JPH0545511U - Imaging device for solder inspection - Google Patents

Imaging device for solder inspection

Info

Publication number
JPH0545511U
JPH0545511U JP11092891U JP11092891U JPH0545511U JP H0545511 U JPH0545511 U JP H0545511U JP 11092891 U JP11092891 U JP 11092891U JP 11092891 U JP11092891 U JP 11092891U JP H0545511 U JPH0545511 U JP H0545511U
Authority
JP
Japan
Prior art keywords
imaging
moving
guide
center line
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11092891U
Other languages
Japanese (ja)
Other versions
JP2565263Y2 (en
Inventor
清彬 清水
Original Assignee
株式会社ロゼフテクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ロゼフテクノロジー filed Critical 株式会社ロゼフテクノロジー
Priority to JP11092891U priority Critical patent/JP2565263Y2/en
Publication of JPH0545511U publication Critical patent/JPH0545511U/en
Application granted granted Critical
Publication of JP2565263Y2 publication Critical patent/JP2565263Y2/en
Active legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 電子部品の組み込み方向やそのリードの形態
に応じて、半田付け部分の画像を適切にとらえられるよ
うにすることである。 【構成】 機枠の中心線の周りに4つの支持体により円
弧状の案内体を配置し、この案内体に対して移動体を駆
動手段によって、傾斜可能な状態で取り付け、この移動
体5に工業用カメラおよび複数の光源を設けている。
(57) [Abstract] [Purpose] To appropriately capture an image of a soldered portion in accordance with an assembling direction of an electronic component and a form of its lead. [Arrangement] An arc-shaped guide body is arranged by four supports around the center line of the machine frame, and a movable body is attached to this guide body by a driving means in a tiltable state. An industrial camera and multiple light sources are provided.

Description

【考案の詳細な説明】[Detailed description of the device]
【0001】[0001]
【産業上の利用分野】[Industrial applications]
本考案は、高密度実装基板に対する集積回路や電子部品の半田付け状態を撮像 する装置の改良に関する。 The present invention relates to an improvement in a device for imaging a soldering state of an integrated circuit or an electronic component on a high-density mounting board.
【0002】[0002]
【従来の技術】[Prior Art]
半田付け状態の検査に画像処理技術が利用されている。半田付け状態の良否が 画像処理によって正確に判別するためには、工業用カメラによって検査対象の半 田付け部分が適切な照明のもとに良好な状態で撮像されなければならない。 Image processing technology is used to inspect the soldering state. In order to accurately determine the quality of the soldered state by image processing, the soldered part of the inspection object must be imaged in good condition under appropriate illumination by an industrial camera.
【0003】 従来、半田付け部分の撮像に複数の工業用カメラと照明用の光源が用いられて いるが、これらは撮像方向や照明方向を異にしながら固定されているため、各種 のIC例えばガルウイングタイプのリードやJタイプのリード、さらに小型の電 子部品のリードに対して最も適切な方向からの撮像が困難となっている。特に、 高い実装密度のもとに電子部品が組み込まれると、電子部品毎に適切な方向から の撮像や照明、さらに光量の調節などが必要となるため、高密度実装化にともな って適切な撮像がますます困難となっている。Conventionally, a plurality of industrial cameras and a light source for illumination have been used to image the soldered portion. However, since these are fixed while the imaging direction and the illumination direction are different, various ICs such as gullwings are fixed. It is difficult to image from the most appropriate direction for the type lead, the J type lead, and the lead of a small electronic component. In particular, if electronic components are installed with a high mounting density, it is necessary to image and illuminate each electronic component from an appropriate direction, and adjust the amount of light, so it is appropriate for high-density mounting. Image acquisition is becoming more difficult.
【0004】[0004]
【考案の目的】[The purpose of the device]
したがって、本考案の目的は、電子部品の組み込み方向やそのリードの形態に 応じて、半田付け部分の画像を適切にとらえられるようにすることである。 Therefore, it is an object of the present invention to appropriately capture an image of a soldered portion according to an assembling direction of an electronic component and a form of its lead.
【0005】[0005]
【考案の解決手段】[Means for solving the problem]
上記目的の下に、本考案は、機枠の中心線の周りに4つの支持体によって円弧 状の案内体を配置し、この案内体に対して移動体を駆動手段によって、傾斜可能 な状態で取り付け、この移動体に工業用カメラおよび複数の光源を設けている。 これによって、4つの工業用カメラが4方から傾斜角度を異にしながら機枠の中 心線上の半田付け部分を適切な照明のもとに撮像できることになるため、半田付 け検査のための画像処理が有効に進められ、半田付け状態の良否の信頼性が高め られる。 For the above-mentioned purpose, the present invention arranges an arc-shaped guide body by four supports around the center line of the machine frame, and the movable body can be tilted with respect to the guide body by the driving means. Attached, the moving body is provided with an industrial camera and a plurality of light sources. As a result, four industrial cameras can image the soldered part on the center line of the machine frame under appropriate illumination while changing the tilt angle from four directions. The process is effectively advanced, and the reliability of the quality of the soldered state is enhanced.
【0006】[0006]
【実施例】【Example】
図1、図2および図3は、半田検査用撮像装置1の構成を示している。この半 田付け検査装置1は、機枠2、支持体3、案内体4、移動体5および駆動手段6 のほか、4つの工業用カメラ7および複数の光源8により組み立てられている。 1, 2 and 3 show the configuration of the solder inspection imaging device 1. This half-bonding inspection apparatus 1 is assembled by a machine frame 2, a support body 3, a guide body 4, a moving body 5 and a driving means 6, as well as four industrial cameras 7 and a plurality of light sources 8.
【0007】 上記機枠2は、図示しない装置の支持枠などに水平な状態で取り付けられてお り、4つの支持体3は、上記機枠2の下面側で、機枠2の中心線の周りに4等配 状態で取り付けられている。この実施例によると、4つの支持体3は、機枠2の 中心線を中心とする円弧に対し接線方向にあって、それぞれ90度の角度を形成 しながら垂直面に沿って取り付けられている。The machine frame 2 is attached in a horizontal state to a support frame of a device (not shown), and the four support bodies 3 are provided on the lower surface side of the machine frame 2 in the center line of the machine frame 2. It is mounted in 4 equal parts around it. According to this embodiment, the four supports 3 are tangential to the arc centered on the centerline of the machine frame 2 and are mounted along a vertical plane, each forming an angle of 90 degrees. .
【0008】 そして案内体4は、機枠2の中心線を中心とする円弧として形成されており、 それぞれの支持体3に取り付けられている。この実施例の場合に、案内体4は、 円弧状の案内レール9を一体的に形成しており、この部分で移動体5に取り付け られた複数例えば4つの溝付案内ローラ10と組み合わせられている。移動体5 は、例えば台形状の板体として構成されており、4本のローラ軸11によって案 内ローラ10と一体化し、機枠2の中心線に対して適切な角度で傾斜できるよう になっている。The guide body 4 is formed as an arc centered on the center line of the machine frame 2 and attached to each support body 3. In the case of this embodiment, the guide body 4 integrally forms an arc-shaped guide rail 9 and is combined with a plurality of, for example, four grooved guide rollers 10 attached to the moving body 5 at this portion. There is. The moving body 5 is configured, for example, as a trapezoidal plate body, and is integrated with the proposed roller 10 by four roller shafts 11 so that it can be inclined at an appropriate angle with respect to the center line of the machine frame 2. ing.
【0009】 また上記駆動手段6は、移動体5を傾斜方向に移動させるためのものであり、 案内体4に取り付けられた回転量制御可能な減速機付のモータ12、移動体5に 取り付けられた円弧状のラック13、このラック13にかみ合いモータ12の出 力軸に取り付けられたピニオン14によって構成されている。The drive means 6 is for moving the moving body 5 in the tilt direction, and is attached to the moving body 5 and the motor 12 with a speed reducer attached to the guide body 4 and capable of controlling the rotation amount. The rack 13 has a circular arc shape and a pinion 14 attached to the output shaft of the meshing motor 12 on the rack 13.
【0010】 そして、上記工業用カメラ7は、4つの移動体5毎に1つずつ、機枠2の中心 線に対して傾斜可能な状態で下向きに取り付けられており、また複数の照明用の 光源8は、移動体5の下側部分で照明方向を異にしながら検査対象の半田付け部 23に向けて取り付けられている。なお、工業用カメラ7の垂直位置や最大傾斜 位置は、それぞれ支持体3に取り付けられた近接センサー15、16と工業用カ メラ7に取り付けられたドグ17との対応関係によって検出される。The industrial camera 7 is attached downward for each of the four moving bodies 5 so as to be tiltable with respect to the center line of the machine frame 2, and for a plurality of illuminations. The light source 8 is attached to the soldering portion 23 to be inspected while changing the illumination direction in the lower portion of the moving body 5. The vertical position and the maximum tilt position of the industrial camera 7 are detected by the correspondence between the proximity sensors 15 and 16 attached to the support 3 and the dog 17 attached to the industrial camera 7, respectively.
【0011】 回路基板18は、機枠2の中心線に対して垂直な状態で、位置決め可能なX− Yテーブル19の上に固定されている。複数のICパッケージなどの電子部品2 0のリード21は、回路基板18の導電パターン22に対し半田付け部23によ って電気的に接続されかつ固定されている。この電子部品20は、X−Yテーブ ル19の移動によって、機枠2の中心線上に位置決めされていく。この位置決め と同時に、図示しない制御装置は、4つの工業用カメラ7のうち適切な工業用カ メラ7を選択し、モータ12を駆動することによって、工業用カメラ7の撮像角 度を決定すると同時に、複数の光源8から利用する1または2以上の光源8を点 灯させる。The circuit board 18 is fixed on a positionable XY table 19 in a state perpendicular to the center line of the machine casing 2. The leads 21 of the electronic component 20 such as a plurality of IC packages are electrically connected and fixed to the conductive pattern 22 of the circuit board 18 by the soldering portions 23. The electronic component 20 is positioned on the center line of the machine casing 2 by the movement of the XY table 19. At the same time as this positioning, a control device (not shown) selects an appropriate industrial camera 7 from the four industrial cameras 7 and drives the motor 12 to determine the imaging angle of the industrial camera 7. The one or more light sources 8 used from the plurality of light sources 8 are lit.
【0012】 このようにして、検査対象の半田付け部23に対し工業用カメラ7および光源 8は、適切な撮像方向または照明方向で向き合うことになる。この状態で、検査 対象の半田付け部23の撮像が行われる。このあと、工業用カメラ7からの画像 情報は、図示しない画像処理装置によって、半田付け部23の画像の明るさ、輝 点の発生の有無、輝点の位置や形状などから半田付け部23の良否や不良の状態 を識別していく。In this way, the industrial camera 7 and the light source 8 face the soldered portion 23 to be inspected in an appropriate imaging direction or illumination direction. In this state, the image of the soldering part 23 to be inspected is taken. After that, the image information from the industrial camera 7 is obtained by the image processing device (not shown) from the brightness of the image of the soldering portion 23, the presence or absence of bright spots, the position and shape of the bright spots, and the like. Identify good and bad states.
【0013】[0013]
【考案の効果】[Effect of the device]
本考案では、4つの工業用カメラが4方の位置に傾斜可能な状態で配置されて おり、しかもこれらのカメラの傾斜と同時に、複数の光源が選択され、その傾斜 方向も調節されるため、高密度実装基板でも、検査対象の半田付け部が適切な照 明のもとに理想的な撮像方向からの撮像が可能となる。したがって、半田付け部 の良否の検査や不良の形態の識別などが画像処理の分野で適切に高い信頼性のも とに行える。これらの4つの工業用カメラがリードの形態や、半田付け部の存在 位置などに応じて選択され、かつ適切な撮像方向に修正されるため、撮像方向や 照明方向が適切であるばかりでなく、4つの工業用カメラや複数の光源を選択す ることで、それらの撮像方向や照射方向の修正量が少なくてすむため、撮像に必 要な時間が短縮できる。 In the present invention, four industrial cameras are arranged in four positions in a tiltable state, and at the same time as the tilting of these cameras, a plurality of light sources are selected and their tilting directions are adjusted. Even on a high-density mounting board, it is possible to image from the ideal imaging direction with proper illumination of the soldered part to be inspected. Therefore, the quality of the soldered portion can be inspected and the form of the defect can be identified with appropriate reliability in the field of image processing. These four industrial cameras are selected according to the form of the lead, the position of the soldering part, etc., and are corrected to an appropriate imaging direction, so not only are the imaging direction and the illumination direction appropriate, By selecting four industrial cameras and multiple light sources, the amount of correction in the imaging direction and irradiation direction can be reduced, and the time required for imaging can be shortened.
【図面の簡単な説明】[Brief description of drawings]
【図1】本考案の半田検査用撮像装置の平面図である。FIG. 1 is a plan view of an image pickup device for solder inspection according to the present invention.
【図2】本考案の半田検査用撮像装置の一部の正面図で
ある。
FIG. 2 is a front view of a part of the solder inspection imaging device of the present invention.
【図3】本考案の半田検査用撮像装置の一部の側面図で
ある。
FIG. 3 is a side view of a part of the solder inspection imaging device of the present invention.
【符号の説明】[Explanation of symbols]
1 半田検査用撮像装置 2 機枠 3 支持体 4 案内体 5 移動体 6 駆動手段 7 工業用カメラ 8 光源 DESCRIPTION OF SYMBOLS 1 Imaging device for solder inspection 2 Machine frame 3 Support body 4 Guide body 5 Moving body 6 Driving means 7 Industrial camera 8 Light source
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // H05K 3/34 W 9154−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location // H05K 3/34 W 9154-4E

Claims (2)

    【実用新案登録請求の範囲】[Scope of utility model registration request]
  1. 【請求項1】 機枠(2)の中心線の周りに4つの支持
    体(3)を配置し、これらの支持体(3)を機枠(2)
    に取り付けるとともに、各支持体(3)に円弧状の案内
    体(4)を固定し、各案内体(4)に移動体(5)を円
    弧方向に変位自在に設け、案内体(4)と移動体(5)
    との間に駆動手段(6)を取り付け、さらに移動体
    (5)に工業用カメラ(7)および複数の光源(8)を
    取り付けてなることを特徴とする半田検査用撮像装置
    (1)。
    1. Four support bodies (3) are arranged around the center line of the machine casing (2), and these support bodies (3) are attached to the machine casing (2).
    The guide body (4) having an arc shape is fixed to each support body (3), and the moving body (5) is provided on each guide body (4) so as to be displaceable in the arc direction. Moving body (5)
    An image pickup device (1) for solder inspection, characterized in that a driving means (6) is mounted between the above and the industrial body (7) and a plurality of light sources (8) are mounted on the moving body (5).
  2. 【請求項2】 機枠(2)の中心線の周りで、4つの支
    持体(3)および工業用カメラ(7)を4等配状態で取
    り付けてなることを特徴とする請求項1記載の半田検査
    用撮像装置(1)。
    2. A support according to claim 1, characterized in that four supports (3) and industrial cameras (7) are mounted in four equidistant arrangements around the center line of the machine casing (2). Imaging device for solder inspection (1).
JP11092891U 1991-11-18 1991-11-18 Imager for solder inspection Active JP2565263Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11092891U JP2565263Y2 (en) 1991-11-18 1991-11-18 Imager for solder inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11092891U JP2565263Y2 (en) 1991-11-18 1991-11-18 Imager for solder inspection

Publications (2)

Publication Number Publication Date
JPH0545511U true JPH0545511U (en) 1993-06-18
JP2565263Y2 JP2565263Y2 (en) 1998-03-18

Family

ID=14548165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11092891U Active JP2565263Y2 (en) 1991-11-18 1991-11-18 Imager for solder inspection

Country Status (1)

Country Link
JP (1) JP2565263Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307741A (en) * 1995-05-02 1996-11-22 Matsushita Electric Ind Co Ltd Image pickup device
JP2006349540A (en) * 2005-06-17 2006-12-28 Matsushita Electric Ind Co Ltd Visual inspection support system
US10168755B2 (en) 2014-04-28 2019-01-01 Su Seon CHOI Portable electronic device having power maintenance function during replacement of battery

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307741A (en) * 1995-05-02 1996-11-22 Matsushita Electric Ind Co Ltd Image pickup device
JP2006349540A (en) * 2005-06-17 2006-12-28 Matsushita Electric Ind Co Ltd Visual inspection support system
US10168755B2 (en) 2014-04-28 2019-01-01 Su Seon CHOI Portable electronic device having power maintenance function during replacement of battery

Also Published As

Publication number Publication date
JP2565263Y2 (en) 1998-03-18

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