JP2002529941A5 - - Google Patents
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- Publication number
- JP2002529941A5 JP2002529941A5 JP2000581869A JP2000581869A JP2002529941A5 JP 2002529941 A5 JP2002529941 A5 JP 2002529941A5 JP 2000581869 A JP2000581869 A JP 2000581869A JP 2000581869 A JP2000581869 A JP 2000581869A JP 2002529941 A5 JP2002529941 A5 JP 2002529941A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- panel
- cover
- snap
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 11
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/189,905 | 1998-11-11 | ||
| US09/189,905 US6028771A (en) | 1998-11-11 | 1998-11-11 | Cover for an electronic cartridge |
| PCT/US1999/026259 WO2000028801A1 (en) | 1998-11-11 | 1999-11-05 | A cover for an electronic cartridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002529941A JP2002529941A (ja) | 2002-09-10 |
| JP2002529941A5 true JP2002529941A5 (enExample) | 2006-12-21 |
Family
ID=22699253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000581869A Pending JP2002529941A (ja) | 1998-11-11 | 1999-11-05 | 電子カートリッジ用カバー |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6028771A (enExample) |
| JP (1) | JP2002529941A (enExample) |
| KR (1) | KR100402399B1 (enExample) |
| CN (1) | CN1179618C (enExample) |
| AU (1) | AU1344600A (enExample) |
| MX (1) | MXPA01004112A (enExample) |
| MY (1) | MY117199A (enExample) |
| WO (1) | WO2000028801A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6046905A (en) | 1996-09-30 | 2000-04-04 | Intel Corporation | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges |
| US6585534B2 (en) * | 1998-08-20 | 2003-07-01 | Intel Corporation | Retention mechanism for an electrical assembly |
| TW428882U (en) * | 1999-04-16 | 2001-04-01 | Hon Hai Prec Ind Co Ltd | Fixing device of the computer board |
| US6888722B2 (en) * | 1999-12-30 | 2005-05-03 | Intel Corporation | Thermal design for minimizing interface in a multi-site thermal contact condition |
| DE10032369C2 (de) * | 2000-07-04 | 2002-05-16 | Infineon Technologies Ag | Abdeckvorrichtung für Keramikmodule |
| US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
| US7453706B2 (en) * | 2003-11-13 | 2008-11-18 | Adc Telecommunications, Inc. | Module with interchangeable card |
| WO2007085211A1 (de) * | 2006-01-27 | 2007-08-02 | Pos Tuning Udo Vosshenrich Gmbh & Co.Kg | Kommunikationssystem für verkaufsräume |
| KR20100030126A (ko) * | 2008-09-09 | 2010-03-18 | 삼성전자주식회사 | 메모리 장치 및 그를 포함하는 전자 장치 |
| USD794641S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD795261S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| USD794642S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794034S1 (en) * | 2009-01-07 | 2017-08-08 | Samsung Electronics Co., Ltd. | Memory device |
| USD794643S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794644S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD795262S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| CN102338142A (zh) * | 2010-07-16 | 2012-02-01 | 深圳富泰宏精密工业有限公司 | 卡合结构及应用该卡合结构的电子装置 |
| KR20130027304A (ko) * | 2011-09-07 | 2013-03-15 | 삼성전자주식회사 | 컨트롤 패널 어셈블리 및 이를 구비한 세탁물 처리 장치 |
| US9606589B2 (en) * | 2011-11-29 | 2017-03-28 | Intel Corporation | Expansion card having synergistic cooling, structural and volume reduction solutions |
| US8971038B2 (en) * | 2012-05-22 | 2015-03-03 | Lear Corporation | Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
| JP6613130B2 (ja) * | 2015-12-22 | 2019-11-27 | モレックス エルエルシー | カード保持部材及びカード用コネクタセット |
| CN108966579A (zh) * | 2018-08-22 | 2018-12-07 | 芜湖飞龙汽车电子技术研究院有限公司 | 一种电子水泵控制板固定用壳体装置 |
| CN110708914B (zh) * | 2019-08-30 | 2021-06-01 | 华为技术有限公司 | 卡扣组件、板卡以及电子设备 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3631299A (en) * | 1970-05-21 | 1971-12-28 | Square D Co | Printed circuit board module and support with circuit board supporting posts |
| JPS5818299Y2 (ja) * | 1978-04-28 | 1983-04-13 | 富士通株式会社 | プリント基板ユニット内蔵型電子機器 |
| JPS5996874U (ja) * | 1982-12-21 | 1984-06-30 | オムロン株式会社 | 電子機器の組立構造 |
| US5838542A (en) * | 1996-09-30 | 1998-11-17 | Intel Corporation | Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage |
| US5856910A (en) * | 1996-10-30 | 1999-01-05 | Intel Corporation | Processor card assembly having a cover with flexible locking latches |
| US5894408A (en) * | 1998-02-17 | 1999-04-13 | Intel Corporation | Electronic cartridge which allows differential thermal expansion between components of the cartridge |
-
1998
- 1998-11-11 US US09/189,905 patent/US6028771A/en not_active Expired - Lifetime
-
1999
- 1999-10-09 MY MYPI99004375A patent/MY117199A/en unknown
- 1999-11-05 JP JP2000581869A patent/JP2002529941A/ja active Pending
- 1999-11-05 MX MXPA01004112A patent/MXPA01004112A/es not_active IP Right Cessation
- 1999-11-05 CN CNB998131318A patent/CN1179618C/zh not_active Expired - Fee Related
- 1999-11-05 WO PCT/US1999/026259 patent/WO2000028801A1/en not_active Ceased
- 1999-11-05 AU AU13446/00A patent/AU1344600A/en not_active Abandoned
- 1999-11-05 KR KR10-2001-7005935A patent/KR100402399B1/ko not_active Expired - Fee Related
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