounter of the present invention, and And a mirror unit installed under the camera. The electronic component adsorption section is configured to be movable in the head along the axial direction of the camera in response to the adsorption or mounting of the electronic components. The mirror unit is configured to be movable in the head in a direction orthogonal to the axial direction of the camera, and in advance to form an optical path between the camera and an electronic component mounting member such as a printed plate positioned at a lower portion thereof at a position, And a mirror for forming an optical path between the electronic component adsorption portion and the camera located at an upper portion thereof at another position.

The head is moved directly from the adsorption position of the electronic component to the mounting position, and the adsorption state of the electronic component is identified in this movement process.

Description

Electronic Component Mounter

(A)-(d) is a figure which shows the operation form of the electronic component mounting apparatus which is an Example of this invention.

2 is a block diagram of a signal processing apparatus in an electronic component mounting apparatus according to an embodiment of the present invention.

3 is a diagram showing reference position image data of a printed plate in an embodiment of the present invention.

4 is a diagram showing image data of an electronic component in an embodiment of the present invention.

5 is a diagram showing a movement path of an electronic component in an embodiment of the present invention.

(A) and (b) of FIG. 6 show conventional printing plate reference position identification and part adsorption.

7 is a view showing a conventional electronic component movement path.

8 is a block diagram of a conventional electronic component mounting identification camera.

9 is an overall configuration perspective view of another embodiment of the electronic component mount of the present invention.

10 is an enlarged perspective view of the electronic component mounting mechanism of FIG.

(A)-(c) of FIG. 11 is a figure which shows the operation form of the electronic component mounting body which is another embodiment of this invention.

FIG. 12 is a form diagram for identifying the transverse adsorption state in FIG. 11. FIG.

13 and 14 show an operation of another electronic component mounter which is an embodiment of the present invention corresponding to FIG. 11 (b).

15 is a view showing a control system of the electronic component mounting apparatus of the present invention.

Fig. 16 is a flowchart showing the component mounting operation of the electronic component mounting apparatus of the present invention.

* Explanation of symbols for main parts of the drawings

1. Printing board 3. Electronic parts

5. Mirror Unit 7. Suction Nozzle

8. Electronic component adsorption part 10. Camera

12. Zoom lens 30. Signal processing device

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component mounter for mounting an electronic component at a predetermined position on a printed plate. In particular, the present invention relates to an image of a suction state of an electronic component adsorbed on a vacuum suction nozzle and an arrangement (mounting) position of the printed plate. It relates to a device to.

Background Art [0002] In the conventional automatic assembly of printed boards, electronic component mounters have been used to mount (mount) electronic components such as IC devices, microcapacitors, resistors, and the like on the printed plate. The electronic component mounting device is configured to, for example, remove the electronic component contained in a double tape by peeling the tape out and place the electronic component taken out.

In order to accurately mount the electronic component at a predetermined position on the printed board, the exact position of the printed board must be identified, and in the case where the electronic component is mounted at the correct position including the direction, the adsorption state of the electronic component must be identified. As for the latter, for example, with respect to IC devices, if there is a misalignment of the adsorption positions or a misalignment of the angles, the leads of the IC devices are not correctly installed on the land of the printed plate. To be mounted on the printing plate.

Fig. 6A shows a schematic diagram of positional identification of a printed plate, and Fig. 6B shows a schematic diagram for identifying a mounting state of an electronic component. 6A, the suction nozzle 7 for vacuum suction of electronic components in the head of the electronic component mounter, the electronic component suction portion 8 supporting the suction nozzle 7, and the camera 60 are shown. The fixed magnification lens 62 is installed, and the head is moved to the upper part where the print plate 1 is placed (mounted) so that the reference position in the print plate 1 is moved through the fixed magnification lens 62 to the camera ( 60) inputs the input data, and detects the correct position of the printed plate on which the electronic component is mounted. In FIG. 6 (b), the adsorption state of the electronic component 3 adsorbed to the adsorption nozzle 7 is fixed at the fixed position where the head is arranged with the camera 64 and the fixed magnification lens 66. Input to the camera 64 through the magnification lens 66, and image processing to identify the adsorption state of the electronic component. Although the position of the printed plate shown in FIG. 6 (a) is identified once with respect to the printed plate, adsorption state identification of the electronic component shown in FIG. 6 (b) is performed a plurality of times for each electronic component.

In FIG. 7, the movement path of the head which absorbed the electronic component is shown. In the moving head mounted with the suction nozzle 7, the electronic component suction part 8, the camera 60, and the fixed magnification lens 62, the component suction nozzle 7 sucks the electronic component 3 entirely.

Then, the head is moved to the image processing position IP where the camera 64 is installed to identify the adsorption state of the electronic component 3 from below, as shown in FIG. Thereafter, the moving head is moved to the component mounting position MP of the printed plate, and the adsorption furnace 7 releases the vacuum adsorption of the electronic component 3 to mount the electronic component 3 at a predetermined position.

Referring to the camera 64 and the fixed magnification lens 66 of FIG. 6 (b), different magnifications are preferably used as shown in FIG. Fixed magnification lenses 81 to 83 in front of the cameras 85 to 87, and the suction state of the electronic component 3 is transferred to the plurality of cameras 85 to 87 through the half mirrors 71 to 73. A fixed magnification lens 81 to 83 in front of the cameras 85 to 87, and the adsorption state of the electronic component 3 through the half mirrors 71 to 73. ), And the adsorption state of the electronic parts is identified using image data having the most appropriate relationship with the magnification of the fixed magnification lenses 81 to 83.

As shown in Figs. 6 (b) and 7, a moving head is provided because the camera 64 for identifying the suction state of the electronic component 3 is provided at a fixed image processing position IP. Each suction or mounting operation of each electronic component is moved along the path of the component suction position CP, the image processing position IP, and the component mounting position MP.

Therefore, the moving distance of the head is increased as much as it passes through the image processing position IP, and accurate positioning is required at the image processing position IP. Therefore, the adsorption or mounting time of the electronic parts is long, and the work efficiency is reduced. there is a problem.

Subsequently, the camera 60 mounted in the moving head for identifying the printing plate 1 shown in FIG. 6 (a) from above. In addition to the failure magnification lens 62, the camera 64 and the fixed magnification lens 66 installed at fixed positions must be installed to identify the electronic component 3 shown in FIG. There is a problem that rises. In addition, the signal processing apparatuses installed at the rear ends of the camera 60 and the camera 64 are shared, but there is a slight gap between the camera 60 and the fixed magnification lens 62 and the camera 64 and the fixed magnification lens 66. There is a problem that the common signal processing precision cannot be obtained accurately due to the difference in precision, and there is a need for further work to promote the difference.

Also, as shown in FIG. In order to obtain an optimal image, if multiple system half mirrors (71 to 73), fixed magnification lenses (81 to 83), and cameras (85 to 87) are installed, the installation price becomes higher and the installation space thereof is different. There are problems such as limiting the installation of parts and limiting the movement of the head.

Accordingly, an object of the present invention is to shorten the adsorption or mounting time of electronic components, to simplify the configuration of equipment, to reduce the cost, to provide space, and to improve the accuracy of identification.

In order to solve the above problems, an electronic component adsorption unit having a camera, a nozzle disposed in parallel with the camera and adsorbing electronic components, on a head moved according to the attachment and mounting of the electronic components of the electronic component mounting apparatus of the present invention, and the It has a mirror unit installed at the bottom of the camera. The electronic component adsorption section is configured to be movable in the head in the axial direction of the camera in accordance with the adsorption or mounting of the electronic components.

The mirror unit is configured to be movable in the head in a direction orthogonal to the axial direction of the camera, and at any position, a mirror that forms an optical path between the camera and an electronic component mounting member such as a printed plate positioned below the mirror. And a mirror that forms an optical path between the electronic component adsorption portion and the camera located at an upper portion at another position.

The head is moved directly from the adsorption position of the electronic component to the mounting position, and the adsorption state of the electronic component is identified in this movement process.

More preferably, a zoom lens is installed on the front part of the camera.

The movable head has a camera, an electronic component adsorption unit with an adsorption nozzle, and a mirror unit. The image processing position (IP) shown in FIG. 7 is detected because the adsorption state of the electronic components adsorbed to the nozzle is detected through the mirror unit. There is no need to install a camera for detecting the adsorption state of the electronic component in the process, and in the moving process of adsorbing the electronic component and attaching it to a predetermined position of the electronic component mounting member such as a printing plate without passing through the image processing position (IP). The adsorption state of electronic parts can be identified. As a result, the mounting time of the electronic component can be shortened.

In addition, since the position detection of electronic component mounting members, such as a printed plate, which is located on the other side of the electronic component adsorption side through the mirror unit is performed by the one camera, the position detection accuracy due to the difference in accuracy when using another camera There is no error. By using one zoom lens and adjusting the focus position, an optimum image can be obtained.

EXAMPLE

In FIG. 1, the moving head of the electronic component mounter is equipped with a mirror unit 5, an electronic component adsorption unit 8 equipped with a suction nozzle 7, a camera 10 and a zoom lens 12. As shown in FIG. In the ear canal head, a servo motor (not shown) for moving the mirror unit 5 on the rail provided in the moving head in the right direction (R) or the left direction (L), and the electronic component adsorption part 8 in the upward direction (U). Or a servo motor (not shown) for moving in the downward direction D and a servo motor (not shown) for moving the zoom lens 12 up and down. The moving head is also driven by the servomotor, and the moving position is detected by the encoder.

The mirror unit 5 is provided inside the first mirror 51, the second mirror 52, the third mirror 53, and the fourth mirror 54 as shown. As shown in FIG. 1A, the third mirror 53 and the fourth mirror 54 have an optical path between the camera plate 10 and the printing plate 1 provided in the lower portion of the mirror unit 5. It is provided so that 21 may be formed. In addition, the first mirror 51 and the second mirror 52, as shown in Fig. 1 (c), the electronic component (3) adsorbed to the suction nozzle (7) located above the mirror unit (5). And an optical path 23 are formed between the camera 10 and the camera 10. By configuring the mirror unit 5 in this manner, it is possible to detect the suction state of the electronic component 3 and the reference position of the print plate 1 with one camera.

The camera 10 is a CCD camera, and image data (image data) is input to the seesaw processing apparatus 30 shown in FIG. The signal processing device 30 is connected to the input unit 31, the memory 32, the data setting unit 33, the memory 34, the identification control unit 35, and the display unit 36 as shown. Consists of.

An operation of detecting the exact position of the print plate 1 by detecting the reference mark of the print plate 1 will be described with reference to FIG.

The moving head is moved on the print plate 1 which is the electronic component mounting member. As shown in FIG. 3, the printed plate 1 is marked with a reference mark, for example, + for defining the position equally. In the camera 10 mounted on the moving head, each of the printed boards 1 through the zoom lens 12 adjusted to a predetermined magnification by the zoom lens driving servomotor in response to the control command from the identification control unit 35. The moving head is moved so that the reference mark is detected.

The video signal from the camera 10 is stored in the memory 32 via the input unit 31. In the memory 34, data corresponding to the reference marks other than the print plate 1 is stored in advance through the data setting unit 33. The identification control unit 35 compares whether or not the video data stored in the memory 32 matches the data stored in the memory 34, and controls the moving head to match.

If the image data stored in the memory 32 coincides with the data stored in the memory 34, the value of the encoder at that time is inputted and the mounting position of the moving head is accurately detected.

It is displayed on the display unit 36 so that the correlation between the reference mark input through the camera 10 and the reference mark stored through the data setting unit 33 can be known.

Subsequently, the adsorption or mounting operation of the electronic component will be described with reference to FIGS. 1 (b) to (d). This adsorption or mounting operation is performed by moving the moving head between the component adsorption position CP and the component mounting position MP as shown in FIG. 5 to adsorb the electronic component 3 on this ear canal path. Status is identified.

In FIG. 1B, when the moving head is positioned at the component adsorption position CP, the mirror unit 5 is moved to the right direction R by the mirror unit driving servomotor.

As a result, the electronic component adsorption part 8 is movable in the downward direction D, and the electronic component adsorption part 8 is lowered in the downward direction D by the servomotor for driving the electronic component adsorption part so that the adsorption position is lowered. Is placed on the suction nozzle 7 at the tip of the electronic component suction portion 8.

In Fig. 1 (c), the suction nozzle 7 which sucks the electronic component 3 and the electronic component suction part 8 are raised in the upward direction U by the servomotor for forming the electronic component suction main. .

Then. The mirror unit 5 is moved to the left direction L by the mirror unit driving servomotor. As a result, an optical path 23 is formed between the electronic component 3 and the camera 10, and the adsorption state of the electronic component 3 adsorbed at the tip of the suction nozzle 7 is used as an image signal in the camera 10. It is input to the input unit 31.

The magnification of the zoom lens 12 is adjusted by controlling the zoom lens driving servomotor so as to be optimally focused by the image signal and the memory 32 and to be focused by the identification control unit 35.

At the time when the electronic component adsorption part 8 returns to the return position of FIG. 1C, the moving head is moved toward the component mounting position MP.

During this movement, the adsorption state identification of the electronic component 3 is performed by the signal processing device 30. Through the data setting unit 33, the adsorption state of the regular electronic component 3 is collected in the memory 34, and the state of adsorption of the regular electronic component in which the identification control unit 35 is stored in the memory 34. The data and the adsorption state data of the image data from the camera 10 stored in the memory 32 are compared. And if there is a difference in the adsorption state, the difference is calculated.

The adsorption state and the difference stored in the memory 32 are displayed on the display unit 36 as shown in FIG. FIG. 4 illustrates image data of the adsorbed electronic component 3 and the adsorption nozzle 7 around it, and the broken line shows a normal electronic component adsorption state.

When the moving head is moved on the upper portion of the printing plate 1, as shown in FIG. 1 (d), the mirror unit 5 servo motor for driving the mirror unit in response to the control command of the identification control unit 35 The suction nozzle 7, which is moved in the right direction R and sucks the electronic component 3, can be lowered in the downward direction D. As shown in FIG. The right direction R of the mirror unit 5 may be moved while the moving head is moving to the component mounting position MP.

When the angle control or the position correction is necessary according to the result of the adsorption state identification of the electronic component 3, the identification control unit 35 ensures that the electronic component 3 is accurately positioned at a predetermined mounting position of the printing plate 1. Then, the position or angle correction of the electronic component adsorption unit 8 is performed. Thereafter, the electronic component 3 is released from the suction of the suction nozzle 7 and mounted at the predetermined correct position of the print plate 1.

The moving head is returned from the component mounting position MP to the component adsorption position CP, and the operations described with reference to FIGS. 1B to 1D are repeated as many times as necessary for electronic component mounting.

FIG. 9 shows an overall perspective view of the electronic component mounting apparatus of another embodiment of the present invention, and FIG. 10 shows a partial enlarged view of FIG.

FIG. 15 is a general view of the control system of the electronic component mounting apparatus of the present invention, and FIG. 16 is a flowchart showing the component mounting operation of the electronic component mounting apparatus of the present invention.

In FIG. 9, the electronic component mounting device of the present embodiment is composed of an X-axis moving mechanism 88, and Y-axis moving mechanisms 89 and 90. In FIG. The electronic component mounting mechanism 91 is attached to the X axis moving mechanism 88 and is moved in the axial direction of the X axis moving mechanism 88. The X axis moving mechanism 88 is further moved in the Y axis direction along the Y axis moving mechanisms 89 and 90.

That is, the Y-axis moving mechanisms 89 and 90 are combined with the pair of conveying screws 112 and 113, the driving servo motors 114 and 115, and the conveying screws 112 and 113 on the pair of beams 110 and 111 arranged in parallel. It consists of a moving beam 118 with 116, 117. The X-axis moving mechanism 88 is attached to the upper portion of the moving beam 118 by the transfer screw 119 and the drive servomotor 120 so as to rotately rotate, and is coupled to the transfer screw 119, and An electronic component mounting mechanism 91 capable of moving in the X direction by rotation is provided.

In FIG. 10, the electronic component mounting mechanism 91 includes a fixed mirror 92, a movable mirror 93, a half mirror block 94, first, second, third cameras 95, 96, and the like. (97), the rotary lifting adsorption mechanism (98), and the movable mirror moving mechanism (99) for moving the movable mirror (93) in the horizontal direction (H) are mounted. The rotation lifting adsorption mechanism 98 rotates the rotating part 100 provided in the lower part to (R) direction, and raises the rotating part 100 again in a Z direction, ie, a height direction. As the rotary part 100 rotates and elevates, the reflecting plate 101 and the suction nozzle 102 also rotate and elevate. In addition, the rotary lifting adsorption mechanism 98 has a vacuum adsorption mechanism and adsorbs electronic components through the adsorption nozzle 102.

That is, the rotation lifting adsorption mechanism 98 can be lifted and lowered by the driving mechanism of the conveying screw 122 and the conveying nut 123 and the driving servomotor 124 provided in the movable block 121. ) The rotary drive is driven by a drive servomotor 125 provided on the upper portion thereof.

Driving of the movable mirror 93 is attached to the movable mirror 93 and the movable mirror moving mechanism 99 in a state in which the movable mirror 93 can slide relative to the lower end of the movable block 121. The drive for movement is such that the transfer screw 126 provided on the dead part of the moving block 121 can be rotated by the drive servomotor 127, and the link mechanism lever 128 can be moved left and right. The other end 129 of the 128 is connected to the movable mirror moving mechanism 99 by a connecting rod 130.

The half mirror block 94 is provided with first, second and third half mirrors 103, 104 and 105 as shown in FIG. These half mirrors 103, 104, and 105 transmit the image from the fixed mirror to the cameras 95, 96, and 97 at the top thereof, and at the same time, the first half mirror 103 Also reflects the image to the second and third half mirrors 104 and 105.

Fixed mirror 92, movable mirror 93, suction nozzle 102, reflector plate 101, rotation 100, first to third half mirrors 103, 104, 105, first to The positional relationship of the third cameras 95, 96, and 97 is shown in Fig. 11A. The first to third cameras 95, 96, and 97 have different magnifications, and magnifications that are suitable for image identification of the adsorption state according to the size of the electronic components adsorbed on the respective adsorption nozzles 102. Is set to.

In addition, as shown in FIG. 15, the control system of the electronic component mounting apparatus of the present invention includes the X and Y moving mechanisms 88 and 89, the rotating lifting adsorption mechanism 98, the movable mirror moving mechanism 99, and the angular driving. The servo motors 114, 115, 120, 124, 125, 127 and the image processing apparatus can be controlled by the program control apparatus 131. The program control device 131 feeds back the data of the type, number, mounting position, mounting angle, etc. of the parts to be mounted, the program of image processing and the angle correction data of the parts, and feeds back the lift lifting adsorption mechanism 98. To control.

Hereinafter, the operation of the electronic component mounter according to the present embodiment will be described with reference to FIGS. 9, 10, 11 (a) to (c), and FIG. 16.

11A to 11C show an example in which the large electronic component 106 is mounted on the printed board 107.

When the large electronic component 106 is mounted on the suction nozzle 102, the X-axis moving mechanism 88 is first positioned in the Y-axis direction by the Y-axis moving mechanisms 89 and 90, and then the electrons The component mounting mechanism 91 is positioned in the X direction by the X-axis moving mechanism 88.

As a result, the suction nozzle 102 mounted on the electronic component mounting mechanism 91 is positioned in the X and Y directions of the electronic component installation position 150 on which the electronic component to be mounted is placed.

When the position is determined in the X and Y directions, the suction nozzle 102 is lowered to the component position of the electronic component installation position 150 by the rotary lifting adsorption mechanism 98 as shown in FIG. The large electronic component 106 is vacuum sucked.

When the suction nozzle 102 sucks the large electronic component 106, the suction nozzle 102 is moved by the movement of the electronic component mounting mechanism 91 in the X direction and the movement of the X-axis movement mechanism 88 in the Y direction. It starts to move to the mounting position of the printed board 107.

When the large electronic component 106 is vacuum-adsorbed to the suction nozzle 102, as shown in FIG. 11 (b), in the process of conveying the electronic component, the suction nozzle is sucked by the rotary lifting suction mechanism 98. As the 102 is raised by the height H1, the movable mirror 93 is moved in the right direction shown by the movable mirror moving mechanism 99. The movement of the movable mirror 93 is performed so as not to collide with the absorbed large electronic component 106.

The lift of the suction nozzle 102 causes the large electronic component 106 to absorb the large electronic component 106 adsorbed as shown in FIG. 12 through the first half mirror 103 and the first camera 95. Judging by recognizing). That is, the adsorption nozzle 102 which adsorbs the large electronic component 106 is moved by the rotation lifting adsorption mechanism 98 from the state not recognized by the first camera 95 to the state recognized. Identification of the horizontal adsorption state of the large electronic component 106 in this raised position, that is, the adsorption state of the large electronic component 106 viewed in the horizontal direction is basically based on the image data from the first camera 95. Identification is performed by an image processing unit (not shown).

In addition, when the state of adsorption from the planar direction of the large-sized electronic component 106 is raised to a position where it is sufficiently recognized, the rise is stopped.

When the lifting of the suction nozzle 102 stops, the first half mirror 103 and the first curryma 95 identify the correct suction state of the large electronic component 106 by the first camera 95. . In this case, identification of the parts suction state is performed by the optical system of the movable mirror 93, the fixed mirror 92, the first half mirror 103, and the first camera 95. The identification process itself of this state of adsorption is performed in the same manner as in the prior art in the image processing unit (not shown).

When the identification of the parts adsorption state is completed, the movable mirror 93 is retracted by the temporary mirror moving mechanism 99 to the original position shown by the broken line.

As such, the suction nozzle 102 is lifted, the movable mirror 93 is moved, and the suction state of the large electronic component 106 is absorbed by the large electronic component 106 as shown in FIG. The suction nozzle 102 is moved while the electronic component mounting mechanism 91 is moved to the mounting position of the printed circuit board 107 by the movement in the X direction and the movement of the X axis moving mechanism 88 in the Y direction.

Therefore, since the suction state of the large electronic component 106 is identified during the movement of the large electronic component 106, the transfer time of the large electronic component 106 can be shortened.

When the large electronic component 106 is identified during the conveyance of the large electronic component 106 to the printed circuit board 107 and the adjustment of the component mounting position is necessary, the rotary lifting adsorption mechanism 98 rotates the rotating portion. Rotate appropriately.

When the suction nozzle 102 which adsorbs the large electronic component 106 is lowered to the upper part of the mounting position of the printed board 107, as shown in FIG. 11 (c), the large electronic component 106 The printed board 107 is mounted at the mounting position. That is, the suction nozzle 102 is lowered by the rotary lifting adsorption mechanism 98 until the large electronic component 106 abuts on the mounting position of the printed board 107, and the large electronic component 106 is sucked. Release it. As a result, the large electronic component 106 is mounted at the predetermined position of the printed board 107.

The large electronic component 106 is mounted on the printed board 107, and the suction nozzle 102 is lifted by the rotary lifting suction mechanism 98, and again, the electronic component mounting mechanism 91 and the X-axis moving mechanism ( 88 drives the suction nozzle 102 to the electronic component installation position 150.

The medium electronic component 108 and the small electronic component 109 are mounted in the same manner as the large electronic component 106. In this case, however, the uptake for identifying the adsorption state of the parts depends on the size of the parts. That is, when mounting the medium-sized electronic component 108, as shown in FIG. 13, it raises by the height H2 lower than the height H1 which raised the large electronic component 106, and the small electronic component 109 is raised. When mounted, it is raised by a lower H3 as shown in FIG. These rising position detections are judged by the second half mirror 104, the second camera 96, and an image processing unit (not shown) in FIG. In addition, in FIG. 14, it is performed by the 3rd half mirror 105, the 3rd camera 97, and an image processing part. In other words, the identification of the parts adsorbed state of the medium-sized electronic component 108 is performed by the third camera 97. For this reason, the 1st half mirror 103, the 2nd half mirror 104, and the 3rd half mirror 105 are comprised by the semi-transmissive half mirror.

13 and 14 correspond to FIG. 11 (b).

As mentioned above, since the position where the adsorbed electronic component and the movable mirror 93 collide with each other differs according to the size of the component, the suction nozzle 102 is raised to a position of the minimum height that does not collide with the movable mirror 93. Let's do it.

The image processing for controlling the above operation and identifying the part adsorption state is realized by, for example, a microcomputer. That is, the position control of the X-axis dynamic mechanism 88, the position control of the Y-axis movement mechanism 89, 90, the rotation of the rotary lifting adsorption mechanism 98, the lifting, the suction control, the moving mirror, the moving mechanism 99 ), The control of the rising position of the component, the identification of the electronic component adsorption state, and the adjustment of the rotational position of the electronic component, if necessary, are performed by a microcomputer.

Although the above has exemplified the case in which the electronic components 106, 108, and 109 are vacuum-adsorbed, the same applies to the case in which the electronic components 106, 108, and 109 are magnetically absorbed or mechanically held. Therefore, in the present invention, the adsorption includes not only vacuum adsorption and magnetic adsorption but also anything that is held.

As described above, according to the present invention, the mounting time of the electronic component is shortened until the adsorption state of the electronic component is identified from the adsorption of the electronic component to the mounting. Further, according to the present invention, the pair of cameras and the zoom lens makes the identification of the adsorption state of the electronic components and the position of the electronic component mounting members the same, so that the equipment price is low and the installation space thereof is also reduced.

In addition, based on the image data obtained by the pair of cameras and the zoom lens, the adsorption state of the electronic components and the position of the electronic component mounting members are fixed. The fall can be prevented.

In addition, according to the present invention, the rise time of the suction nozzle is raised to the optimum position according to the size of the electronic component.

Claims (1)

An electronic part mounting device having a camera for attracting electronic parts and activating the adsorption state of the electronic parts, wherein the electronic part mounting mechanism 91 and the electronic part mounting device attached to the moving means 88, 89, 90 in a horizontal plane are provided. A component adsorption nozzle 102 movable in a vertical direction attached to 91, a camera 95, 96, 97 attached in parallel with the component adsorption nozzle 102, and a lower end of the component adsorption nozzle 102; Attaching the movable mirror moving mechanism 99 having the movable mirror 93 to the left and right in the movable state, and photographing the absorbed electronic components 106, 108, and 109, the movable mirror moving mechanism is attached to the component adsorption nozzle 102. When the electronic component (106, 108, 109) is adsorbed or mounted at the bottom of the), the movable mirror moving mechanism (99) moves horizontally from the lower end of the component adsorption nozzle (102), and the adsorption nozzle (102) is Mount the electronic component to the position where the electronic component is adsorbed to attach the electronic component. Sphere 91 is performed in the process of moving the movement of the movable mirror moving mechanism (99) mount the electronic component to be producing format of the electronic component is running.