JP2003059871A5 - - Google Patents
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- Publication number
- JP2003059871A5 JP2003059871A5 JP2001244859A JP2001244859A JP2003059871A5 JP 2003059871 A5 JP2003059871 A5 JP 2003059871A5 JP 2001244859 A JP2001244859 A JP 2001244859A JP 2001244859 A JP2001244859 A JP 2001244859A JP 2003059871 A5 JP2003059871 A5 JP 2003059871A5
- Authority
- JP
- Japan
- Prior art keywords
- tape
- grinding
- dicing
- semiconductor wafer
- registered trademark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001244859A JP2003059871A (ja) | 2001-08-10 | 2001-08-10 | Ｉｃチップの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001244859A JP2003059871A (ja) | 2001-08-10 | 2001-08-10 | Ｉｃチップの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003059871A JP2003059871A (ja) | 2003-02-28 |
| JP2003059871A5 true JP2003059871A5 (enExample) | 2004-12-24 |
Family
ID=19074720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001244859A Pending JP2003059871A (ja) | 2001-08-10 | 2001-08-10 | Ｉｃチップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003059871A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183764A (ja) * | 2003-12-22 | 2005-07-07 | Mitsui Chemicals Inc | 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法 |
| US7713846B2 (en) | 2004-12-29 | 2010-05-11 | Siliconware Precision Industries Co., Ltd. | Process applied to semiconductor |
| WO2007011811A1 (en) * | 2005-07-19 | 2007-01-25 | Merck & Co., Inc. | Spirochromanone derivatives as acetyl coenzyme a carboxylase (acc) inhibitors |
| US20100148312A1 (en) * | 2008-12-16 | 2010-06-17 | Ivi Smart Technologies, Inc. | Reinforced smart cards & methods of making same |
| US9221231B2 (en) | 2011-11-22 | 2015-12-29 | Samsung Display Co., Ltd. | Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same |
| JP5865064B2 (ja) * | 2011-11-22 | 2016-02-17 | ニッタ株式会社 | 光学用アクリル系粘着シートおよびこれを用いた光学部材の取り外し方法 |
-
2001
- 2001-08-10 JP JP2001244859A patent/JP2003059871A/ja active Pending
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