JP2002503032A5 - - Google Patents
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- Publication number
- JP2002503032A5 JP2002503032A5 JP2000530943A JP2000530943A JP2002503032A5 JP 2002503032 A5 JP2002503032 A5 JP 2002503032A5 JP 2000530943 A JP2000530943 A JP 2000530943A JP 2000530943 A JP2000530943 A JP 2000530943A JP 2002503032 A5 JP2002503032 A5 JP 2002503032A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/019,570 US5990549A (en) | 1998-02-06 | 1998-02-06 | Thermal bus bar design for an electronic cartridge |
| US09/019,570 | 1998-02-06 | ||
| PCT/US1999/000052 WO1999040625A1 (en) | 1998-02-06 | 1999-01-04 | Thermal bus bar design for an electronic cartridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002503032A JP2002503032A (ja) | 2002-01-29 |
| JP2002503032A5 true JP2002503032A5 (enExample) | 2006-03-02 |
Family
ID=21793909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000530943A Pending JP2002503032A (ja) | 1998-02-06 | 1999-01-04 | 電子カートリッジのための熱母線設計 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5990549A (enExample) |
| JP (1) | JP2002503032A (enExample) |
| KR (1) | KR100373228B1 (enExample) |
| AU (1) | AU2025499A (enExample) |
| WO (1) | WO1999040625A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6046905A (en) * | 1996-09-30 | 2000-04-04 | Intel Corporation | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges |
| US6483702B1 (en) | 1997-12-17 | 2002-11-19 | Intel Corporation | Apparatus and methods for attaching thermal spreader plate to an electronic card |
| US6369333B1 (en) * | 1998-02-13 | 2002-04-09 | Intel Corporation | Flexible connection system |
| US6585534B2 (en) * | 1998-08-20 | 2003-07-01 | Intel Corporation | Retention mechanism for an electrical assembly |
| US6256199B1 (en) * | 1999-10-01 | 2001-07-03 | Intel Corporation | Integrated circuit cartridge and method of fabricating the same |
| US6166908A (en) * | 1999-10-01 | 2000-12-26 | Intel Corporation | Integrated circuit cartridge |
| DK1240811T3 (da) * | 1999-12-01 | 2007-11-12 | Cool Options Inc | Konstruktionsramme af termisk ledende materiale |
| US6888722B2 (en) * | 1999-12-30 | 2005-05-03 | Intel Corporation | Thermal design for minimizing interface in a multi-site thermal contact condition |
| EP2244289B1 (en) * | 2000-04-19 | 2014-03-26 | Denso Corporation | Coolant cooled type semiconductor device |
| US6367263B1 (en) | 2000-05-31 | 2002-04-09 | Intel Corporation | Integrated circuit refrigeration device |
| JP3695376B2 (ja) * | 2001-09-28 | 2005-09-14 | 日本電気株式会社 | 回路基板の反り防止構造及び反り防止方法 |
| US7411337B2 (en) * | 2001-11-16 | 2008-08-12 | Intel Corporation | Electrical energy-generating system and devices and methods related thereto |
| US6603665B1 (en) * | 2002-09-12 | 2003-08-05 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating assembly with thermal plates |
| US6700783B1 (en) * | 2003-01-15 | 2004-03-02 | Industrial Technology Research Institute | Three-dimensional stacked heat spreader assembly for electronic package and method for assembling |
| US6714414B1 (en) * | 2003-02-07 | 2004-03-30 | Morningstar Corporation | Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces |
| GB0308305D0 (en) * | 2003-04-10 | 2003-05-14 | Hewlett Packard Development Co | Digital message encryption and authentication |
| US7068510B2 (en) * | 2003-12-04 | 2006-06-27 | International Business Machines Corporation | Dissipating heat reliably in computer systems |
| DE102006034964B3 (de) * | 2006-07-28 | 2007-09-06 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung |
| JP4729001B2 (ja) * | 2007-05-28 | 2011-07-20 | 株式会社東芝 | プリント配線板構造、プリント配線板の部品実装方法および電子機器 |
| KR20120102661A (ko) * | 2009-10-30 | 2012-09-18 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 블레이드 인클로저용 방열 버스 바 |
| JP4869444B2 (ja) * | 2011-04-06 | 2012-02-08 | 株式会社東芝 | 電子機器およびプリント配線板 |
| US9465049B2 (en) * | 2012-04-13 | 2016-10-11 | James B. Colvin | Apparatus and method for electronic sample preparation |
| US8702052B2 (en) * | 2012-07-05 | 2014-04-22 | Globe Motors, Inc. | Retention structure for heat generating component |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
| JPS62141751A (ja) * | 1985-12-16 | 1987-06-25 | Fuji Electric Co Ltd | 平形半導体素子スタツク |
| US4711804A (en) * | 1986-07-02 | 1987-12-08 | General Electric Company | Circuit board construction |
| JPH07120865B2 (ja) * | 1987-04-24 | 1995-12-20 | 株式会社日立製作所 | プリント板の冷却構造 |
| JPS6480032A (en) * | 1987-09-21 | 1989-03-24 | Hitachi Maxell | Semiconductor device and manufacture thereof |
| JPH0289352A (ja) * | 1988-09-26 | 1990-03-29 | Mitsubishi Electric Corp | 半導体装置 |
| JPH02232956A (ja) * | 1989-03-07 | 1990-09-14 | Mitsubishi Electric Corp | 半導体装置 |
| JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
| JPH05198708A (ja) * | 1992-01-23 | 1993-08-06 | Hitachi Ltd | 半導体集積回路装置 |
| DE4326207A1 (de) * | 1992-10-06 | 1994-04-07 | Hewlett Packard Co | Mechanisch schwimmendes Mehr-Chip-Substrat |
| US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
| JPH0730051A (ja) * | 1993-07-09 | 1995-01-31 | Fujitsu Ltd | 半導体装置 |
| US5527740A (en) * | 1994-06-28 | 1996-06-18 | Intel Corporation | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| US5719436A (en) * | 1995-03-13 | 1998-02-17 | Intel Corporation | Package housing multiple semiconductor dies |
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1998
- 1998-02-06 US US09/019,570 patent/US5990549A/en not_active Expired - Lifetime
-
1999
- 1999-01-04 WO PCT/US1999/000052 patent/WO1999040625A1/en not_active Ceased
- 1999-01-04 JP JP2000530943A patent/JP2002503032A/ja active Pending
- 1999-01-04 AU AU20254/99A patent/AU2025499A/en not_active Abandoned
- 1999-01-04 KR KR10-2000-7008406A patent/KR100373228B1/ko not_active Expired - Fee Related