JP2002503032A - 電子カートリッジのための熱母線設計 - Google Patents

電子カートリッジのための熱母線設計

Info

Publication number
JP2002503032A
JP2002503032A JP2000530943A JP2000530943A JP2002503032A JP 2002503032 A JP2002503032 A JP 2002503032A JP 2000530943 A JP2000530943 A JP 2000530943A JP 2000530943 A JP2000530943 A JP 2000530943A JP 2002503032 A JP2002503032 A JP 2002503032A
Authority
JP
Japan
Prior art keywords
integrated circuit
substrate
circuit package
hot plate
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000530943A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002503032A5 (enExample
Inventor
チュ，チャ−ピン
ユサフ，イムラン
コウシック，バナジー
ヤング，トッド
ソルブレッケン，ゲイリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2002503032A publication Critical patent/JP2002503032A/ja
Publication of JP2002503032A5 publication Critical patent/JP2002503032A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000530943A 1998-02-06 1999-01-04 電子カートリッジのための熱母線設計 Pending JP2002503032A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/019,570 US5990549A (en) 1998-02-06 1998-02-06 Thermal bus bar design for an electronic cartridge
US09/019,570 1998-02-06
PCT/US1999/000052 WO1999040625A1 (en) 1998-02-06 1999-01-04 Thermal bus bar design for an electronic cartridge

Publications (2)

Publication Number Publication Date
JP2002503032A true JP2002503032A (ja) 2002-01-29
JP2002503032A5 JP2002503032A5 (enExample) 2006-03-02

Family

ID=21793909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000530943A Pending JP2002503032A (ja) 1998-02-06 1999-01-04 電子カートリッジのための熱母線設計

Country Status (5)

Country Link
US (1) US5990549A (enExample)
JP (1) JP2002503032A (enExample)
KR (1) KR100373228B1 (enExample)
AU (1) AU2025499A (enExample)
WO (1) WO1999040625A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294348A (ja) * 2007-05-28 2008-12-04 Toshiba Corp プリント配線板構造、プリント配線板の部品実装方法および電子機器
JP2011142346A (ja) * 2011-04-06 2011-07-21 Toshiba Corp 電子機器およびプリント配線板

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6483702B1 (en) 1997-12-17 2002-11-19 Intel Corporation Apparatus and methods for attaching thermal spreader plate to an electronic card
US6369333B1 (en) * 1998-02-13 2002-04-09 Intel Corporation Flexible connection system
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US6256199B1 (en) * 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
DE60035798T2 (de) * 1999-12-01 2008-04-30 Cool Options, Inc. Tragrahmen eines wärmeleitenden materials
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
EP1742265B1 (en) * 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
JP3695376B2 (ja) * 2001-09-28 2005-09-14 日本電気株式会社 回路基板の反り防止構造及び反り防止方法
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6603665B1 (en) * 2002-09-12 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly with thermal plates
US6700783B1 (en) * 2003-01-15 2004-03-02 Industrial Technology Research Institute Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
DE102006034964B3 (de) * 2006-07-28 2007-09-06 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung
WO2011053305A1 (en) * 2009-10-30 2011-05-05 Hewlett-Packard Development Co Thermal bus bar for a blade enclosure
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US8702052B2 (en) * 2012-07-05 2014-04-22 Globe Motors, Inc. Retention structure for heat generating component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266898A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd プリント板の冷却構造
JPH05198708A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 半導体集積回路装置
JPH06196600A (ja) * 1992-10-06 1994-07-15 Hewlett Packard Co <Hp> マルチ・チップ・モジュール
JPH07106477A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> 熱伝導板付きヒートシンクアセンブリ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components
JPS62141751A (ja) * 1985-12-16 1987-06-25 Fuji Electric Co Ltd 平形半導体素子スタツク
US4711804A (en) * 1986-07-02 1987-12-08 General Electric Company Circuit board construction
JPS6480032A (en) * 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor device and manufacture thereof
JPH0289352A (ja) * 1988-09-26 1990-03-29 Mitsubishi Electric Corp 半導体装置
JPH02232956A (ja) * 1989-03-07 1990-09-14 Mitsubishi Electric Corp 半導体装置
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
JPH0730051A (ja) * 1993-07-09 1995-01-31 Fujitsu Ltd 半導体装置
US5527740A (en) * 1994-06-28 1996-06-18 Intel Corporation Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
US5719436A (en) * 1995-03-13 1998-02-17 Intel Corporation Package housing multiple semiconductor dies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266898A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd プリント板の冷却構造
JPH05198708A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 半導体集積回路装置
JPH06196600A (ja) * 1992-10-06 1994-07-15 Hewlett Packard Co <Hp> マルチ・チップ・モジュール
JPH07106477A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> 熱伝導板付きヒートシンクアセンブリ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294348A (ja) * 2007-05-28 2008-12-04 Toshiba Corp プリント配線板構造、プリント配線板の部品実装方法および電子機器
JP2011142346A (ja) * 2011-04-06 2011-07-21 Toshiba Corp 電子機器およびプリント配線板

Also Published As

Publication number Publication date
AU2025499A (en) 1999-08-23
KR100373228B1 (ko) 2003-02-25
WO1999040625A1 (en) 1999-08-12
US5990549A (en) 1999-11-23
KR20010040541A (ko) 2001-05-15

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