JP2003017530A5 - - Google Patents

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Publication number
JP2003017530A5
JP2003017530A5 JP2001196083A JP2001196083A JP2003017530A5 JP 2003017530 A5 JP2003017530 A5 JP 2003017530A5 JP 2001196083 A JP2001196083 A JP 2001196083A JP 2001196083 A JP2001196083 A JP 2001196083A JP 2003017530 A5 JP2003017530 A5 JP 2003017530A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001196083A
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JP2003017530A (ja
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Application filed filed Critical
Priority to JP2001196083A priority Critical patent/JP2003017530A/ja
Priority claimed from JP2001196083A external-priority patent/JP2003017530A/ja
Publication of JP2003017530A publication Critical patent/JP2003017530A/ja
Publication of JP2003017530A5 publication Critical patent/JP2003017530A5/ja
Pending legal-status Critical Current

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JP2001196083A 2001-06-28 2001-06-28 半導体装置およびその実装方法 Pending JP2003017530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001196083A JP2003017530A (ja) 2001-06-28 2001-06-28 半導体装置およびその実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001196083A JP2003017530A (ja) 2001-06-28 2001-06-28 半導体装置およびその実装方法

Publications (2)

Publication Number Publication Date
JP2003017530A JP2003017530A (ja) 2003-01-17
JP2003017530A5 true JP2003017530A5 (ja) 2008-07-31

Family

ID=19033955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001196083A Pending JP2003017530A (ja) 2001-06-28 2001-06-28 半導体装置およびその実装方法

Country Status (1)

Country Link
JP (1) JP2003017530A (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6960830B2 (en) * 2002-10-31 2005-11-01 Rohm Co., Ltd. Semiconductor integrated circuit device with dummy bumps
TWI228814B (en) * 2003-06-26 2005-03-01 United Microelectronics Corp Parasitic capacitance-preventing dummy solder bump structure and method of making the same
KR100546346B1 (ko) * 2003-07-23 2006-01-26 삼성전자주식회사 재배선 범프 형성방법 및 이를 이용한 반도체 칩과 실장구조
CN1328790C (zh) * 2003-09-27 2007-07-25 联华电子股份有限公司 一种避免产生寄生电容的虚拟焊料凸块结构暨制作方法
JP4506168B2 (ja) * 2003-12-24 2010-07-21 カシオ計算機株式会社 半導体装置およびその実装構造
JP4627632B2 (ja) * 2004-05-17 2011-02-09 Okiセミコンダクタ株式会社 半導体装置
JP4880218B2 (ja) * 2004-12-22 2012-02-22 三洋電機株式会社 回路装置
JP2006222374A (ja) 2005-02-14 2006-08-24 Fuji Film Microdevices Co Ltd 半導体チップ
KR100702969B1 (ko) 2005-04-19 2007-04-03 삼성전자주식회사 더미 솔더 볼을 갖는 bga형 반도체 칩 패키지의 기판 실장 구조
JP2007288038A (ja) * 2006-04-19 2007-11-01 Casio Comput Co Ltd 半導体装置
JP4887997B2 (ja) * 2006-09-19 2012-02-29 日本電気株式会社 電子部品の実装方法
JP5007250B2 (ja) 2008-02-14 2012-08-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4568337B2 (ja) * 2008-02-22 2010-10-27 株式会社東芝 集積半導体装置
JP2010278133A (ja) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd 回路基板
WO2013069192A1 (ja) * 2011-11-10 2013-05-16 パナソニック株式会社 半導体装置
KR101300571B1 (ko) 2011-12-27 2013-08-27 앰코 테크놀로지 코리아 주식회사 반도체 장치
JP6239048B2 (ja) * 2016-06-22 2017-11-29 Hoya株式会社 半導体パッケージ
DE102017128568A1 (de) * 2017-12-01 2019-06-06 Infineon Technologies Ag Halbleiterchip mit einer vielzahl von externen kontakten, chip-anordnung und verfahren zum überprüfen einer ausrichtung einer position eines halbleiterchips

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691299B2 (ja) * 1989-06-12 1997-12-17 株式会社ニコン 基板ホルダ
JPH08195415A (ja) * 1995-01-13 1996-07-30 Hitachi Ltd 半導体集積回路装置
JPH1012620A (ja) * 1996-06-26 1998-01-16 Denso Corp フリップチップ用バンプ電極
JP2000022034A (ja) * 1998-07-01 2000-01-21 Hitachi Ltd 電子回路装置の接続構造
JP2001319997A (ja) * 2000-05-10 2001-11-16 Mitsubishi Electric Corp 半導体パッケージおよび半導体チップ

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