JPH0545511U - Imaging device for solder inspection - Google Patents

Abstract

(57) [Abstract] [Purpose] To appropriately capture an image of a soldered portion in accordance with an assembling direction of an electronic component and a form of its lead. [Arrangement] An arc-shaped guide body is arranged by four supports around the center line of the machine frame, and a movable body is attached to this guide body by a driving means in a tiltable state. An industrial camera and multiple light sources are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement in a device for imaging a soldering state of an integrated circuit or an electronic component on a high-density mounting board.

[0002]

[Prior Art]

 Image processing technology is used to inspect the soldering state. In order to accurately determine the quality of the soldered state by image processing, the soldered part of the inspection object must be imaged in good condition under appropriate illumination by an industrial camera.

Conventionally, a plurality of industrial cameras and a light source for illumination have been used to image the soldered portion. However, since these are fixed while the imaging direction and the illumination direction are different, various ICs such as gullwings are fixed. It is difficult to image from the most appropriate direction for the type lead, the J type lead, and the lead of a small electronic component. In particular, if electronic components are installed with a high mounting density, it is necessary to image and illuminate each electronic component from an appropriate direction, and adjust the amount of light, so it is appropriate for high-density mounting. Image acquisition is becoming more difficult.

[0004]

[The purpose of the device]

 Therefore, it is an object of the present invention to appropriately capture an image of a soldered portion according to an assembling direction of an electronic component and a form of its lead.

[0005]

[Means for solving the problem]

 For the above-mentioned purpose, the present invention arranges an arc-shaped guide body by four supports around the center line of the machine frame, and the movable body can be tilted with respect to the guide body by the driving means. Attached, the moving body is provided with an industrial camera and a plurality of light sources. As a result, four industrial cameras can image the soldered part on the center line of the machine frame under appropriate illumination while changing the tilt angle from four directions. The process is effectively advanced, and the reliability of the quality of the soldered state is enhanced.

[0006]

【Example】

 1, 2 and 3 show the configuration of the solder inspection imaging device 1. This half-bonding inspection apparatus 1 is assembled by a machine frame 2, a support body 3, a guide body 4, a moving body 5 and a driving means 6, as well as four industrial cameras 7 and a plurality of light sources 8.

The machine frame 2 is attached in a horizontal state to a support frame of a device (not shown), and the four support bodies 3 are provided on the lower surface side of the machine frame 2 in the center line of the machine frame 2. It is mounted in 4 equal parts around it. According to this embodiment, the four supports 3 are tangential to the arc centered on the centerline of the machine frame 2 and are mounted along a vertical plane, each forming an angle of 90 degrees. .

The guide body 4 is formed as an arc centered on the center line of the machine frame 2 and attached to each support body 3. In the case of this embodiment, the guide body 4 integrally forms an arc-shaped guide rail 9 and is combined with a plurality of, for example, four grooved guide rollers 10 attached to the moving body 5 at this portion. There is. The moving body 5 is configured, for example, as a trapezoidal plate body, and is integrated with the proposed roller 10 by four roller shafts 11 so that it can be inclined at an appropriate angle with respect to the center line of the machine frame 2. ing.

The drive means 6 is for moving the moving body 5 in the tilt direction, and is attached to the moving body 5 and the motor 12 with a speed reducer attached to the guide body 4 and capable of controlling the rotation amount. The rack 13 has a circular arc shape and a pinion 14 attached to the output shaft of the meshing motor 12 on the rack 13.

The industrial camera 7 is attached downward for each of the four moving bodies 5 so as to be tiltable with respect to the center line of the machine frame 2, and for a plurality of illuminations. The light source 8 is attached to the soldering portion 23 to be inspected while changing the illumination direction in the lower portion of the moving body 5. The vertical position and the maximum tilt position of the industrial camera 7 are detected by the correspondence between the proximity sensors 15 and 16 attached to the support 3 and the dog 17 attached to the industrial camera 7, respectively.

The circuit board 18 is fixed on a positionable XY table 19 in a state perpendicular to the center line of the machine casing 2. The leads 21 of the electronic component 20 such as a plurality of IC packages are electrically connected and fixed to the conductive pattern 22 of the circuit board 18 by the soldering portions 23. The electronic component 20 is positioned on the center line of the machine casing 2 by the movement of the XY table 19. At the same time as this positioning, a control device (not shown) selects an appropriate industrial camera 7 from the four industrial cameras 7 and drives the motor 12 to determine the imaging angle of the industrial camera 7. The one or more light sources 8 used from the plurality of light sources 8 are lit.

In this way, the industrial camera 7 and the light source 8 face the soldered portion 23 to be inspected in an appropriate imaging direction or illumination direction. In this state, the image of the soldering part 23 to be inspected is taken. After that, the image information from the industrial camera 7 is obtained by the image processing device (not shown) from the brightness of the image of the soldering portion 23, the presence or absence of bright spots, the position and shape of the bright spots, and the like. Identify good and bad states.

[0013]

[Effect of the device]

 In the present invention, four industrial cameras are arranged in four positions in a tiltable state, and at the same time as the tilting of these cameras, a plurality of light sources are selected and their tilting directions are adjusted. Even on a high-density mounting board, it is possible to image from the ideal imaging direction with proper illumination of the soldered part to be inspected. Therefore, the quality of the soldered portion can be inspected and the form of the defect can be identified with appropriate reliability in the field of image processing. These four industrial cameras are selected according to the form of the lead, the position of the soldering part, etc., and are corrected to an appropriate imaging direction, so not only are the imaging direction and the illumination direction appropriate, By selecting four industrial cameras and multiple light sources, the amount of correction in the imaging direction and irradiation direction can be reduced, and the time required for imaging can be shortened.

[Brief description of drawings]

FIG. 1 is a plan view of an image pickup device for solder inspection according to the present invention.

FIG. 2 is a front view of a part of the solder inspection imaging device of the present invention.

FIG. 3 is a side view of a part of the solder inspection imaging device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Imaging device for solder inspection 2 Machine frame 3 Support body 4 Guide body 5 Moving body 6 Driving means 7 Industrial camera 8 Light source

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Claims (2)

[Scope of utility model registration request] 1. Four support bodies (3) are arranged around the center line of the machine casing (2), and these support bodies (3) are attached to the machine casing (2).
The guide body (4) having an arc shape is fixed to each support body (3), and the moving body (5) is provided on each guide body (4) so as to be displaceable in the arc direction. Moving body (5)
An image pickup device (1) for solder inspection, characterized in that a driving means (6) is mounted between the above and the industrial body (7) and a plurality of light sources (8) are mounted on the moving body (5). 2. A support according to claim 1, characterized in that four supports (3) and industrial cameras (7) are mounted in four equidistant arrangements around the center line of the machine casing (2). Imaging device for solder inspection (1).