JP2002365148A - 電気回路 - Google Patents

電気回路

Info

Publication number
JP2002365148A
JP2002365148A JP2002074915A JP2002074915A JP2002365148A JP 2002365148 A JP2002365148 A JP 2002365148A JP 2002074915 A JP2002074915 A JP 2002074915A JP 2002074915 A JP2002074915 A JP 2002074915A JP 2002365148 A JP2002365148 A JP 2002365148A
Authority
JP
Japan
Prior art keywords
track
conductive track
conductive
insulating layer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002074915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002365148A5 (cg-RX-API-DMAC10.html
Inventor
Waldemar Brinkis
ブリンキス ヴァルデマー
Erich Mattmann
マットマン エーリッヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JP2002365148A publication Critical patent/JP2002365148A/ja
Publication of JP2002365148A5 publication Critical patent/JP2002365148A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2002074915A 2001-03-17 2002-03-18 電気回路 Pending JP2002365148A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10113474A DE10113474B4 (de) 2001-03-17 2001-03-17 Elektrische Schaltung
DE10113474.6 2001-03-17

Publications (2)

Publication Number Publication Date
JP2002365148A true JP2002365148A (ja) 2002-12-18
JP2002365148A5 JP2002365148A5 (cg-RX-API-DMAC10.html) 2005-07-21

Family

ID=7678208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002074915A Pending JP2002365148A (ja) 2001-03-17 2002-03-18 電気回路

Country Status (3)

Country Link
US (1) US6683525B2 (cg-RX-API-DMAC10.html)
JP (1) JP2002365148A (cg-RX-API-DMAC10.html)
DE (1) DE10113474B4 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299982A (ja) * 2006-05-01 2007-11-15 Nitto Denko Corp 配線回路基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132692C2 (de) * 2001-07-05 2003-11-13 Siemens Ag Einrichtung zur Messung der Achslast eines Kraftfahrzeugs
DE10307978B4 (de) * 2003-02-24 2006-02-09 Siemens Ag Vorrichtung zur Bestimmung einer Kraft
JP3948452B2 (ja) * 2003-11-04 2007-07-25 松下電器産業株式会社 荷重センサ及びその製造方法
DE102016217585B3 (de) 2016-09-15 2017-08-03 Schaeffler Technologies AG & Co. KG Dehnungsmesstreifen sowie Verfahren zur Herstellung eines Dehnungsmessstreifens

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835993A (ja) * 1981-08-28 1983-03-02 松下電器産業株式会社 プリント配線基板
JPH05218604A (ja) * 1992-01-30 1993-08-27 Furukawa Electric Co Ltd:The 金属ベース回路基板
JPH05327152A (ja) * 1992-05-18 1993-12-10 Sanken Electric Co Ltd 配線基板及びその製造方法
JPH05327169A (ja) * 1992-05-22 1993-12-10 Denki Kagaku Kogyo Kk 金属ベース多層回路基板
JPH11275192A (ja) * 1998-03-25 1999-10-08 Nec Corp 変形検知機能付き携帯機器
EP1020909A2 (en) * 1999-01-17 2000-07-19 Delphi Technologies, Inc. Thick-film hybrid circuit on a metal circuit board and method therefor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429649A1 (de) * 1984-08-11 1986-02-20 Vdo Adolf Schindling Ag, 6000 Frankfurt Elektrischer widerstand
DE3431114A1 (de) * 1984-08-24 1986-03-06 Vdo Adolf Schindling Ag, 6000 Frankfurt Elektrischer widerstand
US4827769A (en) * 1988-09-16 1989-05-09 Hamilton Standard Controls, Inc. Fuel level sensor with buried conductor
US5242722A (en) * 1990-10-29 1993-09-07 Matsushita Electric Industrial Co., Ltd. Strain sensor
DE19706790C2 (de) * 1997-02-20 2000-08-31 Siemens Ag Steuergerät für den Einbau in ein Kraftfahrzeug
DE19747001C2 (de) * 1997-10-24 2000-02-24 Mannesmann Vdo Ag Dehnungsmeßstreifen sowie ein mit diesen Dehnungsmeßstreifen hergestellter mechanisch-elektrischer Wandler
US5898359A (en) * 1997-12-19 1999-04-27 Delco Electronics Corp. Diffusion-barrier materials for thick-film piezoresistors and sensors formed therewith
DE19814261A1 (de) * 1998-03-31 1999-10-14 Mannesmann Vdo Ag Dehnungsempfindlicher Widerstand

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835993A (ja) * 1981-08-28 1983-03-02 松下電器産業株式会社 プリント配線基板
JPH05218604A (ja) * 1992-01-30 1993-08-27 Furukawa Electric Co Ltd:The 金属ベース回路基板
JPH05327152A (ja) * 1992-05-18 1993-12-10 Sanken Electric Co Ltd 配線基板及びその製造方法
JPH05327169A (ja) * 1992-05-22 1993-12-10 Denki Kagaku Kogyo Kk 金属ベース多層回路基板
JPH11275192A (ja) * 1998-03-25 1999-10-08 Nec Corp 変形検知機能付き携帯機器
EP1020909A2 (en) * 1999-01-17 2000-07-19 Delphi Technologies, Inc. Thick-film hybrid circuit on a metal circuit board and method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299982A (ja) * 2006-05-01 2007-11-15 Nitto Denko Corp 配線回路基板

Also Published As

Publication number Publication date
DE10113474B4 (de) 2007-09-13
DE10113474A1 (de) 2002-10-02
US6683525B2 (en) 2004-01-27
US20020130756A1 (en) 2002-09-19

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