AU2025499A - Thermal bus bar design for an electronic cartridge - Google Patents

Thermal bus bar design for an electronic cartridge

Info

Publication number
AU2025499A
AU2025499A AU20254/99A AU2025499A AU2025499A AU 2025499 A AU2025499 A AU 2025499A AU 20254/99 A AU20254/99 A AU 20254/99A AU 2025499 A AU2025499 A AU 2025499A AU 2025499 A AU2025499 A AU 2025499A
Authority
AU
Australia
Prior art keywords
bus bar
bar design
thermal bus
electronic cartridge
cartridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU20254/99A
Other languages
English (en)
Inventor
Chia-Pin Chiu
Banerjee Koushik
Gary Solbrekken
Todd Young
Imran Yusuf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2025499A publication Critical patent/AU2025499A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
AU20254/99A 1998-02-06 1999-01-04 Thermal bus bar design for an electronic cartridge Abandoned AU2025499A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09019570 1998-02-06
US09/019,570 US5990549A (en) 1998-02-06 1998-02-06 Thermal bus bar design for an electronic cartridge
PCT/US1999/000052 WO1999040625A1 (en) 1998-02-06 1999-01-04 Thermal bus bar design for an electronic cartridge

Publications (1)

Publication Number Publication Date
AU2025499A true AU2025499A (en) 1999-08-23

Family

ID=21793909

Family Applications (1)

Application Number Title Priority Date Filing Date
AU20254/99A Abandoned AU2025499A (en) 1998-02-06 1999-01-04 Thermal bus bar design for an electronic cartridge

Country Status (5)

Country Link
US (1) US5990549A (enExample)
JP (1) JP2002503032A (enExample)
KR (1) KR100373228B1 (enExample)
AU (1) AU2025499A (enExample)
WO (1) WO1999040625A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6483702B1 (en) 1997-12-17 2002-11-19 Intel Corporation Apparatus and methods for attaching thermal spreader plate to an electronic card
US6369333B1 (en) * 1998-02-13 2002-04-09 Intel Corporation Flexible connection system
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US6256199B1 (en) * 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
DE60035798T2 (de) * 1999-12-01 2008-04-30 Cool Options, Inc. Tragrahmen eines wärmeleitenden materials
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
EP1742265B1 (en) * 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
JP3695376B2 (ja) * 2001-09-28 2005-09-14 日本電気株式会社 回路基板の反り防止構造及び反り防止方法
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6603665B1 (en) * 2002-09-12 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly with thermal plates
US6700783B1 (en) * 2003-01-15 2004-03-02 Industrial Technology Research Institute Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
DE102006034964B3 (de) * 2006-07-28 2007-09-06 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung
JP4729001B2 (ja) * 2007-05-28 2011-07-20 株式会社東芝 プリント配線板構造、プリント配線板の部品実装方法および電子機器
WO2011053305A1 (en) * 2009-10-30 2011-05-05 Hewlett-Packard Development Co Thermal bus bar for a blade enclosure
JP4869444B2 (ja) * 2011-04-06 2012-02-08 株式会社東芝 電子機器およびプリント配線板
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US8702052B2 (en) * 2012-07-05 2014-04-22 Globe Motors, Inc. Retention structure for heat generating component

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components
JPS62141751A (ja) * 1985-12-16 1987-06-25 Fuji Electric Co Ltd 平形半導体素子スタツク
US4711804A (en) * 1986-07-02 1987-12-08 General Electric Company Circuit board construction
JPH07120865B2 (ja) * 1987-04-24 1995-12-20 株式会社日立製作所 プリント板の冷却構造
JPS6480032A (en) * 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor device and manufacture thereof
JPH0289352A (ja) * 1988-09-26 1990-03-29 Mitsubishi Electric Corp 半導体装置
JPH02232956A (ja) * 1989-03-07 1990-09-14 Mitsubishi Electric Corp 半導体装置
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
JPH05198708A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 半導体集積回路装置
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
JPH0730051A (ja) * 1993-07-09 1995-01-31 Fujitsu Ltd 半導体装置
US5527740A (en) * 1994-06-28 1996-06-18 Intel Corporation Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
US5719436A (en) * 1995-03-13 1998-02-17 Intel Corporation Package housing multiple semiconductor dies

Also Published As

Publication number Publication date
KR100373228B1 (ko) 2003-02-25
WO1999040625A1 (en) 1999-08-12
JP2002503032A (ja) 2002-01-29
US5990549A (en) 1999-11-23
KR20010040541A (ko) 2001-05-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase