JP2003068877A5 - - Google Patents

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Publication number
JP2003068877A5
JP2003068877A5 JP2001245584A JP2001245584A JP2003068877A5 JP 2003068877 A5 JP2003068877 A5 JP 2003068877A5 JP 2001245584 A JP2001245584 A JP 2001245584A JP 2001245584 A JP2001245584 A JP 2001245584A JP 2003068877 A5 JP2003068877 A5 JP 2003068877A5
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JP
Japan
Prior art keywords
memory device
transistor
semiconductor memory
potential
word line
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JP2001245584A
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English (en)
Japanese (ja)
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JP4713783B2 (ja
JP2003068877A (ja
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Priority to JP2001245584A priority Critical patent/JP4713783B2/ja
Priority claimed from JP2001245584A external-priority patent/JP4713783B2/ja
Publication of JP2003068877A publication Critical patent/JP2003068877A/ja
Publication of JP2003068877A5 publication Critical patent/JP2003068877A5/ja
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Publication of JP4713783B2 publication Critical patent/JP4713783B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001245584A 2000-08-17 2001-08-13 半導体メモリ装置 Expired - Fee Related JP4713783B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001245584A JP4713783B2 (ja) 2000-08-17 2001-08-13 半導体メモリ装置

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2000247735 2000-08-17
JP2000-247735 2000-08-17
JP2000247735 2000-08-17
JP2000389106 2000-12-21
JP2000389106 2000-12-21
JP2000-389106 2000-12-21
JP2001180633 2001-06-14
JP2001-180633 2001-06-14
JP2001180633 2001-06-14
JP2001245584A JP4713783B2 (ja) 2000-08-17 2001-08-13 半導体メモリ装置

Publications (3)

Publication Number Publication Date
JP2003068877A JP2003068877A (ja) 2003-03-07
JP2003068877A5 true JP2003068877A5 (enrdf_load_stackoverflow) 2005-07-21
JP4713783B2 JP4713783B2 (ja) 2011-06-29

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JP2001245584A Expired - Fee Related JP4713783B2 (ja) 2000-08-17 2001-08-13 半導体メモリ装置

Country Status (1)

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JP (1) JP4713783B2 (enrdf_load_stackoverflow)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
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JP3933608B2 (ja) 2003-06-30 2007-06-20 株式会社東芝 半導体記憶装置及び半導体集積回路
JP4443886B2 (ja) 2003-09-30 2010-03-31 株式会社東芝 半導体記憶装置
JP4342970B2 (ja) 2004-02-02 2009-10-14 株式会社東芝 半導体メモリ装置及びその製造方法
JP4028499B2 (ja) 2004-03-01 2007-12-26 株式会社東芝 半導体記憶装置
JP4149961B2 (ja) 2004-05-20 2008-09-17 株式会社東芝 半導体記憶装置
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US7476939B2 (en) 2004-11-04 2009-01-13 Innovative Silicon Isi Sa Memory cell having an electrically floating body transistor and programming technique therefor
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US7606066B2 (en) 2005-09-07 2009-10-20 Innovative Silicon Isi Sa Memory cell and memory cell array having an electrically floating body transistor, and methods of operating same
US7542345B2 (en) 2006-02-16 2009-06-02 Innovative Silicon Isi Sa Multi-bit memory cell having electrically floating body transistor, and method of programming and reading same
US7492632B2 (en) 2006-04-07 2009-02-17 Innovative Silicon Isi Sa Memory array having a programmable word length, and method of operating same
US7542340B2 (en) 2006-07-11 2009-06-02 Innovative Silicon Isi Sa Integrated circuit including memory array having a segmented bit line architecture and method of controlling and/or operating same
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KR20090116088A (ko) 2008-05-06 2009-11-11 삼성전자주식회사 정보 유지 능력과 동작 특성이 향상된 커패시터리스 1ｔ반도체 메모리 소자
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KR101308048B1 (ko) 2007-10-10 2013-09-12 삼성전자주식회사 반도체 메모리 장치
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KR20090075063A (ko) 2008-01-03 2009-07-08 삼성전자주식회사 플로팅 바디 트랜지스터를 이용한 동적 메모리 셀을 가지는메모리 셀 어레이를 구비하는 반도체 메모리 장치 및 이장치의 동작 방법
US8773933B2 (en) 2012-03-16 2014-07-08 Micron Technology, Inc. Techniques for accessing memory cells
JP2009188196A (ja) 2008-02-06 2009-08-20 Elpida Memory Inc 半導体装置及びその製造方法
KR100979362B1 (ko) * 2008-04-24 2010-08-31 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
KR101505494B1 (ko) * 2008-04-30 2015-03-24 한양대학교 산학협력단 무 커패시터 메모리 소자
JP2010034191A (ja) 2008-07-28 2010-02-12 Toshiba Corp 半導体記憶装置とその製造方法
US7947543B2 (en) 2008-09-25 2011-05-24 Micron Technology, Inc. Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation
KR20100070158A (ko) 2008-12-17 2010-06-25 삼성전자주식회사 커패시터가 없는 동작 메모리 셀을 구비한 반도체 메모리 장치 및 이 장치의 동작 방법
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US8710566B2 (en) 2009-03-04 2014-04-29 Micron Technology, Inc. Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device
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JP2011155071A (ja) 2010-01-26 2011-08-11 Toshiba Corp 半導体記憶装置
US8576631B2 (en) 2010-03-04 2013-11-05 Micron Technology, Inc. Techniques for sensing a semiconductor memory device
EP3511982A1 (en) 2010-03-15 2019-07-17 Micron Technology, Inc. Techniques for providing a semiconductor memory device
FR2958779B1 (fr) * 2010-04-07 2015-07-17 Centre Nat Rech Scient Point memoire ram a un transistor
JP2011222105A (ja) 2010-04-14 2011-11-04 Elpida Memory Inc 半導体装置
US8411524B2 (en) 2010-05-06 2013-04-02 Micron Technology, Inc. Techniques for refreshing a semiconductor memory device
US8531878B2 (en) 2011-05-17 2013-09-10 Micron Technology, Inc. Techniques for providing a semiconductor memory device
US9559216B2 (en) 2011-06-06 2017-01-31 Micron Technology, Inc. Semiconductor memory device and method for biasing same
US11031402B1 (en) 2019-12-05 2021-06-08 International Business Machines Corporation Capacitorless dram cell

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