JP2003045618A5 - - Google Patents
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- Publication number
- JP2003045618A5 JP2003045618A5 JP2001230874A JP2001230874A JP2003045618A5 JP 2003045618 A5 JP2003045618 A5 JP 2003045618A5 JP 2001230874 A JP2001230874 A JP 2001230874A JP 2001230874 A JP2001230874 A JP 2001230874A JP 2003045618 A5 JP2003045618 A5 JP 2003045618A5
- Authority
- JP
- Japan
- Prior art keywords
- glass
- wafer
- heating apparatus
- wafer heating
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 7
- 239000013078 crystal Substances 0.000 claims 3
- 238000002441 X-ray diffraction Methods 0.000 claims 2
- 229910052661 anorthite Inorganic materials 0.000 claims 2
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical group [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 claims 2
- 230000009477 glass transition Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001230874A JP4688363B2 (ja) | 2001-07-31 | 2001-07-31 | ウエハ加熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001230874A JP4688363B2 (ja) | 2001-07-31 | 2001-07-31 | ウエハ加熱装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003045618A JP2003045618A (ja) | 2003-02-14 |
| JP2003045618A5 true JP2003045618A5 (cg-RX-API-DMAC7.html) | 2005-06-09 |
| JP4688363B2 JP4688363B2 (ja) | 2011-05-25 |
Family
ID=19063006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001230874A Expired - Fee Related JP4688363B2 (ja) | 2001-07-31 | 2001-07-31 | ウエハ加熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4688363B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4535242B2 (ja) * | 2004-04-13 | 2010-09-01 | Hoya株式会社 | 熱処理評価方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02174116A (ja) * | 1988-12-26 | 1990-07-05 | Toshiba Ceramics Co Ltd | サセプタ |
| JP3588227B2 (ja) * | 1997-05-28 | 2004-11-10 | 京セラ株式会社 | セラミックヒータ |
| JP3865973B2 (ja) * | 1999-06-29 | 2007-01-10 | 京セラ株式会社 | ウエハ加熱装置 |
| JP2001203245A (ja) * | 1999-08-30 | 2001-07-27 | Ibiden Co Ltd | ウエハプローバおよびウエハプーバに使用されるセラミック基板 |
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2001
- 2001-07-31 JP JP2001230874A patent/JP4688363B2/ja not_active Expired - Fee Related