JP2002504032A - インクジェットプリンタペンの結合システムおよびそれを提供するための方法 - Google Patents

インクジェットプリンタペンの結合システムおよびそれを提供するための方法

Info

Publication number
JP2002504032A
JP2002504032A JP50253899A JP50253899A JP2002504032A JP 2002504032 A JP2002504032 A JP 2002504032A JP 50253899 A JP50253899 A JP 50253899A JP 50253899 A JP50253899 A JP 50253899A JP 2002504032 A JP2002504032 A JP 2002504032A
Authority
JP
Japan
Prior art keywords
coupling system
latent
curable composition
ink
jet printer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50253899A
Other languages
English (en)
Japanese (ja)
Inventor
アール. ローロフ,ロバート
エー. ジョージ,クレイトン
Original Assignee
ミネソタ マイニング アンド マニュファクチャリング カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミネソタ マイニング アンド マニュファクチャリング カンパニー filed Critical ミネソタ マイニング アンド マニュファクチャリング カンパニー
Publication of JP2002504032A publication Critical patent/JP2002504032A/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14362Assembling elements of heads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP50253899A 1997-06-06 1998-05-26 インクジェットプリンタペンの結合システムおよびそれを提供するための方法 Pending JP2002504032A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US87016297A 1997-06-06 1997-06-06
US08/870,162 1997-06-06
PCT/US1998/010717 WO1998055316A1 (en) 1997-06-06 1998-05-26 Bonding system in an inkjet printer pen and method for providing the same

Publications (1)

Publication Number Publication Date
JP2002504032A true JP2002504032A (ja) 2002-02-05

Family

ID=25354891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50253899A Pending JP2002504032A (ja) 1997-06-06 1998-05-26 インクジェットプリンタペンの結合システムおよびそれを提供するための方法

Country Status (7)

Country Link
EP (1) EP0986480A1 (pt)
JP (1) JP2002504032A (pt)
KR (1) KR20010013348A (pt)
CN (1) CN1259085A (pt)
AU (1) AU7599598A (pt)
BR (1) BR9809732A (pt)
WO (1) WO1998055316A1 (pt)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009523633A (ja) * 2006-01-19 2009-06-25 スリーエム イノベイティブ プロパティズ カンパニー 耐インク性カバーコートを有するフレキシブル回路
JP2013048680A (ja) * 2011-08-30 2013-03-14 Gc Corp 咬合圧測定器、咬合圧測定システム

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6210522B1 (en) 1999-06-15 2001-04-03 Lexmark International, Inc. Adhesive bonding laminates
US6543890B1 (en) * 2001-12-19 2003-04-08 3M Innovative Properties Company Method and apparatus for radiation curing of ink used in inkjet printing
CN100541673C (zh) * 2003-06-19 2009-09-16 矢崎总业株式会社 电线用着色喷嘴
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
CN102153963A (zh) * 2011-03-28 2011-08-17 常州拓邦新材料科技有限公司 一种热熔压敏性结构胶膜及其制备工艺
WO2015116025A1 (en) 2014-01-28 2015-08-06 Hewlett-Packard Development Company, L.P. Flexible carrier
CN111394028A (zh) * 2019-05-08 2020-07-10 枚林优交(上海)新材料开发有限公司 光激活延迟热固化胶黏剂及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL298323A (pt) 1959-12-24
US4256828A (en) 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US5089536A (en) 1982-11-22 1992-02-18 Minnesota Mining And Manufacturing Company Energy polmerizable compositions containing organometallic initiators
US5568171A (en) * 1992-04-02 1996-10-22 Hewlett-Packard Company Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof
EP0572948B1 (en) * 1992-06-01 2000-09-06 Canon Kabushiki Kaisha Ink jet recording head fabrication method
CA2101454C (en) * 1992-07-31 1998-09-22 Kenjiro Watanabe Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head
CA2115888A1 (en) 1993-04-15 1994-10-16 Clayton A. George Epoxy/polyester hot melt compositions
US5388326A (en) * 1993-09-07 1995-02-14 Hewlett-Packard Corporation Self aligning orifice construction for thermal ink-jet printheads
JPH07314671A (ja) * 1994-05-25 1995-12-05 Citizen Watch Co Ltd インクジェット記録装置の記録ヘッド
US5637166A (en) * 1994-10-04 1997-06-10 Hewlett-Packard Company Similar material thermal tab attachment process for ink-jet pen
JP3176245B2 (ja) * 1995-03-23 2001-06-11 シャープ株式会社 インクジェットヘッド
US6243117B1 (en) * 1995-05-12 2001-06-05 Lexmark International, Inc. Print head cartridge and method of making a print head cartridge by one-shot injection molding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009523633A (ja) * 2006-01-19 2009-06-25 スリーエム イノベイティブ プロパティズ カンパニー 耐インク性カバーコートを有するフレキシブル回路
JP2013048680A (ja) * 2011-08-30 2013-03-14 Gc Corp 咬合圧測定器、咬合圧測定システム

Also Published As

Publication number Publication date
KR20010013348A (ko) 2001-02-26
CN1259085A (zh) 2000-07-05
BR9809732A (pt) 2000-07-11
EP0986480A1 (en) 2000-03-22
WO1998055316A1 (en) 1998-12-10
AU7599598A (en) 1998-12-21

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