JP2002520833A - 多位置ロードロックチャンバー - Google Patents

多位置ロードロックチャンバー

Info

Publication number
JP2002520833A
JP2002520833A JP2000559271A JP2000559271A JP2002520833A JP 2002520833 A JP2002520833 A JP 2002520833A JP 2000559271 A JP2000559271 A JP 2000559271A JP 2000559271 A JP2000559271 A JP 2000559271A JP 2002520833 A JP2002520833 A JP 2002520833A
Authority
JP
Japan
Prior art keywords
wafer
moving
station
machine according
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000559271A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002520833A5 (https=
Inventor
イボ ジェイ． ラアイジメイカーズ
Original Assignee
エーエスエム アメリカ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エーエスエム アメリカ インコーポレイテッド filed Critical エーエスエム アメリカ インコーポレイテッド
Publication of JP2002520833A publication Critical patent/JP2002520833A/ja
Publication of JP2002520833A5 publication Critical patent/JP2002520833A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2000559271A 1998-07-10 1999-06-30 多位置ロードロックチャンバー Pending JP2002520833A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/113,767 1998-07-10
US09/113,767 US6162299A (en) 1998-07-10 1998-07-10 Multi-position load lock chamber
PCT/US1999/015072 WO2000003057A1 (en) 1998-07-10 1999-06-30 Multi-position load lock chamber

Publications (2)

Publication Number Publication Date
JP2002520833A true JP2002520833A (ja) 2002-07-09
JP2002520833A5 JP2002520833A5 (https=) 2006-08-17

Family

ID=22351390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000559271A Pending JP2002520833A (ja) 1998-07-10 1999-06-30 多位置ロードロックチャンバー

Country Status (6)

Country Link
US (3) US6162299A (https=)
EP (1) EP1097252A4 (https=)
JP (1) JP2002520833A (https=)
KR (1) KR20010071818A (https=)
TW (1) TW420839B (https=)
WO (1) WO2000003057A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019039316A1 (ja) * 2017-08-23 2019-02-28 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
WO2025084439A1 (ja) * 2023-10-17 2025-04-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法

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US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
US6152070A (en) * 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US5961269A (en) 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
US6468353B1 (en) * 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
US6318957B1 (en) * 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
US6162299A (en) * 1998-07-10 2000-12-19 Asm America, Inc. Multi-position load lock chamber
JP2000174091A (ja) * 1998-12-01 2000-06-23 Fujitsu Ltd 搬送装置及び製造装置
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
DE10061628B4 (de) * 2000-12-11 2006-06-08 Leica Microsystems Wetzlar Gmbh Vorrichtung und Verfahren zum Ergreifen und Transportieren von Wafern
US6609869B2 (en) * 2001-01-04 2003-08-26 Asm America Transfer chamber with integral loadlock and staging station
US20040096300A1 (en) * 2001-06-30 2004-05-20 Ilya Perlov Loadlock chamber
KR100782529B1 (ko) * 2001-11-08 2007-12-06 에이에스엠지니텍코리아 주식회사 증착 장치
US6899507B2 (en) 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
US7214027B2 (en) * 2003-10-16 2007-05-08 Varian Semiconductor Equipment Associates, Inc. Wafer handler method and system
US20050205210A1 (en) * 2004-01-06 2005-09-22 Devine Daniel J Advanced multi-pressure workpiece processing
US20060251499A1 (en) * 2005-05-09 2006-11-09 Lunday Andrew P Linear substrate delivery system with intermediate carousel
US7534080B2 (en) * 2005-08-26 2009-05-19 Ascentool, Inc. Vacuum processing and transfer system
US20070218702A1 (en) * 2006-03-15 2007-09-20 Asm Japan K.K. Semiconductor-processing apparatus with rotating susceptor
KR20080027009A (ko) * 2006-09-22 2008-03-26 에이에스엠지니텍코리아 주식회사 원자층 증착 장치 및 그를 이용한 다층막 증착 방법
US20080241384A1 (en) * 2007-04-02 2008-10-02 Asm Genitech Korea Ltd. Lateral flow deposition apparatus and method of depositing film by using the apparatus
US8282735B2 (en) 2007-11-27 2012-10-09 Asm Genitech Korea Ltd. Atomic layer deposition apparatus
US8273178B2 (en) 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US8440048B2 (en) 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
JP4766156B2 (ja) * 2009-06-11 2011-09-07 日新イオン機器株式会社 イオン注入装置
KR102443290B1 (ko) * 2016-07-13 2022-09-14 유니버셜 인스트루먼츠 코퍼레이션 모듈식 다이 핸들링 시스템
WO2019212651A1 (en) * 2018-05-03 2019-11-07 Applied Materials, Inc Substrate tilt control in high speed rotary sorter
US10998209B2 (en) * 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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JPS58180227A (ja) * 1982-04-17 1983-10-21 Samuko Internatl Kenkyusho:Kk 複数の反応室を備えた能率的プラズマ処理装置
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US5000652A (en) * 1986-09-22 1991-03-19 International Business Machines Corporation Wafer transfer apparatus
US5156521A (en) * 1987-10-15 1992-10-20 Epsilon Technology, Inc. Method for loading a substrate into a GVD apparatus
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US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
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JPH0812847B2 (ja) * 1991-04-22 1996-02-07 株式会社半導体プロセス研究所 半導体製造装置及び半導体装置の製造方法
EP0591706B1 (de) * 1992-10-06 2002-04-24 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
KR0135840B1 (ko) * 1994-07-26 1998-04-29 김광호 개구부 매몰(filling)장치와 이를 이용한 반도체소자 제조방법
JP3354761B2 (ja) * 1995-08-30 2002-12-09 オリジン電気株式会社 ディスク用被膜形成装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5754294A (en) * 1996-05-03 1998-05-19 Virginia Semiconductor, Inc. Optical micrometer for measuring thickness of transparent wafers
DE19715245C2 (de) * 1997-04-12 1999-09-02 Leybold Systems Gmbh Vakuumbehandlungsvorrichtung zum Aufbringen dünner Schichten
US5951770A (en) * 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6162299A (en) * 1998-07-10 2000-12-19 Asm America, Inc. Multi-position load lock chamber
US6318957B1 (en) * 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
US6158951A (en) * 1998-07-10 2000-12-12 Asm America, Inc. Wafer carrier and method for handling of wafers with minimal contact

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019039316A1 (ja) * 2017-08-23 2019-02-28 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP2019040947A (ja) * 2017-08-23 2019-03-14 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
WO2025084439A1 (ja) * 2023-10-17 2025-04-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
TW420839B (en) 2001-02-01
US6162299A (en) 2000-12-19
WO2000003057A1 (en) 2000-01-20
US6368051B2 (en) 2002-04-09
EP1097252A4 (en) 2004-06-16
US20010026749A1 (en) 2001-10-04
US20020072241A1 (en) 2002-06-13
EP1097252A1 (en) 2001-05-09
KR20010071818A (ko) 2001-07-31

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