JP2002504584A5 - - Google Patents

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Publication number
JP2002504584A5
JP2002504584A5 JP2000532472A JP2000532472A JP2002504584A5 JP 2002504584 A5 JP2002504584 A5 JP 2002504584A5 JP 2000532472 A JP2000532472 A JP 2000532472A JP 2000532472 A JP2000532472 A JP 2000532472A JP 2002504584 A5 JP2002504584 A5 JP 2002504584A5
Authority
JP
Japan
Prior art keywords
weight
polymer
melt
curable
polystyrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000532472A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002504584A (ja
Filing date
Publication date
Priority claimed from US09/025,400 external-priority patent/US6518362B1/en
Application filed filed Critical
Publication of JP2002504584A publication Critical patent/JP2002504584A/ja
Publication of JP2002504584A5 publication Critical patent/JP2002504584A5/ja
Pending legal-status Critical Current

Links

JP2000532472A 1998-02-18 1998-06-22 Ppe/ポリスチレン/硬化性エポキシ混合物を用いたハイブリッド材料 Pending JP2002504584A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/025,400 US6518362B1 (en) 1998-02-18 1998-02-18 Melt blending polyphenylene ether, polystyrene and curable epoxy
US09/025,400 1998-02-18
PCT/US1998/012179 WO1999042524A1 (en) 1998-02-18 1998-06-22 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures

Publications (2)

Publication Number Publication Date
JP2002504584A JP2002504584A (ja) 2002-02-12
JP2002504584A5 true JP2002504584A5 (enExample) 2006-01-05

Family

ID=21825841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000532472A Pending JP2002504584A (ja) 1998-02-18 1998-06-22 Ppe/ポリスチレン/硬化性エポキシ混合物を用いたハイブリッド材料

Country Status (7)

Country Link
US (4) US6518362B1 (enExample)
EP (1) EP1060213B1 (enExample)
JP (1) JP2002504584A (enExample)
AU (1) AU7961698A (enExample)
CA (1) CA2319218A1 (enExample)
DE (1) DE69823882T2 (enExample)
WO (1) WO1999042524A1 (enExample)

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US20080227899A1 (en) * 2006-05-11 2008-09-18 David Abecassis Novel method for polymer RDP-clay nanocomposites and mechanisms for polymer/polymer blending
US20080023679A1 (en) * 2006-05-11 2008-01-31 David Abecassis Novel flame retardant nanoclay
US20080071013A1 (en) * 2006-07-12 2008-03-20 David Abecassis Novel thermoplastic pelletizing technology
US20080317987A1 (en) * 2006-07-21 2008-12-25 David Abecassis Nanocomposite materials for ethanol, methanol and hydrocarbon transportation use and storage
US20080064798A1 (en) * 2006-07-21 2008-03-13 David Abecassis Novel method for nanoclay particle dispersion
US20080064802A1 (en) * 2006-07-26 2008-03-13 David Abecassis Method for polymer-polymer compatiblization and non polymer filler dispersion and compositions made therefrom
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
CN101632237B (zh) * 2007-01-09 2012-12-19 诺基亚公司 用于上行链路确认传输的功率
WO2008115414A2 (en) * 2007-03-15 2008-09-25 Glen Burnie Technologies, L.L.C. A novel method for producing an organoclay additive for use in polypropylene
US20090042044A1 (en) * 2007-08-08 2009-02-12 David Abecassis Novel nanocomposite coating for the reduction of pigment particles loss and UV fade and chemical degradation for decorative & structural products made from concrete and concrete composites
US20100029986A1 (en) * 2007-10-19 2010-02-04 David Abecassis Novel amine functionalized carbon nanotube
US8337163B2 (en) 2007-12-05 2012-12-25 General Electric Company Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof
US8425785B2 (en) 2008-03-31 2013-04-23 Intel Corporation Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US8079820B2 (en) * 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
US20110070379A1 (en) * 2009-03-11 2011-03-24 Cytec Technology Corp. Light and uv stabilisers
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
BR112012022319B1 (pt) 2010-03-04 2020-01-28 Zephyros Inc laminado estrutural compósito
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
CN103441162B (zh) * 2013-09-06 2016-04-13 苏州柯莱美高分子材料科技有限公司 太阳能电池组件的太阳能背板以及太阳能电池组件
CN104650573B (zh) * 2013-11-22 2017-11-17 深圳光启创新技术有限公司 用于制作高频天线基板的复合材料、高频天线基板及其制作方法
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
US11674002B2 (en) 2017-10-02 2023-06-13 Commscope Technologies Llc Low compression set thermoplastic gel and cable gel seal arrangement

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US5308565A (en) 1993-02-05 1994-05-03 General Electric Company Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance
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US6518362B1 (en) * 1998-02-18 2003-02-11 3M Innovative Properties Company Melt blending polyphenylene ether, polystyrene and curable epoxy

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