JP2002520863A5 - - Google Patents

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Publication number
JP2002520863A5
JP2002520863A5 JP2000559715A JP2000559715A JP2002520863A5 JP 2002520863 A5 JP2002520863 A5 JP 2002520863A5 JP 2000559715 A JP2000559715 A JP 2000559715A JP 2000559715 A JP2000559715 A JP 2000559715A JP 2002520863 A5 JP2002520863 A5 JP 2002520863A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000559715A
Other languages
Japanese (ja)
Other versions
JP2002520863A (ja
Filing date
Publication date
Priority claimed from GBGB9814835.6A external-priority patent/GB9814835D0/en
Application filed filed Critical
Publication of JP2002520863A publication Critical patent/JP2002520863A/ja
Publication of JP2002520863A5 publication Critical patent/JP2002520863A5/ja
Pending legal-status Critical Current

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JP2000559715A 1998-07-08 1999-07-08 熱管理素子およびその製造方法 Pending JP2002520863A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB9814835.6 1998-07-08
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9825376.8 1998-11-19
GB9900924.3 1999-01-15
GB9900924 1999-01-15
PCT/GB1999/002180 WO2000003567A1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device

Publications (2)

Publication Number Publication Date
JP2002520863A JP2002520863A (ja) 2002-07-09
JP2002520863A5 true JP2002520863A5 (enExample) 2006-08-24

Family

ID=27269389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000559715A Pending JP2002520863A (ja) 1998-07-08 1999-07-08 熱管理素子およびその製造方法

Country Status (17)

Country Link
US (2) US6514616B1 (enExample)
EP (2) EP1492396A3 (enExample)
JP (1) JP2002520863A (enExample)
KR (1) KR100707155B1 (enExample)
CN (1) CN1184866C (enExample)
AT (1) ATE277497T1 (enExample)
AU (1) AU4790799A (enExample)
CA (1) CA2336889C (enExample)
DE (1) DE69920459T2 (enExample)
DK (1) DK1095545T3 (enExample)
ES (1) ES2229727T3 (enExample)
GB (2) GB9814835D0 (enExample)
HK (1) HK1040473B (enExample)
PT (1) PT1095545E (enExample)
RU (1) RU2214698C2 (enExample)
SI (1) SI1095545T1 (enExample)
WO (1) WO2000003567A1 (enExample)

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GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
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US20020021997A1 (en) * 2000-06-23 2002-02-21 Akira Taomoto Graphite sheet coated with insulating material and coating method thereof
US8382004B2 (en) * 2001-04-04 2013-02-26 Graftech International Holdings Inc. Flexible graphite flooring heat spreader
KR100468122B1 (ko) * 2002-07-08 2005-01-26 삼성전자주식회사 전자렌지
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
WO2004097934A2 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College An encased thermal management device and method of making such a device
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
GB2409341A (en) * 2003-12-16 2005-06-22 Otter Controls Ltd Improvements relating to thermal control units
KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US20090169410A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a thermo pyrolytic graphite-embedded heatsink
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
WO2010065035A1 (en) * 2008-12-04 2010-06-10 Hewlett-Packard Development Company, L.P. Carbon laminated enclosure
US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
CN108646885A (zh) * 2014-01-26 2018-10-12 太仓斯迪克新材料科技有限公司 用于笔记本电脑的散热片
US20180229825A1 (en) 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
CN108701880B (zh) * 2016-03-14 2022-04-08 松下知识产权经营株式会社 复合片以及使用该复合片的电池组
EP3479662B1 (en) * 2016-06-29 2023-03-01 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
EP4066037B1 (fr) * 2020-03-02 2023-12-27 Airbus Defence and Space SAS Instrument optique spatial comprenant une garde thermique améliorée
US11497137B2 (en) * 2020-12-18 2022-11-08 Hewlett Packard Enterprise Development Lp Method and apparatus for extended serial temperature control in a compute device
WO2025079195A1 (ja) * 2023-10-12 2025-04-17 日本碍子株式会社 半導体製造装置用部材

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JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4318954A (en) 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
FR2546878B1 (fr) * 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
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US4916016A (en) 1986-01-23 1990-04-10 Ici Americas Inc. Metal or plastic-clad polyvinyl resin laminates
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4791248A (en) 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US5296310A (en) 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
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US5309321A (en) 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
CA2124158C (en) 1993-06-14 2005-09-13 Daniel H. Hecht High modulus carbon and graphite articles and method for their preparation
DE69328687D1 (de) * 1993-07-06 2000-06-21 Toshiba Kawasaki Kk Wärmeleitende platte
WO1996037915A1 (en) 1995-05-26 1996-11-28 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
WO1998040431A1 (en) * 1997-03-11 1998-09-17 Amoco Corporation Thermally conductive film and method for the preparation thereof
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material

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