|
WO1998036888A1
(en)
|
1997-02-24 |
1998-08-27 |
Superior Micropowders Llc |
Aerosol method and apparatus, particulate products, and electronic devices made therefrom
|
|
US20030148024A1
(en)
*
|
2001-10-05 |
2003-08-07 |
Kodas Toivo T. |
Low viscosity precursor compositons and methods for the depositon of conductive electronic features
|
|
CN1439032A
(zh)
|
2000-06-02 |
2003-08-27 |
Sri国际公司 |
聚合物组合物
|
|
US7316855B2
(en)
|
2001-06-01 |
2008-01-08 |
Polyfuel, Inc. |
Fuel cell assembly for portable electronic device and interface, control, and regulator circuit for fuel cell powered electronic device
|
|
AU2002312178A1
(en)
|
2001-06-01 |
2002-12-16 |
Polyfuel, Inc |
Fuel cell assembly for portable electronic device and interface, control, and regulator circuit for fuel cell powered electronic device
|
|
CN100593259C
(zh)
*
|
2002-02-28 |
2010-03-03 |
托马斯·翰翎 |
制备层结构的方法、膜电极单元及其组合平面设置结构
|
|
EP1369230A1
(en)
*
|
2002-06-05 |
2003-12-10 |
Kba-Giori S.A. |
Method of manufacturing an engraved plate
|
|
GB0218202D0
(en)
*
|
2002-08-06 |
2002-09-11 |
Avecia Ltd |
Organic light emitting diodes
|
|
GB2391871A
(en)
*
|
2002-08-16 |
2004-02-18 |
Qinetiq Ltd |
Depositing conductive solid materials using reservoirs in a printhead
|
|
JP4581326B2
(ja)
*
|
2002-12-27 |
2010-11-17 |
日産自動車株式会社 |
積層型電池の製造装置
|
|
US20040191626A1
(en)
*
|
2003-03-27 |
2004-09-30 |
Lewis David H. |
MEMS volumetric Li/ion battery for space, air and terrestrial applications
|
|
JP2004319927A
(ja)
*
|
2003-04-21 |
2004-11-11 |
Shinko Electric Ind Co Ltd |
パターニング装置及び膜のパターニング方法
|
|
JP4207678B2
(ja)
*
|
2003-06-18 |
2009-01-14 |
日産自動車株式会社 |
リチウムイオン電池型二次電池用電極の製造方法およびその装置並びにリチウムイオン電池型二次電池用電極
|
|
US7537799B2
(en)
*
|
2003-07-11 |
2009-05-26 |
Hewlett-Packard Development Company, L.P. |
Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
|
|
WO2005013400A2
(en)
*
|
2003-07-31 |
2005-02-10 |
Nissan Motor Co., Ltd. |
Secondary cell electrode and fabrication method, and secondary cell, complex cell, and vehicle
|
|
JP4920169B2
(ja)
*
|
2003-10-06 |
2012-04-18 |
日産自動車株式会社 |
電池およびこの電池を搭載する車両
|
|
JP4581384B2
(ja)
*
|
2003-12-08 |
2010-11-17 |
日産自動車株式会社 |
電池およびその製造方法
|
|
JP4539173B2
(ja)
*
|
2004-05-25 |
2010-09-08 |
日産自動車株式会社 |
インバータ装置、およびそれを用いた駆動システム
|
|
US7931941B1
(en)
|
2004-10-29 |
2011-04-26 |
Pchem Associates, Inc. |
Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures
|
|
CN101056716B
(zh)
*
|
2004-11-10 |
2010-05-05 |
大日本印刷株式会社 |
金属氧化物膜的制造方法
|
|
JP5098150B2
(ja)
*
|
2004-12-07 |
2012-12-12 |
日産自動車株式会社 |
バイポーラ電池およびその製造方法
|
|
WO2006076614A1
(en)
*
|
2005-01-14 |
2006-07-20 |
Cabot Corporation |
A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
|
|
WO2006076607A1
(en)
*
|
2005-01-14 |
2006-07-20 |
Cabot Corporation |
Ink-jet printing of passive electricalcomponents
|
|
WO2006076612A2
(en)
|
2005-01-14 |
2006-07-20 |
Cabot Corporation |
A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
|
|
US7533361B2
(en)
|
2005-01-14 |
2009-05-12 |
Cabot Corporation |
System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
|
|
WO2006076606A2
(en)
*
|
2005-01-14 |
2006-07-20 |
Cabot Corporation |
Optimized multi-layer printing of electronics and displays
|
|
US7824466B2
(en)
|
2005-01-14 |
2010-11-02 |
Cabot Corporation |
Production of metal nanoparticles
|
|
US7687327B2
(en)
*
|
2005-07-08 |
2010-03-30 |
Kovio, Inc, |
Methods for manufacturing RFID tags and structures formed therefrom
|
|
KR100760219B1
(ko)
*
|
2005-08-01 |
2007-10-05 |
연세대학교 산학협력단 |
로보 디스펜싱에 의한 전기화학적 셀의 제조방법, 그요소소재 페이스트, 및 이에 의해 제조된 고체산화물연료전지
|
|
WO2007038950A1
(en)
*
|
2005-09-28 |
2007-04-12 |
Stichting Dutch Polymer Institute |
Method for generation of metal surface structures and apparatus therefor
|
|
US20070144305A1
(en)
*
|
2005-12-20 |
2007-06-28 |
Jablonski Gregory A |
Synthesis of Metallic Nanoparticle Dispersions
|
|
JP2006270118A
(ja)
*
|
2006-05-29 |
2006-10-05 |
Morimura Chemicals Ltd |
回路基板の製造方法
|
|
JP2006229254A
(ja)
*
|
2006-05-29 |
2006-08-31 |
Morimura Chemicals Ltd |
透光体の製造方法
|
|
TWI348499B
(en)
*
|
2006-07-07 |
2011-09-11 |
Rohm & Haas Elect Mat |
Electroless copper and redox couples
|
|
EP1876260B1
(en)
*
|
2006-07-07 |
2018-11-28 |
Rohm and Haas Electronic Materials LLC |
Improved electroless copper compositions
|
|
TWI347373B
(en)
*
|
2006-07-07 |
2011-08-21 |
Rohm & Haas Elect Mat |
Formaldehyde free electroless copper compositions
|
|
EP1876262A1
(en)
*
|
2006-07-07 |
2008-01-09 |
Rohm and Haas Electronic Materials, L.L.C. |
Environmentally friendly electroless copper compositions
|
|
US8231811B2
(en)
*
|
2006-07-22 |
2012-07-31 |
Conductive Inkjet Technology Limited |
Formation of conductive metal regions on substrates
|
|
US7981508B1
(en)
|
2006-09-12 |
2011-07-19 |
Sri International |
Flexible circuits
|
|
US8110254B1
(en)
|
2006-09-12 |
2012-02-07 |
Sri International |
Flexible circuit chemistry
|
|
US8293121B2
(en)
*
|
2006-09-27 |
2012-10-23 |
Samsung Electro-Mechanics Co., Ltd. |
Method for forming fine wiring
|
|
US20080136861A1
(en)
*
|
2006-12-11 |
2008-06-12 |
3M Innovative Properties Company |
Method and apparatus for printing conductive inks
|
|
CN101641210A
(zh)
|
2007-03-01 |
2010-02-03 |
珀凯姆联合有限公司 |
基于金属纳米粒子组合物的屏蔽及其装置和方法
|
|
US7641728B2
(en)
*
|
2007-04-23 |
2010-01-05 |
Hewlett-Packard Development Company, L.P. |
Ink composition and method for forming the same
|
|
US8530589B2
(en)
*
|
2007-05-04 |
2013-09-10 |
Kovio, Inc. |
Print processing for patterned conductor, semiconductor and dielectric materials
|
|
KR100850757B1
(ko)
*
|
2007-06-14 |
2008-08-06 |
삼성전기주식회사 |
기판의 표면처리방법 및 미세배선 형성방법
|
|
US8628818B1
(en)
|
2007-06-21 |
2014-01-14 |
Sri International |
Conductive pattern formation
|
|
US7989029B1
(en)
|
2007-06-21 |
2011-08-02 |
Sri International |
Reduced porosity copper deposition
|
|
CA2701412C
(en)
*
|
2007-10-01 |
2017-06-20 |
Kovio, Inc. |
Profile engineered thin film devices and structures
|
|
FI20085018A0
(fi)
*
|
2008-01-10 |
2008-01-10 |
Valtion Teknillinen |
Painettavan elektroniikan superkondensaattori
|
|
KR20090077705A
(ko)
*
|
2008-01-11 |
2009-07-15 |
주식회사 엘지화학 |
도전성 패턴 및 이의 형성방법
|
|
US20100015462A1
(en)
*
|
2008-02-29 |
2010-01-21 |
Gregory Jablonski |
Metallic nanoparticle shielding structure and methods thereof
|
|
US20090252933A1
(en)
*
|
2008-04-04 |
2009-10-08 |
3M Innovative Properties Company |
Method for digitally printing electroluminescent lamps
|
|
US7927976B2
(en)
*
|
2008-07-23 |
2011-04-19 |
Semprius, Inc. |
Reinforced composite stamp for dry transfer printing of semiconductor elements
|
|
JP2011529126A
(ja)
*
|
2008-07-24 |
2011-12-01 |
コヴィオ インコーポレイテッド |
アルミニウムインク及びその製造方法、アルミニウムインクを堆積する方法、並びにアルミニウムインクの印刷及び／又は堆積により形成されたフィルム
|
|
WO2010059781A1
(en)
*
|
2008-11-19 |
2010-05-27 |
Semprius, Inc. |
Printing semiconductor elements by shear-assisted elastomeric stamp transfer
|
|
US8895874B1
(en)
|
2009-03-10 |
2014-11-25 |
Averatek Corp. |
Indium-less transparent metalized layers
|
|
JP2012521947A
(ja)
*
|
2009-03-23 |
2012-09-20 |
エスビーエー マテリアルズ インク |
新規な誘電体酸化物膜およびその製造方法
|
|
WO2010122918A1
(ja)
*
|
2009-04-24 |
2010-10-28 |
住友電気工業株式会社 |
プリント配線板用基板、プリント配線板、及びそれらの製造方法
|
|
US8378702B2
(en)
|
2009-05-08 |
2013-02-19 |
Corning Incorporated |
Non-contact testing of printed electronics
|
|
US8261660B2
(en)
*
|
2009-07-22 |
2012-09-11 |
Semprius, Inc. |
Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
|
|
WO2011057218A2
(en)
*
|
2009-11-09 |
2011-05-12 |
Carnegie Mellon University |
Metal ink compositions, conductive patterns, methods, and devices
|
|
JP2011159488A
(ja)
*
|
2010-02-01 |
2011-08-18 |
Sony Corp |
非水電解質組成物および非水電解質二次電池
|
|
JP5492686B2
(ja)
*
|
2010-07-07 |
2014-05-14 |
大日本スクリーン製造株式会社 |
電池用電極の製造方法、電池の製造方法、電池、車両および電子機器
|
|
CN102398438A
(zh)
*
|
2010-09-15 |
2012-04-04 |
中国科学院化学研究所 |
激光或微波处理喷印金属导电油墨制备的初级电路的方法
|
|
WO2012079747A1
(en)
*
|
2010-12-16 |
2012-06-21 |
Stichting Dutch Polymer Institute |
Method for preparing microstructured patterns of superconductive materials
|
|
US9065093B2
(en)
|
2011-04-07 |
2015-06-23 |
Massachusetts Institute Of Technology |
Controlled porosity in electrodes
|
|
KR102230556B1
(ko)
*
|
2012-08-16 |
2021-03-22 |
에노빅스 코오퍼레이션 |
3차원 배터리들을 위한 전극 구조들
|
|
JP2014107484A
(ja)
*
|
2012-11-29 |
2014-06-09 |
Jsr Corp |
接続方法および導電性インク
|
|
US9763370B2
(en)
|
2013-03-15 |
2017-09-12 |
National Technology & Engineering Solutions Of Sandia, Llc |
Apparatus for assembly of microelectronic devices
|
|
EP2973785B1
(en)
|
2013-03-15 |
2019-10-02 |
Enovix Corporation |
Separators for three-dimensional batteries
|
|
KR102444716B1
(ko)
|
2013-05-17 |
2022-09-16 |
밀텍 코포레이션 |
화학선 및 전자 빔 조사 경화성 수성 전극 결합제 및 그를 포함하는 전극
|
|
US9506149B2
(en)
*
|
2014-01-16 |
2016-11-29 |
The United States Of America, As Represented By The Secretary Of Commerce |
Liquid deposition composition and process for forming metal therefrom
|
|
US10076032B2
(en)
|
2014-03-20 |
2018-09-11 |
Sumitomo Electric Industries, Ltd. |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
|
|
CN106134298B
(zh)
|
2014-03-27 |
2019-02-22 |
住友电气工业株式会社 |
印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
|
|
US9954262B2
(en)
*
|
2014-08-29 |
2018-04-24 |
Honda Motor Co., Ltd. |
Air secondary battery including cathode having trap portion
|
|
US10675819B2
(en)
|
2014-10-03 |
2020-06-09 |
Massachusetts Institute Of Technology |
Magnetic field alignment of emulsions to produce porous articles
|
|
US10569480B2
(en)
|
2014-10-03 |
2020-02-25 |
Massachusetts Institute Of Technology |
Pore orientation using magnetic fields
|
|
WO2016117575A1
(ja)
|
2015-01-22 |
2016-07-28 |
住友電気工業株式会社 |
プリント配線板用基材、プリント配線板及びプリント配線板の製造方法
|
|
KR101985129B1
(ko)
*
|
2015-03-18 |
2019-05-31 |
히타치가세이가부시끼가이샤 |
결합제 수지 조성물, 리튬 이온 이차 전지용 전극 및 리튬 이온 이차 전지
|
|
TWI896945B
(zh)
|
2015-05-14 |
2025-09-11 |
美商易諾維公司 |
用於能量儲存裝置之縱向約束
|
|
RU2617705C2
(ru)
*
|
2015-08-20 |
2017-04-26 |
Федеральное государственное бюджетное образовательное учреждение высшего образования "Омский государственный технический университет" |
Способ получения металлизированного изображения
|
|
TWI554172B
(zh)
*
|
2015-09-17 |
2016-10-11 |
欣興電子股份有限公司 |
線路板的製作方法
|
|
TWI832314B
(zh)
|
2016-05-13 |
2024-02-11 |
美商易諾維公司 |
用於三維電池之尺寸拘束件
|
|
TWI819481B
(zh)
|
2016-11-16 |
2023-10-21 |
美商易諾維公司 |
具有可壓縮陰極之三維電池
|
|
US10256507B1
(en)
|
2017-11-15 |
2019-04-09 |
Enovix Corporation |
Constrained electrode assembly
|
|
TWI794330B
(zh)
|
2017-11-15 |
2023-03-01 |
美商易諾維公司 |
電極總成、蓄電池組、及製造方法
|
|
US11211639B2
(en)
|
2018-08-06 |
2021-12-28 |
Enovix Corporation |
Electrode assembly manufacture and device
|
|
US20230064831A1
(en)
*
|
2020-01-30 |
2023-03-02 |
Liquid X Printed Metals, Inc. |
Force sensor controlled conductive heating elements
|
|
JP2023547993A
(ja)
|
2020-09-18 |
2023-11-15 |
エノビクス・コーポレイション |
電池に使用する電極の製造のための装置、システム、及び方法
|
|
CN116783744A
(zh)
|
2020-12-09 |
2023-09-19 |
艾诺维克斯公司 |
用于制造二次电池的电极组合件的方法及装置
|