KR100373228B1 - 전자 카트리지를 위한 열 버스 바 설계 - Google Patents

전자 카트리지를 위한 열 버스 바 설계 Download PDF

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Publication number
KR100373228B1
KR100373228B1 KR10-2000-7008406A KR20007008406A KR100373228B1 KR 100373228 B1 KR100373228 B1 KR 100373228B1 KR 20007008406 A KR20007008406 A KR 20007008406A KR 100373228 B1 KR100373228 B1 KR 100373228B1
Authority
KR
South Korea
Prior art keywords
integrated circuit
substrate
hot plate
circuit package
electronic assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-7008406A
Other languages
English (en)
Korean (ko)
Other versions
KR20010040541A (ko
Inventor
치우치아-핀
유서프임란
쿠시크베너지
영토드
솔브레켄게리
Original Assignee
인텔 코오퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010040541A publication Critical patent/KR20010040541A/ko
Application granted granted Critical
Publication of KR100373228B1 publication Critical patent/KR100373228B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
KR10-2000-7008406A 1998-02-06 1999-01-04 전자 카트리지를 위한 열 버스 바 설계 Expired - Fee Related KR100373228B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/019,570 US5990549A (en) 1998-02-06 1998-02-06 Thermal bus bar design for an electronic cartridge
US09/019,570 1998-02-06

Publications (2)

Publication Number Publication Date
KR20010040541A KR20010040541A (ko) 2001-05-15
KR100373228B1 true KR100373228B1 (ko) 2003-02-25

Family

ID=21793909

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7008406A Expired - Fee Related KR100373228B1 (ko) 1998-02-06 1999-01-04 전자 카트리지를 위한 열 버스 바 설계

Country Status (5)

Country Link
US (1) US5990549A (enExample)
JP (1) JP2002503032A (enExample)
KR (1) KR100373228B1 (enExample)
AU (1) AU2025499A (enExample)
WO (1) WO1999040625A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6483702B1 (en) 1997-12-17 2002-11-19 Intel Corporation Apparatus and methods for attaching thermal spreader plate to an electronic card
US6369333B1 (en) * 1998-02-13 2002-04-09 Intel Corporation Flexible connection system
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US6256199B1 (en) * 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
ES2290062T3 (es) * 1999-12-01 2008-02-16 Cool Options, Inc. Cuadro estructural de materiales termoconductores.
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
EP2234154B1 (en) * 2000-04-19 2016-03-30 Denso Corporation Coolant cooled type semiconductor device
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
JP3695376B2 (ja) * 2001-09-28 2005-09-14 日本電気株式会社 回路基板の反り防止構造及び反り防止方法
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6603665B1 (en) * 2002-09-12 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly with thermal plates
US6700783B1 (en) * 2003-01-15 2004-03-02 Industrial Technology Research Institute Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
DE102006034964B3 (de) * 2006-07-28 2007-09-06 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung
JP4729001B2 (ja) * 2007-05-28 2011-07-20 株式会社東芝 プリント配線板構造、プリント配線板の部品実装方法および電子機器
WO2011053305A1 (en) * 2009-10-30 2011-05-05 Hewlett-Packard Development Co Thermal bus bar for a blade enclosure
JP4869444B2 (ja) * 2011-04-06 2012-02-08 株式会社東芝 電子機器およびプリント配線板
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US8702052B2 (en) * 2012-07-05 2014-04-22 Globe Motors, Inc. Retention structure for heat generating component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061990A (en) * 1987-09-21 1991-10-29 Hitachi Maxell, Ltd. Semiconductor device and the manufacture thereof
US5297006A (en) * 1991-08-13 1994-03-22 Fujitsu Limited Three-dimensional multi-chip module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components
JPS62141751A (ja) * 1985-12-16 1987-06-25 Fuji Electric Co Ltd 平形半導体素子スタツク
US4711804A (en) * 1986-07-02 1987-12-08 General Electric Company Circuit board construction
JPH07120865B2 (ja) * 1987-04-24 1995-12-20 株式会社日立製作所 プリント板の冷却構造
JPH0289352A (ja) * 1988-09-26 1990-03-29 Mitsubishi Electric Corp 半導体装置
JPH02232956A (ja) * 1989-03-07 1990-09-14 Mitsubishi Electric Corp 半導体装置
JPH05198708A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 半導体集積回路装置
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
JPH0730051A (ja) * 1993-07-09 1995-01-31 Fujitsu Ltd 半導体装置
US5527740A (en) * 1994-06-28 1996-06-18 Intel Corporation Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
US5719436A (en) * 1995-03-13 1998-02-17 Intel Corporation Package housing multiple semiconductor dies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061990A (en) * 1987-09-21 1991-10-29 Hitachi Maxell, Ltd. Semiconductor device and the manufacture thereof
US5297006A (en) * 1991-08-13 1994-03-22 Fujitsu Limited Three-dimensional multi-chip module

Also Published As

Publication number Publication date
US5990549A (en) 1999-11-23
JP2002503032A (ja) 2002-01-29
KR20010040541A (ko) 2001-05-15
WO1999040625A1 (en) 1999-08-12
AU2025499A (en) 1999-08-23

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