JP2002510150A - 排除駆動式ｓｍｉｆポッド・パージ・システム - Google Patents

排除駆動式ｓｍｉｆポッド・パージ・システム

Info

Publication number
JP2002510150A
JP2002510150A JP2000541069A JP2000541069A JP2002510150A JP 2002510150 A JP2002510150 A JP 2002510150A JP 2000541069 A JP2000541069 A JP 2000541069A JP 2000541069 A JP2000541069 A JP 2000541069A JP 2002510150 A JP2002510150 A JP 2002510150A
Authority
JP
Japan
Prior art keywords
pod
gas
flow
inlet
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000541069A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002510150A5 (enExample
Inventor
ウィリアム ジェイ フォスナイト
アントニー シー ボノラ
レイモンド エス マーティン
ジェイ タトロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
Original Assignee
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of JP2002510150A publication Critical patent/JP2002510150A/ja
Publication of JP2002510150A5 publication Critical patent/JP2002510150A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000541069A 1998-03-27 1999-03-22 排除駆動式ｓｍｉｆポッド・パージ・システム Pending JP2002510150A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/049,461 1998-03-27
US09/049,461 US5988233A (en) 1998-03-27 1998-03-27 Evacuation-driven SMIF pod purge system
PCT/US1999/006253 WO1999050145A1 (en) 1998-03-27 1999-03-22 Evacuation-driven smif pod purge system

Publications (2)

Publication Number Publication Date
JP2002510150A true JP2002510150A (ja) 2002-04-02
JP2002510150A5 JP2002510150A5 (enExample) 2006-05-11

Family

ID=21959936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000541069A Pending JP2002510150A (ja) 1998-03-27 1999-03-22 排除駆動式ｓｍｉｆポッド・パージ・システム

Country Status (5)

Country Link
US (1) US5988233A (enExample)
EP (1) EP1075418A4 (enExample)
JP (1) JP2002510150A (enExample)
KR (1) KR100687306B1 (enExample)
WO (1) WO1999050145A1 (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007520895A (ja) * 2004-02-05 2007-07-26 インテグリス・インコーポレーテッド ウェハ輸送コンテナのパージング
KR100799415B1 (ko) * 2005-06-24 2008-01-30 티디케이가부시기가이샤 제품 컨테이너용 퍼지 시스템 및 퍼지 시스템에 사용하기위한 테이블
JP2010520625A (ja) * 2007-02-28 2010-06-10 インテグリス・インコーポレーテッド 基板コンテナ用パージシステム
US8061738B2 (en) 2006-02-20 2011-11-22 Tdk Corporation Gas replacement system
JP2015012039A (ja) * 2013-06-26 2015-01-19 株式会社ダイフク 処理設備
JP2015029057A (ja) * 2013-06-28 2015-02-12 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法並びに記録媒体
WO2015166710A1 (ja) * 2014-04-28 2015-11-05 村田機械株式会社 パージ装置及びパージ方法
JP2015535394A (ja) * 2012-10-31 2015-12-10 株式会社ダイフク 半導体ウェハ製造システムにおいてｓｔｂに不活性ガスを供給する方法及びこれを用いた半導体ウェハ製造システム（ｍｅｔｈｏｄｆｏｒｓｕｐｐｌｙｉｎｇｉｎｅｒｔｇａｓｔｏｓｔｂｉｎｓｅｍｉｃｏｎｄｕｃｔｏｒｗａｆｅｒｐｒｏｄｕｃｔｉｏｎｓｙｓｔｅｍａｎｄｓｅｍｉｃｏｎｄｕｃｔｏｒｗａｆｅｒｐｒｏｄｕｃｔｉｏｎｓｙｓｔｅｍｕｓｉｎｇｔｈｅｓａｍｅ）
JP2016503586A (ja) * 2012-11-20 2016-02-04 インテグリス・インコーポレーテッド パージ用接続部を備えた基板容器
JP2016039295A (ja) * 2014-08-08 2016-03-22 Tdk株式会社 ガスパージユニット、ロードポート装置およびパージ対象容器の設置台
US9305817B2 (en) 2012-02-03 2016-04-05 Tokyo Electron Limited Method for purging a substrate container
JP2017112394A (ja) * 2017-02-21 2017-06-22 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP2018505546A (ja) * 2014-12-01 2018-02-22 インテグリス・インコーポレーテッド 基板収納容器の弁アセンブリ
US10014200B2 (en) 2014-02-07 2018-07-03 Murata Machinery, Ltd. Gas injection device and assisting member
JP2018129530A (ja) * 2018-04-10 2018-08-16 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP2019117955A (ja) * 2019-04-24 2019-07-18 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート

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JP3167970B2 (ja) * 1997-10-13 2001-05-21 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US6319297B1 (en) * 1998-03-27 2001-11-20 Asyst Technologies, Inc. Modular SMIF pod breather, adsorbent, and purge cartridges
US6056026A (en) * 1998-12-01 2000-05-02 Asyst Technologies, Inc. Passively activated valve for carrier purging
FR2802335B1 (fr) * 1999-12-09 2002-04-05 Cit Alcatel Systeme et procede de controle de minienvironnement
JP3619119B2 (ja) * 2000-05-15 2005-02-09 キヤノン株式会社 真空処理方法
KR100410991B1 (ko) * 2001-02-22 2003-12-18 삼성전자주식회사 반도체 제조장치의 로드포트
US6701972B2 (en) * 2002-01-11 2004-03-09 The Boc Group, Inc. Vacuum load lock, system including vacuum load lock, and associated methods
FR2834974B1 (fr) * 2002-01-24 2004-10-15 Air Liquide Enceinte de stockage, valve d'evacuation de gaz pour cette enceinte, et procede d'alimentation en gaz de cette enceinte
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
JP2004235516A (ja) * 2003-01-31 2004-08-19 Trecenti Technologies Inc ウエハ収納治具のパージ方法、ロードポートおよび半導体装置の製造方法
US6899145B2 (en) * 2003-03-20 2005-05-31 Asm America, Inc. Front opening unified pod
JP4027837B2 (ja) * 2003-04-28 2007-12-26 Ｔｄｋ株式会社 パージ装置およびパージ方法
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
WO2004109748A2 (en) * 2003-06-05 2004-12-16 Palbam Class Ltd. Supporting shelf for front opening unified pod
US6919102B2 (en) * 2003-06-20 2005-07-19 Powerchip Semiconductor Corp. Method of stabilizing material layer
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
KR100572321B1 (ko) * 2003-10-02 2006-04-19 삼성전자주식회사 반도체 소자 제조 설비 및 방법 그리고 이에 사용되는스토커
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
KR101233101B1 (ko) 2004-08-19 2013-02-14 브룩스 오토메이션 인코퍼레이티드 저용량 캐리어 및 그 사용방법
EP1803151B1 (en) * 2004-08-23 2011-10-05 Murata Machinery, Ltd. Elevator-based tool loading and buffering system
JP2008510673A (ja) * 2004-08-24 2008-04-10 ブルックス オートメーション インコーポレイテッド 搬送システム
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
WO2007019105A1 (en) * 2005-08-03 2007-02-15 Entegris, Inc. A transfer container
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
TWI367539B (en) 2006-01-11 2012-07-01 Applied Materials Inc Methods and apparatus for purging a substrate carrier
TWM320179U (en) * 2006-06-09 2007-10-01 Gudeng Prec Industral Co Ltd Gas filling equipment and filling chamber therein for photomask conveying box
WO2008147379A1 (en) * 2006-09-14 2008-12-04 Brooks Automation Inc. Carrier gas system and coupling substrate carrier to a loadport
US20080254377A1 (en) * 2006-12-19 2008-10-16 Chen Chien-Ta Metal photomask pod and filter device thereof
TWI475627B (zh) 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
US20100175781A1 (en) * 2007-07-09 2010-07-15 Kondoh Industries, Ltd. Apparatus for Charging Dry Air or Nitrogen Gas into a Container for Storing Semiconductor Wafers and an Apparatus for Thereby Removing Static Electricity from the Wafers
WO2009055612A1 (en) 2007-10-27 2009-04-30 Applied Materials, Inc. Sealed substrate carriers and systems and methods for transporting substrates
TWM330970U (en) * 2007-11-01 2008-04-21 Gudeng Prec Industral Co Ltd Semiconductor elements storage apparatus and reticle storage apparatus
TWM337832U (en) * 2007-11-15 2008-08-01 Gudeng Prec Industral Co Ltd Storage apparatus and filter apparatus therein
TWM331514U (en) * 2007-11-15 2008-05-01 Gudeng Prec Industral Co Ltd Storage apparatus for storing semiconductor element or reticle
TW200929357A (en) * 2007-12-20 2009-07-01 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWI379171B (en) * 2007-12-27 2012-12-11 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWM336219U (en) * 2008-01-31 2008-07-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI331123B (en) * 2008-03-06 2010-10-01 Gudeng Prec Ind Co Ltd Reticle pod and method for keeping reticle clean and dry
JP4692584B2 (ja) * 2008-07-03 2011-06-01 村田機械株式会社 パージ装置
US20100051501A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Ic waper carrier sealed from ambient atmosphere during transportation from one process to the next
JP5381054B2 (ja) * 2008-12-02 2014-01-08 シンフォニアテクノロジー株式会社 ロードポート
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JP2011187539A (ja) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd ガス注入装置、ガス排出装置、ガス注入方法及びガス排出方法
KR101780789B1 (ko) 2010-03-15 2017-09-22 삼성전자주식회사 기판 이송 용기, 가스 퍼지 모니터링 툴, 그리고 이들을 구비한 반도체 제조 설비
CN102194730B (zh) * 2010-03-15 2015-08-05 三星电子株式会社 衬底转移容器、气体净化监视工具及具有其的半导体制造设备
JP5700119B2 (ja) * 2011-05-25 2015-04-15 村田機械株式会社 ロードポート装置、搬送システム、及びコンテナ搬出方法
KR101301057B1 (ko) * 2011-12-16 2013-08-28 주식회사 테라세미콘 웨이퍼 처리장치
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CN103311163A (zh) * 2012-03-09 2013-09-18 家登精密工业股份有限公司 应用于半导体存储装置的逆止阀
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JP5874691B2 (ja) * 2013-06-26 2016-03-02 株式会社ダイフク 不活性気体供給設備
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JPWO2015129122A1 (ja) * 2014-02-27 2017-03-30 村田機械株式会社 パージ装置とパージ方法
WO2015141246A1 (ja) 2014-03-17 2015-09-24 村田機械株式会社 パージ装置とパージ方法
US10646947B2 (en) * 2014-11-10 2020-05-12 Fronius International Gmbh Welding wire cartridge with moisture protection
TWM500354U (zh) * 2015-01-30 2015-05-01 Shu-zhen LIU 具有環境感測及數據傳輸之密封裝置
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007520895A (ja) * 2004-02-05 2007-07-26 インテグリス・インコーポレーテッド ウェハ輸送コンテナのパージング
KR100799415B1 (ko) * 2005-06-24 2008-01-30 티디케이가부시기가이샤 제품 컨테이너용 퍼지 시스템 및 퍼지 시스템에 사용하기위한 테이블
US8061738B2 (en) 2006-02-20 2011-11-22 Tdk Corporation Gas replacement system
JP2010520625A (ja) * 2007-02-28 2010-06-10 インテグリス・インコーポレーテッド 基板コンテナ用パージシステム
US9305817B2 (en) 2012-02-03 2016-04-05 Tokyo Electron Limited Method for purging a substrate container
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US5988233A (en) 1999-11-23
WO1999050145A1 (en) 1999-10-07

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